PH12021551141A1 - Jig conveyance member and surface treatment apparatus and method - Google Patents
Jig conveyance member and surface treatment apparatus and methodInfo
- Publication number
- PH12021551141A1 PH12021551141A1 PH12021551141A PH12021551141A PH12021551141A1 PH 12021551141 A1 PH12021551141 A1 PH 12021551141A1 PH 12021551141 A PH12021551141 A PH 12021551141A PH 12021551141 A PH12021551141 A PH 12021551141A PH 12021551141 A1 PH12021551141 A1 PH 12021551141A1
- Authority
- PH
- Philippines
- Prior art keywords
- jig
- holding
- section
- conveyance member
- holding section
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Coating Apparatus (AREA)
Abstract
A jig conveyance member (100) comprises: a jig-holding section (110) on which a workpiece-holding jig (10) for holding a workpiece W suspended therefrom is detachably installed; a support section (120) for supporting the jig-holding section; and a connecting part (130) for connecting the jig-holding section (110) to the support section (120). The connecting part (130): releases the connection between the jig-holding section (110) and the support section (120) when an external force is being applied; connects the jig-holding section (110) to the support section (120) when the external force is released; and is capable of selecting one of multiple connection positions in which the relative angle between the jig-holding section (110) and the support section (120) in planar view differs when connected.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018217662 | 2018-11-20 | ||
PCT/JP2019/044512 WO2020105524A1 (en) | 2018-11-20 | 2019-11-13 | Jig conveyance member and surface treatment apparatus and method |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12021551141A1 true PH12021551141A1 (en) | 2021-10-25 |
Family
ID=70773587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12021551141A PH12021551141A1 (en) | 2018-11-20 | 2021-05-18 | Jig conveyance member and surface treatment apparatus and method |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6909524B2 (en) |
KR (1) | KR20210092219A (en) |
CN (1) | CN113056576A (en) |
PH (1) | PH12021551141A1 (en) |
TW (1) | TWI725629B (en) |
WO (1) | WO2020105524A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112251693B (en) * | 2020-09-08 | 2023-09-01 | 徐州瑞马智能技术有限公司 | Perpendicular blowing type hot galvanizing device for foundation bolt with only part of length being plated |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5420424Y2 (en) * | 1974-05-30 | 1979-07-24 | ||
JPH046223Y2 (en) * | 1986-02-19 | 1992-02-20 | ||
JP2006093651A (en) | 2004-08-26 | 2006-04-06 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board and non-electrolytic plating device for wiring board manufacture |
JP5164693B2 (en) * | 2008-06-30 | 2013-03-21 | 木田精工株式会社 | Plating equipment |
JP5569713B2 (en) * | 2009-05-29 | 2014-08-13 | 日立化成株式会社 | Electroless copper plating apparatus for thickening, electroless copper plating method for thickening, and manufacturing method of multilayer printed wiring board |
JP5602553B2 (en) * | 2010-09-17 | 2014-10-08 | アルメックスPe株式会社 | Surface treatment equipment |
JP5833355B2 (en) * | 2011-06-30 | 2015-12-16 | アルメックスPe株式会社 | Surface treatment equipment |
DE102012012990B4 (en) * | 2011-06-30 | 2014-09-04 | Almex Pe Inc. | Surface treatment system and workpiece support support |
CN203049036U (en) * | 2013-01-18 | 2013-07-10 | 瑞华高科技电子工业园(厦门)有限公司 | Copper plating fixture for circuit boards |
TWM464817U (en) * | 2013-07-03 | 2013-11-01 | Ampoc Far East Co Ltd | Circuit board clamping device with flipping mechanism |
JP6117891B2 (en) * | 2015-10-29 | 2017-04-19 | アルメックスPe株式会社 | Surface treatment equipment |
MY195297A (en) * | 2016-09-29 | 2023-01-12 | Almex Pe Inc | Workpiece Holding Jig and Method for Attaching Workpiece to Workpiece Holding Jig |
-
2019
- 2019-11-13 JP JP2020558320A patent/JP6909524B2/en active Active
- 2019-11-13 CN CN201980075887.1A patent/CN113056576A/en active Pending
- 2019-11-13 KR KR1020217015823A patent/KR20210092219A/en unknown
- 2019-11-13 WO PCT/JP2019/044512 patent/WO2020105524A1/en active Application Filing
- 2019-11-19 TW TW108141873A patent/TWI725629B/en active
-
2021
- 2021-05-18 PH PH12021551141A patent/PH12021551141A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPWO2020105524A1 (en) | 2021-03-18 |
TWI725629B (en) | 2021-04-21 |
WO2020105524A1 (en) | 2020-05-28 |
KR20210092219A (en) | 2021-07-23 |
CN113056576A (en) | 2021-06-29 |
TW202037546A (en) | 2020-10-16 |
JP6909524B2 (en) | 2021-07-28 |
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