JP2005133139A - Copper sulfate plating method and device for roll for plate making - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a copper sulfate plating method for the roll for plate making using an insoluble anode where a plating liquid freed of inevitable impurities causing nibs and pits with a filter is fed and plating is performed, and to provide a device therefor. <P>SOLUTION: A plating liquid obtained by adding copper-containing fine powder to sulfuric acid is stored in a plating liquid replenishment tank. Inevitable impurities contained in the plating liquid and causing nibs and pits are removed with a filter, and the resultant plating liquid is fed to a plating tank provided with the insoluble anode. The roll for plate making to serve as the body to be plated is disposed inside the plating tank in such a manner that both ends are chucked, is energized as a cathode and is rotated at a required revolving speed. The insoluble anode is brought close to the lower side of the roll for plate making, and plating is performed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a copper sulfate plating method and apparatus for a plate-making roll using an insoluble anode for supplying a plating solution from which inevitable impurities that cause blisters and pits are removed by a filter.

It is known that a conventional copper sulfate plating method and apparatus for a plate roll for gravure printing uses a phosphorous copper anode as an anode for electroplating copper. This phosphorous copper anode for electroplating is known. As one of these, a phosphorus-containing copper anode is known which contains phosphorus: 350 to 700 ppm, oxygen: 2 to 5 ppm, and the balance of copper and inevitable impurities.
A conventional copper sulfate plating method and apparatus for a plate roll for gravure printing is performed by placing a cassette type roll chuck rotating / conveying unit conveyed by a stacker crane on a plating apparatus main body frame and using the cassette type roll chuck rotating / conveying unit. A plate-making roll for gravure printing that is chucked at both ends is connected to the cathode, immersed in a plating solution stored in a plating tank and rotated, and a phosphor-containing copper ball, which is a plating metal immersed in the plating solution, is used as an anode. This was a method in which a plating current was passed between the plate-making rolls. Then, a copper ball made of phosphorous copper containing oxygen: 2 to 5 ppm and P: 350 to 700 ppm is charged and replenished to the plating tank to be plated at a high current density of 10 to 15 A / dm2. .
Phosphorus-containing copper balls contain unavoidable impurities, and black anode sludge adheres to the surface of the plated metal copper balls. The anode sludge is separated from the plated metal copper ball by the agitation of the solution and the dissolution of the plated metal copper ball, floats in the plating solution, adheres to the surface of the plate-making roll, and forms dents (microprojections) and pits (pinholes) It was the cause.
Also, to avoid the plating metal copper balls from dissolving too much and the copper ion concentration in the plating solution being too high, it is not possible to perform appropriate copper sulfate plating. Maintenance with a copper ion concentration plating solution was necessary.
In addition, also in the method of electrolytic copper plating on a semiconductor wafer, a method of flowing a plating current using a phosphorous copper ball as an anode is performed.
JP-A-5-214586 JP-A-8-67932 Japanese Patent Laid-Open No. 11-061488 JP 2003-171797 A JP 2002-275698 A

In the conventional copper sulfate plating method / apparatus for a plate roll for gravure printing, a plating method and apparatus using an insoluble anode are not employed at all.
The following technical literature is available as a copper sulfate plating method and apparatus using an insoluble anode other than the method of dissolving phosphorous-containing copper balls.
JP, 2003-166100, A ... Copper powder used for a copper plating method, and the usage method of copper powder. JP, 2002-068743, A ... Manufacturing method of easily soluble copper oxide, Easy soluble copper oxide, copper plating material, and copper plating method. JP 2002-515549 A ... Method of electrolytic copper plating of substrate Japanese National Patent Publication No. 08-501827 ... Method and apparatus for electrolytic plating of copper

  However, according to the conventional copper plating method using phosphorous-containing copper balls as an anode, inevitable impurities are accumulated in the plating solution, and the inevitable impurities adhere to the surface of the plate-making roll, resulting in bumps and pits. Adopting a copper plating method using a high purity phosphorus-containing copper ball used for copper sulfate plating on a semiconductor wafer as an anode leads to an increase in plating cost and cannot be adopted.

  Also, according to the conventional copper plating method using phosphorous-containing copper balls as the anode, the distance between the anode and the plate-making roll is large, so that the plating current is concentrated at both ends of the roll and the plating thickness is large near both ends of the roll. It was. For this reason, when grinding | polishing grindstone cylinder was grind | polished largely in the vicinity of both ends of a roll. The grinding wheel cylindrical polishing device is large and expensive, and it takes time to process. Therefore, when we examined the use of an electropolishing device that is small and inexpensive, and the processing time is short, electrolytic polishing Since the apparatus cannot polish the non-uniform plating thickness to be uniform, to apply the electrolytic polishing apparatus, it is necessary to construct a plating system that can make the plating thickness uniform over the entire length of the plate-making roll. I understood that.

