KR960015928B1 - Substrate processing apparatus - Google Patents

Abstract

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Description

Substrate Processing Equipment

1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of the substrate processing apparatus shown in FIG. 1 viewed from the opposite direction (line II-II). FIG.

3 is a longitudinal sectional front view of the substrate processing apparatus shown in FIGS. 1 and 2;

4 is a plan view of the substrate treating apparatus shown in FIGS.

5 is a layout diagram in which a plurality of substrate processing apparatuses of this embodiment are arranged.

6 is a schematic system diagram of a substrate cleaning processing unit of the substrate processing apparatus.

7 is an explanatory diagram of a turntable used in the substrate processing apparatus of the present embodiment, wherein a plan view (a) is a longitudinal sectional view, a plan view (b) is a plan view, a plan view (c) is a sectional view taken along line CC of a plan view (a), The dynamic drawing (d) is equivalent to the dynamic drawing (c) of the first modification of the rotational drive mechanism of the turntable, and the dynamic drawing (e) corresponds to the dynamic drawing (c) of the second modification of the rotational drive mechanism of the turntable.

8 is a view for explaining a substrate hand tool used in the substrate processing apparatus of this embodiment. FIG. 8A is a longitudinal sectional view, and FIG. 8B is an explanatory view of a manufacturing example of a substrate placing part of the substrate hand tool. Figure (c) is a partial cross-sectional view of the substrate mounting portion.

9 is a cross-sectional view taken along the line V-V in FIG.

Fig. 10 is an explanatory view of a narrowing link mechanism used in the substrate processing apparatus of this embodiment, in which a plan view (a) is a longitudinal cross section and a plan view (b) is a plan view.

11 is a view for explaining the substrate chuck of the substrate transfer robot used in the substrate processing apparatus of the present embodiment, wherein FIG. 11A is a perspective view, BB line sectional view of FIG. CC line sectional drawing of FIG. (B), the longitudinal drawing (d) are the longitudinal cross-sectional view of the example of a change of a board | substrate check, and FIG.

12 is a diagram illustrating the substrate chuck rotating mechanism of the substrate transfer robot and the traveling mechanisms of the traveling unit main body used in the substrate processing apparatus of the present embodiment. FIG. 12A is a perspective view, and FIG. Is a perspective view of a modification, and the same figure (d) is a side view of the same figure (c).

13 (a), (b), (c) and (d) are front views each showing a modification of the substrate chuck.

Fig. 14 is a perspective view of the separation and rotation mechanism of the substrate chuck shown in Figs. 13 (b), (c) and (d), and corresponds to Fig. 12 (a).

15 is a longitudinal sectional view of principal parts of a modification of the substrate placing portion of the substrate hand tool.

Fig. 16 is a longitudinal sectional view of an essential part showing a modification of the substrate hand tool.

Fig. 17 is a front view of a principal part showing still another modification of the substrate placing part of the substrate hand tool.

FIG. 18 is a sectional side view of the main part of the substrate placing part of the substrate hand tool shown in FIG. 17; FIG.

FIG. 19 is a sectional view of an essential part of a substrate placing portion of the substrate hand tool shown in FIG. 17; FIG.

20 is a front view of an essential part showing another modification of the substrate placing part of the substrate hand tool.

Fig. 21 is a front view of the main part, showing another modification of the substrate placing part of the substrate hand tool.

Fig. 22 is a front sectional view of a main portion showing still another modification of the substrate placing portion of the substrate hand tool.

23 is a longitudinal sectional view of a conventional substrate processing apparatus.

24 is a plan view of a conventional substrate processing apparatus shown in FIG.

* Explanation of symbols for main parts of the drawings

3: substrate transfer part 4: substrate transfer robot

5 substrate processing unit 8 cassette

9 substrate 18 substrate mounting portion

46: driving unit body 47: arm rotation axis

48: shaft rotation means 49: substrate chuck

50: Opposing surface of substrate chuck 49 51: Back surface of substrate chuck 49

52: substrate alignment support groove on the opposite side 50 53: substrate alignment support groove on the rear surface 51

62: driving drive device 74: treatment tank

75: processing substrate placing unit 76: lifting and lowering drive means of the processing substrate placing unit 75

77: first substrate capital position 78: second substrate capital position

79: substrate processing apparatus 81: substrate receiving position

85: lift drive means of the substrate placing unit 18

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for processing a substrate (hereinafter, simply referred to as a “substrate”) such as a semiconductor substrate and a glass substrate, in particular, a substrate transport apparatus of a substrate processing apparatus for treating a substrate surface by immersing the substrate in a processing liquid. It is about improvement of.

Some conventional substrate processing apparatuses are shown in FIGS. 23 and 24. Referring to FIGS. 23 and 24, a conventional substrate processing apparatus includes a substrate transfer portion 503, a substrate processing portion 505, a substrate transfer robot 504, and a substrate drying portion 506. The substrate transfer portion 503 is for removing the substrate 509 from the cassette 508 containing the plurality of substrates 509 or for loading the plurality of substrates 509 into the cassette 508. The substrate processing unit 505 is for surface-treating a plurality of substrates 509 collectively. The board | substrate conveyance robot 504 is for carrying and holding together the some board | substrate 509 between the board | substrate transfer part 503 and the board | substrate processing part 505.

The substrate processing apparatus further includes a cassette loading / unloading stage 501 and a cassette cleaning unit 507.

In particular, with reference to FIG. 24, the cassette loading / unloading stage 50l is provided with a carrying position 510 and a carrying position 512 of the cassette 508. As shown in FIG. The cassette conveyance robot 502 is provided between the cassette carrying in / out stage 501, the substrate transfer part 503, and the cassette cleaning part 507. The cassette conveyance robot 502 is movable in the up and down directions in FIG. The cassette conveying robot 502 can also move up and down and rotate around the vertical axis.

The substrate placing portion 503 is provided with a cassette placing table 511 on which a cassette 508 is placed.

The opening 515 is formed in the lower part of the cassette 508. The water supply insertion hole 516 is formed in the position corresponding to the opening 515 of the cassette 508 of the cassette mounting table 511. As shown in FIG. The cassette placing table 511 is moved up and down by the elevating drive unit 503a (see FIG. 23).

A substrate hand tool 517 is disposed below the water supply insertion hole 516 of the cassette placing table 511. The substrate hand tool 517 is rotatably attached to the frame of the substrate processing apparatus, and is rotated by the driving device 514 fixed to the frame. The substrate placing portion 518 is attached to the head of the substrate hand tool 517.

The substrate transport robot 504 includes a traveling unit body 546 and a pair of substrate chucks 549 attached to the traveling unit body 546. The substrate chuck 549 extends downward, and a substrate alignment holding groove 552 is formed on the inner surface 550 near the lower end thereof. The substrate transport robot 504 is also movable in the vertical direction and in the left and right directions in FIG. In addition, the pair of substrate chucks 549 can be opened and closed left and right about an axis protruding from the traveling part body 546 by an opening and closing drive device mounted in the traveling part body 546.

The substrate processing unit 505 is generally provided with a plurality of processing tanks 574. Each treatment tank 574 is supplied with a predetermined treatment liquid and filled into the treatment tank 574. In the processing tank 574, a substrate holder for holding a substrate is provided.

The conventional substrate processing apparatus shown in FIG. 23 and FIG. 24 operates as follows. The cassette conveyance apparatus which is not shown in figure places the cassette 508 which accommodated the unprocessed board | substrate 509 on the loading position 510 of the cassette carrying-in / out stage 501 shown in FIG. The cassette conveying robot 502 holds this cassette 508, moves up and moves upward as shown in FIG. The cassette conveying robot 502 is rotated 180 degrees about the vertical axis, and the cassette 508 is placed on the cassette placing table 511. At this time, the substrate placing table 511 is raised to the position of the highest position in advance.

Subsequently, the cassette mounting table 511 is lowered to the lowermost position by the elevating driver 503a. At this time, the substrate placing portion 518 of the substrate hand tool 517 passes through the tap opening insertion hole 516 of the cassette placing table 511 and the lower opening 553 of the cassette 508 to pass through the cassette 508. The substrate 509 is supported on the substrate 509 of the substrate hand tool 517. Thus, the substrate 509 is taken out of the cassette 508 descending together with the cassette placing table 511. Is supported. Further, the substrate hand tool 517 is rotated 90 degrees using the rotation driving device 514 so that the alignment direction of the substrate 509 matches the alignment direction of the substrate 509 in the substrate processing unit 505.

Subsequently, the traveling part main body 546 of the board | substrate conveyance robot 504 is moved to the position immediately above the board | substrate hand tool 517. Alternatively, the traveling unit body 546 is moved to the position in advance. The lower portion of the substrate chuck 549 is opened in advance, and the traveling main body 546 is lowered so that the tip of the substrate chuck 549 is moved to the side position of the substrate placing portion 518 of the substrate hand tool 517. Descend. The substrate chuck 549 is closed at a predetermined height, and the substrate held by the substrate placing unit 518 is held by the substrate chuck 549.

Subsequently, the traveling unit body 546 is raised to move along the left and right conveyance paths shown in FIG. 24, and the substrate transport robot 504 is moved to a position indicated by the dashed-dotted line in FIG. 23, for example. . By lowering the traveling unit body 546 at this position, the substrate 509 is placed on the substrate support in the processing tank 574. The substrate chuck 549 is opened to raise the running portion 546. As a result, the substrate is immersed in the processing liquid in the processing tank 574 for a predetermined time.

The processed substrate 509 is taken out of the processing tank 547 by the substrate transfer robot 504, dried by the substrate drying unit 506, and then conveyed to the substrate transfer part 503. The cassette 508 which has been washed is placed on the cassette placing table 511 in advance, and the cassette placing table 511 is lowered to the lowest position.

The driving unit body 546 is lowered to a position immediately above the substrate hand tool 517. When the substrate 509 is in contact with the substrate placing portion 518 of the substrate hand tool 517, the lowering of the traveling unit body 546 is stopped. By opening the substrate chuck 549, the substrate 509 is supported by the substrate placing unit 518. Then, the driving unit body 546 is raised.

