TWI709520B - Attaching mechanism of conveying device and testing equipment for its application - Google Patents

Abstract

A bonding mechanism of a conveying device, including a bonding unit and a temperature control unit. The bonding unit uses a bonding part to be bonded to a carrier tape with a plurality of electronic components, and the bonding part is divided into a pre-temperature zone and a test zone , The temperature control unit is provided with a temperature control on the bonding part, a first temperature guide component is provided in the pre-temperature zone, and a second temperature guide component is provided in the test zone, and the temperature of the temperature control passes through the first guide The temperature component and the second temperature guide component are conducted to a plurality of electronic components on the carrier tape; when the plurality of electronic components on the carrier tape are attached to the first temperature guide component in the pre-temperature zone, the temperature control uses the first temperature guide component Pre-warm the electronic components. When the electronic components are attached to the second temperature-conducting component in the test area, the temperature control uses the second temperature-conducting component to make the electronic components perform test operations in a simulated preset operating temperature environment, which not only improves the test quality, And can shorten the working time of temperature control electronic components , To achieve the practical benefit of improving test production efficiency.

Description

Attaching mechanism of conveying device and testing equipment for its application

The present invention provides a method that enables the electronic components on the carrier tape to be pre-warmed gradually, and the test operation is performed in a simulated preset operating temperature environment, which not only improves the test quality, but also shortens the operation time of the temperature-controlled electronic components, thereby improving the test production Effective attachment mechanism.

Nowadays, electronic components are becoming more and more precise and miniaturized, and they are assembled on a carrier tape made of flexible material (such as a film carrier tape). To ensure the quality of the electronic components, the industry uses test equipment to test the electronic components on the carrier tape. Please refer to Figure 1. The test equipment is equipped with a test device 11 with a probe card 111, and a conveying device 12 is arranged behind the test device 11. The conveying device 12 is equipped with an X direction A movable frame 121 for displacement. The movable frame 121 is equipped with two upper chain wheels 122 and a lower chain wheel 123 on the conveyor belt 13, and a plurality of electronic components 14 to be tested are arranged on the carrier belt 13, and the electronic components 14 are electrically connected by wires The contact points of the carrier tape 13 are provided with multiple holes on both sides of the carrier tape 13 to fit the upper sprocket of the upper sprocket 122 and the lower sprocket of the lower sprocket 123, and a fixed one on the moving frame 121 The attaching member 124 for the carrier tape 13 to abut against; during testing, the moving frame 121 of the conveying device 12 drives the carrier tape 13 with the electronic component 14 to move in the X direction toward the probe card 111 of the testing device 11, so that the electronic component 14 The side contact is electrically connected to the probe of the probe card 111 to perform the test operation; however, when the electronic component 14 is actually used in the future , May be in a low temperature environment or a high temperature environment. Although this test equipment can perform electrical tests on the electronic components 14, it cannot test the electronic components 14 on the carrier tape 13 in simulating the actual low or high temperature environment in the future. In other words, the quality of the electronic component 14 in actual use in a low temperature environment or a high temperature environment in the future cannot be guaranteed, so that the test accuracy and test quality cannot be improved.

The first object of the present invention is to provide a bonding mechanism of a conveying device, which includes a bonding unit and a temperature control unit. The bonding unit uses at least one bonding component to be bonded to a carrier tape with a plurality of electronic components. The bonding part is divided into a pre-temperature zone and a test zone. The temperature control unit is provided with at least one temperature control on the bonding part, and is provided with a first temperature guide component in the pre-temperature zone and a second guide in the test zone. The temperature of at least one temperature control is conducted to the plurality of electronic components on the carrier tape through the first temperature guide component and the second temperature guide component; the plurality of electronic components on the carrier tape are attached to the pre-temperature zone In the case of the first temperature-conducting component, at least one temperature control uses the first temperature-conducting component to pre-heat the adjacent electronic components. The two temperature-conducting components enable electronic components to perform test operations in a simulated preset operating temperature environment to achieve practical benefits of improving test quality.

The second objective of the present invention is to provide an attaching mechanism for a conveying device, wherein each time the carrier tape carries an electronic component, the electronic component is attached to a different part of a first temperature-conducting component, or The first temperature guide components attached to different positions can enable the electronic components to be pre-heated gradually, so as to shorten the operation time of the electronic components heating up or cooling down to the preset test temperature, and achieve the practical benefit of improving the test production efficiency.

The third object of the present invention is to provide a bonding mechanism for a conveying device, wherein the temperature control unit is provided with at least one temperature insulating member on the circumference of the first temperature guide member and the second temperature guide member to avoid The temperature of the temperature control is transmitted to the carrier tape to ensure the flatness of the carrier tape, so that the electronic components of the carrier tape are accurately located at the preset test position, which achieves the practical benefit of improving the test quality.

The fourth object of the present invention is to provide an electronic component test equipment using a conveying device, which includes a machine, a test device, a conveying device and a central control device. The test device is arranged on the machine and is provided with at least one tester. In order to perform test operations on electronic components, the conveying device is arranged on the machine table, and is equipped with a carrying mechanism, a conveying mechanism, and the bonding mechanism of the present invention to convey the carrier tape of the electronic components, and the bonding mechanism is used for warming Control electronic components. The central control device is used to control and integrate the actions of various devices to perform automated operations and achieve practical benefits of improving test performance.