  In order to solve the above-mentioned problems, the inventors of the present application have considered adopting a technique of performing a copper plating process on a plate-making roll using an insoluble anode. This method uses, for example, a titanium-coated catalyst as an insoluble anode, creates a plating solution outside the plating tank, captures inevitable impurities with a filter, and uses a plating solution that does not contain inevitable impurities. Anode sludge is not generated.

  The present invention has been devised by intensively researching and inventing a plating system using an insoluble anode so as to be applied to a plate roll for gravure printing, and a plating system capable of removing inevitable impurities that cause blisters and pits. There is a plating system that can obtain a uniform plating thickness over the entire length of the plate-making roll and can apply electrolytic polishing instead of grinding wheel polishing for mirror finishing after plating, and a plating system that is versatile with respect to the size of the plate-making roll An object of the present invention is to provide a copper sulfate plating method and apparatus for a plate-making roll that can be realized.

The inventors of the present application are equipped with a plating tank capable of performing copper sulfate plating that can control the liquid level when the plating liquid overflows, and can close up the plating tank when the plating tank is in the lowered position. And a washing apparatus for receiving a washing solution, a plating apparatus having a plating solution replenishing tank, and a cassette-type roll chuck rotating and conveying unit conveyed by a stacker crane. How to provide an insoluble anode for the plating tank after preparing the research equipment with a structure for positioning the plate-making roll for gravure printing that is chucked at both ends by the roll chuck rotary conveyance unit above the plating tank Plates with a uniform thickness over the entire length can be applied to plate rolls of different sizes without any pits or pits. It was studied in intensive for Luke.
As a result, it has been found that plating can be carried out without generating pits or pits by supplementary removal of inevitable impurities contained in the plating solution in the process of feeding the plating solution from the plating solution supply tank to the plating tank, and the roll facing surface When an insoluble anode, which is smooth and parallel to the plate-making roll, is energized so as to be an anode, is placed close to the lower surface of the plate-making roll so as to form a gap of 5 mm to 30 mm, a plating current is passed. It is possible to perform plating with a uniform thickness over the entire length of the roll without the influence of current concentration due to current wraparound, and it is possible to radiate ultrasonic waves, reduce the plating solution immersion area of the plate-making roll, or apply a shower. It was found that plating with a required thickness can be obtained in a short time by passing an electric current. However, if the diameter of the plate-making roll is different, the immersion area of the plating solution to the plate-making roll will be different each time, the plating current density will be different and the plating time will be greatly different, so it is difficult to manage the time in the automatic plating line There is a problem. Therefore, independent of the immersion control of the plating solution into the plate making roll, the insoluble anode is provided so that it can be raised and lowered, the gap is controlled independently, and the length of the insoluble anode is at least equal to or greater than the maximum length of the plate making roll. As a result of performing plating tests on plate-making rolls of various sizes while ensuring versatility for plate-making rolls of different sizes, copper sulfate that does not produce pinholes or pits within a time range that is not significantly different It was confirmed that plating was possible. Next, when many plate-making rolls are plated, the copper concentration and sulfuric acid concentration of the plating solution are insufficient. Therefore, the shortage of the copper concentration and sulfuric acid concentration of the plating solution is detected. As a result of automatically replenishing powder or sulfuric acid, the present invention of the present application has been completed by leading to automation and unmanned operation of the plating line.