The substrate hand tool 517 is rotated 90 degrees using the rotation driving device 514. The lift driver 503a is driven to raise the cassette placing table 511. In this process, the substrate supported on the substrate placing portion 518 of the substrate hand tool 517 is accommodated in the cassette 508 placed on the cassette placing table 511. The lifting and lowering drive device 503a stops when the cassette placing table 511 reaches the uppermost position.

The cassette conveying robot 502 holds a cassette on the cassette placing table 511 and takes a path opposite to the path at the time of the cassette loading and unloading the cassette 508 to the unloading position 512 of the cassette unloading stage 501. Move. This cassette 508 is conveyed to the next step by the cassette conveyance apparatus which is not shown in figure.

The above conventional substrate processing apparatus has the following problems.

In the conventional substrate processing apparatus, carriers of the unprocessed substrate 509 and carriers of the processed substrate 509 are transferred to the same substrate alignment holding grooves 552 of the substrate chuck facing surface 550 of the same substrate transfer robot 504. The board | substrate 509 is hold | maintained. The contaminants adhering to the unprocessed substrate 509 are attached to the substrate alignment holding grooves 552 of the substrate chuck facing surface 550. This attachment is reattached to the processed substrate 509 when the processed substrate 509 is held using the substrate chuck opposing surface 550. For this reason, the processed substrate 509 is contaminated.

The substrate which has already been cleaned in the pretreatment and cleaning of the oxidation-calculation process is cleaned using this substrate processing apparatus. Therefore, even an untreated substrate is clean to some extent and there are few problems of contamination as described above.

However, there has been a problem that a water mark is attached to some kinds of substrates when the substrate dried by the substrate iron 549 holding the wet substrate after cleaning is held.

The contamination of the substrate and the adhesion of the watermark on the substrate both lower the yield of the product.

It also has the following problems. When the raw substrate 509 is immersed in the processing tank 574 of the substrate processing unit 505, the substrate chuck 549 is also immersed in the processing liquid in the processing tank 574 at the same time. Contaminants adhered to the substrate chuck 549 may be taken into the treatment tank 574.

In addition to this, the processing liquid in the processing tank 574 is contaminated for the following reasons. The drooping dimension of the substrate chuck 549 is relatively long. This is for the following reason. As described above, when the substrate 509 is provided between the substrate hand tool 517 and the substrate transport robot 504, the substrate placing portion of the substrate hand tool 517 shown in FIG. It is necessary to descend to around 518. In addition, when the substrate processing unit 505 performs the transfer of the substrate between the substrate support in the processing tank 574, the substrate chuck 549 needs to be deeply penetrated into the processing tank 574. That is why the number of loads of the substrate chuck 549 is relatively long.

On the other hand, when the dimension of the board | substrate chuck 549 becomes long, the board | substrate chuck 549 is easy to vibrate during substrate conveyance. Slip occurs between the substrate alignment holding groove 552 of the substrate chuck 549 and the substrate 509 held by the substrate alignment holding groove 552. Particles are generated by this slip and they intrude into the processing tank 574. The processing liquid in the processing tank 574 is contaminated and the yield of the product is lowered.

For that reason, it is an object of the present invention to provide a substrate processing apparatus capable of improving the yield of a product.

Another object of the present invention is to provide a substrate processing apparatus capable of preventing recontamination of a substrate during substrate processing and thereby improving the yield of products.

Still another object of the present invention is to provide a substrate processing apparatus capable of preventing contamination of the substrate processing tank and thereby improving the yield of the product.

It is still another object of the present invention to provide a substrate processing apparatus capable of preventing contamination of the substrate processing tank due to the generation of particles during substrate transport and thereby improving the yield of products.

It is a further object of the present invention to provide a substrate processing apparatus capable of reducing the vibration of the substrate chuck during substrate transport, thereby suppressing the generation of particles and improving the yield of the product.

It is a still further object of the present invention to provide a fin processing apparatus capable of improving the yield of a product by preventing the substrate chuck from being immersed in the substrate processing tank without causing it to be contaminated.

A substrate processing apparatus according to the present invention includes a substrate loading / unloading apparatus for taking out a plurality of substrates into a cassette or loading a plurality of substrates into a cassette, and a plurality of substrates between the substrate loading / unloading apparatus and a predetermined position. A substrate carrying apparatus for carrying and holding a batch and a substrate processing part which accommodates a some board | substrate in a board | substrate carrying apparatus, performs a predetermined process, and returns the processed several board | substrate to a board | substrate carrying apparatus. The substrate transport apparatus includes a main body, a pair of axes parallel to each other protruding in a predetermined direction from the traveling body, and a pair of tracheal chucks and a main body respectively attached to the pair of axes so that the longitudinal direction thereof is parallel to the central axis of these axes. And an axis rotating device for rotating the shaft around the central axis, the first position for transferring the substrate between the main body and the substrate load / unload device, and the substrate processing unit. And moving parts for moving between the second positions for transferring the substrate therebetween. A pair of substrate chucks have a plurality of sets of opposing surfaces. Each of the opposing surfaces of the plurality of sets of opposing surfaces has a plurality of substrate alignment holding grooves that accommodate the end portions of the substrates formed in the direction crossing the longitudinal direction of the substrate chuck.

The substrate processing apparatus according to the present invention is characterized in that the plurality of substrates are collectively held by any one pair of opposing surfaces of the plurality of opposing surfaces by the rotation of the shaft rotating apparatus. By holding the substrate before the process on one set of opposing surfaces and transporting the substrate to the substrate processing portion, the substrate after the process is held on the other set of opposing surfaces and transported so that the deposit of the substrate before the treatment is returned to the surface of the substrate after the treatment through the opposing surface. Attachment can be avoided. The substrate chuck is not used when the substrate is immersed in the substrate processing liquid. By shortening the length of the substrate chuck, vibrations during conveyance of the substrate can be reduced, and generation of particles and the like can be reduced.

Each of the pair of substrate chucks has a cross-sectional shape of, for example, almost fusiform, rectangular, triangular, and drum shaped, and substrate alignment holding grooves are formed at respective predetermined positions on the opposing surfaces. In one embodiment, the substrate processing apparatus further includes a device for changing the distance between the pair of substrate chucks by pinging the center line of each axis in a direction opposite to each other in a direction perpendicular to each other.

Further, in another preferred embodiment, each of the pair of substrate chucks further has a liquid stop groove formed in the longitudinal direction at the boundary portions of the plurality of opposing surfaces.

In one embodiment of the present invention, a substrate load / unload apparatus is installed at a substrate load / unload position, and stands up a plurality of substrates accommodated in a cassette, collectively pulled them out, guides them to the substrate transfer apparatus, and processes the plurality of substrates processed by the substrate transfer apparatus. And a substrate ejecting device for accommodating and accommodating the cassette placed in the substrate load / unload position. The cassette has an opening at the top thereof through which a plurality of substrates can pass, and an opening of a predetermined size at the bottom thereof. The substrate ejecting device is provided at a substrate load / unload position and supports a cassette on an upper surface thereof to rotate at least a predetermined angle, for example, at a right angle, and has a rotation stage having an opening of a predetermined size on the upper surface, and a lower portion of the rotating stage A cassette disposed on the rotating stage, the cassette being disposed on the rotating stage and having a head for standing up and supporting a plurality of substrates passing through both the opening of the bottom of the cassette and the opening of the upper surface of the rotating stage. A plurality of substrates in the cassette placed on the rotating stage by varying the relative height with respect to the rotating stage of the substrate tool for performing transfer of the substrate therebetween;

And a holding device for supporting the substrate to the head of the substrate hand tool or for receiving a plurality of substrates supported on the head of the substrate hand tool in a cassette placed on a rotating stage. The head of the substrate hand tool has a plurality of substrate support surfaces each having substrate alignment grooves for standing and supporting the plurality of substrates, and the substrate hand tool is adapted to support the plurality of substrates by changing the plurality of substrate support surfaces. And a support surface changing device.

For example, the head portion of the substrate water receiving portion is divided into a plurality of portions in the longitudinal direction, and each portion has a substrate alignment groove on its upper surface. The support surface changing device includes a device for changing the relative height with respect to the other part between a predetermined one of these plurality parts between a position higher than the other part and a position lower than the other part. The other part may be fixed or lifted in the reverse direction, for example. Alternatively, the head of the substrate hand tool may be rotatably supported around the longitudinal axis thereof, and any one of the substrate supporting surfaces arranged at different angles about the axis may be positioned at the uppermost portion.

By supporting the substrate prior to processing by any one of the substrate supporting surfaces, the substrate can be taken out of the cassette and passed to the substrate transfer device, and the substrate after the processing can be supported by the other of the substrate supporting surfaces and accommodated in the cassette. Therefore, it is possible to avoid the adhesion of the substrate before the treatment to the substrate after the treatment through the substrate hand tool.

EMBODIMENT OF THE INVENTION Hereinafter, one Example of this invention is described based on drawing. With reference to FIG. 1-FIG. 4, the substrate processing apparatus 21 which concerns on this Example is the cassette carrying-in / out stage 1 and the cassette conveyance robot ( 2) and the substrate transfer part 3, the substrate transfer robot 4, the substrate processing part 5, the substrate drying part 6 and the cassette cleaning part 7 are included. The cassette cleaning unit 7 is not shown in FIG. In addition, the cassette 8 used in this embodiment has a substrate alignment receiving groove therein, and can accommodate the plurality of substrates 9 in a standing alignment state.

Each part is demonstrated in order below.

The cassette carrying in / out stage 1 is a cassette 8 in which a cassette 8 containing an unprocessed substrate 9 is loaded by a cassette conveyance mechanism (not shown) and accommodates a substrate 9 processed by this substrate processing apparatus. ) Is the stage to be carried out in a subsequent process.

