TWI710144B - 具布拉格反射鏡之發光二極體及其製造方法 - Google Patents
具布拉格反射鏡之發光二極體及其製造方法 Download PDFInfo
- Publication number
- TWI710144B TWI710144B TW105104668A TW105104668A TWI710144B TW I710144 B TWI710144 B TW I710144B TW 105104668 A TW105104668 A TW 105104668A TW 105104668 A TW105104668 A TW 105104668A TW I710144 B TWI710144 B TW I710144B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- light
- bragg reflector
- emitting diode
- transparent conductive
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims description 38
- 230000000903 blocking effect Effects 0.000 claims description 20
- 230000007423 decrease Effects 0.000 claims description 2
- 238000009826 distribution Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 229910052709 silver Inorganic materials 0.000 description 11
- 239000004332 silver Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 230000000875 corresponding effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910004261 CaF 2 Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 210000004508 polar body Anatomy 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
本發明係關於一種具布拉格反射鏡之發光二極體及其製造方法,其利用布拉格反射鏡作為反射元件,以將發光層產生的光線反射向理想出光方向;此布拉格反射鏡在結構上係開設有多個貫穿孔,使布拉格反射鏡兩面之金屬層與透明導電層得以相互接觸而導通電流;且本發明可進一步利用前述貫穿孔的分佈特性而使電流能夠較均勻地分散,使發光層均勻發光。
Description
本發明係關於一種發光二極體及其製造方法,尤指一種具布拉格反射鏡之發光二極體。
發光二極體(Light Emitting Diode,LED)是一種半導體材料製成的固態發光元件,其普遍係使用磷化鎵、砷化鎵或氮化鎵等III-V族化學元素之組合,透過將此化合物半導體施加電壓,使電洞和電子在電極電壓作用下在發光層大量相遇而產生複合,此時電子會跌落到較低的能階,同時以光子的模式釋放,讓電能轉換為光,達成發光的效果。
發光二極體為了提升出光亮度,在結構上會設置反射結構,使發光層所產生的光線能夠被反射向理想的出光方向。傳統的反射結構係為銀反射鏡,但考量到銀反射鏡在發光二極體的製程中會受到溫度的影響,從而有相變化發生的可能。銀反射鏡若轉變為流體形式,即有向周邊擴散之虞;因此,銀反射鏡之限制係在於其邊緣不得與發光二極體其他層面之邊緣切齊,需略為內縮並以阻障層覆蓋,而通常是使用鎢化鈦作為阻障材料。
由於傳統的發光二極體需要堆疊銀反射鏡與阻障材料作為反射元件,因此在製程步驟上較為複雜,並且銀反射鏡本身的穩定也是需要額外顧慮的問題,故存在改良的條件。
本發明之主要目的,係提供一種具布拉格反射鏡之發光二極體,其係使用布拉格反射鏡取代傳統的銀反射鏡,能藉此排除銀反射鏡所導致的不穩定因素,因而提升產品良率。
本發明之再一目的,係提供一種具布拉格反射鏡之發光二極體,其於布拉格反射鏡開設多個貫穿孔供電流流通,並得進一步利用貫穿孔的分布狀態調整電流的均勻分布程度。
本發明之另一目的,係提供一種具布拉格反射鏡之發光二極體之製造方法,其可減少傳統製程的步驟,降低製程的複雜度。
因此,本發明揭示了一種具布拉格反射鏡之發光二極體及其製造方法,其在結構上係包含:一磊晶層,具有一第一半導體層、一發光層以及一第二半導體層;一透明導電層,其係位於該第二半導體層上;至少一布拉格反射層,其係位於該透明導電層上,並具有多個貫穿該等布拉格反射層的第一貫穿孔;一第一電極,係電性連接於該第一半導體層;以及一第二電極,係電性連接於該透明導電層。
於本發明另一實施例中,具布拉格反射鏡之發光二極體係在磊晶層與透明導電層之間設置多個電流阻擋層。
於本發明再一實施例中,係利用布拉格反射層之絕緣特性,而整合絕緣層以及布拉格反射層之結構。
為使本發明之特徵及所達成之功效有更進一步之瞭解與認識,謹佐以實施例及配合詳細之說明,說明如後:
首先請一併參考第1圖以及第2圖,本發明於一實施例中所揭示發光二極體在結構上係包含了:一磊晶層21、一透明導電層22、至少一布拉格反射層23、一金屬層24、一絕緣層25、一第一電極26以及一第二電極27。其中,磊晶層21可設置於一透光基板20之一表面上,且磊晶層21之結構包含了依序堆疊之一第一半導體層210、一發光層211以及一第二半導體層212;透明導電層22係設置於磊晶層21之第二半導體層212上;布拉格反射層23係設置於透明導電層22上,並具有多個貫穿布拉格反射層23的第一貫穿孔230;金屬層24係設置於布拉格反射層23以及透明導電層22上,並係透過前述之第一貫穿孔230而與透明導電層22電性相接;絕緣層25係設置於金屬層24上,並具有至少一第二貫穿孔250而暴露出部分之金屬層24;第一電極26係電性連接於磊晶層21之第一半導體層210;而至於第二電極27,則係設置於絕緣層25上,且經由前述之第二貫穿孔250電性連接於金屬層24。
除上述結構之外,第一電極26以及第二電極27在發光二極體實際應用時,係分別透過導電凸塊10、11而與電路板1電性連接,電路板1之表面係具有電路接點100、110,可與前述之導電凸塊10、11相連接。第3圖係為第2圖之A區域的放大示意,其係較清楚地揭示本發明透過開設第一貫穿孔230以及第二貫穿孔250之方式,使電流能沿著第二電極27、金屬層24、透明導電層22之路徑而流通,而不會被具有絕緣特性的布拉格反射層23以及絕緣層25所完全阻擋。
本發明係為覆晶式發光二極體之應用類型,其特徵在於利用布拉格反射層增加整體元件的亮度。本發明之布拉格反射層23可反射來自磊晶層21之發光層211所產生之光線;由於發光層211係為全向發光,而這些被布拉格反射層23所反射的光線原本是朝向相反於理想的出光方向行進,因此若能將其反射,即能有效地提升發光二極體的出光效率。光線被反射後,可經由穿透透明導電層22、磊晶層21等結構,而後穿透透光基板20離開。 請參考第4圖,本發明於一實施例所使用的布拉格反射層23係包含了至少4個子層23a、23b、23c、23d,任一子層皆包含由兩種折射率不同之折射材料所堆疊而成的結構。此布拉格反射層23是利用第一折射材料230與第二折射材料231之反覆堆疊而讓折射率有週期性的變化,這種具備折射率高低交錯之結構可讓入射的光線在入射處形成建設性干涉,造成有很高的反射率。
本發明於此實施例的布拉格反射層23至少作4次反覆堆疊而形成前述之子層23a、23b、23c、23d,整體反射結構的反射率係大於80%。折射材料的選用則可為較常見的GaAs/AlGaAs,其晶格常數接近而較易於形成堆疊,另外也可為TiO2
、Ta2
O5
、Nb2
O5
、SiO2
、Si3
N4
、ZnSe、MgF2
或CaF2
等材料,以折射率之高低交錯為堆疊原則進行搭配,例如SiO2
/TiO2
、SiO2
/Ta2
O5
、SiO2
/Nb2
O5
、ZnSe/MgF2
等,但本發明並不特別限制折射材料的種類。
本發明所揭示之布拉格反射層除了提供反射的功能,其材料的選用為絕緣材料時,又同時可作為電流分散之用;請參考第5圖,由於覆晶式發光二極體在實際應用時,發光層在較靠近P型電極的區域會因為有較多的電流通過而有較好的光電轉換效果,產生較多的光能,因此在本發明另一實施例中,可利用布拉格反射層23所開設之多個第一貫穿孔230的分布形式,影響電流傳導之路徑,達到電流分散的目的。請參考第5圖,在一種分布形式的例子中,第一貫穿孔230之間距D1
~D5
非為定值;進一步而言,該等第一貫穿孔230之間距D1
~D5
係隨著該等第一貫穿孔230與第二電極27之距離逐漸增加而逐漸減少,也就是第一貫穿孔230的密度是隨著所在位置遠離第二電極27的程度而逐漸增加。如前所述,發光層在較靠近P型電極的區域會有較多的電流通過,因此本發明在此實施例中讓第一貫穿孔230的密度隨著遠離第二電極27而逐漸增加,可使電流經分散而較均勻地抵達透明導電層22,進而使發光層211均勻發光。
請參考第6圖,其係為再一種提升電流擴散能力之實施例;如圖所示,其係於第二半導體層212之上方更設置多個電流阻擋層28,該等電流阻擋層28之間係包含多個貫穿之第三貫穿孔280而暴露出部分第二半導體層212,從而使設置於電流阻擋層28上之透明導電層22得有部分成長於第二半導體層212上,得因此與第二半導體層212相接觸而電性連接。該等第三貫穿孔280在垂直方向上係分別與布拉格反射層23之該等第一貫穿孔230為錯位設置,使電流阻擋層28在空間之垂直方向上係設置於對應第一貫穿孔230之位置,且互不連接。因此當電流自第二電極27經由第二貫穿孔250流通至金屬層24,然後再流通至透明導電層22後,當電流要繼續流通至第二半導體層212,其路徑的直線方向會受到電流阻擋層28的阻擋而無法直接流通,需繞過電流阻擋層28而經第三貫穿孔280方抵達第二半導體層212。如此,電流可較平均地分布,使發光二極體均勻發光且亮度提升。
請參考第7圖,其係為更一種提升電流擴散能力之實施例;如圖所示,其不設置絕緣層以及金屬層,而是利用布拉格反射層所使用材料的絕緣特性,使布拉格反射層23本身就可以兼具前述實施例之絕緣層的功能,而同時又具備反射的功能。進一步而言,由於布拉格反射層的材料選用可等同於前述實施例之絕緣層而皆為絕緣材料,因此亦可僅直接設置布拉格反射層。於此實施例之結構中,係在第二半導體層212之上設置如前一實施例所揭示之電流阻擋層28後,成長透明導電層22於電流阻擋層28上,並使透明導電層22透過貫穿電流阻擋層28之多個第三貫穿孔280而接觸第二半導體層212,該等第三貫穿孔280係經蝕刻該電流阻擋層28而形成,同時會使單一的電流阻擋層分離為多個電流阻擋層28,必此互不連接;接著成長至少一布拉格反射層23於透明導電層22上,再利用光阻舉離製程(photoresist lift-off)使布拉格反射層23形成多個貫穿布拉格反射層23之第一貫穿孔230而暴露出部分之透明導電層22;最後再將第二電極27設置於布拉格反射層23之上,並透過第一貫穿孔230與透明導電層22相接觸而電性連接。在此實施例所的結構中,該等第三貫穿孔280在垂直方向上係分別與該等布拉格反射層23之第一貫穿孔230為錯位設置(使電流阻擋層28設置於相對應第一貫穿孔230之位置),因此電流自第二電極27經由第一貫穿孔230流通至透明導電層22後,當電流要繼續流通至第二半導體層212,其路徑的直線方向會受到電流阻擋層28的阻擋而無法直接流通,需繞過電流阻擋層28而經第三貫穿孔280之開設位置方抵達第二半導體層212,如同前一實施例可使電流可較平均地分布,使發光二極體均勻發光且亮度提升。
