TWI725629B - Jig conveying member, surface treatment device and method - Google Patents
Jig conveying member, surface treatment device and method Download PDFInfo
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- TWI725629B TWI725629B TW108141873A TW108141873A TWI725629B TW I725629 B TWI725629 B TW I725629B TW 108141873 A TW108141873 A TW 108141873A TW 108141873 A TW108141873 A TW 108141873A TW I725629 B TWI725629 B TW I725629B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Coating Apparatus (AREA)
- Physical Vapour Deposition (AREA)
Abstract
治具搬運構件(100),具有:治具保持部(110),其供垂下保持工件(W)的工件保持治具(10)裝卸自如地安裝;支撐部(120),其支撐治具保持部;以及連結部(130),其連結治具保持部(110)與支撐部(120)。連結部(130),在賦予有外力時解除治具保持部(110)與支撐部(120)的連結,在外力解除時將治具保持部(110)與支撐部(120)予以連結,在連結時,可選擇俯視觀看下之治具保持部(110)與支撐部(120)的相對角度不同的複數個連結位置之一個。The jig conveying member (100) has: a jig holding part (110) for the work holding jig (10) to hang down and holding the work (W) to be detachably installed; a support part (120) for holding the jig Section; and a connecting portion (130), which connects the jig holding portion (110) and the supporting portion (120). The connection part (130) releases the connection between the jig holding part (110) and the support part (120) when an external force is applied, and connects the jig holding part (110) and the support part (120) when the external force is released. When connecting, one of a plurality of connecting positions with different relative angles between the jig holding portion (110) and the supporting portion (120) viewed from above can be selected.
Description
本發明,是關於將無電解鍍覆等之表面處理用的工件保持治具予以搬運的治具搬運構件、表面處理裝置及方法等。The present invention relates to a jig conveying member, a surface treatment device, and a method for conveying a workpiece holding jig for surface treatment such as electroless plating.
例如無電解鍍覆,是與電鍍不同,不會在池內流動電流,故其優點是被鍍覆處理的工件可不僅是導電體,就連塑膠或陶瓷般的非導電體都行。 於專利文獻1揭示出,在收容無電解鍍覆液的鍍覆槽中,中介有無電解鍍覆液可流通的間隙來將複數個工件鉛直地豎立並排,或是懸吊在架子來進行批次處理(請求項1、3及圖4)。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2006-93651號公報For example, electroless plating is different from electroplating in that no current will flow in the pool. Therefore, its advantage is that the workpiece to be plated can be not only a conductor, but also a non-conductor like plastic or ceramic. Patent Document 1 discloses that in a plating tank containing an electroless plating solution, a gap where the electroless plating solution can flow is interposed, and a plurality of workpieces are vertically erected side by side, or suspended on a shelf for batching. Processing (request items 1, 3 and Figure 4). [Prior Technical Literature] [Patent Literature] [Patent Document 1] JP 2006-93651 A
[發明所欲解決之課題] 若鍍覆液中存在氣泡,且氣泡附著於工件的話,在氣泡存在的區域會成為鍍覆不良。特別是,有著在工件存在貫通孔或有底孔的情況。若工件為電路基板的話,是設置有使基板的兩面導通的通孔,或是使上下的導電層彼此導通的接觸孔或細孔。因此,氣泡容易停留在這種孔,而容易發生鍍覆不良。 本發明的目的在提供一種治具搬運構件、表面處理裝置及方法,其可降低氣泡附著於工件所起因的處理不良。 [用以解決課題之手段] (1)本發明的一態樣,是關於治具搬運構件,具有: 治具保持部,其供垂下保持工件的工件保持治具裝卸自如地安裝; 支撐部,其支撐前述治具保持部;以及 連結部,其連結前述治具保持部與前述支撐部, 前述連結部,在賦予有外力時解除前述治具保持部與前述支撐部的連結,在前述外力解除時將前述治具保持部與前述支撐部予以連結,在連結時,可選擇俯視觀看下之前述治具保持部與前述支撐部的相對角度不同的複數個連結位置之一個。 根據本發明的一態樣,在賦予有外力時解除治具保持部與支撐部的連結,故可在俯視觀看下使治具保持部與支撐部的相對角度變化。之後解除外力時,使治具保持部與支撐部連結。藉此,可選擇俯視觀看下治具保持部與支撐部的相對角度不同的複數個連結位置之一個。工件,是安裝於保持在治具保持部的工件保持治具。因此,變更俯視觀看下之治具保持部與支撐部的相對角度,藉此可對於支撐部來變更工件主面的朝向。藉由該治具搬運構件來使工件浸泡於處理槽內的處理液時,使治具搬運構件的支撐部於第1方向往復擺動。如此來去除附著於工件的氣泡。此時,藉由適當設定工件主面對於往復擺動方向的朝向,而可有效率地去除氣泡。 (2)在本發明的一態樣(1),前述連結部,含有複數個卡合部、以及至少一個被卡合部,藉由因前述外力的賦予而相對移動的前述治具保持部與前述支撐部,來使前述複數個卡合部中的任一個與前述至少一個被卡合部的卡合解除,藉由前述外力的解除來使前述複數個卡合部中的任一個與前述至少一個被卡合部卡合亦可。