In particular, with reference to FIGS. 1 and 4, the cassette loading / unloading stage 1 is provided with a cassette loading / loading position 10 and a carrying position 12. As shown in FIG. 3, below the cassette carrying-in position 10, the roller 22 which aligned the board | substrate 9 so that an orientation flat may be provided is provided.

As shown in FIG. 2, the cassette loading / unloading stage 1 is installed facing the clean room work area 23 side.

1 and 4, the cassette conveying robot 2 is for moving the cassette 8 carried in the loading position 10 to a predetermined position of the substrate transfer portion 3. The cassette conveying robot 1 is capable of lifting up and down as shown in FIG. 3 and rotatable about a vertical center axis as shown in FIGS. 1 and 4.

The substrate transfer section 3 includes a cassette placing table 11 and two turntables 13 installed in the cassette placing table 11. The turntables 13 are arranged along the conveyance direction of the cassette conveyance robot 2. The turntables 13 are arranged in two rows along the direction perpendicular to the conveyance direction of the substrate conveyance robot 4. In particular, the turntable 13 is rotatable 90 degrees in the a and b directions with reference to FIG. 4. This rotation is performed by the rotation drive device 14 (refer FIG. 4 and FIG. 3). Moreover, the water supply insertion hole 16 is formed in each center part of this turntable 13, as shown in FIG. An opening 15 is formed at the bottom of the cassette 8.

Under the turntable 13, a pair of board hand tools 17 are provided. The substrate hand tool 17 is fixed to the upper surface of the platform 20. Substrate transfer portion 3 has a vertical drive screw shaft 19 for elevating the platform 20, and the lifting drive means (85) made of a motor or the like.

The substrate placing portion 18 is provided at the head of the substrate hand tool 17.

Details of the configurations of the turntable 13 and the substrate hand tool 17 will be described later with reference to FIGS. 7 and 8.

With reference to FIG. 7, the specific structure of the turntable 13 of this board | substrate transfer part 3, and its rotation drive apparatus 14 is as follows. Referring to FIG. 3 (a), the turntable 13 is freely attached to the base plate 21 of the cassette transfer table 11 via the bearing 22. The rotary drive device 14 includes a rotary drive motor fixed as a fixture on the back surface of the base plate 21, for example. The pinion gear 24 is fixed to the tip of the output shaft 23 of the rotary drive device 14. On the other hand, the ring gear 25 is carved and fixed to the outer side of the turntable 13. The pinion gear 24 and the ring gear 25 are toothed.

Accordingly, the turntable 13 rotates in accordance with the rotational direction by driving the rotary drive device 14 to rotate the output shaft 23. (See also (7) (c)).

7 (a) and (b), the rectangular water supply insertion hole 16 as described above is formed on the turntable 13. The cassette positioning frame 26 is formed along three sides of the edge of the water supply insertion hole 16. As shown in Fig. 7 (b), the positioning frame 26 has a '⊃' shape in the vicinity of the other one of the edge of the water supply insertion hole 16, in Fig. 7 (a) and 7 (b). The cassette clamp 27 as shown in the figure is provided. This cassette clamp 27 is for positioning and fixing the cassette 8 placed on the turntable 13 to an appropriate position as shown in FIG. 7 (b).

In this embodiment, an example in which the rotary drive motor is used for the rotary drive device 14 is described.

However, the rotary drive device 14 is not limited to the rotary drive motor but other drive means may be used. For example, with reference to FIG. 7 (d), the rotary drive device 14 may include a rotary drive cylinder. The rotary drive cylinder 14 has a piston 28. The rack gear 29 is fixed to the front end of the piston 28. Ring gears 25 fixed to the outside of the rack gear 29 and the turntable 13 are toothed. The turntable 13 rotates by expanding and contracting the piston 28 of the rotation driving cylinder 14.

7 (e) shows another example of the armless drive device 14. The rotary drive device 14 of this example includes an air cylinder for rotary drive. This rotary drive air cylinder has a piston 28. On the other hand, the link 30 is fixed to the outer periphery of the turntable 13. The distal end of the piston 28 of the rotary drive air cylinder is attached to the link 30 so as to be rotatable in a plane about the attachment position. By compressing the piston 28 of the air cylinder, the turntable 13 is rotated to appear in the seventh (e) degree.

Referring to Fig. 8, the substrate hand tool 17 has the following configuration. Referring to FIG. 8 (A), the substrate hand tool 17 is provided with a pipe 32 and a box 33 attached to an upper end of the pipe 32, which are mounted on the pipe support 31 and the pipe support 31. As shown in FIG. And substrate placing portions 18 provided on the upper surface of the box 33.

As shown in FIGS. 8 (a) and 8 (b), the substrate placing portion 18 is fixed to the fixed placing portion 39 and the fixed placing portion 39 fixedly attached to the box 33. Lifting and lowering portions 39 that can be lifted and lowered between a position where the relative height is above the fixed placement portion 39 and the position below the fixed placement portion 39 are included. The elevating mounting portion 38 is constituted by two portions, and the fixed placing portion 39 is constituted by three portions, respectively.

Referring to FIG. 8 (a), three fixed seats 34 are attached to the center and both sides of the upper surface of the box 33. The fixed mounting portion 39 is attached to these three fixed seats 34. On the other hand, the elevating mounting portion 38 is attached to two elevating seats disposed between two adjacent fixed seats 34 as shown in FIG. 8 (a).

Referring to FIG. 8 (a), the substrate hand tool l7 is also inserted into the pipe 32, and the pipe 32 is provided with the lifting leg 36 and the lifting leg 36 having two ends thereof. Lifting drive devices 37 for lifting up and down are included. The lift drive device 37 is attached to the pipe support 31. The upper end of the lifting leg 36 is divided into two as mentioned above, and the above-mentioned lifting chair 35 is respectively fixed to the front-end | tip. Therefore, as the pipe 36 lifts and lowers the inside of the pipe 32 by the lift drive device 37, the height of the lift placement unit 38 relative to the fixed placement unit 39 is changed. In the case of this embodiment, as shown in FIG. 8 (a), the elevating placing portion 38 is disposed between the first position above the fixing placing portion 39 and the second position below the fixing placing portion 39. Go up and down.

Referring to FIG. 8 (c), the substrate alignment holding grooves 90 are formed on the upper surfaces of both the elevating mounting portion 38 and the fixed mounting portion 39 in accordance with the outer periphery of the substrate. The pitch of this substrate alignment holding groove 90 is the same as the substrate alignment receiving groove formed in the cassette 8. Moreover, the side edge 92 of the opening side of the board | substrate alignment holding groove 90 has the surface in order to make a board | substrate hold | maintain smoothly by the elevation mounting part 38 and the fixed mounting part 39. As shown in FIG.

Referring to FIG. 8 (b), the bottom of the substrate alignment holding groove 90 on the upper surface of the elevating mounting portion 38 and the fixed mounting portion 39 is formed with a straight portion 95 corresponding to the orientation flat of the substrate. It becomes the curved part 96 other than that.

That is, the linear part 95 corresponding to the orientation flat of the board | substrate 9 is formed over the part adjacent to the fixed mounting part 39 of the center fixed mounting part 39 and the lifting mounting part 38. As shown in FIG. The curved part 96 is formed in the outer side part of the elevating mounting part 38, and over the fixed mounting part 39 of both sides. Since both of the elevating mounting portion 38 and the fixed placing portion 39 have the straight portion 95 and the curved portions 96, neither the elevating placing portion 38 nor the fixed placing portion 39 is the substrate 9. It can be held without rotating. In addition, these mounting parts 38 and 39 can be easily created by cutting | disconnecting the one integrally formed.

In addition, in the Example shown in FIG. 8, only the lifting lowering part 38 lifted and the fixed mounting part 39 was demonstrated as being fixed. However, the present invention is not limited to this, and not only the lifting lowering portion 38 but also the portion corresponding to the fixed mounting portion 39 may be lifted and lowered. Such an embodiment will be described later.

Referring to FIG. 9, two substrate hand tools 17 are provided in this embodiment. This is to perform the transfer of the substrate 9 between the two cassettes 8 and the substrate transfer robot 4. As shown in FIG. 9, the two cassettes 8 can be separated from each other and passed to the substrate transfer robot 4 as it is, for substrate processing. However, in this case, since a large space is created in the center portion, nonuniformity occurs in the flow of the processing liquid in the processing tank, and the substrate 9 and other substrates facing the center portion among the substrates 9 taken out from the respective cassettes. There exists a possibility that a processing nonuniformity may arise between (9). Therefore, as shown in FIG. 9, it is preferable to hold the board | substrate 9 contained in the two cassettes 8 to the board | substrate conveyance robot 4 with the same eye_space. In this embodiment, the width narrowing device 42 for narrowing the width | variety of two board | substrate hand tools 17 as shown by the dashed-dotted line in FIG. 9 is provided.

The configuration of the width narrowing device 42 is as follows. Referring to FIGS. 10 (a) and 10 (b), the width narrowing device 42 includes a pair of guide rails 43 mounted on the platform 20 and slides freely in the guide rails 43. It includes a narrowing link mechanism 44 for narrowing by connecting a pair of the aforementioned pipe support 31.

The narrowing link mechanism 44 is rotatable about the support shaft 82 and the support shaft 82 provided to extend downward from the center of the platform 20 as shown in FIGS. 10 (a) and 10 (b). The link arm 83 attached to the lower end of the support shaft 82 and a pair of link rods 84 each of which is rotatably attached to one end of the link arm 83 to the pipe support 31, respectively. Include.

In addition, the width narrowing device 42 includes a width narrowing driving cylinder 45 fixed to the rear surface of the platform 20. The tip of the piston of the narrowing drive cylinder 45 is fixed to one of the pipe supports 31. The tip of the piston of the narrowing drive cylinder 45 is fixed to one of the pipe supports 31. Therefore, by expanding and contracting the piston of the narrowing drive cylinder 45, the pair of pipe supports 31 are brought close to or fall by the action of the narrowing link mechanism 44.