According to the first aspect of the present invention, a plate-making roll, which is an object to be plated, is chucked at both ends by a roll rotating means, is placed in a plating tank, is energized so as to become a cathode, and rotates at a required rotational speed. The insoluble anode which is provided below the plate-making roll and has a length equal to or greater than the maximum length of the plate-making roll and which has a smooth surface facing the roll and is parallel to the plate-making roll and becomes an anode is raised. A copper sulfate plating method for a plate-making roll is provided, in which the plate-making roll is brought close to the lower surface of the plate-making roll, and plating is performed by supplying a plating solution from which inevitable impurities causing pinholes and pits are removed by a filter. There is.
The invention according to claim 2 stores a plating solution capable of performing copper sulfate plating by adding cupric oxide powder, copper carbonate powder, or copper sulfate powder to sulfuric acid in a plating solution replenishing tank. The plating solution stored in the plating solution is sucked up by the plating solution feeding means, and the inevitable impurities that cause pinholes and pits are removed by the filter provided in the plating solution feeding means and supplied to the plating tank equipped with the insoluble anode. Then, the plate-making roll, which is the object to be plated, is chucked at both ends by roll rotating means, placed in the plating tank, energized to become the cathode and rotated at the required number of rotations, and the length of the plate-making roll is longer than the maximum length. An insoluble anode which is energized so that the roll-facing surface is smooth and parallel to the plate-making roll and becomes an anode, and is plated close to the lower surface of the plate-making roll, It is to provide a copper plating method.
When the copper concentration and the sulfuric acid concentration of the plating solution in use are measured and the copper concentration is insufficient, the invention according to claim 3 includes any one of cupric oxide powder, copper carbonate powder, or copper sulfate powder. The required amount of fine copper powder, or when the sulfuric acid concentration is insufficient, the required amount of sulfuric acid is automatically replenished. The copper sulfate plating of the plate-making roll according to [Claim 1] or [Claim 2] It is to provide a method.
In the invention according to claim 4, after the plate making roll is positioned at a required position of the plating apparatus body, the elevating and lowering plating tank is raised so as to accommodate at least the lower half of the plate making roll, and then the insoluble anode is formed. The plating solution is placed close to the lower surface of the plate-making roll, and the plating solution is immersed in the lower surface of the plate-making roll, or plating is performed by applying the plating solution from the plating solution shower nozzle provided in the plating tank to the lower surface of the plate-making roll. An object of the present invention is to provide a copper sulfate plating method for a plate-making roll according to any one of claims 1 to 3.
In the invention according to claim 5, after the plate-making roll is positioned in the plating tank that does not move up and down, the insoluble anode provided in the plating tank is raised and close to the lower surface of the plate-making roll, and the plating in the plating tank The liquid level of the liquid is raised, and the plating is performed in a dipping state in which the plating solution completely immerses or immerses about 1/3 or more. (Claim 1) to (Claim 3) It is providing the copper sulfate plating method of the plate-making roll of any one of Claims.
The invention described in claim 6 is characterized in that the plating is performed by transmitting the ultrasonic wave transmitted from the ultrasonic transmission device to the plating solution [Claim 1] to [Claim 5]. It is in providing the copper sulfate plating method of the plate-making roll as described in above.
The invention according to claim 7 is characterized in that after completion of plating, the plate-making roll is washed by moving a washing-water receiving tray below the plate-making roll so that the washing water is not mixed into the plating tank. An object of the present invention is to provide a copper sulfate plating method for a plate-making roll according to any one of claims 1 to 6.
According to an eighth aspect of the present invention, there is provided a roll rotating means capable of rotating at a required number of rotations by energizing a plate-making roll, which is an object to be plated, at both ends to be a cathode at a required position, and the roll rotating means. An elevating and lowering plating tank provided on the lower side, and an insoluble anode that is energized so that it can be raised and lowered horizontally at the center of the plating tank so as to be longer than the maximum length of the plate making roll A plating solution replenishing tank for storing a plating solution capable of performing copper sulfate plating by adding cupric oxide powder, copper carbonate powder, or copper sulfate powder to sulfuric acid, and a plating solution stored in the plating solution replenishing tank A plating solution feeding means for sucking the solution through a filter and supplying the plating solution to the plating tank; and a plating solution feedback means for returning the excess plating solution from the plating tank to the plating solution supply tank. Diameter By making it correspond, the plating solution makes the lower surface of the plate making roll immersed, or the plating solution shower nozzle provided in the plating tank is positioned at a required height so that the plating solution can be applied to the lower surface of the plate making roll. The insoluble anode is raised after the plating tank is raised, and the proximity sensor detects the gap between the insoluble anode and the lower surface of the plate making roll so that the insoluble anode can be brought close to the lower surface of the plate making roll. An object of the present invention is to provide a copper sulfate plating apparatus for a plate-making roll.
According to the ninth aspect of the present invention, when the copper concentration and the sulfuric acid concentration of the plating solution in use are measured and the copper concentration is insufficient, any one of cupric oxide powder, copper carbonate powder, or copper sulfate powder is included. The plate making roll according to claim 8, further comprising means for supplying the required amount of fine copper powder to the plating solution supply tank when the sulfuric acid concentration is insufficient. The object is to provide a copper sulfate plating apparatus.

Effects of the Invention of Claim 1
(1) It is a plating method using an insoluble anode. Phosphorus-containing copper balls are dissolved in a plating solution supply tank as a copper source to be supplied to the plating solution, or cupric oxide powder, copper carbonate powder in the plating solution supply tank, Alternatively, either method of adding copper sulfate powder can be used, but plating can be performed by supplying a plating solution obtained by trapping and removing inevitable impurities that cause pinholes and pits contained in the copper source to the plating tank. Therefore, good copper sulfate plating without pinholes and pits can be performed.
(2) Conventionally, since the distance between the anode and the plate-making roll was large, the plating current was concentrated on both ends of the roll, and the plating thickness was increased near both ends of the roll. For this reason, the cylindrical polishing was also greatly polished near both ends of the roll. In contrast, in the present invention, plating is performed with an insoluble anode having a smooth roll-facing surface parallel to the plate-making roll close to the lower surface of the plate-making roll, so that the plating current has a uniform density over the entire length of the roll. Plating with uniform thickness can be performed. Therefore, if the roll diameter before plating is uniformly processed over the entire length, the roll diameter after plating is maintained at a uniform precision over the entire length, so cylindrical polishing of the roll after plating is not grinding wheel polishing. Polishing in which a soft material is slidable, preferably electrolytic abrasive polishing can be applied.
(3) Since the insoluble anode having a length longer than the maximum length of the plate-making roll is raised and brought close to the lower surface of the plate-making roll, plating is performed, so it has versatility for plate-making rolls with various diameter lengths. . Since plating is performed by bringing the insoluble anode close to the plate-making roll, even if the length of the plate-making roll is 1/2, for example, with respect to the insoluble anode, the plating current is not concentrated near the end face of the roll. A uniform plating current density is maintained over the entire length of the roll, and plating with a uniform thickness can be performed.

