CN106952852B - A inhale a device for chip welding is in batches transported - Google Patents
A inhale a device for chip welding is in batches transported Download PDFInfo
- Publication number
- CN106952852B CN106952852B CN201710250139.5A CN201710250139A CN106952852B CN 106952852 B CN106952852 B CN 106952852B CN 201710250139 A CN201710250139 A CN 201710250139A CN 106952852 B CN106952852 B CN 106952852B
- Authority
- CN
- China
- Prior art keywords
- air valve
- suction pen
- strip
- pen
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Orthopedics, Nursing, And Contraception (AREA)
Abstract
The invention provides a suction pen device for batch transfer during chip welding, which comprises a strip-shaped plate and a suction pen air valve; a boss is arranged at the upper part of the strip-shaped plate; the boss is provided with positioning convex blocks in an array mode, and the positioning convex blocks are provided with pen sucking air holes; a suction pen air cavity communicated with each suction pen air hole is arranged inside the strip-shaped plate; side ear plates are arranged on the width edges of the left side and the right side of the strip-shaped plate; the side ear plate is provided with a positioning hole; the air valve of the suction pen is arranged on the side surface of the strip-shaped plate and is communicated with the air cavity of the suction pen. The pen sucking device can realize the transportation of chips in batches, effectively improves the working efficiency, and can finish the whole transportation operation by one operator due to the design of the pen sucking air valve, so that time and labor are saved.
Description
Technical Field
The invention relates to a transfer tool used in die bonding, in particular to a suction pen device used for batch transfer in die bonding.
Background
At present, in the process of manufacturing micro chips, all small chips need to be positioned in batches, so that the chips are convenient to weld in batches; however, the existing positioning is carried out manually one by one, so that the working efficiency is low, and the requirement of mass production is difficult to meet.
Disclosure of Invention
The invention aims to solve the technical problems that the existing manual chip placement is low in efficiency and difficult to meet the requirement of mass production.
In order to solve the technical problems, the invention provides a pen sucking device for batch transfer during chip welding, which comprises a strip-shaped plate and a pen sucking air valve; a boss is arranged at the upper part of the strip-shaped plate; the boss is provided with positioning convex blocks in an array mode, and the positioning convex blocks are provided with pen sucking air holes; a suction pen air cavity communicated with each suction pen air hole is arranged inside the strip-shaped plate; side ear plates are arranged on the width edges of the left side and the right side of the strip-shaped plate; the side ear plate is provided with a positioning hole; the air valve of the suction pen is arranged on the side surface of the strip-shaped plate and is communicated with the air cavity of the suction pen.
The suction pen device is adopted to transfer the chips positioned by the suction plate device to the welding position in batches, so that batch welding is realized; the suction pen air valve is adopted to control the adsorption and release of chips in batches, so that the working efficiency is effectively improved; the positioning holes are matched with positioning columns on other devices, so that each chip after limiting can be ensured to accurately correspond to the positioning convex blocks on the suction pen device.
As a further limiting scheme of the invention, the air valve of the air suction pen comprises an air valve pipe body, an air valve press cap, a rebound pressure spring and a sealing ball; a baffle and a rubber sealing column are arranged in the air valve tube body; hemispherical depressions are arranged on the rubber sealing columns; the rubber sealing column is fixed on the baffle plate, and vent holes communicated with the hemispherical depressions are arranged on the baffle plate and the rubber sealing column; a connecting rod is arranged on the air valve press cap; the rebound spring is sleeved on the connecting rod; the end part of the connecting rod penetrates through the pipe wall of the air valve pipe body and is inserted into the air valve pipe body, and a triangular block is arranged on the end part; the sealing ball is positioned in the air valve tube body and is arranged between the hemispherical concave and the slope surface of the triangular block; one end of the air valve tube body is communicated with the air cavity of the suction pen, and the other end of the air valve tube body is connected with the vacuum pump. The rubber sealing column, the sealing ball and the triangular block form a structure for stopping air after the air valve pressing cap is pressed down, so that after the positioning of the pen sucking device is completed, the air valve pressing cap is loosened, chips are adsorbed onto the positioning convex blocks in batches, and the chips are transported in batches; the hemispherical concave can be matched with the sealing ball to realize the on-off control of the vent hole; the adoption of the rebound pressure spring can enable the air valve to rebound smoothly by the cap after the pressing force is released.
As a further limiting scheme of the invention, an anti-falling convex ring is arranged on the end part of the connecting rod inserted into the air valve tube body. The connecting rod can be prevented from falling off by adopting the anti-falling convex ring.
As a further limiting aspect of the invention, the outlet direction of the vent hole on the rubber sealing column is perpendicular to the slope surface of the triangular block. The design can ensure that the sealing ball completely seals the vent hole under the pushing action of the triangular block, and the component force of the acting force is smaller.
As a further limiting aspect of the present invention, a support plate is vertically provided at an edge of the side ear plate. The adoption backup pad can make the strip shaped plate obtain the support, prevents that the impact of pen gas valve from damaging.