By installing such a width narrowing device 42, the substrate 9 is lifted by the substrate hand tool 17 above the cassette 8 at the position indicated by the solid line in FIG. ) Can be narrowed to the position indicated by the dashed-dotted line in FIG. The space | interval of the center part in the width | variety board | substrate group becomes substantially the same as the space | interval between other board | substrates. Therefore, these can be collectively held by the board | substrate conveyance robot 4, and can be conveyed to a board | substrate processing part. Even when the processed substrates are accommodated in the cassette 8 by the substrate transfer robot, these substrates can be divided into two cassettes 8 by using a narrowing device.

Hereinafter, the structure of the board | substrate conveyance robot 4 is demonstrated. Particularly, as shown in FIG. 3, the substrate transport robot 4 includes a pair of left and right arm rotation shafts 47 parallel to each other protruding substantially in the same direction from the traveling unit body 46 and the traveling unit body 46, A shaft rotating means 48 (not shown in FIG. 11) for rotating the pair of arm rotating shafts 47 and a pair of substrate chucks 49 fixed to the respective arm rotating shafts 47 are included.

As shown in FIG. 3, a pair of substrate chucks 49 have a pair of chuck opposing surfaces 50 and a pair of chuck opposing surfaces 51 on the back side thereof. With reference to FIG. 11 (b), the substrate alignment holding grooves 52 and 53 are formed in both of the pair of chuck opposing surfaces 50 and the pair of chuck opposing surfaces 51, respectively. The pitches of these substrate alignment holding grooves 52 and 53 are the same as the pitches of the substrate alignment receiving grooves formed in the cassette 8. In a state in which the substrate 9 is not held, the pair of substrate chucks 49 are rotated by rotating the rotary shaft 47 so that the pair of chuck facing surfaces 50 are different from the postures facing the pair of chuck facing surfaces 50. Is switched between opposing postures. In this case, the pair of substrate chucks 49 are held in an open position as shown in FIG. 11 (b). In this position, the substrate 9 can be held as the substrate alignment holding grooves 52 or 53.

Further, the arrangement pitches of the substrate alignment holding grooves 52 and 53 of the chuck opposing surfaces 50 and 51 are the same as the arrangement pitches of the substrate alignment receiving grooves of the cassette 8 in the above embodiment. However, these may not be the same and may be arranged at a pitch of 1/2 of the pitch of the arrangement of the substrate alignment receiving grooves of the cassette 8, for example. This is because the case where the substrate 9 taken out from the cassette 8 is converted to 1/2 by an array pitch conversion device or the like is also considered.

The specific configuration of the substrate chuck 49 is as follows. Referring to FIG. 11 (a), the substrate chuck 49 includes a plate-shaped chuck body 54 and end plates 55 attached to both ends of the chuck body 54. The arm rotation shaft 47 is inserted into the central portion of the chuck body 54 and the abutment portions of the end plate 55 so that the chuck body 54 and the end plates 55 are fixed. A pair of reinforcement pipes 59 are attached in parallel between the end plates 55, and these reinforcement pipes 59 are inserted into and fixed in the chuck body 54.

Referring to FIG. 11 (b), the substrate alignment holding grooves 52 and 53 of the chuck body 54 both have the substrate 9 when the substrate 9 is held by the substrate chuck 49. It is formed in an arc shape so as to follow the edge.

In addition, with reference to FIG. 11 (c), the edge part 57 of the open side of the board | substrate alignment holding grooves 52 and 53 is cut off.

The concrete structure of the substrate chuck 59 is not limited to what is shown in FIG. 11 (a)-(c), For example, you may comprise so that it may appear in 11th (d) and (e). In the substrate chuck shown in FIGS. 11 (d) and (e), the groove forming pipe 58 having the substrate alignment holding grooves 52 and 53 in the reinforcement pipe 59 is carved outwardly. In this case, by screwing the end plate 55 to the reinforcing pipe 59 (see also eleventh (e)), the groove forming pipe 58 is interposed between the both end plates 55, and a certain pressure is applied. Can be fixed by walking.

The shaft rotating means 48 for rotating the arm rotating shaft 47 and the moving devices for moving the traveling unit body 46 in the conveying direction of the substrate have the following structure.

Referring to Fig. 12A, the shaft rotation means 48 includes a pair of shaft-rotating motors. Both of these shaft-only motors are fixed on the traveling unit body 46. The arm rotation shaft 47 is connected to the output shaft 60 of these shaft-only motors via the shaft joint 61. By separately driving these shaft-only motors, the arm rotation shaft 47 can be rotated, respectively.

The driving drive means 62 of the driving unit body 46 includes a driving drive motor. This traveling drive motor is fixed to the stator frame 63 of the substrate processing apparatus. A drive pulley 65 is attached to the tip of the output shaft 64 of the drive motor. In FIG. 3 and FIG. 4 of the substrate processing apparatus, induction flippers (not shown) are rotatably attached to the holder frame 63 in the right direction. An interlocking belt 66 is wound between the drive pulley 65 and an induction pulley not shown. The travel part body 46 is attached to this interlocking belt 66.

12 (b), the lower part of the traveling part main body 46 of the fixing frame 63 is flat, and a pair of parallel guide rails 67 are provided on the flat upper surface thereof. have. The traveling portion main body 46 can travel freely on the pair of guide rails 67.

In the example shown in FIG. 12 (a), (b), the two shaft rotation exclusive motors are used as the shaft rotation means 48. As shown in FIG. However, as shown in Figs. 12 (c) and (d), one shaft rotating motor may be used for the shaft rotating means 48. In that case, the drive gear 68 is fixed to the tip of the output shaft 60 of the shaft-only motor. In addition, an inverted gear 69 engaged with the drive gear 68 is attached on the traveling body 46. Then, a pair of arm rotation shafts 47 are rotatably attached to the traveling part body 46, and an input gear 75 is attached to one of the arm rotation shafts 47, and an input gear 71 is attached to the other. The input gear 70 is engaged with the driving gear 60, and the input gear 7l is engaged with the inverting gear 60, respectively. With this configuration, by driving the axis-only motor of the axis rotating means 48 and rotating the output shaft 60 in a certain direction, the pair of arm rotating shafts 47 are driven in the opposite direction and the axis-only motor respectively. By rotating the output shaft 60 in the reverse direction, the pair of arm rotation shafts 47 each rotate in the opposite direction as before.

Moreover, the structure shown in FIG. 12 (d) can also be considered as the driving | operation drive means 62 of the traveling part main body 46. FIG. In the example shown in FIG. 12 (d), the driving drive motor is used as the driving drive means 62. FIG. This traveling drive motor is attached to the traveling part main body 46. The output shaft 64 of this traveling drive motor protrudes from the lower surface of the traveling part main body 46, and the pinion gear 72 is fixed here. The rack gear 73 is provided on the upper surface portion of the one-side fixing frame 63. The drive sub-body 46 can reciprocate on the guide rails 67 by engaging the pinion gear 72 and the rack gears 73 to drive a certain drive motor with the drive drive means 62.

In addition, as shown in FIG. 3, the substrate conveying robot 46 has the substrate conveying position 77 (right in FIG. 3) and the second substrate conveying position (FIG. 3) in FIG. It is possible to make a round trip with the left). The substrate water transfer position of FIG. 1 is a position where the transfer of a board | substrate is performed between the board | substrate transfer part 3 and the board | substrate conveyance robot 4. As shown in FIG. The second substrate transfer position 78 is a position where substrate transfer is performed between the substrate transfer robot 4 and the substrate processing unit 5. The structure of the substrate processing unit is as follows. Referring again to FIGS. 2 to 4, the substrate processing unit 5 includes two separate system processing units of the pickling processing unit 5b for pickling without overflowing the overflow type cleaning processing unit 5a. do. The cleaning processing section 5a includes two overflow type processing tanks 74a. The pickling processing unit 5b includes a processing tank 74b which is not an overflow type. Predetermined chemical liquids 80 are supplied to these cleaning processing portions 5a and 5b from the cleaning chemical liquid storage containers 106A-106E shown in the lower left direction in FIG.

Two of these processing tanks 74a are processing tanks for performing an overflow type washing process. The treatment tank 74b is a treatment tank that performs pickling without overflowing. In each processing tank 74a, 74b, the process board mounting tool 75 which supports the board | substrate 9 is provided. In addition, elevating driving means 76 (refer to FIG. 1, FIG. 4) is provided in each processing board mounting tool 75, and the processing board mounting tool 75 is able to raise and lower by the lifting driving means 76. As shown in FIG. .

That is, with reference to FIG. 3, the case where the board | substrate conveyance robot 4 is located in the 2nd board | substrate capital position 78 is considered. In this case, it is assumed that water transfer of the substrate is performed between the central treatment tank 74a. The processing substrate placing member 75 is located at the substrate processing position 79 in the processing tank 74 when descending to the second substrate water transfer position 78 when raised. In the raised position, the processing substrate placing member 75 can support the lower portion of the substrate 9 held by the substrate transfer robot 4. In the substrate processing position 79, the substrate 9 supported by the processing substrate placing tool 75 is immersed in the processing liquid in the processing tank 74a.

Referring to FIG. 6 (a), the overflow type cleaning processing section 5a includes two substrate cleaning tanks 74a and 74a and a lower portion of each substrate cleaning tank 74a under each of the substrate cleaning tanks 74a. A cleaning liquid supply port 104 for supplying a plurality of types of cleaning liquids at an arbitrary ratio, and a cleaning liquid discharge port 140 for discharging the cleaning liquid overflowed from each substrate cleaning tank 74a.

This overflow type substrate cleaning tank 74a is made of quartz glass. The side surface is formed in a V-shape at the lower portion thereof, and its planar shape is almost rectangular. The substrate cleaning tank 74a is not limited to a edible glass. For example, when using hydrofluoric acid which corrodes quartz glass as the cleaning liquid, the substrate cleaning tank 74a may be formed of a resinous material such as tetrafluoroethylene resin having corrosion resistance against hydrofluoric acid.