Advantages of the Invention of Claim 2 In addition to the effects (1), (2), and (3) of the invention of claim 1 above, the following effect (4) is obtained.
(4) Stop using copper balls and use a plating solution capable of copper sulfate plating by adding cupric oxide powder, copper carbonate powder, or copper sulfate powder to sulfuric acid. Even when plating is performed, it is avoided that a shortage of the copper source material occurs.

The effect of the invention of claim 3 Conventionally, the line operation was stopped when replenishing the phosphorus-containing copper balls. However, the present invention controls the copper ion concentration and sulfuric acid concentration of the plating solution and automatically controls the copper source material. Since metering and automatic replenishment can be realized, it is possible to avoid stopping the operation of the plating line when replenishing the copper source, and the operation rate of the line is increased, and the toxic cupric oxide powder, copper carbonate powder, or sulfuric acid It has a weighted effect of avoiding manual handling of copper powder.

The effect of the invention of claim 4 Since the plating tank is raised by the required stroke and then the insoluble anode is raised by the required stroke, even if the diameter of the plate making roll is large or small, the plate making roll corresponds to the diameter of the plate making roll. The plating solution immersion area and the gap between the insoluble anode and the lower surface of the plate-making roll can be set to optimum conditions and numerical values, respectively, so that optimum plating conditions by high-density current can be determined. Therefore, even if the roll diameter is large or small, the immersion area of the plating solution with respect to the plate making roll can be set within a certain range and the insoluble anode can be brought close to the lower surface of the plate making roll. Whatever the case, the current density can be controlled to be large and within a certain range, and a thick copper sulfate plating can be obtained in a short time.

The effect of the invention of claim 5 Even if the roll diameter is large or small, it is possible to apply a method in which the plating solution is immersed in a state where the plate making roll is fully immersed or about 1/3 or more, and plating is performed using an insoluble anode. Depending on the diameter of the plate-making roll, the immersion area of the plating solution of the plate-making roll and the gap between the insoluble anode and the bottom surface of the plate-making roll can be set to optimum conditions and numerical values, respectively, and optimum plating conditions with high-density current can be set. Can be determined.

The effect of the invention of claim 6 The plating is carried out by transmitting the ultrasonic wave transmitted from the ultrasonic transmission device to the plating solution, so that the stirring and dispersion of the copper ions in the plating solution is performed. It has a weighted effect that a thick plating can be performed in a short time.

The effect of the invention of claim 7 Conventionally, a strongly acidic plating solution adhering to the roll is obtained by washing the plate-making roll located in the plating tank by plating in a plating tank that can be completely submerged and plating. Rinsing is avoided immediately to avoid the occurrence of rust. At this time, the washing water mixes with the plating solution and dilutes the plating solution. In this invention, the washing solution is not mixed with the plating solution. It has a weighted effect that the concentration management of the toner becomes easy.

Effects of the Invention of Claim 8 The effects of the inventions of Claims 1, 2, and 4 to 5 are provided.
If an ultrasonic device is provided as a constituent requirement, the effect of the invention of claim 6 is also obtained.

The effect of the invention of claim 9 In addition to the effect of the invention of claim 8, it has the effect of the invention of claim 3.

A method and apparatus for plating a plate-making roll with copper sulfate includes a pair of oppositely energized chuck cones and an outer side of each chuck cone, which are provided in the plating apparatus main body and conveyed by a traveling roll conveyance robot. Either a roll chuck rotating means having a waterproof cap for hermetically sealing can be chucked at both ends, and the plate-making roll can be energized to the cathode via the chuck cone, or a cassette as disclosed in Japanese Patent Publication No. 57-36995 It is desirable that the cassette type roll chuck rotating and conveying unit, which is substantially the same as the automatic roll type desorbing apparatus, be a plating apparatus that can be adopted as the roll rotating means.
This cassette-type roll chuck rotating and conveying unit has a pair of opposed chuck cones and a waterproof cap that seals the outside of each chuck cone. The cassette type roll chuck rotating and conveying unit is conveyed by a stacker crane and chucks the plate-making roll, which is the object to be plated, at both ends for plating. When placed on the apparatus main body, the drive system is connected and can be energized to become a cathode at a required position and rotate at a required rotational speed.

