TWI712506B - 積層體基板、積層體基板之製造方法、導電性基板、及導電性基板之製造方法 - Google Patents
積層體基板、積層體基板之製造方法、導電性基板、及導電性基板之製造方法 Download PDFInfo
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- TWI712506B TWI712506B TW105133020A TW105133020A TWI712506B TW I712506 B TWI712506 B TW I712506B TW 105133020 A TW105133020 A TW 105133020A TW 105133020 A TW105133020 A TW 105133020A TW I712506 B TWI712506 B TW I712506B
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- layer
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- copper
- substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0036—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015204642A JP6601137B2 (ja) | 2015-10-16 | 2015-10-16 | 積層体基板、積層体基板の製造方法、導電性基板、及び導電性基板の製造方法 |
JPJP2015-204642 | 2015-10-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201728444A TW201728444A (zh) | 2017-08-16 |
TWI712506B true TWI712506B (zh) | 2020-12-11 |
Family
ID=58518273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105133020A TWI712506B (zh) | 2015-10-16 | 2016-10-13 | 積層體基板、積層體基板之製造方法、導電性基板、及導電性基板之製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6601137B2 (fr) |
KR (1) | KR102430694B1 (fr) |
CN (1) | CN108136731A (fr) |
TW (1) | TWI712506B (fr) |
WO (1) | WO2017065184A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018221183A1 (fr) * | 2017-05-29 | 2018-12-06 | 住友金属鉱山株式会社 | Procédé de fabrication d'un substrat électroconducteur transparent, et substrat électroconducteur transparent |
JP7266955B2 (ja) * | 2021-05-20 | 2023-05-01 | Nissha株式会社 | 導電シート、タッチセンサ及びタッチセンサの製造方法 |
WO2024004404A1 (fr) * | 2022-07-01 | 2024-01-04 | 日東電工株式会社 | Film électroconducteur |
WO2024004405A1 (fr) * | 2022-07-01 | 2024-01-04 | 日東電工株式会社 | Film électroconducteur |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005268688A (ja) * | 2004-03-22 | 2005-09-29 | Bridgestone Corp | 光透過性電磁波シールド材及びその製造方法並びにこの電磁波シールド材を有するディスプレイ用前面フィルタ |
JP2008300393A (ja) * | 2007-05-29 | 2008-12-11 | Dainippon Printing Co Ltd | ディスプレイ用電磁波遮蔽フィルタ、複合フィルタ、及びその製造方法 |
JP2015069440A (ja) * | 2013-09-30 | 2015-04-13 | 大日本印刷株式会社 | タッチパネルセンサおよびタッチパネルモジュール |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001127485A (ja) * | 1999-10-25 | 2001-05-11 | Nisshinbo Ind Inc | 透視性電磁波シールド材及びその製造方法 |
JP4086132B2 (ja) | 2001-11-16 | 2008-05-14 | 株式会社ブリヂストン | 透明導電性フィルムおよびタッチパネル |
JP5256880B2 (ja) * | 2008-06-24 | 2013-08-07 | 凸版印刷株式会社 | プラズマディスプレイ前面板用黒色化シールドメッシュおよびその製造方法 |
JP2010098196A (ja) * | 2008-10-17 | 2010-04-30 | Hitachi Cable Ltd | 配線構造及び配線構造の製造方法 |
JP5361579B2 (ja) | 2009-07-09 | 2013-12-04 | 信越ポリマー株式会社 | 大型ディスプレイ用のセンサパネル及びその製造方法 |
JP2013069261A (ja) | 2011-09-08 | 2013-04-18 | Dainippon Printing Co Ltd | タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置 |
JP5885993B2 (ja) * | 2011-10-17 | 2016-03-16 | 関東化學株式会社 | エッチング液組成物およびエッチング方法 |
JP6228846B2 (ja) * | 2011-11-28 | 2017-11-08 | 日東電工株式会社 | 透明導電性フィルムの製造方法 |
CN103582304B (zh) * | 2012-07-30 | 2016-08-03 | 富葵精密组件(深圳)有限公司 | 透明印刷电路板及其制作方法 |
KR101421702B1 (ko) * | 2012-09-27 | 2014-07-22 | 엘에스엠트론 주식회사 | 연성회로 동장 적층판과 이를 이용한 인쇄회로 기판 및 그 제조 방법 |
KR101580372B1 (ko) * | 2013-05-10 | 2015-12-28 | 삼성전기주식회사 | 터치센서 |
JP2015103223A (ja) * | 2013-11-28 | 2015-06-04 | グンゼ株式会社 | 導電性基板、タッチパネル及び電磁波シールド |
CN104749830A (zh) * | 2013-12-27 | 2015-07-01 | 介面光电股份有限公司 | 电极结构及带有该电极结构的触控面板装置 |
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2015
- 2015-10-16 JP JP2015204642A patent/JP6601137B2/ja active Active
-
2016
- 2016-10-12 KR KR1020187009122A patent/KR102430694B1/ko active IP Right Grant
- 2016-10-12 CN CN201680060141.XA patent/CN108136731A/zh active Pending
- 2016-10-12 WO PCT/JP2016/080279 patent/WO2017065184A1/fr active Application Filing
- 2016-10-13 TW TW105133020A patent/TWI712506B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005268688A (ja) * | 2004-03-22 | 2005-09-29 | Bridgestone Corp | 光透過性電磁波シールド材及びその製造方法並びにこの電磁波シールド材を有するディスプレイ用前面フィルタ |
JP2008300393A (ja) * | 2007-05-29 | 2008-12-11 | Dainippon Printing Co Ltd | ディスプレイ用電磁波遮蔽フィルタ、複合フィルタ、及びその製造方法 |
JP2015069440A (ja) * | 2013-09-30 | 2015-04-13 | 大日本印刷株式会社 | タッチパネルセンサおよびタッチパネルモジュール |
Also Published As
Publication number | Publication date |
---|---|
KR102430694B1 (ko) | 2022-08-08 |
KR20180066057A (ko) | 2018-06-18 |
TW201728444A (zh) | 2017-08-16 |
JP6601137B2 (ja) | 2019-11-06 |
WO2017065184A1 (fr) | 2017-04-20 |
JP2017074749A (ja) | 2017-04-20 |
CN108136731A (zh) | 2018-06-08 |
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