如此一來,治具保持部與支撐部的連結及連結解除為容易,且使至少一個被卡合部卡合於複數個卡合部中的任一個,藉此使旋轉後的位置固定。 (3)在本發明的一態樣(2),前述卡合部,是可供前述至少一個被卡合部嵌入的孔或凹部。如此一來,使連結部的構造簡易化,使治具保持部與支撐部的連結及連結解除變得更容易。 (4)在本發明的一態樣(2)或(3), 前述治具保持部,含有被導引部, 前述支撐部,含有可使前述被導引部升降地導引的導引部, 前述連結部,含有: 與前述被導引部一起移動的可動部、 與前述可動部相對地配置在前述導引部的固定部, 在前述可動部與前述固定部之一方設有前述複數個卡合部, 在前述可動部與前述固定部之另一方設有前述至少一個被卡合部亦可。 如此一來,藉由使治具保持部與支撐部相對地升降,而可容易進行治具保持部與支撐部的連結及連結解除。 (5)本發明之其他的態樣,是關於表面處理裝置,具有: 治具搬運構件,其供垂下保持工件的工件保持治具裝卸自如地安裝; 處理槽,其將被保持在前述工件保持治具的複數個工件之表面藉由處理液來進行處理;以及 裝載部,其將從外部搬入的前述工件保持治具安裝於前述治具搬運構件,並將前述治具搬運構件對前述處理槽裝載, 前述治具搬運構件,是本發明之一態樣(1)~(4)之任一者所述之治具搬運構件,含有前述治具保持部、前述支撐部及前述連結部, 前述處理槽,含有使前述治具搬運構件於第1方向往復擺動的擺動部, 前述裝載部,含有: 使前述治具搬運構件的前述治具保持部升降的升降部、 使上升後的前述治具保持部在水平面內旋轉的旋轉部。 (6)在本發明之其他的態樣(5), 前述旋轉部,可使前述治具保持部旋轉成:使保持在前述治具保持部的前述複數個工件之前述表面與前述第1方向成為非平行。 (7)本發明之另外的其他態樣,是關於表面處理方法, 是以表面處理裝置,來對複數個工件進行表面處理的方法, 該表面處理裝置,具有: 治具搬運構件,其供垂下保持工件的工件保持治具裝卸自如地安裝; 處理槽,其將被保持在前述工件保持治具的前述複數個工件之表面藉由處理液來進行處理;以及 裝載部,其將從外部搬入的前述工件保持治具安裝於前述治具搬運構件,並將前述治具搬運構件對前述處理槽裝載, 前述治具搬運構件,是本發明之一態樣(1)~(4)之任一者所述之治具搬運構件,含有前述治具保持部、前述支撐部及前述連結部, 該表面處理方法,含有: 使前述治具搬運構件的前述治具保持部上升的步驟、 使上升後的前述治具保持部在水平面內旋轉的步驟、 之後,使前述治具保持部下降的步驟。 (8)在本發明之另外的其他態樣(7), 前述處理槽,含有使前述治具搬運構件沿著第1方向往復擺動的擺動部, 前述旋轉步驟,可使前述治具保持部旋轉成:使保持在前述治具保持部的前述複數個工件之前述表面與前述第1方向成為非平行。 根據本發明之各態樣(5)(7),在裝載部藉由升降部來使治具保持部上升,藉此解除治具保持部與支撐部的連結。在裝載部藉由旋轉部來使上升後的治具保持部在水平面內旋轉,藉此變更俯視觀看下之治具保持部與支撐部的相對角度。之後,在裝載部藉由升降部來使治具保持部下降,藉此連結治具保持部與支撐部。藉此,選擇俯視觀看下之治具保持部與支撐部的相對角度不同的複數個連結位置之一個。在使用有該工件保持治具的處理槽,是使工件保持治具的支撐部於第1方向往復擺動,來去除附著於工件的氣泡。此時,藉由適當設定工件主面對於往復擺動方向的朝向,而可有效率地去除氣泡。 根據本發明之各態樣(6)(8),藉由擺動而在工件表面作用有較多處理液體的液壓。因此,可將停留在工件表面、有底孔或貫通孔的氣泡,藉由液壓來有效率地從工件去除。[The problem to be solved by the invention] If there are bubbles in the plating solution, and the bubbles adhere to the workpiece, the area where the bubbles exist will cause poor plating. In particular, there are cases where a through hole or a bottomed hole exists in the workpiece. If the work is a circuit board, it is provided with a through hole that conducts both sides of the board, or a contact hole or a pore that conducts the upper and lower conductive layers with each other. Therefore, air bubbles tend to stay in such holes, and poor plating is likely to occur. The object of the present invention is to provide a jig conveying member, a surface treatment device and a method, which can reduce processing defects caused by air bubbles adhering to a workpiece. [Means to solve the problem] (1) One aspect of the present invention relates to a jig conveying member, which has: Jig holding part, which can be installed and unloaded freely for the workpiece holding jig that hangs down to hold the workpiece; A supporting part, which supports the aforementioned jig holding part; and The connecting part connects the jig holding part and the supporting part, The connection part releases the connection between the jig holding part and the support part when an external force is applied, and connects the jig holding part and the support part when the external force is released. When connecting, you can choose to view it in a plan view. One of a plurality of connecting positions where the relative angle of the jig holding part and the supporting part is different. According to an aspect of the present invention, when an external force is applied, the connection between the jig holding portion and the support portion is released, so that the relative angle of the jig holding portion and the support portion can be changed in a plan view. After the external force is released, the jig holding part and the supporting part are connected. Thereby, one of a plurality of connecting positions