  The plating tank is configured as a fixed tank, and after the plate making roll chucked by the roll rotating means is located in the plating tank, the plating solution is supplied from the plating solution replenishing tank to raise the liquid level. The plating solution is either completely immersed in the plate making roll or about 1/3 of the diameter, and the plating solution overflowing at a predetermined liquid level is returned to the plating solution supply tank, or movable up and down. After the plate making roll chucked by the roll rotating means is located in the plating apparatus main body, the movable tank rises by a required stroke corresponding to the diameter of the plate making roll, and the plate making roll is put in the vessel. After being positioned, the plating solution is supplied from the plating solution replenishing tank and the liquid level rises, and the plating solution submerges the plate making roll by about 1/3 diameter to about 1/4 diameter to keep the liquid level. The plating solution that overflows It is desirable that the structure is fed back to the gas-liquid supply tank.

This copper sulfate plating method / apparatus for a plate-making roll makes a plating solution in a plating solution supply tank and supplies copper ions to the plating tank. The plating solution can be produced by introducing phosphorous-containing copper balls into the plating solution replenishment tank, stirring the air, and dissolving it by the synergistic action of free sulfuric acid and dissolved oxygen in the plating solution to produce copper ions (cations). To supply the copper ions that are deficient in the plating tank by liquid supply means consisting of a check valve type pumping port, pumping pump, piping, flow control valve, filter for catching inevitable impurities, etc. Including. In this case, it is preferable that the metal copper immersed in the plating solution is brought into contact with a precious metal such as gold, platinum, palladium, or the like, and the dissolution of copper is promoted by air stirring.
However, as described above, rather than dissolving the phosphorous-containing copper balls, the copper-containing fine particles of cupric oxide powder, copper carbonate powder, or copper sulfate powder that are easily soluble in sulfuric acid and easily become copper ions. It is preferable to use a method of supplying powder to the plating solution supply tank.

It is desirable to supply the copper-containing fine powder to the plating solution supply tank under concentration control.
Specifically, it has a concentration analysis tank equipped with a copper concentration sensor and a sulfuric acid concentration sensor corresponding to the plating solution replenishment tank, an automatic powder metering device, and an automatic liquid metering device. It is circulated in the concentration analysis tank so that the copper concentration and sulfuric acid concentration are constantly measured, and the electric signal output when the copper concentration sensor detects that the copper concentration is insufficient is input to the automatic powder metering device, The electric signal output when the sulfuric acid concentration sensor detects that the sulfuric acid concentration is insufficient is input to the automatic liquid metering device.
The automatic powder metering device automatically measures and stocks the required amount of copper-containing fine powder in advance, and when the electrical signal output from the copper concentration sensor is input, the copper-containing fine powder is placed in the plating solution supply tank. Is configured to throw in,
The automatic liquid metering device automatically measures and stocks the required amount of sulfuric acid in advance, and when the electric signal output from the sulfuric acid concentration sensor is input, the stocked sulfuric acid is charged into the plating solution supply tank. It is preferable to be configured as described above.

In this copper sulfate plating method / apparatus for a plate-making roll, the plating tank is provided with an insoluble electrode so as to be an anode, and the plate-making roll as a plate to be plated is energized so as to be a cathode.
For example, the insoluble anode is preferably formed by coating iridium oxide on a titanium plate.
The insoluble anode is provided below the plate making roll and is movable up and down, has a length equal to or greater than the maximum length of the plate making roll, has a smooth roll-facing surface, and is close to and parallel to the plate making roll. When the plating solution is immersed in the plate making roll, it is energized.
The insoluble anode is preferably raised before, simultaneously with, or after the start of the rise in the liquid level of the plating solution to ensure a gap of 5 mm to 30 mm with respect to the lower surface of the plate making roll.
The insoluble anode has a configuration in which the roll-facing surface of the insoluble anode is a concave cylindrical surface having a radius of curvature that is substantially concentric with the plate-making roll when the roll-facing surface of the insoluble anode is brought close to the plate-making roll having the maximum diameter. In this case, even if the diameter of the plate-making roll is large or small, the gap change is the best, and the plating current can be applied to the plate-making roll so as to obtain a high current density. Is obtained.

  This plate-making roll copper sulfate plating method / apparatus has a plate for washing water that prevents the washing water from being mixed into the plating solution after the raised plating tank and the insoluble anode are lowered after the plating is finished. It is desirable to move to the lower side of the roll and clean the plate-making roll.

