TWI711132B - 環氧樹脂組成物 - Google Patents

環氧樹脂組成物 Download PDF

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Publication number
TWI711132B
TWI711132B TW105139260A TW105139260A TWI711132B TW I711132 B TWI711132 B TW I711132B TW 105139260 A TW105139260 A TW 105139260A TW 105139260 A TW105139260 A TW 105139260A TW I711132 B TWI711132 B TW I711132B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
alumina filler
present
underfill material
Prior art date
Application number
TW105139260A
Other languages
English (en)
Chinese (zh)
Other versions
TW201727848A (zh
Inventor
長谷川将宏
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW201727848A publication Critical patent/TW201727848A/zh
Application granted granted Critical
Publication of TWI711132B publication Critical patent/TWI711132B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
TW105139260A 2015-12-18 2016-11-29 環氧樹脂組成物 TWI711132B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015247112A JP6688065B2 (ja) 2015-12-18 2015-12-18 エポキシ樹脂組成物
JP2015-247112 2015-12-18

Publications (2)

Publication Number Publication Date
TW201727848A TW201727848A (zh) 2017-08-01
TWI711132B true TWI711132B (zh) 2020-11-21

Family

ID=59056021

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105139260A TWI711132B (zh) 2015-12-18 2016-11-29 環氧樹脂組成物

Country Status (5)

Country Link
JP (1) JP6688065B2 (ja)
KR (1) KR102626002B1 (ja)
CN (1) CN108368326A (ja)
TW (1) TWI711132B (ja)
WO (1) WO2017104298A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109654388A (zh) * 2018-12-06 2019-04-19 安徽皇广实业有限公司 一种集成高导热基材led灯具
CN112080238B (zh) * 2020-09-07 2022-05-27 江苏矽时代材料科技有限公司 一种导热填充胶及其制备方法和应用
WO2022092323A1 (ja) 2020-11-02 2022-05-05 三菱ケミカル株式会社 ゼオライト、ゼオライトの製造方法、組成物、液状組成物、液状封止剤、樹脂複合材、封止材、封止材の製造方法、及びデバイス
CN117795002A (zh) * 2021-11-16 2024-03-29 纳美仕有限公司 环氧树脂组合物、液状压缩模制材料、顶部包封材料以及半导体装置
KR102693047B1 (ko) 2022-01-12 2024-08-09 주식회사 이포트 알루미나 제조방법 및 이에 의해 제조된 알루미나
CN114292613A (zh) * 2022-02-16 2022-04-08 武汉市三选科技有限公司 复合膜、倒装led芯片及其制造方法
CN116445117B (zh) * 2023-04-23 2023-12-29 有行鲨鱼（上海）科技股份有限公司 一种大尺寸芯片补强用光热双固封边胶及其制备与使用

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003160644A (ja) * 2001-11-27 2003-06-03 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2003261647A (ja) * 2002-03-08 2003-09-19 Toray Ind Inc エポキシ樹脂組成物及び半導体装置
TW200718750A (en) * 2005-11-02 2007-05-16 Shinetsu Chemical Co Liquid epoxy resin composition
CN101006135A (zh) * 2004-08-18 2007-07-25 株式会社钟化 半导体密封剂用环氧树脂组合物以及环氧树脂成型材料
TW201037008A (en) * 2009-03-17 2010-10-16 Nippon Soda Co Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor
CN101970526A (zh) * 2008-03-31 2011-02-09 新日铁化学株式会社 环氧树脂组合物及成型物
CN102212249A (zh) * 2010-02-16 2011-10-12 信越化学工业株式会社 环氧树脂组合物和半导体装置
TW201529698A (zh) * 2013-09-30 2015-08-01 Nippon Steel & Sumikin Chem Co 含磷環氧樹脂組成物及硬化物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124647A (ja) * 1983-12-09 1985-07-03 Sumitomo Bakelite Co Ltd 低放射線性エポキシ樹脂組成物
JPH0611845B2 (ja) * 1986-07-02 1994-02-16 住友ベ−クライト株式会社 低放射線性エポキシ樹脂組成物
JPH10173103A (ja) 1996-12-13 1998-06-26 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JP3446730B2 (ja) * 2000-09-26 2003-09-16 松下電工株式会社 エポキシ樹脂組成物及び半導体装置
JP3446731B2 (ja) * 2000-09-26 2003-09-16 松下電工株式会社 エポキシ樹脂組成物及び半導体装置
JP2003160643A (ja) * 2001-11-27 2003-06-03 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2003160642A (ja) * 2001-11-27 2003-06-03 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP4631296B2 (ja) * 2004-03-05 2011-02-16 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
TWI518034B (zh) 2010-04-15 2016-01-21 新日鐵住金高新材料股份有限公司 用以製造球狀氧化鋁粉末之方法
JP5983085B2 (ja) * 2012-06-25 2016-08-31 住友ベークライト株式会社 エポキシ樹脂組成物及び電子部品装置
JP5968137B2 (ja) * 2012-07-20 2016-08-10 ナミックス株式会社 液状封止材、それを用いた電子部品
JP5983590B2 (ja) * 2013-12-13 2016-08-31 株式会社デンソー 硬化性樹脂組成物、封止材、及びこれを用いた電子デバイス製品

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003160644A (ja) * 2001-11-27 2003-06-03 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2003261647A (ja) * 2002-03-08 2003-09-19 Toray Ind Inc エポキシ樹脂組成物及び半導体装置
CN101006135A (zh) * 2004-08-18 2007-07-25 株式会社钟化 半导体密封剂用环氧树脂组合物以及环氧树脂成型材料
TW200718750A (en) * 2005-11-02 2007-05-16 Shinetsu Chemical Co Liquid epoxy resin composition
CN101970526A (zh) * 2008-03-31 2011-02-09 新日铁化学株式会社 环氧树脂组合物及成型物
TW201037008A (en) * 2009-03-17 2010-10-16 Nippon Soda Co Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor
CN102212249A (zh) * 2010-02-16 2011-10-12 信越化学工业株式会社 环氧树脂组合物和半导体装置
TW201141897A (en) * 2010-02-16 2011-12-01 Shinetsu Chemical Co Epoxy resin composition and semiconductor device
TW201529698A (zh) * 2013-09-30 2015-08-01 Nippon Steel & Sumikin Chem Co 含磷環氧樹脂組成物及硬化物

Also Published As

Publication number Publication date
KR20180094882A (ko) 2018-08-24
JP2017110146A (ja) 2017-06-22
CN108368326A (zh) 2018-08-03
JP6688065B2 (ja) 2020-04-28
WO2017104298A1 (ja) 2017-06-22
KR102626002B1 (ko) 2024-01-16
TW201727848A (zh) 2017-08-01

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