The structure of the cleaning liquid supply part 104 of the overflow type cleaning process part 5a is demonstrated below with reference to 6th (A). In addition, in the following description, since the washing | cleaning process is performed in the substrate processing tank 74a, it shall be called the substrate cleaning tank 74a. The cleaning liquid supply unit 104 includes a plurality of chemical liquid introduction valves 108 connected to the pure water supply pipe 103 connected to the lower portion of each substrate cleaning tank 74a and the pure water supply only 103 through the introduction variable plate 116, respectively. And a plurality of chemical reservoirs 106 (106A-106E in FIG. 3) connected to the respective chemical liquid introduction valves 108A-108E via the chemical liquid delivery means 125, respectively.

In the pipeline from the pure water supply pipe 103 to each of the substrate cleaning tanks 74a, the supply and drain valve 113, the static mixer 114, and the aforementioned inlet valve connecting pipe are sequentially moved upstream from each substrate processing tank 74a. 116 and on-off valve 127 are provided. The pure water supply pipe 103 is supplied with pure water (Dw) heated at normal temperature or to a predetermined temperature. It is more preferable to use deoxidation treatment for pure water (Dw) to prevent surface oxidation of the substrate.

The supply valve 113 is always supplied with pure water (Dw) and the processing liquid to the substrate processing tank 74a. The gradient liquid switching valve 113 is switched so as to discharge the processing liquid in the substrate processing tank 74a to the drainage drain 143 described later through the drainage pipe 142 described later as needed.

The static mixer 114 includes a mixer conduit and torsional tubes (not shown) with holes provided in the mixer conduit. The static mixer 114 is intended to cause confusion by torsion plates in the flow of pure water (Dw) and chemical liquids (Q _A -A _E ) flowing in the mixer tube, thereby mixing them uniformly. In addition to this static mixer 114, other types of mixers may be used. In addition, if the conduit from the inlet valve connecting plate 1116 to each substrate cleaning tank 74a is sufficiently long, such a mixer may be removed.

The chemical liquid introduction valves 108A-108E described above are fixed to the inlet valve connecting pipe 116 disposed upstream of the static mixer 114, as shown in FIG. 7C. It is connected to the pure water supply pipe 103 through 116.

The chemical liquid introduction valve 108 has been proposed by the applicant of the present application in the Japanese Utility Model Registration Application (Application No .: Utility Model Registration Application No. 93634). The chemical liquid introduction valve 108 includes a valve body 180. In the valve body 180, a chemical liquid introduction chamber 181 and a valve driving chamber (not shown) are partitioned. The valve shaft 183 penetrates through the chemical liquid introduction chamber 181 and the valve driving chamber. A chemical liquid supply pipe 107 (107A-107E) is connected to the chemical liquid introduction chamber 181 through the chemical liquid pressure feeding means 125 described above. The valve body 184a is fixed to the front end of the valve shaft 183 in the chemical liquid introduction chamber 181. The valve body 184a is configured to be closed by the valve seat 184b formed in the inlet valve connecting pipe 116. The valve body 184a is opened and closed with respect to the valve seat 184b by combining the compressed air and the compression springs sent to the valve drive chamber. Thereby, the chemical liquids Q _A -Q _E can be pumped into the pure water supply pipe 103 by a predetermined amount through the respective chemical liquid introduction valves 108A-108E.

In this embodiment, the valve body 184a is blocked at the valve seat 184b formed in the inlet valve connecting pipe 116. Therefore, as is clear from the cross sectional view of FIG. 6 (c), the space which diverges from the pure water supply pipe 103 between the valve body 184a and the pure water supply pipe 103 is reduced. That is, the area where the chemical liquid supplied from the chemical liquid introduction valve 108 to the pure water supply tube 103 is blocked by making the distance from the valve seat 184b to the pure water passage of the pure water supply tube 103 as close as possible ( Shooter). Therefore, when each chemical liquid introduction valve 108A-108E is closed, the liquid shutoff of the chemical liquid 9 becomes good. Unnecessary chemical liquid is not mixed in the water supply pipe 103 for a long time. It is possible to precisely control the supply amount of each chemical solution Q _A -Q _E with respect to the supply amount of pure water Dw, and obtain a predetermined chemical liquid concentration. If the pure water is continuously supplied after the chemical liquid supply, there is no problem of the purity decrease of pure water. As a result, the surface cleaning quality of the substrate W is improved. In addition, there is no fear that pure water stays in the shooter area and bacteria are generated, and as a result, the surface cleaning quality of the substrate W is deteriorated.

In the above description, it is assumed that the chemical liquid introduction valves 108A-108E operate with compressed air. However, the present invention is not limited to this, and it is obvious that an electromagnetic open / close valve or the like can be used.

The chemical liquid delivery means 125 included in the cleaning liquid supply part 104 has the following configuration with reference to FIG. 6 (a). Each chemical liquid feeding means 125 includes a conduit connected to one end of the chemical liquid storage containers 106 and 106A and a pressure pump pump 115 of the chemical liquid connected to the other end of the conduit. A chemical liquid supply pipe 107A is connected to the discharge side of the chemical liquid pressure pump 115. The chemical liquid supply pipe 107A branches at the branching portion 118, and the ends of the branched chemical liquid supply pipe 107A are connected to the plurality of chemical liquid introduction valves 108A described above, respectively. The chemical liquid feeding means 125 is also provided at the discharge side of the pressure pump 115 and at the upstream side of the branch portion 118 of the chemical liquid supply pipe 107A (specifically, a pressure gauge) and a pressure detector 126. The driving source 119 for controlling the rotation speed of the pump pump 115 and the chemical pump control means 112 to control the rotation speed of the pump pump 115 to drive the pump pump 115. ) According to the above-described configuration, the pressure detector 126 detects an excess or deficiency of the detected pressure with respect to the predetermined set pressure and gives it to the chemical liquid conveyance control means 112. The chemical liquid feeding control unit 112 responds to the output of the pressure detector 126 to drive the driving source 119 of the pressure feeding pump 115 so that the chemical liquid fed to each substrate cleaning tank 74a is at a predetermined set pressure. .

Thus, even when the chemical liquid is supplied to both of the two substrate cleaning tanks 74a and 74b, and the chemical liquid is supplied to only one of the substrate cleaning tanks 74a and 74b, the single pump pump 115 The chemical liquid of the predetermined flow rate can be supplied, and the chemical liquid of a predetermined set amount can be supplied to each substrate cleaning tank.

In addition, in FIG. 6 (a), among the plurality of chemical liquid introduction valves 108A-107E, the chemical app pressure feeding of one type of chemical liquid Q _A introduced into the feed water supply pipe 103 by the chemical liquid introduction valve 108A is performed. The means 125 has been described. However, the chemical liquid conveying means for the other kinds of chemical liquids Q _B , Q _C , Q _D , Q _E also have the same configuration. If the chemical liquid conveying means 125 is configured as described above to supply the same kind of chemical liquid to the plurality of substrate cleaning tanks 74a and 74a, a common chemical liquid storage container is not prepared without preparing a plurality of chemical liquid current containers. Only one set may be arranged.

The cleaning liquid discharge part 140 includes an overflow liquid recovery part 141 installed around the upper opening of the cleaning tank 74a, drainage pipes 142 connecting the overflow liquid recovery part 141 and the drainage drain 143. do. The drain pipe 142 and the bottoms of the substrate cleaning tank 74a are connected to each other via the water supply and drain switching valve 113 as described above. The process liquid in the substrate cleaning tank 74a is discharged to the drain drain 143 by communicating the bottom of the substrate cleaning tank 74a with the drain pipe 142 by the water supply / exhaust switching valve 113.

Referring to FIG. 6 (b), the pickling processing unit 5b pickles more than one substrate processing tank (pickling tank) 74b and the bottom of the pickling tank 74b which collectively wash the plurality of substrates W. As shown in FIG. Pickling liquid supply unit 104b for supplying pickling liquid into the tank 74b, and pickling liquid recovery unit 140b for recovering pickling liquid from the pickling tank 74b.

The pickling liquid supplying part 104b includes a conduit connecting the washing chemical storage container 106 and the bottoms of the pickling bath 74b and chemical liquid conveying means 125b connected to the conduit. The chemical liquid feeding means 125b is, for example, a pumping pump.

The pickling liquid recovery part 140b branches from the pickling liquid supply part 104b, and includes a conduit connected to the cleaning liquid storage container 106 and closed valves installed in the conduit. The pickling liquid in the pickling tank 74b is recovered into the cleaning chemical storage container 106 by opening the closing valve and the on / off valves provided immediately upstream of the bottom of the pickling tank 74b.

In the above-mentioned example, the board | substrate washing | cleaning part 74a of the overflow type process part 5a combines two washing tanks in series. However, this invention is not limited to this, The process part 5a may also contain three or more board | substrate washing tank 74a. The pickling treatment is generally finished earlier than the other treatments. Therefore, two substrate cleaning tanks 74a are provided in the overflow processing unit 5a as in the present embodiment, and one substrate cleaning tank 74b is provided in the acid cleaning processing unit 5b. By doing in this way, since two types of cleaning processes are performed by sharing with two overflow type board | substrate washing tanks 74a and 74a, a process speed does not fall compared with the serial type washing process like the prior art. In the pickling treatment, a pickling treatment for the common substrate is performed in one pickling bath 74b, so that the space for the substrate drying unit 6 can also be effectively used.

Hereinafter, an example of the layout in the clean room of the substrate processing apparatus which concerns on this invention is shown. Referring to FIG. 5, the conveyance path 133 in the green room is branched from the clean room work station 130. On both sides of the conveyance path 133 at the branching position to the conveyance path 133, the water supply of the substrate cassette is performed between the main board conveyance robot in the clean room 130 and the substrate conveyance apparatus which conveys a board along the conveyance path 133. A station 132 is provided for the purpose. On both sides of the transfer path 133, a plurality of substrate processing apparatuses according to the present invention are arranged.