with different relative angles of the jig holding portion and the supporting portion in a plan view can be selected. The workpiece is a workpiece holding jig that is installed in the jig holding part. Therefore, by changing the relative angle of the jig holding portion and the supporting portion in a plan view, the orientation of the main surface of the workpiece can be changed with respect to the supporting portion. When the workpiece is immersed in the processing liquid in the processing tank by the jig conveying member, the support portion of the jig conveying member is reciprocated in the first direction. In this way, air bubbles attached to the workpiece are removed. At this time, by appropriately setting the orientation of the main surface of the workpiece with respect to the reciprocating swing direction, air bubbles can be efficiently removed. (2) In one aspect (1) of the present invention, the connecting portion includes a plurality of engaging portions and at least one engaged portion, and the jig holding portion and the jig holding portion that move relative to each other due to the application of the external force The support portion is used to release any one of the plurality of engaging portions and the at least one engaged portion, and the release of the external force causes any one of the plurality of engaging portions to and the at least one One can be engaged by the engaging part. In this way, the connection and disconnection of the jig holding portion and the support portion are easy, and at least one engaged portion is engaged with any one of the plurality of engaging portions, thereby fixing the rotated position. (3) In one aspect (2) of the present invention, the engaging portion is a hole or recess into which the at least one engaged portion can be inserted. In this way, the structure of the connection portion is simplified, and the connection and disconnection of the jig holding portion and the support portion are easier. (4) In one aspect (2) or (3) of the present invention, The aforementioned jig holding part contains the guided part, The support part includes a guide part that can guide the guided part up and down, The aforementioned connection part contains: The movable part that moves with the aforementioned guided part, The fixed part of the guide part is arranged opposite to the movable part, The plurality of engaging portions are provided on one of the movable portion and the fixed portion, The at least one engaged portion may be provided on the other of the movable portion and the fixed portion. In this way, by relatively raising and lowering the jig holding portion and the support portion, the connection and disconnection of the jig holding portion and the support portion can be easily performed. (5) Another aspect of the present invention relates to a surface treatment device, which has: Jig conveying component, which can be installed freely by hanging down and holding the workpiece holding jig; A processing tank, which will be held on the surface of a plurality of workpieces of the aforementioned workpiece holding jig to be processed by a processing liquid; and A loading part which mounts the workpiece holding jig carried in from the outside on the jig conveying member, and loads the jig conveying member on the processing tank, The jig conveying member is the jig conveying member according to any one of the aspects (1) to (4) of the present invention, and includes the jig holding portion, the supporting portion, and