The invention has the beneficial effects that: the suction pen device is adopted to transfer the chips positioned by the suction plate device to the welding position in batches, so that batch welding is realized; the suction pen air valve is adopted to control the adsorption and release of chips in batches, so that the working efficiency is effectively improved; the positioning holes are matched with positioning columns on other devices, so that each chip after limiting can be ensured to accurately correspond to the positioning convex blocks on the suction pen device.
Drawings
FIG. 1 is a schematic top view of a suction pen device according to the present invention;
FIG. 2 is a schematic side view of the suction pen device of the present invention;
fig. 3 is a schematic diagram of a sectional structure of an air valve of the suction pen of the present invention.
In the figure, 1, a strip-shaped plate, 2, a side ear plate, 3, a supporting plate, 4, a boss, 5, a positioning lug, 6, a suction pen air hole, 7, a positioning hole, 8, an air valve pipe body, 9, an air valve pressing cap, 10, a connecting rod, 11, a rebound pressure spring, 12, a sealing ball, 13, a triangular block, 14, an anti-falling convex ring, 15, a hemispherical concave, 16, a rubber sealing column, 17, a baffle, 18 and an air vent.
Detailed Description
As shown in fig. 1 to 3, the suction pen device for batch transfer during die bonding disclosed by the invention comprises: a strip-shaped plate 1 and a suction pen air valve.
Wherein, a boss 4 is arranged at the upper part of the strip-shaped plate 1; a positioning lug 5 is arranged on the boss 4 in an array manner, and a pen sucking air hole 6 is arranged on the positioning lug 5; a suction pen air cavity communicated with each suction pen air hole 6 is arranged inside the strip-shaped plate 1; side ear plates 2 are arranged on the width edges of the left side and the right side of the strip-shaped plate 1; the side ear plate 2 is provided with a positioning hole 7; the air valve of the suction pen is arranged on the side surface of the strip-shaped plate 1 and is communicated with the air cavity of the suction pen; the edge of the side ear plate 2 is vertically provided with a supporting plate 3.
As shown in fig. 3, the air valve of the air suction pen comprises an air valve tube body 8, an air valve press cap 9, a rebound compression spring 11 and a sealing ball 12; a baffle 17 and a rubber sealing column 16 are arranged in the air valve pipe body 8; a hemispherical recess 15 is arranged on the rubber sealing column 16; the rubber sealing column 16 is fixed on the baffle plate 17, and vent holes 18 communicated with the hemispherical depressions 15 are arranged on the baffle plate 17 and the rubber sealing column 16; a connecting rod 10 is arranged on the air valve press cap 9; the rebound pressure spring 11 is sleeved on the connecting rod 10; the end part of the connecting rod 10 penetrates through the pipe wall of the air valve pipe body 8 and is inserted into the air valve pipe body 8, and a triangular block 13 is arranged on the end part; the sealing ball 12 is positioned in the air valve pipe body 8 and is arranged between the hemispherical concave 15 and the slope surface of the triangular block 13; one end of the air valve tube body 8 is communicated with the air cavity of the suction pen, and the other end is connected with the vacuum pump; an anti-falling convex ring 14 is arranged at the end part of the connecting rod 10 inserted into the air valve pipe body 8; the outlet direction of the vent hole 18 on the rubber sealing column 16 is perpendicular to the slope surface of the triangular block 13.
When the pen sucking device disclosed by the invention is used, firstly, the air valve pipe body 8 is connected with the vacuum pump; then the air valve is pressed down, the air valve is cut off by the cap 9, and the three rows of chips are aligned with the pen sucking device through the matching of the positioning holes 7; and then the air valve pressing cap 9 is loosened, so that aligned batch chips are adsorbed to the positioning convex blocks 5 and transferred to a welding machine, and after the air valve pressing cap 9 is pressed down again, all the chips are distributed on the circuit board in order for welding.
The pen sucking device can realize the transportation of chips in batches, effectively improves the working efficiency, and can finish the whole transportation operation by one operator due to the design of the pen sucking air valve, thereby saving time and labor.
Claims (2)
1. A inhale a device that is used for chip welding to transport in batches, its characterized in that: comprises a strip-shaped plate (1) and a suction pen air valve; a boss (4) is arranged at the upper part of the strip-shaped plate (1); a positioning lug (5) is arranged on the boss (4) in an array manner, and a pen sucking air hole (6) is arranged on the positioning lug (5); a suction pen air cavity communicated with each suction pen air hole (6) is arranged inside the strip-shaped plate (1); side ear plates (2) are arranged on the width edges of the left side and the right side of the strip-shaped plate (1); a positioning hole (7) is arranged on the side ear plate (2); the air valve of the suction pen is arranged on the side surface of the strip-shaped plate (1) and is communicated with the air cavity of the suction pen;
the air valve of the suction pen comprises an air valve pipe body (8), an air valve press cap (9), a rebound compression spring (11) and a sealing ball (12); a baffle (17) and a rubber sealing column (16) are arranged in the air valve pipe body (8); a hemispherical concave (15) is arranged on the rubber sealing column (16); the rubber sealing column (16) is fixed on the baffle plate (17), and vent holes (18) communicated with the hemispherical depressions (15) are arranged on the baffle plate (17) and the rubber sealing column (16); a connecting rod (10) is arranged on the air valve pressing cap (9); the rebound pressure spring (11) is sleeved on the connecting rod (10); the end part of the connecting rod (10) penetrates through the pipe wall of the air valve pipe body (8) and is inserted into the air valve pipe body (8), and a triangular block (13) is arranged on the end part; the sealing ball (12) is positioned in the air valve pipe body (8) and is arranged between the hemispherical concave (15) and the slope surface of the triangular block (13); one end of the air valve tube body (8) is communicated with the air cavity of the suction pen, and the other end is connected with the vacuum pump;
the outlet direction of the vent hole (18) on the rubber sealing column (16) is vertical to the slope surface of the triangular block (13);
the edge of the side ear plate (2) is vertically provided with a supporting plate (3).