請參考第8A~8E圖,本發明所揭示的具布拉格反射鏡之發光二極體之製造方法,在一實施例之步驟上係包含: 步驟S1:成長一磊晶層,該磊晶層具有一第一半導體層、一發光層以及一第二半導體層; 步驟S2:成長一透明導電層於該第二半導體層上; 步驟S3:成長一布拉格反射層於該透明導電層上; 步驟S4:形成多個第一貫穿孔貫穿該布拉格反射層多; 步驟S5:成長一金屬層於該布拉格反射層之上,且該金屬層透過該些第一貫穿孔而電性連接於該透明導電層; 步驟S6:成長一絕緣層於該金屬層之上;以及 步驟S7:形成至少一第二貫穿孔於該絕緣層上而暴露出部分之該金屬層。
在上述的步驟中,所選用的透明基板20可為藍寶石基板;透明導電層22則可選用氧化銦錫、氧化銦鋅等材料,使所形成之透明導電層22具有大於98%之透光率,且透明導電層與第二半導體層之間係存在歐姆接觸。金屬層24為鉻、金、鉑、鈦或鋁等元素所組成,經濺鍍而形成薄膜狀結構覆蓋於布拉格反射層23之上,此金屬層24可提供電流流通,作為電極之延伸而輔以分散電流分布,其也具備黏著上下層面之功能,例如於此實施例中與透明導電層接合,另外,其本身亦可提供部分的反射能力。絕緣層25則可以使用二氧化矽為材料,在覆蓋於金屬層24之上後,再蝕刻出第二貫穿孔250暴露出金屬層24,使後續設置的第二電極27得以和金屬層24接觸而導通電流,此絕緣層25亦覆蓋磊晶層之側邊及部分第一半導體層212之上表面。而若要進行如前述在結構上之各種變化,例如整合絕緣層與布拉格反射層,或是變更透明導電層、金屬層以及布拉格反射層之堆疊順序等,則係視需要而於步驟增加或減少成長相對應之層面,以及利用蝕刻之手段製作貫穿孔或間隙,使電流得以流通。
請參考第9圖,其係為本發明之再一實施例,其係在第二半導體層212之上設置布拉格反射層23,再利用光阻舉離製程形成多個貫穿布拉格反射層23之第一貫穿孔230而暴露出部分之第二半導體層212。布拉格反射層23之上則設置透明導電層22,透明導電層22可透過第一貫穿孔230而與第二半導體層212接觸。透明導電層22之上則是設置金屬層24,其與透明導電層22之間與係存在歐姆接觸。
綜上所述,本發明詳細揭示了一種具布拉格反射鏡之發光二極體及其製造方法,其利用布拉格反射鏡取代傳統的銀反射鏡,不但可以免除額外覆蓋鎢化鈦防止銀的擴散,減少製程步驟與不穩定因素,因而提升產品良率,並且也可利用布拉格反射鏡提供高反射率,讓發光二極體的出光亮度得以維持在的狀態,故在結合眾多優點之下,本發明無疑為一種兼具實用與商業價值之具布拉格反射鏡之發光二極體及其製造方法。
惟以上所述者,僅為本發明之實施例而已,並非用來限定本發明實施之範圍,舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。
1‧‧‧電路板
10‧‧‧導電凸塊
100‧‧‧電路接點
11‧‧‧導電凸塊
110‧‧‧電路接點
20‧‧‧透光基板
21‧‧‧磊晶層
210‧‧‧第一半導體層
211‧‧‧發光層
212‧‧‧第二半導體層
22‧‧‧透明導電層
23‧‧‧布拉格反射層
230‧‧‧第一折射材料
231‧‧‧第二折射材料
23a~23d‧‧‧子層
230‧‧‧第一貫穿孔
24‧‧‧金屬層
25‧‧‧絕緣層
250‧‧‧第二貫穿孔
26‧‧‧第一電極
27‧‧‧第二電極
28‧‧‧電流阻擋層
280‧‧‧第三貫穿孔
A‧‧‧局部放大區域
D1~D5‧‧‧第一貫穿孔之間距
第1圖:其係為本發明一實施例之結構剖視示意圖,用以表示磊晶層及其上之反射結構; 第2圖:其係為本發明一實施例之結構剖視示意圖; 第3圖:其係為本發明一實施例之結構局部放大示意圖,用以表示第3圖中的A區域; 第4圖:其係為本發明一實施例之部分結構示意圖,用以表示布拉格反射層係以第一反射材料以及第二反射材料反覆堆疊為具有至少4個子層; 第5圖:其係為本發明另一實施例之部分結構示意圖,用以表示部分第一貫穿孔之間距係與第二電極之相對距離為負相關; 第6圖:其係為本發明再一實施例之部分結構示意圖,用以表示使用電流阻擋層提升電流分布的均勻性; 第7圖:其係為本發明更一實施例之部分結構示意圖,用以表示使用電流阻擋層並省略金屬層與絕緣層之製作; 第8A~8E圖:其係為本發明一實施例之製造方法流程示意圖;以及 第9圖:其係為本發明更一實施例之部分結構示意圖,用以表示將透明導電層設置於布拉格反射層與金屬層之間。
20‧‧‧透光基板
21‧‧‧磊晶層
210‧‧‧第一半導體層
211‧‧‧發光層
212‧‧‧第二半導體層
22‧‧‧透明導電層
23‧‧‧布拉格反射層
230‧‧‧第一貫穿孔
24‧‧‧金屬層
25‧‧‧絕緣層
250‧‧‧第二貫穿孔
26‧‧‧第一電極
27‧‧‧第二電極
Claims (5)
- 一種具布拉格反射鏡之發光二極體,其結構係包含:一磊晶層,具有一第一半導體層、一發光層以及一第二半導體層;多個電流阻擋層,係位於該第二半導體層上;一透明導電層,其係位於該第二半導體層上,並覆蓋該等電流阻擋層多;一絕緣層,其係位於該透明導電層上,並具有多個貫穿孔;一第一電極,係電性連接於該第一半導體層;以及一第二電極,其係位於該絕緣層上,且經由該些貫穿孔電性連接於該透明導電層。
- 如申請專利範圍第1項所述之具布拉格反射鏡之發光二極體,其中,該絕緣層包含至少一布拉格反射層。
- 如申請專利範圍第1項所述之具布拉格反射鏡之發光二極體,其中,每一貫穿孔分別對準該些電流阻擋層的其中之一,且不超過所對準的該些電流阻擋層的範圍。
- 如申請專利範圍第1項所述之具布拉格反射鏡之發光二極體,更包含一金屬層及一第二絕緣層,其中,該第二絕緣層具有至少一第二貫穿孔,而該金屬層位於該絕緣層與該第二絕緣層之間,其中,該金屬層經由該些貫穿孔與該透明導電層電性連接,該第二電極係於該第二絕緣層上,且經由該至少一第二貫穿孔與該金屬層電性連接。
- 如申請專利範圍第1項所述之具布拉格反射鏡之發光二極體,其中,該些貫穿孔之間距係隨著該些貫穿孔與該第二電極之距離逐漸增加而逐漸減少。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562116923P | 2015-02-17 | 2015-02-17 | |
US62/116,923 | 2015-02-17 | ||
US201562148761P | 2015-04-17 | 2015-04-17 | |
US62/148,761 | 2015-04-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201703278A TW201703278A (zh) | 2017-01-16 |
TWI710144B true TWI710144B (zh) | 2020-11-11 |
Family
ID=56622525
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105104621A TWI695523B (zh) | 2015-02-17 | 2016-02-17 | 發光二極體晶片 |
TW109115259A TWI738324B (zh) | 2015-02-17 | 2016-02-17 | 發光二極體晶片 |
TW110126690A TWI772117B (zh) | 2015-02-17 | 2016-02-17 | 發光二極體晶片 |
TW105104668A TWI710144B (zh) | 2015-02-17 | 2016-02-17 | 具布拉格反射鏡之發光二極體及其製造方法 |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105104621A TWI695523B (zh) | 2015-02-17 | 2016-02-17 | 發光二極體晶片 |
TW109115259A TWI738324B (zh) | 2015-02-17 | 2016-02-17 | 發光二極體晶片 |
TW110126690A TWI772117B (zh) | 2015-02-17 | 2016-02-17 | 發光二極體晶片 |
Country Status (3)
Country | Link |
---|---|
US (4) | US9705045B2 (zh) |
CN (3) | CN105895772A (zh) |
TW (4) | TWI695523B (zh) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI695523B (zh) * | 2015-02-17 | 2020-06-01 | 新世紀光電股份有限公司 | 發光二極體晶片 |
KR102380825B1 (ko) * | 2015-05-29 | 2022-04-01 | 삼성전자주식회사 | 반도체 발광다이오드 칩 및 이를 구비한 발광장치 |
CN106486572B (zh) | 2015-09-02 | 2020-04-28 | 新世纪光电股份有限公司 | 发光二极管芯片 |
KR102266960B1 (ko) * | 2016-03-02 | 2021-06-18 | 한국전자통신연구원 | 쇼트키 다이오드 및 이의 제조 방법 |
JP6738169B2 (ja) * | 2016-03-11 | 2020-08-12 | Dowaエレクトロニクス株式会社 | 半導体光デバイスおよびその製造方法 |
US9893027B2 (en) * | 2016-04-07 | 2018-02-13 | Nxp Usa, Inc. | Pre-plated substrate for die attachment |
CN106129215A (zh) * | 2016-08-26 | 2016-11-16 | 广东德力光电有限公司 | 一种高光效led芯片结构 |
US10580932B2 (en) | 2016-12-21 | 2020-03-03 | Nichia Corporation | Method for manufacturing light-emitting device |
KR20180081371A (ko) | 2017-01-06 | 2018-07-16 | 서울바이오시스 주식회사 | 전류 차단층을 가지는 발광 소자 |
CN106684219A (zh) * | 2017-01-22 | 2017-05-17 | 厦门乾照光电股份有限公司 | 一种led芯片结构及其加工方法 |
TWI778010B (zh) * | 2017-01-26 | 2022-09-21 | 晶元光電股份有限公司 | 發光元件 |
CN106935695A (zh) * | 2017-05-17 | 2017-07-07 | 广东工业大学 | 一种紫外led器件 |
TWI790249B (zh) * | 2017-07-13 | 2023-01-21 | 大陸商蘇州樂琻半導體有限公司 | 發光裝置及發光裝置封裝 |
EP3439050B1 (en) * | 2017-08-02 | 2020-10-28 | Lg Innotek Co. Ltd | Light emitting device package |
CN107681026B (zh) * | 2017-09-25 | 2019-06-07 | 厦门乾照光电股份有限公司 | 一种发光二极管及其制备方法 |
CN109698264B (zh) * | 2017-10-20 | 2020-08-18 | 展晶科技(深圳)有限公司 | 发光二极管及其制造方法 |
CN107799638A (zh) * | 2017-10-24 | 2018-03-13 | 厦门乾照光电股份有限公司 | 一种倒装led及其制作方法 |
US10777764B2 (en) * | 2017-12-25 | 2020-09-15 | Epistar Corporation | Light-emitting element and light-emitting device comprising the same |
CN116864595A (zh) * | 2017-12-25 | 2023-10-10 | 晶元光电股份有限公司 | 一种发光元件及其发光装置 |
CN108231961B (zh) * | 2018-01-30 | 2019-05-14 | 厦门乾照光电股份有限公司 | 一种led芯片结构的制作方法 |
US10879420B2 (en) | 2018-07-09 | 2020-12-29 | University Of Iowa Research Foundation | Cascaded superlattice LED system |
CN109461753B (zh) * | 2018-10-29 | 2020-08-25 | 北京协同创新研究院 | 一种大注入倒装微米led芯片及其制备方法 |
CN109659414B (zh) * | 2018-11-22 | 2021-06-11 | 华灿光电(浙江)有限公司 | 一种倒装led芯片及其制作方法 |
CN111293202A (zh) * | 2018-12-06 | 2020-06-16 | 新世纪光电股份有限公司 | 发光二极管及其制造方法 |
CN109671829A (zh) * | 2018-12-13 | 2019-04-23 | 合肥彩虹蓝光科技有限公司 | 一种倒装式发光二极管芯片制备方法 |
TWI823644B (zh) * | 2019-01-25 | 2023-11-21 | 晶元光電股份有限公司 | 光電半導體裝置 |
TWI779188B (zh) * | 2019-05-02 | 2022-10-01 | 光感動股份有限公司 | 發光元件封裝結構及其製作方法 |
CN111916550B (zh) * | 2019-05-09 | 2023-02-03 | 群创光电股份有限公司 | 电子装置 |
WO2021059485A1 (ja) * | 2019-09-27 | 2021-04-01 | 三菱電機株式会社 | 光半導体装置およびその製造方法 |
CN111129251A (zh) * | 2019-12-30 | 2020-05-08 | 广东德力光电有限公司 | 一种高焊接性倒装led芯片的电极结构 |
TWI764127B (zh) * | 2020-04-08 | 2022-05-11 | 台灣愛司帝科技股份有限公司 | 發光二極體晶片初始結構、影像顯示裝置與晶片分類系統 |
CN111430522A (zh) * | 2020-05-09 | 2020-07-17 | 东莞市中晶半导体科技有限公司 | Led芯片、led显示屏模组及制作方法 |
CN111799354A (zh) * | 2020-06-11 | 2020-10-20 | 淮安澳洋顺昌光电技术有限公司 | 一种高推力值的MiniLED芯片制备方法 |
CN113380940B (zh) * | 2021-06-07 | 2023-02-28 | 厦门三安光电有限公司 | 发光二极管芯片及其制备方法 |
CN113964247B (zh) * | 2021-10-19 | 2024-01-30 | 淮安澳洋顺昌光电技术有限公司 | 发光二极管芯片及其制作方法 |
TWI804122B (zh) * | 2021-12-21 | 2023-06-01 | 友達光電股份有限公司 | 顯示裝置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201130164A (en) * | 2009-12-11 | 2011-09-01 | Showa Denko Kk | Semiconductor light emitting element, light emitting device using semiconductor light emitting element, and electronic apparatus |
CN102231413A (zh) * | 2009-10-13 | 2011-11-02 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管芯片及其制作方法 |
TWM460413U (zh) * | 2013-04-09 | 2013-08-21 | Gang Li | 半導體發光元件結構 |
Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4112455A (en) | 1977-01-27 | 1978-09-05 | The United States Of America As Represented By The Secretary Of The Navy | Field-effect transistor with extended linear logarithmic transconductance |
JPH07254732A (ja) | 1994-03-15 | 1995-10-03 | Toshiba Corp | 半導体発光装置 |
US6809010B1 (en) * | 1996-02-29 | 2004-10-26 | Kyocera Corporation | Sapphire single crystal, semiconductor laser diode using the same for substrate, and method for manufacturing the same |
US7511311B2 (en) * | 2002-08-01 | 2009-03-31 | Nichia Corporation | Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same |
JP4580633B2 (ja) * | 2003-11-14 | 2010-11-17 | スタンレー電気株式会社 | 半導体装置及びその製造方法 |
US8097897B2 (en) | 2005-06-21 | 2012-01-17 | Epistar Corporation | High-efficiency light-emitting device and manufacturing method thereof |
TWI370560B (en) | 2007-12-14 | 2012-08-11 | Delta Electronics Inc | Light-emitting diode device and manufacturing method thereof |
CN101510578B (zh) * | 2008-02-15 | 2013-05-01 | 奇力光电科技股份有限公司 | 发光二极管装置 |
TWI373153B (en) | 2008-09-22 | 2012-09-21 | Ind Tech Res Inst | Light emitting diode, and package structure and manufacturing method therefor |
KR100999806B1 (ko) | 2009-05-21 | 2010-12-08 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
CN101859861A (zh) * | 2010-05-13 | 2010-10-13 | 厦门市三安光电科技有限公司 | 具有双反射层的氮化镓基倒装发光二极管及其制备方法 |
JP5693375B2 (ja) | 2010-05-28 | 2015-04-01 | シチズンホールディングス株式会社 | 半導体発光素子 |
JP5398644B2 (ja) | 2010-06-07 | 2014-01-29 | 株式会社東芝 | 半導体発光装置を用いた光源装置 |
US8664684B2 (en) | 2010-08-31 | 2014-03-04 | Micron Technology, Inc. | Solid state lighting devices with improved contacts and associated methods of manufacturing |
EP2439793B1 (en) | 2010-10-11 | 2016-03-16 | LG Innotek Co., Ltd. | Light emitting device and lighting instrument including the same |
KR101169036B1 (ko) | 2010-10-21 | 2012-07-26 | 갤럭시아포토닉스 주식회사 | 전류 저지층을 포함하는 발광 다이오드 및 발광 다이오드 패키지 |
TWI553903B (zh) * | 2010-12-20 | 2016-10-11 | Lg伊諾特股份有限公司 | 發光元件及其製造方法 |
KR101054169B1 (ko) | 2011-02-22 | 2011-08-03 | (주)더리즈 | 질화갈륨계 반도체 발광소자 |
JP2012186195A (ja) | 2011-03-03 | 2012-09-27 | Toshiba Corp | 半導体発光素子及びその製造方法 |
KR101812745B1 (ko) * | 2011-05-12 | 2017-12-27 | 서울바이오시스 주식회사 | 발광 다이오드 및 그의 제조 방법 |
JP5642623B2 (ja) | 2011-05-17 | 2014-12-17 | 株式会社東芝 | 半導体発光装置 |
US9666764B2 (en) * | 2012-04-09 | 2017-05-30 | Cree, Inc. | Wafer level packaging of multiple light emitting diodes (LEDs) on a single carrier die |
CN102856454B (zh) | 2011-06-30 | 2015-02-04 | 展晶科技(深圳)有限公司 | Led磊晶结构 |
TWI529963B (zh) * | 2011-07-25 | 2016-04-11 | 廣鎵光電股份有限公司 | 發光元件結構 |
US9012939B2 (en) * | 2011-08-02 | 2015-04-21 | Kabushiki Kaisha Toshiba | N-type gallium-nitride layer having multiple conductive intervening layers |
JP5949294B2 (ja) * | 2011-08-31 | 2016-07-06 | 日亜化学工業株式会社 | 半導体発光素子 |
TW201322489A (zh) | 2011-11-29 | 2013-06-01 | Genesis Photonics Inc | 發光二極體元件及覆晶式發光二極體封裝元件 |
TW201324863A (zh) | 2011-12-13 | 2013-06-16 | Genesis Photonics Inc | 發光二極體元件以及覆晶式發光二極體封裝元件 |
US9227257B2 (en) * | 2012-04-24 | 2016-01-05 | Seagate Technology Llc | Laser subassembly metallization for heat assisted magnetic recording |
TW201407747A (zh) * | 2012-08-03 | 2014-02-16 | Chi Mei Lighting Tech Corp | 發光二極體結構及其製造方法 |
US20130292719A1 (en) * | 2012-05-04 | 2013-11-07 | Chi Mei Lighting Technology Corp. | Light-emitting diode structure and method for manufacturing the same |
US9496458B2 (en) * | 2012-06-08 | 2016-11-15 | Cree, Inc. | Semiconductor light emitting diodes with crack-tolerant barrier structures and methods of fabricating the same |
TW201401558A (zh) | 2012-06-28 | 2014-01-01 | Lextar Electronics Corp | 發光二極體結構及其製作方法 |
CN103579436A (zh) * | 2012-07-18 | 2014-02-12 | 广东量晶光电科技有限公司 | 一种半导体发光结构及其制作方法 |
TWI565097B (zh) | 2013-02-08 | 2017-01-01 | 隆達電子股份有限公司 | 發光二極體及其製造方法 |
US20140231852A1 (en) | 2013-02-15 | 2014-08-21 | Seoul Viosys Co., Ltd. | Led chip resistant to electrostatic discharge and led package including the same |
WO2014178651A1 (ko) | 2013-04-30 | 2014-11-06 | 주식회사 세미콘라이트 | 반도체 발광소자 |
CN104282816A (zh) * | 2013-07-05 | 2015-01-14 | 大连徳豪光电科技有限公司 | 具有布拉格反射层的倒装芯片发光二级管及其制备方法 |
CN103441198A (zh) * | 2013-09-09 | 2013-12-11 | 聚灿光电科技(苏州)有限公司 | 一种led高亮度倒装芯片以及制作方法 |
CN203503689U (zh) * | 2013-09-12 | 2014-03-26 | 刘艳 | 覆晶式led芯片 |
TWI478387B (zh) * | 2013-10-23 | 2015-03-21 | Lextar Electronics Corp | 發光二極體結構 |
KR102239625B1 (ko) | 2014-10-29 | 2021-04-13 | 엘지이노텍 주식회사 | 발광 소자 |
KR20160051394A (ko) | 2014-11-03 | 2016-05-11 | 엘지이노텍 주식회사 | 발광소자 및 조명시스템 |
TWI695523B (zh) * | 2015-02-17 | 2020-06-01 | 新世紀光電股份有限公司 | 發光二極體晶片 |
-
2016
- 2016-02-17 TW TW105104621A patent/TWI695523B/zh active
- 2016-02-17 TW TW109115259A patent/TWI738324B/zh active
- 2016-02-17 US US15/045,488 patent/US9705045B2/en active Active
- 2016-02-17 CN CN201610089450.1A patent/CN105895772A/zh active Pending
- 2016-02-17 CN CN201911295352.3A patent/CN110993765A/zh active Pending
- 2016-02-17 TW TW110126690A patent/TWI772117B/zh active
- 2016-02-17 US US15/045,266 patent/US20160240758A1/en not_active Abandoned
- 2016-02-17 TW TW105104668A patent/TWI710144B/zh active
- 2016-02-17 CN CN201610089271.8A patent/CN105895776B/zh not_active Expired - Fee Related
-
2017
- 2017-07-10 US US15/644,969 patent/US20170309787A1/en not_active Abandoned
-
2018
- 2018-05-09 US US15/975,743 patent/US10608144B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102231413A (zh) * | 2009-10-13 | 2011-11-02 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管芯片及其制作方法 |
TW201130164A (en) * | 2009-12-11 | 2011-09-01 | Showa Denko Kk | Semiconductor light emitting element, light emitting device using semiconductor light emitting element, and electronic apparatus |
TWM460413U (zh) * | 2013-04-09 | 2013-08-21 | Gang Li | 半導體發光元件結構 |
Also Published As
Publication number | Publication date |
---|---|
US20180261729A1 (en) | 2018-09-13 |
US10608144B2 (en) | 2020-03-31 |
US20170309787A1 (en) | 2017-10-26 |
CN105895776A (zh) | 2016-08-24 |
TW201703278A (zh) | 2017-01-16 |
TW201631809A (zh) | 2016-09-01 |
CN110993765A (zh) | 2020-04-10 |
US20160240758A1 (en) | 2016-08-18 |
TW202034545A (zh) | 2020-09-16 |
US20160240744A1 (en) | 2016-08-18 |
TW202141815A (zh) | 2021-11-01 |
CN105895772A (zh) | 2016-08-24 |
US9705045B2 (en) | 2017-07-11 |
TWI772117B (zh) | 2022-07-21 |
CN105895776B (zh) | 2020-01-14 |
TWI695523B (zh) | 2020-06-01 |
TWI738324B (zh) | 2021-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI710144B (zh) | 具布拉格反射鏡之發光二極體及其製造方法 | |
US10749075B2 (en) | Semiconductor light-emitting device | |
KR102539900B1 (ko) | 발광 디바이스 | |
JP4907842B2 (ja) | 平面全方位リフレクタを有する発光ダイオード | |
US20170012175A1 (en) | Light-emitting element and light-emitting device | |
US20180309029A1 (en) | Light emitting device and method of fabricating the same | |
US6900474B2 (en) | Light emitting devices with compact active regions | |
US11637223B2 (en) | Light emitting diode device | |
US11621374B2 (en) | Light-emitting device with a plurality of electrodes on a semiconductor stack | |
US20230238488A1 (en) | Semiconductor light-emitting device | |
CN116053381A (zh) | 倒装发光二极管及其制备方法 | |
US9991426B2 (en) | Light-emitting device package | |
CN114141925B (zh) | 发光二极管 | |
JP2013540365A (ja) | オプトエレクトロニクス素子及びその製造方法 | |
KR101805301B1 (ko) | 광추출효율 향상을 위한 p-형 오믹 접합 전극 패턴을 구비한 자외선 발광 다이오드 소자 | |
CN109935671B (zh) | 发光元件 | |
WO2019054943A1 (en) | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME | |
US20240170610A1 (en) | Light-emitting element, light-emitting module and display backlight unit | |
KR101672878B1 (ko) | 반도체 발광다이오드 | |
TWI552380B (zh) | 發光二極體結構 |