the connecting portion, The processing tank includes a swinging portion for reciprocating the jig conveying member in the first direction, The aforementioned loading part contains: An elevating part that raises and lowers the jig holding part of the jig conveying member, A rotating part that rotates the raised jig holding part in a horizontal plane. (6) In another aspect (5) of the present invention, The rotating part can rotate the jig holding part so that the surfaces of the plurality of workpieces held by the jig holding part are non-parallel to the first direction. (7) Another aspect of the present invention relates to a surface treatment method, It is a method of surface treatment on a plurality of workpieces with a surface treatment device, The surface treatment device has: Jig conveying component, which can be installed freely by hanging down and holding the workpiece holding jig; A processing tank, which will be held on the surface of the plurality of workpieces of the workpiece holding jig to be processed by a processing liquid; and A loading part which mounts the workpiece holding jig carried in from the outside on the jig conveying member, and loads the jig conveying member on the processing tank, The jig conveying member is the jig conveying member according to any one of the aspects (1) to (4) of the present invention, and includes the jig holding portion, the supporting portion, and the connecting portion, The surface treatment method contains: The step of raising the jig holding part of the jig conveying member, The step of rotating the raised jig holding part in the horizontal plane, After that, the step of lowering the aforementioned jig holding portion. (8) In another aspect (7) of the present invention, The processing tank includes a swinging portion that reciprocally swings the jig conveying member in the first direction, In the rotating step, the jig holding portion can be rotated so that the surfaces of the plurality of workpieces held by the jig holding portion are non-parallel to the first direction. According to the aspects (5) and (7) of the present invention, the jig holding part is raised by the lifting part in the loading part, thereby releasing the connection between the jig holding part and the supporting part. In the loading part, the raised jig holding part is rotated in the horizontal plane by the rotating part, thereby changing the relative angle of the jig holding part and the supporting part in a plan view. After that, the jig holding part is lowered by the lifting part in the loading part, thereby connecting the jig holding part and the supporting part. Thereby, one of a plurality of connecting positions with different relative angles between the jig holding portion and the supporting portion in a plan view is selected. In the processing tank using the workpiece holding jig, the support portion of the workpiece holding jig is reciprocated in the first direction to remove air bubbles adhering to the workpiece. At this time, by appropriately setting the orientation of the main surface of the workpiece with respect to the reciprocating swing direction, air bubbles can be efficiently removed. According to various aspects (6) and (8) of the present invention, hydraulic pressure of more processing liquid acts on the surface of the workpiece by swinging. Therefore, air bubbles remaining on the surface of the workpiece, bottomed holes or through holes can be efficiently removed from the workpiece by hydraulic pressure.
以下的揭示中,為了實施與所提示之主題不同的特徵,而提供多種不同的實施型態或實施例。當然該等僅為例子,並沒有用來限定的意圖。此外,在本揭示於各種例子中有著反覆使用參考符號及/或文字的情況。這種反覆使用只是為了簡潔明瞭,它本身並不代表各種實施型態及/或所說明的構造之間必須有關係。此外,當記載成第1要件「連接」或「連結於」第2要件時,這種記載是包含第1要件與第2要件互相直接連接或連結的實施型態,並且亦包含著第1要件與第2要件具有中介於其間之1個以上的其他要件來互相間接連接或連結的實施型態。且,當記載成第1要件對第2要件「移動」時,這種記載是包含第1要件及第2要件之至少一方對另一方移動的相對移動。
圖1是表面處理裝置1的剖面圖。於圖1,顯示有:治具搬運構件100,其搬運工件保持治具10;以及處理槽200,其將保持在工件保持治具10的至少一個例如複數個工件W的表面藉由處理液Q來進行處理。表面處理裝置1,如圖2(A)(B)所示般,可具有至少一個例如複數個處理槽200-1~200-n(n為複數)。複數個處理槽200-1~200-n除了鍍覆處理等之表面處理槽以外,還可包含該表面處理前後所必要的前處理槽及/或後處理槽。在處理槽200,將工件W浸泡於鍍覆液等之處理液Q,藉此可對工件W進行表面處理。
圖2(A)所示之表面處理裝置1A,在處理槽200-1~200-n所連結之長度方向的一端具有裝載/卸載部210。在圖2(A),於裝載/卸載部210,使從外部搬入的工件保持治具10安裝於治具搬運構件100。裝載/卸載部210,將裝有工件保持治具10的治具搬運構件100予以裝載於處理槽200。例如治具搬運構件100,是先被搬運至處理槽200-1之後,依序間歇地從處理槽200-1搬運至200-n,而使複數個工件W在各處理槽200-1~200-n進行批次處理。處理結束後,在裝載/卸載部210,將工件保持治具10從治具搬運構件100拆下。
圖2(B)所示之表面處理裝置1B,在處理槽200-1~200-n所連結之長度方向的一端具有裝載部220,在長度方向的另一端具有卸載部230。在圖2(B),於裝載部220,使從外部搬入的工件保持治具10安裝於治具搬運構件100。裝載部220,將裝有工件保持治具10的治具搬運構件100予以裝載於處理槽200。例如治具搬運構件100,是依序間歇地從處理槽200-1搬運至200-n,而使複數個工件W在各處理槽200-1~200-n進行批次處理。處理結束後,在卸載部230,將工件保持治具10從治具搬運構件100拆下。
在此,在圖2(A)所示之裝載/卸載部210與圖2(B)所示之裝載部220及卸載部230,配置有外力賦予裝置250。該外力賦予裝置250,在針對工件保持治具10及治具搬運構件100說明之後再說明。
首先,針對工件保持治具10來說明。工件保持治具10,例如可使用本案申請人在PCT/JP2017/034924所揭示的治具。若簡單說明工件保持治具10的話,如圖1及圖2所示般,工件保持治具10具有框體11。於框體11的上部固定有上部夾持器12,其保持複數個例如20片的工件W之上端,而將工件W懸吊支撐。在工件W較薄而懸吊時會撓曲的情況等,如圖1及圖2所示般,進一步設有下部夾持器13。下部夾持器13可對於框體11上下移動地支撐為佳。如此一來,藉由下部夾持器13的自重而使工件W被賦予朝向下方的張力,使工件W不會產生撓曲。於框體11具有:往上方伸出的臂14、設在臂14之上部的鉤15。又,圖1及圖2所示之工件保持治具10為一例,只要可懸吊保持工件W的話亦可使用其他各種的工件保持治具。
工件保持治具10,可如圖3所示般,為使複數個工件W不撓曲地平行配置的批次處理用治具。其結果,使該工件保持治具10所保持的複數個工件W浸泡於鍍覆池時,即使是較薄的工件W亦可在相鄰的工件W間確保供鍍覆液流通的適當間隙。藉此,可維持鍍覆品質地來進行無電解鍍覆並批次處理複數個工件W。
接著,針對治具搬運構件100來說明。治具搬運構件100,如圖1所示般,具有:治具保持部110,其供垂下保持複數個工件W的工件保持治具10裝卸自如地安裝;支撐部120,其支撐治具保持部110;以及連結部130,其連結治具保持部110與支撐部120。連結部130,在賦予有外力時解除治具保持部110與支撐部120的連結,在外力解除時將治具保持部110與支撐部120予以連結。在連結時,可選擇俯視觀看下之治具保持部110與支撐部120的相對角度不同的複數個連結位置之一個。
治具搬運構件100的治具保持部110,具有懸吊支撐部111,其供工件保持治具10的鉤15裝卸自如地懸吊支撐。懸吊支撐部111,具備供鉤15定位的定位部111A。工件保持治具10的鉤15被定位部111A導引而如圖3所示般被懸吊支撐部111所支撐,藉此使工件保持治具10被懸吊支撐。治具保持部110,進一步具有從懸吊支撐部111往上方延伸的被導引部例如圓形剖面的垂直軸部112。垂直軸部112,可具有上限止動件113。
治具搬運構件100的支撐部120,具有導引部121,其具備可將被導引部亦即垂直軸部112予以升降地導引的例如圓形的孔121A。支撐部120,進一步具有:連結於導引部121的被卡止部122、連結於被卡止部122的被搬運部123。治具搬運構件100的被卡止部122,在圖2(A)(B)所示之表面處理裝置1A、1B中,卡止於卡止部240,該卡止部240配置在治具搬運構件100所停止的各位置(處理槽200-1~200-n、裝載/卸載部210、裝載部220及卸載部230)。藉此,可使安裝有工件保持治具10的治具搬運構件100在各位置停止地支撐。治具搬運構件100,其被搬運部123是與未圖示的搬運部卡合來間歇搬運。如此一來,可使安裝有工件保持治具10的治具搬運構件100朝向各位置間歇搬運。
治具搬運構件100的連結部130,含有:被固定在垂直軸部112的上部而與垂直軸部112一起移動的可動部131、與可動部131相對地配置在導引部121的固定部132。又,固定部132與導引部121為一體亦可。在可動部131與固定部132之一方,例如在固定部132如圖4所示般設有複數個卡合部例如孔132A或凹部。在可動部131與固定部132之另一方,例如在可動部131設有至少一個例如複數個被卡合部亦即銷131A。
圖5,是表示配置在裝載/卸載部210(裝載部220、卸載部230)之外力賦予裝置250的圖。外力賦予裝置250,具有:使治具保持部110升降的升降部260、使上升後的治具保持部110在水平面內旋轉的旋轉部270。在圖5所示的實施型態,雖舉出了以旋轉部270使升降部260旋轉的例子,但並不限定於此。
升降部260,亦可如圖6所示般,包含:升降驅動部261、藉由升降驅動部261來升降的升降軸262、固定在升降軸262的推桿263。藉由升降驅動部261,推桿263會從圖5所示之下降位置往箭頭A方向移動,而設定於圖6所示的上升位置。在圖6所示之上升位置,推桿263將治具保持部110的懸吊支撐部111推起。治具搬運構件100之中,支撐部120卡止於卡止部240,另一方面,治具保持部110對支撐部120上升移動。該上升移動,會因治具保持部110的止動件113抵接於導引部121的下面而停止。
如圖6所示般,在停止於上升位置般賦予有外力時,連結治具保持部110與支撐部120的連結部130之連結被解除。這是因為,固定在治具保持部110之垂直軸112的可動部131,從配置在支撐部120之導引部121的固定部132脫離,銷131A與孔132A的卡合被解除的緣故。
在圖6所示的上升位置,旋轉部270旋轉。藉此,搭載於旋轉部270的升降部260會旋轉。支撐在升降部260的治具保持部110,會繞著插通於導引部121之孔121A的垂直軸部112之軸來往箭頭B方向旋轉。如此一來,俯視觀看下治具保持部110會對於支撐部120旋轉。
之後,藉由升降部260,使推桿263從圖6的上升位置下降至圖5的下降位置。藉此,固定在治具保持部110之垂直軸112的可動部131會下降,銷131A會卡合於旋轉後之固定部132之複數個孔132A之中相對向的孔132A。如此一來,選擇了俯視觀看下之治具保持部110與支撐部120的相對角度不同的複數個連結位置之一個。
在裝載/卸載部210或裝載部220實施了上述動作的治具搬運構件100,會依序在處理槽200-1~200-n移動,處理結束後往裝載/卸載部210或卸載部230移動。在裝載/卸載部210或卸載部230,藉由上述的升降動作及旋轉動作,使治具搬運構件100回到初始狀態。
圖7~圖9,是表示配置在處理槽200的工件保持治具10或工件W之狀態的俯視圖。圖7,表示治具搬運構件100之治具保持部110沒有旋轉的初始狀態。圖8,表示治具搬運構件100之治具保持部110從圖7的位置旋轉45度的狀態。圖8,表示治具搬運構件100之治具保持部110從圖7的位置旋轉90度的狀態。
在此,處理槽200,含有使治具搬運構件100於第1方向往復擺動的擺動部。雖省略該擺動部的機構,但例如使用偏心凸輪機構等使治具搬運構件100往復擺動。若在圖7中往復擺動方向與Y軸方向平行的話,使治具搬運構件100的治具保持部110旋轉的必要性較低。但是,若在圖7中往復擺動方向與X軸方向平行的話,就會產生使治具搬運構件100的治具保持部110旋轉的必要。這是因為,工件W的主面與往復擺動方向X(第1方向)平行,因擺動所致之氣泡的去除效果較少的緣故。
在此,例如圖8或圖9所示般,使治具搬運構件100的治具保持部110旋轉,而使工件W的主面設定成與往復擺動方向X(第1方向)成為非平行。又,治具保持部110的旋轉角度,在圖8或圖9僅為一例,亦可設定其他各種角度。若設定成使工件W的主面與往復擺動方向X(第1方向)成為非平行的角度的話,因擺動而對工件W的主面作用有較多的處理液Q的液壓。藉此,可將停留在工件W表面、有底孔或貫通孔的氣泡,藉由液壓來有效率地從工件W去除。In the following disclosure, in order to implement features different from the suggested theme, a variety of different implementation types or embodiments are provided. Of course, these are only examples and are not intended to be limiting. In addition, in various examples in the present disclosure, reference symbols and/or words are repeatedly used. This repeated use is only for brevity and clarity, and does not in itself mean that there must be a relationship between various implementation types and/or illustrated structures. In addition, when the first element is described as "connected" or "connected to" the second element, this description includes the implementation type in which the first element and the second element are directly connected or connected to each other, and also includes the first element The second element has one or more other elements in between to indirectly connect or connect with each other. In addition, when the first requirement is described as "moving" to the second requirement, this description includes the relative movement of at least one of the first requirement and the second requirement to the other.
FIG. 1 is a cross-sectional view of the surface treatment device 1. In FIG. 1, there is shown: a
1,1A,1B:表面處理裝置 10:工件保持治具 100:治具搬運構件 110:治具保持部 111:懸吊支撐部 112:被導引部(垂直軸部) 113:止動件 120:支撐部1, 1A, 1B: surface treatment device 10: Workpiece holding fixture 100: Fixture handling components 110: Fixture holding part 111: Suspension support 112: Guided part (vertical shaft part) 113: Stop 120: Support
121:導引部 121: Guiding Department
121A:孔 121A: Hole
130:連結部 130: connection part
131:可動部 131: Movable part
131A:被卡合部(銷) 131A: The engaged part (pin)
132:固定部 132: Fixed part
132A:卡合部(孔) 132A: engagement part (hole)
200,200-1~200-n:處理槽 200,200-1~200-n: processing tank
210:裝載/卸載部 210: Loading/Unloading Department
220:裝載部 220: loading department
230:卸載部 230: Unloading Department
240:卡止部 240: Locking part
250:外力賦予部 250: External force imparting department
260:升降部 260: Lifting Department
263:推桿 263: Putter
270:旋轉部 270: Rotating part
Q:處理液 Q: Treatment liquid
W:工件 W: Workpiece
[圖1]是本發明之一實施型態之表面處理裝置的剖面圖。 [圖2(A)]及[圖2(B)]是表面處理裝置的概略俯視圖。 [圖3]是表示圖1的表面處理裝置所使用之工件保持治具的圖。 [圖4]是在治具搬運構件的連結部所設置之固定部的俯視圖。 [圖5]是表示以裝載/卸載部(裝載部、卸載部)來使治具保持部下降之狀態的圖。 [圖6]是表示以裝載/卸載部(裝載部、卸載部)來使治具保持部上升之狀態的圖。 [圖7]是在裝載/卸載部(裝載部、卸載部)所配置之治具搬運構件的俯視圖。 [圖8]是表示從圖7的位置使治具保持部旋轉45度之狀態的圖。 [圖9]是表示從圖7的位置使治具保持部旋轉90度之狀態的圖。[Fig. 1] is a cross-sectional view of a surface treatment device of an embodiment of the present invention. [FIG. 2(A)] and [FIG. 2(B)] are schematic plan views of the surface treatment apparatus. [Fig. 3] is a diagram showing a workpiece holding jig used in the surface treatment device of Fig. 1. [Fig. [Fig. 4] is a plan view of the fixing part provided at the connection part of the jig conveying member. [Fig. 5] is a diagram showing a state where the jig holding unit is lowered by the loading/unloading unit (loading unit, unloading unit). [Fig. 6] is a diagram showing a state in which the jig holding unit is raised by the loading/unloading unit (loading unit, unloading unit). [Fig. 7] is a plan view of the jig conveying member arranged in the loading/unloading section (loading section, unloading section). Fig. 8 is a diagram showing a state where the jig holding portion is rotated 45 degrees from the position of Fig. 7. Fig. 9 is a diagram showing a state where the jig holder is rotated 90 degrees from the position of Fig. 7.