2. The suction pen device for batch transfer during die bonding according to claim 1, wherein: an anti-falling convex ring (14) is arranged at the end part of the connecting rod (10) inserted into the air valve pipe body (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710250139.5A CN106952852B (en) | 2017-04-17 | 2017-04-17 | A inhale a device for chip welding is in batches transported |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710250139.5A CN106952852B (en) | 2017-04-17 | 2017-04-17 | A inhale a device for chip welding is in batches transported |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106952852A CN106952852A (en) | 2017-07-14 |
| CN106952852B true CN106952852B (en) | 2023-09-05 |
Family
ID=59477035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710250139.5A Active CN106952852B (en) | 2017-04-17 | 2017-04-17 | A inhale a device for chip welding is in batches transported |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106952852B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107478259A (en) * | 2017-07-18 | 2017-12-15 | 上海申矽凌微电子科技有限公司 | The test device and method of testing of sensor chip batch production |
| CN109256351B (en) * | 2018-09-20 | 2021-06-08 | 南方科技大学 | Batch transfer device and method for micro chips |
| CN110459500A (en) * | 2019-07-29 | 2019-11-15 | 南京中电熊猫平板显示科技有限公司 | Microdevice vacuum cups and the method for microdevice transfer |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202094096U (en) * | 2011-05-13 | 2011-12-28 | 淄博美林电子有限公司 | KBP crystal grain wobble plate filling device |
| CN204222355U (en) * | 2014-11-13 | 2015-03-25 | 蓝思科技（长沙）有限公司 | A kind of silk-screen bat printing fexible unit |
| CN206697462U (en) * | 2017-04-17 | 2017-12-01 | 如皋市大昌电子有限公司 | The wand device of bulk transport during a kind of welding for chip |
-
2017
- 2017-04-17 CN CN201710250139.5A patent/CN106952852B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202094096U (en) * | 2011-05-13 | 2011-12-28 | 淄博美林电子有限公司 | KBP crystal grain wobble plate filling device |
| CN204222355U (en) * | 2014-11-13 | 2015-03-25 | 蓝思科技（长沙）有限公司 | A kind of silk-screen bat printing fexible unit |
| CN206697462U (en) * | 2017-04-17 | 2017-12-01 | 如皋市大昌电子有限公司 | The wand device of bulk transport during a kind of welding for chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106952852A (en) | 2017-07-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106952852B (en) | A inhale a device for chip welding is in batches transported | |
| JP6415273B2 (en) | Adsorption holding device | |
| CN206084430U (en) | Processing tool of aluminium alloy cell -phone shell | |
| CN201010361Y (en) | Sucked type feeding tool | |
| CN202151794U (en) | Chip blowing device for clamp pad block | |
| CN213635941U (en) | Suction means of bead cutter | |
| CN103447795A (en) | Valve ball assembling method | |
| CN106952850B (en) | Chip batch positioning system | |
| CN205201654U (en) | Bipeltate section processing vacuum fixing device | |
| CN209520260U (en) | A kind of pipe fitting mold | |
| CN106952849B (en) | A suction plate device for chip welding is time fixed a position in batches | |
| CN206697463U (en) | A kind of chip batch alignment system | |
| CN206697462U (en) | The wand device of bulk transport during a kind of welding for chip | |
| CN106734030B (en) | A kind of pcb board dust suction jig | |
| CN209618324U (en) | Automatic clamping and placing material device | |
| CN206697461U (en) | The suction disc device of batch positioning during a kind of welding for chip | |
| CN113526118B (en) | Quick and reliable heat conduction material separating mechanism | |
| CN203030698U (en) | Automatic punching machine | |
| CN108340043B (en) | Guiding device for quick feeding of sheet to be welded into tray during chip welding forming and die filling process | |
| CN218284545U (en) | Simple on-off switch type sucker | |
| CN204526024U (en) | Trickle fixture | |
| CN111547501B (en) | Upset loading attachment | |
| CN217194087U (en) | Negative pressure fixing device for machine tool machining material | |
| CN218939627U (en) | Welding track structure for module packaging | |
| CN204851966U (en) | Sucking disc that adsorbs reinforce |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |