PH12021551141A1 - Jig conveyance member and surface treatment apparatus and method - Google Patents

Jig conveyance member and surface treatment apparatus and method

Info

Publication number
PH12021551141A1
PH12021551141A1 PH12021551141A PH12021551141A PH12021551141A1 PH 12021551141 A1 PH12021551141 A1 PH 12021551141A1 PH 12021551141 A PH12021551141 A PH 12021551141A PH 12021551141 A PH12021551141 A PH 12021551141A PH 12021551141 A1 PH12021551141 A1 PH 12021551141A1
Authority
PH
Philippines
Prior art keywords
jig
holding
section
conveyance member
holding section
Prior art date
Application number
PH12021551141A
Inventor
Masahide Watanabe
Katsumi Ishii
Original Assignee
Almex Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Almex Tech Inc filed Critical Almex Tech Inc
Publication of PH12021551141A1 publication Critical patent/PH12021551141A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Abstract

A jig conveyance member (100) comprises: a jig-holding section (110) on which a workpiece-holding jig (10) for holding a workpiece W suspended therefrom is detachably installed; a support section (120) for supporting the jig-holding section; and a connecting part (130) for connecting the jig-holding section (110) to the support section (120). The connecting part (130): releases the connection between the jig-holding section (110) and the support section (120) when an external force is being applied; connects the jig-holding section (110) to the support section (120) when the external force is released; and is capable of selecting one of multiple connection positions in which the relative angle between the jig-holding section (110) and the support section (120) in planar view differs when connected.
PH12021551141A 2018-11-20 2021-05-18 Jig conveyance member and surface treatment apparatus and method PH12021551141A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018217662 2018-11-20
PCT/JP2019/044512 WO2020105524A1 (en) 2018-11-20 2019-11-13 Jig conveyance member and surface treatment apparatus and method

Publications (1)

Publication Number Publication Date
PH12021551141A1 true PH12021551141A1 (en) 2021-10-25

Family

ID=70773587

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12021551141A PH12021551141A1 (en) 2018-11-20 2021-05-18 Jig conveyance member and surface treatment apparatus and method

Country Status (6)

Country Link
JP (1) JP6909524B2 (en)
KR (1) KR20210092219A (en)
CN (1) CN113056576A (en)
PH (1) PH12021551141A1 (en)
TW (1) TWI725629B (en)
WO (1) WO2020105524A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112251693B (en) * 2020-09-08 2023-09-01 徐州瑞马智能技术有限公司 Perpendicular blowing type hot galvanizing device for foundation bolt with only part of length being plated

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420424Y2 (en) * 1974-05-30 1979-07-24
JPH046223Y2 (en) * 1986-02-19 1992-02-20
JP2006093651A (en) 2004-08-26 2006-04-06 Ngk Spark Plug Co Ltd Manufacturing method of wiring board and non-electrolytic plating device for wiring board manufacture
JP5164693B2 (en) * 2008-06-30 2013-03-21 木田精工株式会社 Plating equipment
JP5569713B2 (en) * 2009-05-29 2014-08-13 日立化成株式会社 Electroless copper plating apparatus for thickening, electroless copper plating method for thickening, and manufacturing method of multilayer printed wiring board
JP5602553B2 (en) * 2010-09-17 2014-10-08 アルメックスＰｅ株式会社 Surface treatment equipment
JP5833355B2 (en) * 2011-06-30 2015-12-16 アルメックスＰｅ株式会社 Surface treatment equipment
KR101500966B1 (en) * 2011-06-30 2015-03-10 아루멕쿠스 피이 가부시키가이샤 Surface treatment apparatus and jig for holding work
CN203049036U (en) * 2013-01-18 2013-07-10 瑞华高科技电子工业园(厦门)有限公司 Copper plating fixture for circuit boards
TWM464817U (en) * 2013-07-03 2013-11-01 Ampoc Far East Co Ltd Circuit board clamping device with flipping mechanism
JP6117891B2 (en) * 2015-10-29 2017-04-19 アルメックスＰｅ株式会社 Surface treatment equipment
JP6793967B2 (en) * 2016-09-29 2020-12-02 株式会社アルメックステクノロジーズ Work holding jig and how to attach the work to the work holding jig

Also Published As

Publication number Publication date
WO2020105524A1 (en) 2020-05-28
TW202037546A (en) 2020-10-16
KR20210092219A (en) 2021-07-23
CN113056576A (en) 2021-06-29
TWI725629B (en) 2021-04-21
JP6909524B2 (en) 2021-07-28
JPWO2020105524A1 (en) 2021-03-18

Similar Documents

Publication Publication Date Title
MXPA04000659A (en) Apparatus for securing a workpiece.
MY185737A (en) Laser processing apparatus
MY196500A (en) Transfer Jig And Surface Treatment Apparatus Using Same
HK1119118A1 (en) Work piece carrier for positioning a work piece on a chuck and clamping apparatus with a chuck and a work piece carrier
JP2007245333A (en) Clamping device for positioning and fixing workpiece
ATE550135T1 (en) MODULAR PROCESSING DEVICE
ATE516111T1 (en) PRESSING DEVICE FOR CUTTING MEANS AND DEVICE AND METHOD FOR FINISHING CIRCUMFERENTIAL SURFACES OF CYLINDRICAL WORKPIECE SECTIONS
ATE400397T1 (en) FEED DEVICE FOR PLATE-SHAPED WORKPIECES
ATE534483T1 (en) DEVICE FOR RELEASABLY HOLDING WORKPIECES ON MACHINING EQUIPMENT
WO2006012448A3 (en) Bayonet collet pickup tool for agile fixturing
PH12021551141A1 (en) Jig conveyance member and surface treatment apparatus and method
ATE465827T1 (en) MACHINE ARRANGEMENT FOR PROCESSING PLATE-LIKE WORKPIECES WITH A PROCESSING DEVICE AND WITH A HANDLING DEVICE FOR PROCESSING PRODUCTS
KR20170114135A (en) Ballast pipe processing device for inserting the jig for preventing distortion
BRPI0512258A (en) device for specially clamping surface-type workpieces having a clamping surface
ATE468198T1 (en) METHOD AND DEVICE FOR FASTENING WORKPIECES TO BE MACHINED BY MACHINE TOOLS TO A PREPARATION AND SUPPORT PLATE
DE602006005648D1 (en) Apparatus for holding a turbine blade and method of blade processing using this fixture
TWD218093S (en) Part of wafer boat for substrate processing equipment
SG133507A1 (en) Apparatus and method for arranging devices for processing
EP1473764A3 (en) Multifunction support for substrat
MY198794A (en) Workpiece processing method and processing apparatus
WO2005099946A3 (en) Clamping device for hollow parts
KR20130005776U (en) vacuum clamping apparatus
WO2009074273A3 (en) Apparatus for chucking a work carrier on a chuck which can be fixed to a machine tool
PH12019500670A1 (en) Workpiece holding jig and method for attaching workpiece to workpiece holding jig
WO2007067367A3 (en) Apparatus and method for cutting flat stent precursors