As shown in FIG. 5, the substrate processing apparatus which concerns on this invention is provided so that the cassette carrying-in / out stage 1 may face the direction of the conveyance path 133. As shown in FIG. The cassette placed on the cassette carrying in / out stage 1 by the cassette conveying apparatus is transferred to the substrate conveying robot in the substrate processing apparatus from the cassette by the substrate transferring part 3. The substrate conveying robot conveys the substrate according to the moving part 177. The substrate treatment section 5 (5a, 5b) is used to further dry the substrate drying section 6. The number of substrates between the processing units therebetween is performed by the substrate conveying robot that moves the moving unit 177 and the coarse substrate fixtures in the processing tanks 74a and 74b. The substrate is transferred back to the ashing portion 3 by the substrate transporting robot and transferred to the cassette which has been cleaned by the substrate ashing portion 3. . The cassette conveyance apparatus which moves the conveyance path 133 takes this cassette out of the substrate processing apparatus 21, and conveys it to the station 132. As shown in FIG. In addition, this cassette is conveyed to the subsequent process by the station cassette 132 by the jucassette conveying apparatus.

As shown in FIG. 2 and FIG. 5, the board | substrate carrying in / out stage 1 and the board | substrate transfer part 3 are arrange | positioned in the part which faces the conveyance path 133. As shown to FIG. At the rear, the substrate drying unit 6 and the substrate processing unit 5 are provided in the vertical direction in FIG. 5, and the moving unit 177 of the substrate is provided along the left side thereof. In addition, as shown in FIGS. 1 to 3, the substrate cleaning tanks 74 (74a and 74b), the supply and discharge piping chamber 120, and the cleaning liquid reservoir 106 of the substrate processing unit 5 are disposed in three stages above and below. They are stacked and laid out vertically and horizontally. This secured the maintenance space 99 on the right side in FIG. 5 of the portion in which these three tiers were stacked as shown in FIGS. 4 and 5. In the maintenance work area 24, the clean room 130 and the conveying paths 133 in the clean room are provided on the opposite side, so that the clean room may not be contaminated by the maintenance work.

The operations of the substrate processing apparatus of this embodiment will be described below with reference to FIGS. 1 to 4 and 6 to 12. FIG.

As shown in FIGS. 1, 3, and 4, two substrate cassettes 8 are placed at the loading position 10 of the cassette loading / unloading stage 1. The cassette conveyance robot 2 holds the cassettes 8 one by one, moves them up and down in FIG. 4, and inverts them by 180 degrees to place the cassettes 8 on the turntable 13. When the cassette transfer robot 2 mounts two cassettes 8 on two turntables 13, transfer of the substrate from the cassette 8 to the substrate transfer robot 4 is performed as follows.

Prior to mounting on the cassette 8 on the turntable l3, the substrate hand tool 17 is moved to its lowest position as shown in FIG. 3 by the elevating driving means 85 and the longitudinal screw shaft 19. As shown in FIG. Is descended. Subsequently, the turntable 13 is rotated 90 degrees by the rotary drive device 14 shown in FIG. 7 as shown in FIG. As a result, the cassette 8 also rotates 90 degrees, and the substrate 9 placed on the cassette 8 is parallel to the posture of the substrate 9 in the substrate processing unit 5.

With reference to FIGS. 3 and 8, the elevating drive device 37 is driven to raise and lower the elevating placing portion 38 to a position above the fixed placing portion 39. As shown in FIG. Subsequently, the lift drive means 85 is driven to move the substrate hand tool l7 upward. At this time, the substrate placing portion 18 at the tip of the substrate hand tool 17 passes through both the water supply insertion hole 16 provided in the turntable 13 and the lower opening 15 provided in the cassette 8, thereby providing a cassette 8 The board | substrate 9 mounted on the back side) is supported by the elevating mounting part 38 shown to FIG. 3 and FIG.

Therefore, when the substrate hand tool 17 reaches the lowest position, all the substrates 9 placed in the cassette 8 are supported by the two substrate hand tools 17 as shown in FIG.

At this time, it should be noted that since the lifting material chip 38 is located above the fixed mounting portion 39, the substrate 9 is supported only by the lifting mounting portion 38, and is not in contact with the fixed mounting portion 39. . Thereby, there is no possibility that the contaminants of the substrate before the treatment will adhere to the fixed mounting portion 39 and the processed substrate is supported by the rigid mounting portion 39 instead of the elevating mounting portion 38, thereby adhering to the substrate before the processing. There is no risk of recontaminating the substrate after processing with the contaminated material.

Subsequently, by operating the width narrowing device 42 shown in FIGS. 9 and 10, the pair of substrate hand tools 17 move in a direction close to each other. Thereby, as shown by the dashed-dotted line in FIG. 9, the space | interval of the board | substrate 9 becomes substantially constant over the board | substrate taken out from two cassettes. In addition, the substrate hand tool 17 is raised to raise the substrate 9 to a position where the substrate transport robot 4 can hold the substrate 9.

Prior to this, the substrate transport robot 4 is moved to the first substrate water transfer position 77 shown in FIG. 3 by the traveling driving means 62 shown in FIG. In addition, the pair of substrate chucks 49 are raised so as not to interfere with the substrate 19 which has been raised by driving the axial rotation means 48 shown in FIG.

When the substrate 9 has reached a sufficient height, the substrate chuck 49 is rotated so that the substrate 9 as shown in FIGS. 11 (a) and (b) is opposite to one side of the substrate chuck 49 ( It holds by the board | substrate alignment holding groove 52 of 50). At this time, care should be taken that the substrate 9 does not come into contact with the other pair of chuck facing surfaces 51. For this reason, there is no possibility that contaminants adhering to the untreated substrate 9 may adhere to the substrate alignment holding grooves 53 of the other chuck facing surface 51. If the processed substrate is held by the substrate alignment holding grooves 53 of the chuck facing surface 51, there is no fear that the processed substrate may be recontaminated by the contaminants of the substrate before the treatment.

Referring to FIG. 3, the substrate transport robot 4 is moved to the second substrate water transfer position 78. Then, the substrate 9 held by the substrate transfer robot 4 may be placed on the processing substrate holder 75 by raising the processing substrate placing member 75 in the substrate processing unit 5. As the processing substrate placing tool 75 descends again, the substrate is immersed in the treatment agent 80 in the processing tanks 74a and 74b and the like, and the surface treatment to the substrate is performed. In addition, prior to such treatment, the washing liquid of a desired configuration is supplied to the treatment tanks 74a and 74b by the washing liquid supplying portion 104a and the pickling liquid supplying portion 104b shown in FIG.

After the cleaning is completed, the substrate 9 is again transferred to the substrate transfer robot 4 and dried in the substrate drying unit 6. After completion of drying, the substrate 9 is also transferred to the substrate transport robot 4 and conveyed to the first substrate water transfer position 77 shown in FIG.

When conveying the processed substrate to the substrate transfer robot 4, the chuck facing surface where the unprocessed substrate is conveyed by rotating the pair of substrate chucks 49 by 80 degrees with reference to FIGS. 11 (a) and (b). The substrate 9 is held not only by the substrate 50 but by the substrate alignment holding grooves 53 formed on the other chuck facing surface 51. Thereby, there is no possibility that the contaminants adhering to the untreated substrate as described above may re-contaminate the substrate 9 after the process through the substrate chuck 49.

Moreover, the substrate processing apparatus which concerns on this invention can also be applied to the preprocessing washing | cleaning apparatus of an oxidation-diffusion process. In that case, the already cleaned substrate is washed again. Therefore, there is little concern about cross-conference, which is clean enough to be an untreated substrate and recontaminates the processed substrate from contaminants of the untreated substrate as described above. Therefore, the chuck facing surfaces 50 and 51 of the substrate chuck 49 may be distinguished from each other before and after the cleaning process, and eventually, for the retained substrate and the retained substrate. This will be described later.

Next, a description will be given of a water transfer method of the substrate to the cassette 8 cleaned by the substrate transfer robot 4 at the first substrate transfer position 77. Prior to this, the cassette 8 in which the substrate is taken out and emptied is passed to the cassette cleaner 7 by the cassette transport robot 2, and cleaned by the cassette cleaner 7. The cleaned washing section 8 is again placed on the cassette placing table 13 by the cassette conveying robot 2. In this way, when the cassette conveying robot 2 feeds the cassette between the cassette placing table 13, the substrate hand tool 17 needs to be placed in the lowered position as shown in FIG.

The turntable 13 on which the cleaned cassette 8 is placed is rotated 90 degrees in advance so that the alignment direction of the substrate accommodated in the cassette and the alignment directions of the substrate are parallel in the substrate processing unit 5. By driving the elevating driving means 85, the substrate hand tool 17 is mounted on the tap opening hole 16 of the turntable 13 and the lower opening of the cassette 8 placed on the turntable 13 ( Pass it through both drops of 15) and raise it to the position of substrate water. In addition, the pair of substrate hand tools 17 are narrowed by the width narrowing device 42. At this time, the elevating mounting portion 38 is lowered with reference to FIG. 8 to be positioned below the fixed mounting portion 39. In this way, the processed substrate is supported by the fixed mounting portion 39. The fixing mounting part 39 as described above does not contact the untreated plate 9. Therefore, there is no fear that the processed substrate 9 will be recontaminated by the contaminants of the untreated substrate.

The substrate 9, which has been moved to the first substrate transfer position 77, is supported by the substrate placing portion 18 on the pair of substrate hand tools 17. As shown in FIG. By rotating the substrate chuck 49, the substrate 9 is completely moved to the substrate placing unit 18. The board hand tool 17 is lowered using the elevating drive means 85, and at the same time, the board narrowing device 42 is used to divide these boards into two groups. As the substrate hand tool 17 descends completely below the turntable 13, the substrate 9 supported by the substrate placing unit 18 is accommodated in the cleaned cassette 8.

After the turntable 13 is rotated 90 degrees, the cassette conveying robot 2 conveys these cassettes to the unloading position 12 shown in FIG. 4, for example. The cassette 8 mounted at the carrying out position 12 is conveyed to the next process by the board | substrate conveying apparatus not shown.

