TWI717542B - 基板保持裝置 - Google Patents

基板保持裝置 Download PDF

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Publication number
TWI717542B
TWI717542B TW106126061A TW106126061A TWI717542B TW I717542 B TWI717542 B TW I717542B TW 106126061 A TW106126061 A TW 106126061A TW 106126061 A TW106126061 A TW 106126061A TW I717542 B TWI717542 B TW I717542B
Authority
TW
Taiwan
Prior art keywords
holding device
substrate holding
electrostatic chuck
resin film
insulating resin
Prior art date
Application number
TW106126061A
Other languages
English (en)
Chinese (zh)
Other versions
TW201806072A (zh
Inventor
竹元啓一
原山洋一
朝日洋二
青木周三
Original Assignee
日商新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商新光電氣工業股份有限公司 filed Critical 日商新光電氣工業股份有限公司
Publication of TW201806072A publication Critical patent/TW201806072A/zh
Application granted granted Critical
Publication of TWI717542B publication Critical patent/TWI717542B/zh

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Classifications

    • H10P72/72—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H10P72/0432—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
TW106126061A 2016-08-09 2017-08-02 基板保持裝置 TWI717542B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016156470A JP6708518B2 (ja) 2016-08-09 2016-08-09 基板固定装置及びその製造方法
JP2016-156470 2016-08-09

Publications (2)

Publication Number Publication Date
TW201806072A TW201806072A (zh) 2018-02-16
TWI717542B true TWI717542B (zh) 2021-02-01

Family

ID=61160420

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106126061A TWI717542B (zh) 2016-08-09 2017-08-02 基板保持裝置

Country Status (4)

Country Link
US (1) US10361110B2 (enExample)
JP (1) JP6708518B2 (enExample)
KR (1) KR20180018335A (enExample)
TW (1) TWI717542B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6708518B2 (ja) * 2016-08-09 2020-06-10 新光電気工業株式会社 基板固定装置及びその製造方法
KR102471635B1 (ko) * 2018-05-31 2022-11-29 어플라이드 머티어리얼스, 인코포레이티드 극도의 균일성의 가열식 기판 지지 조립체
JP7172163B2 (ja) * 2018-06-20 2022-11-16 日新電機株式会社 基板保持装置
JP7329917B2 (ja) * 2018-11-30 2023-08-21 新光電気工業株式会社 基板固定装置
US11302536B2 (en) * 2019-10-18 2022-04-12 Applied Materials, Inc. Deflectable platens and associated methods
WO2021167939A1 (en) * 2020-02-18 2021-08-26 Lam Research Corporation High temperature substrate support with heat spreader
JP7496250B2 (ja) * 2020-06-16 2024-06-06 新光電気工業株式会社 基板固定装置、静電チャック及び静電チャックの製造方法
CN114496886A (zh) 2020-11-13 2022-05-13 新光电气工业株式会社 基板固定装置、静电吸盘和静电吸盘的制造方法
JP7670316B2 (ja) * 2021-03-24 2025-04-30 新光電気工業株式会社 静電チャック、基板固定装置
KR102640829B1 (ko) * 2021-03-29 2024-02-23 주식회사 케이티앤지 에어로졸 발생 장치용 히터 및 이를 포함하는 에어로졸 발생 장치
JP7783696B2 (ja) 2021-05-14 2025-12-10 新光電気工業株式会社 基板固定装置、静電チャック及び静電チャックの製造方法
JP2023183628A (ja) * 2022-06-16 2023-12-28 新光電気工業株式会社 基板固定装置及び基板固定装置の製造方法
JP2024002793A (ja) 2022-06-24 2024-01-11 新光電気工業株式会社 基板固定装置
JP2024105999A (ja) * 2023-01-26 2024-08-07 東京エレクトロン株式会社 基板処理装置及び基板支持部
CN120917868A (zh) * 2023-03-29 2025-11-07 琳得科株式会社 层叠体
KR102854447B1 (ko) * 2025-01-24 2025-09-03 (주)파웰 코퍼레이션 정전척

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007157488A (ja) * 2005-12-05 2007-06-21 Sankei Giken:Kk 面状発熱体
JP2011256072A (ja) * 2010-06-09 2011-12-22 Ngk Spark Plug Co Ltd 発熱体を有するセラミック基板及びその製造方法
JP2014130908A (ja) * 2012-12-28 2014-07-10 Ngk Spark Plug Co Ltd 静電チャック

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07307377A (ja) * 1993-12-27 1995-11-21 Shin Etsu Chem Co Ltd 静電チャック付セラミックスヒーター
JP2003100422A (ja) * 2001-09-25 2003-04-04 Toshiba Ceramics Co Ltd 箔状の抵抗発熱素子及び面状セラミックスヒーター
US7646580B2 (en) * 2005-02-24 2010-01-12 Kyocera Corporation Electrostatic chuck and wafer holding member and wafer treatment method
JP5163349B2 (ja) * 2008-08-01 2013-03-13 住友大阪セメント株式会社 静電チャック装置
JP5262878B2 (ja) * 2009-03-17 2013-08-14 東京エレクトロン株式会社 載置台構造及びプラズマ成膜装置
JP5846186B2 (ja) * 2010-01-29 2016-01-20 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法
JP5423632B2 (ja) 2010-01-29 2014-02-19 住友大阪セメント株式会社 静電チャック装置
US8898889B2 (en) * 2011-11-22 2014-12-02 Lam Research Corporation Chuck assembly for plasma processing
JP5441019B1 (ja) * 2012-08-29 2014-03-12 Ｔｏｔｏ株式会社 静電チャック
JP6052976B2 (ja) * 2012-10-15 2016-12-27 日本タングステン株式会社 静電チャック誘電体層および静電チャック
JP6708518B2 (ja) * 2016-08-09 2020-06-10 新光電気工業株式会社 基板固定装置及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007157488A (ja) * 2005-12-05 2007-06-21 Sankei Giken:Kk 面状発熱体
JP2011256072A (ja) * 2010-06-09 2011-12-22 Ngk Spark Plug Co Ltd 発熱体を有するセラミック基板及びその製造方法
JP2014130908A (ja) * 2012-12-28 2014-07-10 Ngk Spark Plug Co Ltd 静電チャック

Also Published As

Publication number Publication date
KR20180018335A (ko) 2018-02-21
US10361110B2 (en) 2019-07-23
US20180047604A1 (en) 2018-02-15
JP6708518B2 (ja) 2020-06-10
JP2018026427A (ja) 2018-02-15
TW201806072A (zh) 2018-02-16

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