JP6708518B2 - 基板固定装置及びその製造方法 - Google Patents

基板固定装置及びその製造方法 Download PDF

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Publication number
JP6708518B2
JP6708518B2 JP2016156470A JP2016156470A JP6708518B2 JP 6708518 B2 JP6708518 B2 JP 6708518B2 JP 2016156470 A JP2016156470 A JP 2016156470A JP 2016156470 A JP2016156470 A JP 2016156470A JP 6708518 B2 JP6708518 B2 JP 6708518B2
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JP
Japan
Prior art keywords
electrostatic chuck
heating element
fixing device
resin film
insulating resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016156470A
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English (en)
Japanese (ja)
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JP2018026427A (ja
JP2018026427A5 (enExample
Inventor
啓一 竹元
啓一 竹元
洋一 原山
洋一 原山
洋二 朝日
洋二 朝日
周三 青木
周三 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2016156470A priority Critical patent/JP6708518B2/ja
Priority to US15/662,480 priority patent/US10361110B2/en
Priority to KR1020170096709A priority patent/KR20180018335A/ko
Priority to TW106126061A priority patent/TWI717542B/zh
Publication of JP2018026427A publication Critical patent/JP2018026427A/ja
Publication of JP2018026427A5 publication Critical patent/JP2018026427A5/ja
Application granted granted Critical
Publication of JP6708518B2 publication Critical patent/JP6708518B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
JP2016156470A 2016-08-09 2016-08-09 基板固定装置及びその製造方法 Active JP6708518B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016156470A JP6708518B2 (ja) 2016-08-09 2016-08-09 基板固定装置及びその製造方法
US15/662,480 US10361110B2 (en) 2016-08-09 2017-07-28 Substrate holding apparatus
KR1020170096709A KR20180018335A (ko) 2016-08-09 2017-07-31 기판 고정 장치 및 그 제조방법
TW106126061A TWI717542B (zh) 2016-08-09 2017-08-02 基板保持裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016156470A JP6708518B2 (ja) 2016-08-09 2016-08-09 基板固定装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2018026427A JP2018026427A (ja) 2018-02-15
JP2018026427A5 JP2018026427A5 (enExample) 2019-04-18
JP6708518B2 true JP6708518B2 (ja) 2020-06-10

Family

ID=61160420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016156470A Active JP6708518B2 (ja) 2016-08-09 2016-08-09 基板固定装置及びその製造方法

Country Status (4)

Country Link
US (1) US10361110B2 (enExample)
JP (1) JP6708518B2 (enExample)
KR (1) KR20180018335A (enExample)
TW (1) TWI717542B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240001065A (ko) 2022-06-24 2024-01-03 신꼬오덴기 고교 가부시키가이샤 기판 고정 디바이스

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6708518B2 (ja) * 2016-08-09 2020-06-10 新光電気工業株式会社 基板固定装置及びその製造方法
KR20250100800A (ko) * 2018-05-31 2025-07-03 어플라이드 머티어리얼스, 인코포레이티드 극도의 균일성의 가열식 기판 지지 조립체
JP7172163B2 (ja) * 2018-06-20 2022-11-16 日新電機株式会社 基板保持装置
JP7329917B2 (ja) * 2018-11-30 2023-08-21 新光電気工業株式会社 基板固定装置
US11302536B2 (en) * 2019-10-18 2022-04-12 Applied Materials, Inc. Deflectable platens and associated methods
KR20220142498A (ko) * 2020-02-18 2022-10-21 램 리써치 코포레이션 열 확산기를 갖는 고온 기판 지지부
JP7496250B2 (ja) 2020-06-16 2024-06-06 新光電気工業株式会社 基板固定装置、静電チャック及び静電チャックの製造方法
CN114496886A (zh) 2020-11-13 2022-05-13 新光电气工业株式会社 基板固定装置、静电吸盘和静电吸盘的制造方法
JP7670316B2 (ja) * 2021-03-24 2025-04-30 新光電気工業株式会社 静電チャック、基板固定装置
KR102640829B1 (ko) * 2021-03-29 2024-02-23 주식회사 케이티앤지 에어로졸 발생 장치용 히터 및 이를 포함하는 에어로졸 발생 장치
JP7783696B2 (ja) 2021-05-14 2025-12-10 新光電気工業株式会社 基板固定装置、静電チャック及び静電チャックの製造方法
JP2023183628A (ja) * 2022-06-16 2023-12-28 新光電気工業株式会社 基板固定装置及び基板固定装置の製造方法
JP2024105999A (ja) * 2023-01-26 2024-08-07 東京エレクトロン株式会社 基板処理装置及び基板支持部
CN120917868A (zh) * 2023-03-29 2025-11-07 琳得科株式会社 层叠体
KR102854447B1 (ko) * 2025-01-24 2025-09-03 (주)파웰 코퍼레이션 정전척

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07307377A (ja) * 1993-12-27 1995-11-21 Shin Etsu Chem Co Ltd 静電チャック付セラミックスヒーター
JP2003100422A (ja) * 2001-09-25 2003-04-04 Toshiba Ceramics Co Ltd 箔状の抵抗発熱素子及び面状セラミックスヒーター
US7646580B2 (en) * 2005-02-24 2010-01-12 Kyocera Corporation Electrostatic chuck and wafer holding member and wafer treatment method
JP2007157488A (ja) * 2005-12-05 2007-06-21 Sankei Giken:Kk 面状発熱体
JP5163349B2 (ja) * 2008-08-01 2013-03-13 住友大阪セメント株式会社 静電チャック装置
JP5262878B2 (ja) * 2009-03-17 2013-08-14 東京エレクトロン株式会社 載置台構造及びプラズマ成膜装置
JP5846186B2 (ja) * 2010-01-29 2016-01-20 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法
JP5423632B2 (ja) 2010-01-29 2014-02-19 住友大阪セメント株式会社 静電チャック装置
JP2011256072A (ja) * 2010-06-09 2011-12-22 Ngk Spark Plug Co Ltd 発熱体を有するセラミック基板及びその製造方法
US8898889B2 (en) * 2011-11-22 2014-12-02 Lam Research Corporation Chuck assembly for plasma processing
JP5441019B1 (ja) * 2012-08-29 2014-03-12 Ｔｏｔｏ株式会社 静電チャック
JP6052976B2 (ja) * 2012-10-15 2016-12-27 日本タングステン株式会社 静電チャック誘電体層および静電チャック
JP6077301B2 (ja) * 2012-12-28 2017-02-08 日本特殊陶業株式会社 静電チャック
JP6708518B2 (ja) * 2016-08-09 2020-06-10 新光電気工業株式会社 基板固定装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240001065A (ko) 2022-06-24 2024-01-03 신꼬오덴기 고교 가부시키가이샤 기판 고정 디바이스
US12340991B2 (en) 2022-06-24 2025-06-24 Shinko Electric Industries Co., Ltd. Substrate fixing device

Also Published As

Publication number Publication date
TW201806072A (zh) 2018-02-16
JP2018026427A (ja) 2018-02-15
KR20180018335A (ko) 2018-02-21
US10361110B2 (en) 2019-07-23
US20180047604A1 (en) 2018-02-15
TWI717542B (zh) 2021-02-01

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