In this substrate processing apparatus as described above, contamination of the substrate is prevented as follows. First, referring to FIG. 3, when carrying the unprocessed board | substrate 9 in the board | substrate conveyance robot 4, the pair of chuck | zipper facing surface 50 of the board | substrate chuck 49 is used. Moreover, when conveying the processed board | substrate 9, the board | substrate is hold | maintained using the chuck | zipper facing surface 5l of the back surface. In this way, there is no fear that the contaminants adhering to the unprocessed substrate 9 will adhere to the chuck facing surface 51 holding the processed substrate. Therefore, there is no fear that the processed substrate 9 will be recontaminated with contaminants attached to the untreated substrate 9.

In addition, the unprocessed substrate 9 is supported by the elevating mounting portion 38, and the processed substrate 9 is supported by the fixed mounting portion 39 in the substrate hand tool 17. Therefore, there is no fear that the contaminants adhering to the unprocessed substrate may be reattached to the processed substrate 9 through the elevating mounting portion 38 and the fixed placing portion 39.

In the above-described embodiment, the processing substrate placing unit 75 is provided in the processing tanks 74a and 74b of the fin processing unit 5. And when the board | substrate of the board | substrate with the board | substrate conveyance robot 4 is raised, the process board mounting part 75 is raised to the 2nd board | substrate water supply position 78, and the water of the board | substrate 9 is not lowered. Is done. Therefore, the substrate chuck 49 is not contaminated by the contaminants attached to the substrate chuck 49 in the processing tanks 74a and 74b without needing to be immersed into the processing tanks 74a and 74b. In addition, since it is not necessary to break the substrate chuck 49 into the processing tanks 74a and 74b, the number of dimensions of the substrate chuck 49 can be shortened. As a result, the vibration of the substrate chuck 49 is reduced during substrate transfer. The sliding between the board | substrate 9 and the board | substrate alignment holding grooves 52 and 53 of the board | substrate chuck 49 is also reduced, and generation | occurrence | production of a particle is reduced. Therefore, chipping of particles into the processing tanks 74a and 74b is reduced, and contamination of the substrate 9 due to the particles is also reduced.

13 (a)-(d) show a modification of the substrate chuck 49 in consideration of the case where the substrate chuck 49 is divided into the holding of the dried substrate and the holding of the wet substrate.

The substrate chuck 49 of the modification shown in FIG. 13 (a) forms the liquid stop groove 54a at the upper and lower ends of the main body 54 of the chuck shown in FIG. 11 (a). The liquid stop groove 54a is disposed at both ends of the end face of the substantially spindle-shaped chuck body 54 and is formed in the longitudinal direction of the chuck body 54. According to the substrate chuck 49 of this modification, the droplets attached to the substrate 9 when the substrate 9 has been immersed in the substrate processing unit 5 are held by the chuck 49. It flows down through and guides into this liquid stop groove 54a. When holding the board | substrate 9 dried on the pair of chuck | zipper counter surface 50 of the other side, the liquid stop groove 54a in which the droplet was guided is located upwards. However, the droplets do not flow down in the liquid stop groove 54a due to the surface tension of the magnetic body, and thus droplets are prevented from adhering to the dried substrate 9.

In the modification shown in FIG. 13 (b), the chuck body 54 is formed of a rod member having a substantially rectangular cross section (rectangle) in place of the plate member in FIG. In this case, the arm rotation shafts 47 are spaced apart from each other, or the arm rotation shafts 47 are spaced apart from each other by using a parallel rotation means for driving in the direction of approach. At the same time, the arm rotating shaft 47 is rotated to switch the chuck facing surfaces 50a and 50b. Substrate alignment holding grooves are formed on the pair of chuck counter-facing surfaces 50a and 50b parallel to each other so as to be symmetrical with respect to the female rotation shaft 47. The liquid stopping groove 54a is formed along the apex portion where the substrate alignment holding groove is not formed.

FIG. 13 (c) shows a modified example in which the chuck body 54 is replaced with the one in FIG. In this modified example, the substrate alignment holding groove is formed on the side of the drum type, and the substrate 9 can be held on one side as well as the substrate 9 is held on the entire side. Further, a liquid stop groove 54a is formed in each of the surface and the bottom surface on which the substrate holding groove is not formed. Also in this example, the mechanism which moves the arm rotating shaft 47 apart and approaches each other is employ | adopted.

13 (d) shows that the chuck body 54 is formed of a rod member having a substantially triangular cross section. Three sets of chuck facing surfaces 50a, 50b, and 50c can be switched using three sides of a triangular shape. Moreover, the liquid stop groove 54a is formed in the part used as the boundary of each side surface. Also in this modification, the mechanism which moves the arm rotating shaft 47 apart from each other is employ | adopted.

FIG. 14 is a perspective view showing a mechanism for separating, approaching and rotating the arm rotating shaft 47 when the chuck body shown in FIGS. 13 (b)-(d) is used. The instrument shown in FIG. 14 is nearly equivalent to the instrument shown in FIG. 12 (a). The same reference numerals and names are given to the same parts. Their function is the same. Therefore, detailed description thereof will not be repeated here.

In FIG. 14, the arm rotation shaft 47 is attached to the left and right pairs of bases 46a and 46b, respectively. Together with these bases 46a and 46b, it is provided so that a movement is possible along the pair of guide rails 67a and 67b provided on the traveling part main body 46. As shown in FIG. In addition, a pair of actuators 48a and 48b are fixed on the running unit body 46, and the bases 46a and 46b can be reciprocated by the guide rails 67a and 67b by these actuators 48a and 48b. It is supposed to be done.

15 and 16 are side cross-sectional views of the main part showing the substrate placing portion 218 of the modification of the substrate placing portion 18 of the substrate hand tool 17. The substrate placing portion 218 is divided into five portions 238a and 239b in the same shape as the substrate placing portion 18 shown in FIG. Substrate alignment holding grooves are formed on the upper surfaces of the elevating mounting portions 238a and 239b. The substrate alignment holding groove has a straight portion 295 and a curved portion 296 as in the first embodiment. The straight portion 295 corresponds to the orientation plate of the substrate 209, and the curved portion 296 corresponds to the curved portion of the outer circumference of the substrate 209. Thus, the board | substrate mounting groove of both the elevating mounting parts 238a and 239b has the straight part 295 and the curved part 296, and the board | substrate is raised by either the lifting mounting part 238a or the lifting mounting part 239b. Even when 209 is held, rotation of the substrate 209 can be prevented.

Referring to FIG. 16, the elevating placing portion 238a and the elevating placing portion 239b are lifted up and down independently of each other. In addition, the two parts of the lifting lowering part 238a and the three parts of the lifting lowering part 239b are lifted together as a unit.

The elevating mechanism of the elevating mounting portion of the substrate hand tool 217 is rotatably attached to the distal end of the driving actuator 237 and the driving actuator 237 fixed to the box bottom of the head of the substrate hand tool 211. And the lifting bases 235a and 235b rotatably attached to opposite sides with respect to the swinging axis P of the swinging arm 236 and the swinging arm 236 oscillating in the vertical plane about the swinging axis P. As shown in FIG. It is fixed to both ends of the elevating base 235a, and is fixed to both ends and the center of the elevating rod 234a and the elevating base 235b having the elevating mounting portion 235a attached to the front end thereof. It includes three lifting rods 234b to which the lifting lowering part 239b is attached.

By raising and lowering the rod of the driving actuator 237, the substrate placing portions 238a and 239b are raised and lowered in opposite directions, respectively, so that the height with the raising and lowering portions 238a and 239b can be switched. And it is comprised so that a board | substrate may be hold | maintained by either one in the raise position among the board | substrate mounting parts 238a and 239b.

17 to 19 show another variation of the substrate hand tool. With reference to FIGS. 17-19, the substrate hand tool 361 is, for example, in the support cylindrical member 336 attached to the pipe support 31 shown in FIG. Includes the inserted rotating rod 338 and the support frame 340 fixed to the top of the rotating rod 338. As shown in FIG. 18, the support frame 340 is formed in a "⊃" shape, and its upper and both sides are open. The substrate placing part 320 is attached to an upper portion of the support frame 340.

18 and 19, the substrate placing portion 320 has holding portions 345 and 346 for holding the substrate. Each of the holding portions 345 and 346 is a member having a predetermined width and length whose upper surface is formed in a jaw shape, and is fixed to the connecting member 347 by a screw 353. Substrate holding grooves 345a and 346a are formed on opposite sides of the holding portions 345 and 346, respectively. These board | substrate holding grooves are arcuate shape as shown in FIG. 19, The board | substrate outer part is inserted in this, and a board | substrate is hold | maintained. The connection member 347 is rotatably supported by the support frame 340.

Referring to FIG. 18, the rotary actuator 348 is fixed to the lower surface of the support frame 340. The rotary actuator 348 has a drive shaft 349. The first tooth 350 is fixed to the drive shaft 349. The first tooth 350 is engaged with the third tooth 352 via the second tooth 351. The third tooth 352 is fixed to one end of the connecting member 347. In addition, the second tooth 351 is rotatably supported by the side wall of the support frame 340.

In addition, the substrate hand tool 316 shown in FIGS. 17-19 uses, for example, the lifting table 20, the longitudinal screw shaft 19, and the lifting driving means 85 shown in FIG. It is lifted up and down. In addition, unlike the example shown in FIG. 3, the rotation rod 338 of the substrate hand tool 316 is connected to a rotation drive motor (not shown), and the support frame 340 is rotated by the rotation of the rotation drive motor. The predetermined angle is rotatable. Thus, for example, the alignment direction of the substrate can be rotated without using the turntable 13 shown in FIG. In addition, two board | substrate hand tools 316 are prepared like the example shown in FIG. 9, and are narrowed by the mechanism similar to the width narrowing device 42. As shown in FIG.