This copper sulfate plating method and apparatus for a plate-making roll circulates a plating solution between a plating tank and a plating solution supply tank. The plating solution supply means for supplying the plating solution stored in the plating solution supply tank to the plating tank includes a filter that captures and removes inevitable impurities. The plating tank is managed so that the level of the plating solution is constant. Since the plating tank is an open tank, it is managed by the overflow method so that the liquid level is constant. The plating solution feedback means is sufficient if the plating solution returns to the plating solution supply tank from the plating tank via a pipe line by a gravity flow method.
When managing the liquid level of the plating solution in the plating tank by the overflow method, a method of adjusting the height of the overflow weir, which is a partial configuration, may be adopted, but the overflow weir is a tulip type opening and closing structure Thus, a method of raising and lowering the tank body is desirable.

FIG. 1 shows a copper sulfate plating apparatus to which a cassette-type roll chuck rotating and conveying unit substantially the same as the cassette-type roll automatic detaching apparatus shown in Japanese Patent Publication No. 57-36995 can be applied. The cassette type roll chuck rotary conveyance unit U is placed on the plate and plating is performed.
More specifically, when the cassette-type roll chuck rotary conveyance unit U is placed on the plating apparatus main body X, the cassette-type roll is placed on the chain 2 of the chain winding apparatus driven by the motor 1 provided in the plating apparatus main body X. The sprocket 4 fitted and fixed to the spindle 3 on the driving side of the chuck rotation conveyance unit U is engaged.
The cassette-type roll chuck rotating and conveying unit U is provided at both ends of the plate-making roll R by a pair of energizable roll chucks 7 and 8 provided at both ends of the pair of spindles 3 and 6 that are provided from both ends of the lifting frame 5 and face each other. And a pair of liquid-proof caps 9 and 10 fitted to the spindles 3 and 6 are moved to abut against the end face of the plate-making roll R to energize the roll chucks 7 and 8 which are energized. It is the structure which prevents the approach of a process liquid.
The plate-making roll R is rotated by driving the motor 1 and plating is performed by passing a plating current between the plate-making roll R and the insoluble anode 11.

  In this copper sulfate plating apparatus, gravure printing in which a cassette type roll chuck rotary transport unit U transported by a stacker crane is placed on a frame F of a plating apparatus body X and chucked at both ends by the cassette type roll chuck rotary transport unit U. The plate-making roll R for use is immersed in a plating solution 13 stored in the plating tank 12 and the insoluble anode 11 is raised so as to be close to the lower surface of the plate-making roll R so as to form a gap of 5 mm to 30 mm. Ultrasonic waves are oscillated, and copper sulfate plating is performed by flowing a plating current larger than the normal plating current so that the insoluble anode 11 becomes an anode and the plate making roll R becomes a cathode.

  The insoluble anode 11 is supported by brackets 16 connected to the lifting device 15 in the vicinity of both ends in the length direction. When the plate-making roll R is positioned in the plating tank 12, the lifting device 15 is operated and raised. The surface facing the roll immediately approaches the plate-making roll R in parallel. The insoluble anode 11 has a length that is greater than or equal to the maximum length of the plate-making roll R, and the roll facing surface is smooth. The ascending stroke of the insoluble anode 11 is calculated by inputting the diameter data when each plate-making roll R is processed on the plating line.

  In this copper sulfate plating apparatus, the plating solution 18 in the plating solution supply tank 17 is transferred to the plating tank 12 by a plating solution supply means 19 comprising a check valve type pumping port, a pump, a pipe, a flow rate adjusting valve, a filter 19a and the like. By feeding, copper ions that are deficient in the plating tank 12 are replenished, and the presence of the filter 19a that captures inevitable impurities can prevent the occurrence of pinholes and pits due to adhesion of inevitable impurities during plating.

In this copper sulfate plating apparatus, the plating tank 12 is provided with overflow tanks at both ends in the longitudinal direction, and the plate-making roll R is plated in the overflow tank so as to be almost immersed in the plating solution 13. The liquid level of the liquid is controlled, and the overflowing plating liquid is returned to the plating liquid replenishing tank 17 through the liquid feedback means (pipe) 20 by a gravity flow method.
The plating tank 12 is preferably a lifting type rather than a fixed type as described above. Specifically, first, in order to secure a space for raising and lowering the plating tank 12, a plating solution replenishing tank 17 is provided at a position removed from directly below the plating tank 12, and the plating tank 12 is engaged with the lifting guide and servoed to the plating tank 12. By engaging with a lifting drive means comprising a rotation / linear motion conversion mechanism such as a pinion / rack system using a motor as a drive source, the plating tank 12 can be moved up and down, and the insoluble anode 11 is moved up and down on both sides of the plating tank 12. The elevating device 15 is attached, and the insoluble anode 11 is supported via a bracket 16 connected to the elevating device 15. Then, after the plate making roll R is accommodated in the main body of the plating apparatus, the plating tank 12 is raised to correspond to the diameter of the plate making roll R, and 1/3 to 1/4 of the plate making roll R is plated. Then, the elevating device 15 is operated to raise the insoluble anode 11 so as to be close to the lower surface of the plate making roll R so as to have a parallel gap of 5 mm to 30 mm. . And if the plating tank 12 is made into a raising / lowering type structure, when the plating tank 12 is lowered, the washing water tray is moved from the side between the plating tank 12 and the plate-making roll R to perform washing with water. it can.