10:工件保持治具 10: Workpiece holding fixture
100:治具搬運構件 100: Fixture handling components
110:治具保持部 110: Fixture holding part
111:懸吊支撐部 111: Suspension support
112:被導引部(垂直軸部) 112: Guided part (vertical shaft part)
113:止動件 113: Stop
120:支撐部 120: Support
121:被導引部 121: Guided Department
121A:孔 121A: Hole
130:連結部 130: connection part
131:可動部 131: Movable part
131A:被卡合部(銷) 131A: The engaged part (pin)
132:固定部 132: Fixed part
240:卡止部 240: Locking part
250:外力賦予部 250: External force imparting department
260:升降部 260: Lifting Department
261:升降驅動部 261: Lifting drive
263:推桿 263: Putter
270:旋轉部 270: Rotating part
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JP2006093651A (en) | 2004-08-26 | 2006-04-06 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board and non-electrolytic plating device for wiring board manufacture |
JP5164693B2 (en) * | 2008-06-30 | 2013-03-21 | 木田精工株式会社 | Plating equipment |
JP5602553B2 (en) * | 2010-09-17 | 2014-10-08 | アルメックスPe株式会社 | Surface treatment equipment |
JP5833355B2 (en) * | 2011-06-30 | 2015-12-16 | アルメックスPe株式会社 | Surface treatment equipment |
JP6117891B2 (en) * | 2015-10-29 | 2017-04-19 | アルメックスPe株式会社 | Surface treatment equipment |
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JP2010275603A (en) * | 2009-05-29 | 2010-12-09 | Hitachi Chem Co Ltd | Plating apparatus and plating method |
TW201323668A (en) * | 2011-06-30 | 2013-06-16 | Almex Pe Inc | Surface treatment system and workpiece-holding jig |
CN203049036U (en) * | 2013-01-18 | 2013-07-10 | 瑞华高科技电子工业园(厦门)有限公司 | Copper plating fixture for circuit boards |
TWM464817U (en) * | 2013-07-03 | 2013-11-01 | Ampoc Far East Co Ltd | Circuit board clamping device with flipping mechanism |
WO2018062260A1 (en) * | 2016-09-29 | 2018-04-05 | アルメックスPe株式会社 | Workpiece holding jig and method for attaching workpiece to workpiece holding jig |
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Publication number | Publication date |
---|---|
PH12021551141A1 (en) | 2021-10-25 |
JPWO2020105524A1 (en) | 2021-03-18 |
CN113056576B (en) | 2024-08-16 |
CN113056576A (en) | 2021-06-29 |
WO2020105524A1 (en) | 2020-05-28 |
JP6909524B2 (en) | 2021-07-28 |
TW202037546A (en) | 2020-10-16 |
KR20210092219A (en) | 2021-07-23 |
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