In the substrate hand tool 316 shown in FIGS. 17-19, one of the holding portions 345 and 346 is driven by driving the rotary actuator 348 to rotate the connecting member 347. Can be placed up. Thus, for example, when the unprocessed substrate is held by the holding unit 345 and the switch is held so as to hold the processed substrate by the holding unit 346, the contaminants adhered to the unprocessed substrate may cause the substrate hand tool 316 to fall off. There is no fear of reattaching to the substrate after processing. Moreover, when holding is carried out by switching the holding tools 345 and 346 described above between the wet substrate and the dried substrate, there is no fear that the watermark will adhere to the dried substrate.

In either of the examples shown in Figs. 8 and 17-19, the substrate hand tool has two substrate placing parts. However, the number of substrate placing parts is not limited to two. For example, referring to FIG. 20, for example, a triangular connecting member 388 may be used, and the substrate placing portions 385, 386, and 387 may be provided on these three side surfaces, respectively. Substrate alignment retaining grooves 385a, 386a, and 387a are formed in each of the substrate placing portions 385, 386, and 387. By rotating the connecting member 388 by 120 degrees, the substrate placing portions 385, 386, and 387 are formed. Either one can be positioned at the top, and these three substrate placing parts can be distinguished and used in some cases.

Alternatively, as shown in FIG. 21, the substrate mounting portions 390, 391, 392, and 393 may be provided on the four side surfaces by using the quadrangular connecting member 394. Grooves 390a, 391a, 392a, and 393a are formed. By rotating the connecting member 394 in increments of 90 degrees, any one of the four substrate placing portions 390, 391, 392, and 393 can be positioned at the top, and these four substrate placing portions can be distinguished and used. .

Further, as shown in FIG. 22, a nozzle 395 for spraying washing water may be provided under the substrate placing tool 320. As shown in FIG. When the substrate placing portions 345 and 346 are positioned downward, the substrate placing portions 345 and 346 which are not in use can be cleaned by jetting the washing water from the nozzle 395. This further reduces the risk of contamination of the substrate after the treatment.

Claims (24)

Substrate loading / unloading means for removing the substrate from the cassette for accommodating the plurality of substrates at a predetermined interval from each other, and for loading the plurality of substrates into the cassette, and a plurality of substrate loading / unloading means between the substrate loading / unloading means and a predetermined position. A substrate conveying means for conveying while collectively holding the substrate and a predetermined process arranged at the predetermined position to exchange a plurality of substrates by the substrate conveying means, and returning the plurality of processed substrates to the substrate conveying means. A substrate carrying means comprising: a main body, a pair of axes parallel to each other, protruding in a predetermined direction from the main body, and a longitudinal direction of the pair of axes parallel to a central axis of the pair of axes A pair of substrate chuck means attached to each other so as to be connected with the main body and the pair of axes, and the axis is the main axis of the central axis. A first position for transferring the substrate between the shaft rotation means for improving upward, the main body and the substrate load / unload means, and a second position for transferring the substrate between the substrate processing means. A pair of substrate chuck means having a plurality of sets of opposing surfaces, each of the opposing surfaces of the plurality of sets of opposing surfaces intersecting with a longitudinal direction of the substrate chuck means. It has a plurality of substrate alignment holding grooves for accommodating the end of the substrate formed in the direction, the axial rotation means by rotating the shaft, the plurality of substrates collectively by any set of opposing surfaces of the plurality of opposing surfaces The substrate processing apparatus characterized by holding. 2. The substrate alignment holding according to claim 1, wherein each of the pair of substrate chuck means has a substantially fusiform cross-sectional shape, and each of the opposing surfaces becomes a lower portion when opposed to the pair of substrate chuck means axes. A substrate treating apparatus having a groove. 3. A substrate processing apparatus according to claim 2, wherein each of the pair of substrate chuck means further has a liquid stop groove formed in the longitudinal direction along a vertex portion of the fusiform cross section. 4. A substrate processing apparatus according to claim 3, wherein each of the pair of substrate chuck means has the liquid stop grooves at both of the two apex portions of the fusiform cross section. The substrate processing apparatus according to claim 1, further comprising a distance changing means for changing a distance between the pair of substrate chuck means. 6. The apparatus according to claim 5, wherein the distance changing means is provided in the main body, and includes parallel moving means for moving the pair of axes in a direction perpendicular to the center line of each axis and in a direction opposite to the paired axes. Substrate processing apparatus to be. 7. The apparatus of claim 6, wherein each of the pair of substrate chuck means has a rectangular cross-sectional shape, and the plurality of opposing surfaces includes a pair of side surfaces formed by a pair of parallel sides of the rectangular chuck of the substrate chuck means. And each of the pair of side surfaces has the pin alignment retaining groove at a portion thereof which becomes upper when facing the pair of substrate chuck means paired. 8. A substrate processing apparatus according to claim 7, wherein each of the pair of substrate chuck means further has a liquid stop groove formed in the longitudinal direction along a vertex portion of the rectangular cross section. 7. A substrate processing apparatus according to claim 6, wherein each of the pair of substrate chuck means has a substantially north cross-sectional shape, and the opposing surface includes both sides of the north type. 10. The substrate according to claim 9, wherein each of the pair of substrate chuck means further has a liquid stop groove formed in the central portion of the head surface and the bottom surface of the drum-shaped cross section and in the longitudinal direction of the pair of substrate chuck means. Processing unit. 7. The substrate processing apparatus of claim 6, wherein each of the pair of substrate chuck means has a substantially triangular cross-sectional shape, and the plurality of opposing surfaces includes a plurality of triangular side surfaces. 11. A substrate processing apparatus according to claim 10, wherein each of the pair of substrate chuck means further has a liquid stop groove formed along the head portion of the triangular cross section and in the longitudinal direction of the pair of substrate chuck means. . The method of claim 6. And each of the pair of substrate chuck means further has a liquid stop groove formed in the longitudinal direction of the pair of substrate chuck means at mutually boundary portions of the plurality of opposing surfaces. The substrate loading / unloading means according to claim 1, wherein the substrate loading / unloading means holds a cassette stage on which a plurality of cassettes are placed, a cassette placed on the cassette stage, and conveys them to a predetermined substrate loading / unloading position. Cassette conveying means for conveying and placing the cassette placed in the unloaded position to the cassette stage, and a plurality of substrates installed at the substrate load / unloaded position, standing up and aligned, taken out collectively, and delivered to the substrate conveying means. And substrate ejecting means for receiving a plurality of substrates processed by the substrate transporting means and accommodating them into a cassette placed in the substrate loading / unloading position. 15. The cassette holding means according to claim 14, wherein the substrate ejecting means is provided on the opposite side to the cassette stage with respect to the cassette conveying means, the cassette conveying means comprising: cassette holding means capable of holding a cassette and releasing it from the holding; And rotation driving means for rotating the cassette holding means about a vertical axis. The moving means and the cassette moving means are arranged so that the extension of the moving path of the substrate by the moving means and the moving path of the cassette holding means by the cassette moving means cross each other at a predetermined angle. The cassette has an opening through which a plurality of substrates can pass and an opening of a predetermined size at its bottom, and the substrate ejecting means is provided at the substrate load / unload position, and the upper surface thereof. A rotating stage rotatably supporting the cassette at least by the predetermined angle and having an opening having a predetermined size on the upper surface, and disposed below the rotating stage, the opening of the bottom of the cassette and the upper surface of the rotating stage. A head for standing and aligning and supporting a plurality of substrates that can pass through both of the openings of the A substrate mounting means for carrying out the transfer of the substrate between the cassette placed on the stage and the substrate carrying means, and a relative height of the substrate transferring means relative to the rotation stage, thereby changing the rotation. Elevating means for supporting a plurality of substrates in the cassette mounted on the stage to the head of the substrate conveying means, or for receiving a plurality of substrates supported by the head of the substrate conveying means in the cassette placed in the rotating stage. Substrate processing apparatus comprising a. The substrate processing apparatus of claim 16, wherein the predetermined angle is a right angle. 18. The board according to claim 17, wherein the head portion of the substrate conveying means has a plurality of substrate supporting surfaces each having substrate alignment grooves for standing and supporting a plurality of substrates, and the substrate conveying means comprises a plurality of substrate holding means. And a support surface changing means for supporting the plurality of substrates by changing the substrate support surface. 19. The head of claim 18, wherein the head portion of the substrate watering means is divided into a plurality of portions in the longitudinal direction of the head portion, and each of the plurality of portions has the substrate alignment grooves on an upper surface thereof, and the support surface changing means. Is a relative height relative to the other of the plurality of portions between the predetermined one of the plurality of portions between a position higher than the other of the plurality of portions and a position lower than the other of the plurality of portions. A substrate processing apparatus comprising means for making. The said other thing in the said some part of the said head part is fixed with respect to the said lifting means, The means for changing the said relative height are the said predetermined | prescribed in the said some part of the said some part of the said head part. And means for elevating the substrate. 19. The head according to claim 18, wherein the substrate conducting means further includes means for rotatably supporting the head along the longitudinal axis thereof, wherein the head is different from the axis along the longitudinal direction of the head, respectively. It is disposed about an angle and has a plurality of substrate supporting surfaces having the substrate alignment grooves, and the supporting surface changing means changes the angle around the axis of the head so that the other substrate supporting surfaces are located at the top. A substrate processing apparatus comprising means for making. 22. The substrate processing apparatus of claim 21, wherein the head has two substrate surfaces. 22. The method of claim 21, wherein the substrate water supply means is provided under the head, and further comprises means for cleaning by spraying a predetermined cleaning liquid on the substrate support surface other than the substrate support ground located above the head. Substrate processing apparatus characterized by. The said substrate processing means is a process tank, the means for supplying a predetermined process liquid to the said process tank, The means for supplying a predetermined process liquid to the said process tank, And raising and lowering the substrate placing means for mounting a plurality of substrates, the position where water is transferred between the substrate placing means and the substrate transfer means, and a position where the substrate is immersed in the processing liquid in the processing tank. A substrate processing apparatus comprising means for.