  In this copper sulfate plating apparatus, the copper concentration and sulfuric acid concentration of the plating solution 18 in the plating solution replenishing tank 17 are constantly measured by the copper concentration sensor 21 and the sulfuric acid concentration sensor 22, and the copper concentration is insufficient. Is input to the automatic powder metering device 23, and the electrical signal output when the sulfuric acid concentration sensor 22 detects that the sulfuric acid concentration is insufficient. It is configured to input to the weighing-in device 24.

The automatic powder metering device 20 automatically measures a necessary amount of cupric oxide powder, cupric carbonate powder, or copper sulfate powder containing copper sulfate in advance and stores it in a chamber having a charging port at the lower end and a valve. When an electric signal output from the copper concentration sensor is input, the valve is opened and the copper-containing fine powder in the chamber is put into the plating solution supply tank.
The automatic liquid metering device 21 automatically measures the required amount in advance and stores it in the charging tank. When an electric signal output from the sulfuric acid concentration sensor is input, the charging tank valve is opened to replenish the plating solution. It is comprised so that a required quantity of sulfuric acid may be thrown into a tank.

In this copper sulfate plating apparatus, sulfuric acid and cupric oxide powder, copper carbonate powder, or copper-containing fine powder of copper sulfate powder are charged from one side of the plating solution replenishing tank 17 at a required ratio and stirred by the stirring device 25. Copper copper (cation) is generated.
For example, when cupric oxide powder is used, the reaction formula is: CuO + H ₂ SO ₄ → CuSO ₄ + H ₂ O.

The plating solution is supplied from the plating solution supply tank 14 to the plating tank 12 by the plating solution supply means 16 including a check valve type pumping port, a pumping pump, piping, a flow rate adjusting valve, a filter 16a for capturing inevitable impurities, and the like. In addition to supplying insufficient copper ions into the plating tank 12, the level of the plating solution in the plating tank 12 is controlled by the overflow method so as to be in a nearly immersed state, and the plating overflows. The liquid is returned to the plating solution replenishing tank 14 through a liquid feedback means (pipe) 17 by a gravity flow method.
When the plating is finished, the automatic opening / closing valve 27 provided in the liquid drop pipe 26 connecting the plating tank 12 and the plating solution supply tank 17 is opened, and the plating solution in the plating tank 12 is supplied to the plating solution supply tank 17. Can be recovered.

  With the above configuration, since the copper ion concentration in the plating solution can always be managed in an appropriate state, good copper sulfate plating can be maintained. Since no anode sludge is generated in the plating tank, there is no formation of pits and pits on the surface of the copper sulfate plating that has reached the plate making roll, and a clean surface copper sulfate plating can be formed in a short time. When grain polishing is applied, even if the polishing allowance is small, it is possible to perform very good mirror polishing without any defects or pits, so that the plating thickness can be reduced, the plating time can be shortened, and the plate making failure is reduced.

  The present invention also includes a plating method in which a cassette-type roll chuck rotary transport unit transported by a stacker crane is not applied. The present invention is also applicable to the case where the plating apparatus has chuck means for rotating the plate-making roll by chucking it and transfers the plate-making roll conveyed by an industrial robot. Moreover, the plate making roll for gravure printing includes a type with a shaft.

1 is a schematic longitudinal front view of a copper sulfate plating method and apparatus according to the present invention.

Explanation of symbols

U: cassette type roll chuck rotary conveyance unit, X: plating apparatus main body, F: frame of the plating apparatus main body, R: plate-making roll for gravure printing, 1 ... motor, 2. ..Chains, 3... Drive side spindle, 4... Sprocket, 5... Lifting frame, 6. Liquid-proof cap, 11 ... insoluble anode, 12 ... plating tank, 12a ... overflow, 13 ... plating solution, 14 ... ultrasonic device, 15 ... lifting device, 16 ... Bracket, 17 ... Plating solution supply tank, 18 ... Plating solution, 19 ... Plating solution supply means, 19a ... Filter, 20 ... Automatic powder metering device, 21 ... Copper concentration sensor, 22 ... Sulfuric acid concentration sensor, 23 ... Automatic powder metering device, 24 ... Automatic liquid metering device, 25 ... Falling tube, 26 ... Falling tube, 27 ... Automatic open / close valve,

Claims (9)

