KR20180018335A - 기판 고정 장치 및 그 제조방법 - Google Patents

기판 고정 장치 및 그 제조방법 Download PDF

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Publication number
KR20180018335A
KR20180018335A KR1020170096709A KR20170096709A KR20180018335A KR 20180018335 A KR20180018335 A KR 20180018335A KR 1020170096709 A KR1020170096709 A KR 1020170096709A KR 20170096709 A KR20170096709 A KR 20170096709A KR 20180018335 A KR20180018335 A KR 20180018335A
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KR
South Korea
Prior art keywords
electrostatic chuck
resin film
insulating resin
base plate
heat generating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020170096709A
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English (en)
Korean (ko)
Inventor
게이이치 다케모토
요이치 하라야마
요지 아사히
슈조 아오키
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20180018335A publication Critical patent/KR20180018335A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
KR1020170096709A 2016-08-09 2017-07-31 기판 고정 장치 및 그 제조방법 Ceased KR20180018335A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016156470A JP6708518B2 (ja) 2016-08-09 2016-08-09 基板固定装置及びその製造方法
JPJP-P-2016-156470 2016-08-09

Publications (1)

Publication Number Publication Date
KR20180018335A true KR20180018335A (ko) 2018-02-21

Family

ID=61160420

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170096709A Ceased KR20180018335A (ko) 2016-08-09 2017-07-31 기판 고정 장치 및 그 제조방법

Country Status (4)

Country Link
US (1) US10361110B2 (enExample)
JP (1) JP6708518B2 (enExample)
KR (1) KR20180018335A (enExample)
TW (1) TWI717542B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102854447B1 (ko) * 2025-01-24 2025-09-03 (주)파웰 코퍼레이션 정전척

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6708518B2 (ja) * 2016-08-09 2020-06-10 新光電気工業株式会社 基板固定装置及びその製造方法
KR20250100800A (ko) * 2018-05-31 2025-07-03 어플라이드 머티어리얼스, 인코포레이티드 극도의 균일성의 가열식 기판 지지 조립체
JP7172163B2 (ja) * 2018-06-20 2022-11-16 日新電機株式会社 基板保持装置
JP7329917B2 (ja) * 2018-11-30 2023-08-21 新光電気工業株式会社 基板固定装置
US11302536B2 (en) * 2019-10-18 2022-04-12 Applied Materials, Inc. Deflectable platens and associated methods
KR20220142498A (ko) * 2020-02-18 2022-10-21 램 리써치 코포레이션 열 확산기를 갖는 고온 기판 지지부
JP7496250B2 (ja) 2020-06-16 2024-06-06 新光電気工業株式会社 基板固定装置、静電チャック及び静電チャックの製造方法
CN114496886A (zh) 2020-11-13 2022-05-13 新光电气工业株式会社 基板固定装置、静电吸盘和静电吸盘的制造方法
JP7670316B2 (ja) * 2021-03-24 2025-04-30 新光電気工業株式会社 静電チャック、基板固定装置
KR102640829B1 (ko) * 2021-03-29 2024-02-23 주식회사 케이티앤지 에어로졸 발생 장치용 히터 및 이를 포함하는 에어로졸 발생 장치
JP7783696B2 (ja) 2021-05-14 2025-12-10 新光電気工業株式会社 基板固定装置、静電チャック及び静電チャックの製造方法
JP2023183628A (ja) * 2022-06-16 2023-12-28 新光電気工業株式会社 基板固定装置及び基板固定装置の製造方法
JP2024002793A (ja) 2022-06-24 2024-01-11 新光電気工業株式会社 基板固定装置
JP2024105999A (ja) * 2023-01-26 2024-08-07 東京エレクトロン株式会社 基板処理装置及び基板支持部
CN120917868A (zh) * 2023-03-29 2025-11-07 琳得科株式会社 层叠体

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07307377A (ja) * 1993-12-27 1995-11-21 Shin Etsu Chem Co Ltd 静電チャック付セラミックスヒーター
JP2003100422A (ja) * 2001-09-25 2003-04-04 Toshiba Ceramics Co Ltd 箔状の抵抗発熱素子及び面状セラミックスヒーター
US7646580B2 (en) * 2005-02-24 2010-01-12 Kyocera Corporation Electrostatic chuck and wafer holding member and wafer treatment method
JP2007157488A (ja) * 2005-12-05 2007-06-21 Sankei Giken:Kk 面状発熱体
JP5163349B2 (ja) * 2008-08-01 2013-03-13 住友大阪セメント株式会社 静電チャック装置
JP5262878B2 (ja) * 2009-03-17 2013-08-14 東京エレクトロン株式会社 載置台構造及びプラズマ成膜装置
JP5846186B2 (ja) * 2010-01-29 2016-01-20 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法
JP5423632B2 (ja) 2010-01-29 2014-02-19 住友大阪セメント株式会社 静電チャック装置
JP2011256072A (ja) * 2010-06-09 2011-12-22 Ngk Spark Plug Co Ltd 発熱体を有するセラミック基板及びその製造方法
US8898889B2 (en) * 2011-11-22 2014-12-02 Lam Research Corporation Chuck assembly for plasma processing
JP5441019B1 (ja) * 2012-08-29 2014-03-12 Ｔｏｔｏ株式会社 静電チャック
JP6052976B2 (ja) * 2012-10-15 2016-12-27 日本タングステン株式会社 静電チャック誘電体層および静電チャック
JP6077301B2 (ja) * 2012-12-28 2017-02-08 日本特殊陶業株式会社 静電チャック
JP6708518B2 (ja) * 2016-08-09 2020-06-10 新光電気工業株式会社 基板固定装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102854447B1 (ko) * 2025-01-24 2025-09-03 (주)파웰 코퍼레이션 정전척

Also Published As

Publication number Publication date
TW201806072A (zh) 2018-02-16
JP6708518B2 (ja) 2020-06-10
JP2018026427A (ja) 2018-02-15
US10361110B2 (en) 2019-07-23
US20180047604A1 (en) 2018-02-15
TWI717542B (zh) 2021-02-01

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