The plate making roll, which is the object to be plated, is chucked at both ends by roll rotating means and is placed in the plating tank, energized to become a cathode and rotated at the required number of rotations, and is provided below the plate making roll. The insoluble anode, which is longer than the maximum length of the plate-making roll and has a roll facing surface that is smooth and parallel to the plate-making roll and is energized so as to serve as the anode, is brought close to the lower surface of the plate-making roll. A method of plating copper sulfate on a plate-making roll, wherein plating is performed by supplying a plating solution from which inevitable impurities causing pinholes and pits are removed by a filter. In the plating solution replenishment tank, a plating solution that can be plated with copper sulfate powder, copper carbonate powder, or copper sulfate powder added to sulfuric acid is stored, and the plating solution stored in the plating solution supply tank is plated. A plate to be plated is an object to be plated, which is sucked by the liquid feeding means and removed by the filter provided in the plating liquid feeding means to remove inevitable impurities that cause pinholes and pits and supplied to a plating tank having an insoluble anode. The roll is chucked at both ends by a roll rotating means, placed in the plating tank, energized to become a cathode, rotated at the required number of rotations, and has a length greater than the maximum length of the plate-making roll, and the roll facing surface is smooth. A copper sulfate plating method for a plate-making roll, characterized in that plating is carried out by bringing an insoluble anode that is energized in parallel with the plate-making roll into an anode close to the lower surface of the plate-making roll. When the copper concentration and sulfuric acid concentration of the plating solution in use are measured and the copper concentration is insufficient, the required amount of the copper-containing fine powder of either cupric oxide powder, copper carbonate powder, or copper sulfate powder, When the sulfuric acid concentration is insufficient, a required amount of sulfuric acid is automatically replenished, and the copper sulfate plating method for a plate-making roll according to [Claim 1] or [Claim 2]. After positioning the plate-making roll at a required position of the plating apparatus body, the elevating and lowering plating tank is raised so as to accommodate at least the lower half of the plate-making roll, and then the insoluble anode is brought close to the lower surface of the plate-making roll, The plating solution causes the lower surface of the plate-making roll to be immersed, or the plating solution is applied to the lower surface of the plate-making roll from a plating solution shower nozzle provided in the plating tank. The method for plating copper sulfate on a plate-making roll according to any one of claims 3 to 4. After positioning the plate-making roll in the plating tank that does not move up and down, the insoluble anode provided in the plating tank is raised to approach the lower surface of the plate-making roll, and the level of the plating solution in the plating tank is raised. The plate making process according to any one of claims 1 to 3, wherein the plating solution is plated in a dipping state in which the plate making roll is fully immersed or about 1/3 or more immersed. Copper sulfate plating method for rolls. The copper sulfate of the plate-making roll according to any one of [1] to [5], wherein the ultrasonic wave transmitted from the ultrasonic transmission device is transmitted to the plating solution for plating. Plating method. After the completion of plating, the plate-making roll is cleaned by moving a washing-water receiving tray that prevents the washing water from mixing into the plating tank to the lower side of the plate-making roll. Item 6. A method for plating copper sulfate on a plate-making roll according to any one of Items 6]. A roll rotating means capable of rotating at a required number of rotations by energizing the plate-making roll, which is an object to be plated, at both ends to be a cathode at a required position, and a freely movable up and down provided on the lower side of the roll rotating means. A plating tank, an insoluble anode that is horizontally mounted so as to be movable up and down so as to be longer than the maximum length of the plate-making roll in the center of the plating tank, and a cupric oxide powder in sulfuric acid. A plating solution replenishing tank for storing a plating solution capable of performing copper sulfate plating by adding copper carbonate powder or copper sulfate powder, and a plating tank for sucking the plating solution stored in the plating solution replenishing tank through a filter By providing a plating solution feeding means for supplying to the plating solution and a plating solution feedback means for returning the excess plating solution from the plating tank to the plating solution replenishing tank, by making the rising stroke of the plating tank correspond to the diameter of the plate making roll, The bottom surface of the plate-making roll is immersed in the plating solution, or the plating solution shower nozzle provided in the plating tank is positioned at a required height so that the plating solution can be applied to the bottom surface of the plate-making roll. The insoluble anode is raised after the plating tank is raised, and a gap between the insoluble anode and the lower surface of the plate-making roll is detected by a proximity sensor so that the insoluble anode can be brought close to the lower surface of the plate-making roll. Copper sulfate plating equipment for plate-making rolls. When the copper concentration and sulfuric acid concentration of the plating solution in use are measured and the copper concentration is insufficient, the required amount of the copper-containing fine powder of either cupric oxide powder, copper carbonate powder, or copper sulfate powder, 9. A copper sulfate plating apparatus for a plate-making roll according to claim 8, further comprising means for supplying a necessary amount of sulfuric acid to the plating solution supply tank when the sulfuric acid concentration is insufficient.

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