In order to enable your reviewer to have a better understanding of the present invention, a preferred embodiment is given in conjunction with the drawings. The details are as follows:

Please refer to Figures 2, 3, and 4, the conveying device 20 includes a bearing mechanism, a conveying mechanism, and the attaching mechanism of the present invention; the bearing mechanism is provided with at least one displacement in the first direction (such as the X direction) driven by the bearing driver The mobile frame, furthermore, the carrying drive can be a cylinder, a linear motor, or a motor and transmission group. The carrying drive can be fixed on the frame or driven by the carrying drive for the first, second and third directions (such as X-Z-Y Direction) displacement; in this embodiment, the load-bearing driver includes a motor 211 and a transmission group. The motor 211 drives a transmission group that is arranged in the X direction and is the screw and screw seat group 212, and the screw seat of the screw and screw seat group 212 is connected to drive A moving frame 213 moves in the X direction.

The conveying mechanism is assembled on the moving frame 213 of the carrying mechanism, and the moving frame 213 is provided with a first conveying wheel 221 and a second conveying wheel 222 to convey a carrier tape with electronic components; in this embodiment , The first conveying wheel 221 and the second conveying wheel 222 are gears with transmission teeth, and are arranged up and down , The first conveyor wheel 221 is used to engage a carrier tape with electronic components, and carry the carrier tape for displacement in the Z direction , The second conveying wheel 222 outputs a carrier tape with electronic components.

The sticking mechanism of the present invention is configured on the carrying mechanism, and includes a sticking unit and a temperature control unit , The sticking unit is provided with at least one sticking part for sticking to the carrier tape with electronic components, and the sticking part is divided into a pre-temperature zone and a test zone. Furthermore, the sticking part can be a fixed configuration or Driven by the pasting driver to move in at least one direction, the pasting driver can be a cylinder, a linear motor, or a motor and transmission group. For example, the pasting unit can be fixed on the movable frame 213 with pasting parts, for example, the pasting unit can be provided Two sticking parts, one sticking part is fixed to the moving frame 213, the other sticking part is driven by the sticking driver to move in the X direction, so that the two sticking parts are used for sticking and clamping the carrier tape for positioning; In one embodiment, the attaching unit includes a first attaching piece 231 and a second attaching piece 232. The first attaching piece 231 is fixed to the movable frame 213 and is divided into a pre-heating zone L1 and a testing zone L2; The second bonding member 232 is located in front of the first bonding member 231, and is provided with at least one opening 2321 for exposing the electronic components of the carrier tape; further, the second bonding member 232 may be provided with two Z-directions Dispose the panel, and keep the two panels at an appropriate distance to form an opening 2321, or the second bonding member 232 is provided with a through hole as the opening 2321 on a panel arranged in the Z direction. Both of the aforementioned types can be used. The electronic components for the carrier tape are exposed; in this embodiment, the second attachment member 232 is provided with two panels 2322 arranged in the Z direction, and the two panels 2322 are kept at an appropriate distance to form an opening 2321. The bonding member 232 is driven by the bonding driver to move in the X direction. The bonding driver is a pressing cylinder 233 and is assembled on the moving frame 213 to drive the second bonding member 232 to move in the X direction relative to the first bonding member 231 .

The temperature control unit is provided with at least one temperature control on the bonding part, at least one first temperature guide component is provided in the pre-temperature zone L1, and at least one second temperature guide component is provided in the test zone L2, the first The temperature guide component conducts the temperature of the temperature control for pre-warming the electronic component, and the second temperature guide component conducts the temperature of the temperature control for the electronic component to be located in a simulated preset temperature test environment; the temperature control can be a cooling chip, The heating element or the carrier with fluid, the carrier can be a sticking part, allowing fluid to flow inside the sticking part; the first and second temperature guiding parts can be planes or bumps; the first guide The temperature component and the second temperature guide component can be arranged on the fixture or a part of the temperature control, or a part of the bonding part, for example, the first temperature guide part and the second temperature guide part can be assembled on the bonding part Fixtures for components; for example, with multiple temperature controls (such as cooling chips or heating elements ) One side is respectively used as the first temperature guide component and the second temperature guide component; for example, the first temperature guide component and the second temperature guide component are formed on the bonding part; in this embodiment, the temperature control unit is attached to the first The part 231 is provided with a temperature control, the temperature control is a carrier with low temperature fluid, and the temperature control unit uses the first attachment part 231 as the carrier , And a flow channel 2311 is opened inside the first attachment member 231, one end of the flow channel 2311 is connected to an input pipe 2312, and the input pipe 2312 is connected to a refrigerant supply device (not shown) to input the refrigerant into the flow channel 2311, The other end of the flow channel 2311 is connected to the output pipe 2313 to output the refrigerant, and the temperature control unit is located in the pre-heating zone L1 of the first bonding member 231 with a first temperature guide member 2314, and the first temperature guide member 2314 conducts flow The temperature of the refrigerant in the channel 2311 is used to pre-warm the electronic components. In addition, a second temperature guide member 2315 is provided in the test area L2 of the first bonding member 231. The second temperature guide member 2315 conducts the temperature of the refrigerant in the flow channel 2311 to the electronic components. , For electronic components to be tested in a simulated low temperature test environment.

Please refer to Figure 5, a schematic diagram of the conveying device 20 applied to electronic component testing equipment. The testing device 30 of the testing equipment is mounted on the carrier plate 31 with a tester that is a probe card 32. The probe card 32 has a probe for testing electronic components. Needle 321; The conveying device 20 is arranged behind the testing device 30, and the opening 2321 of the second attachment 232 is opposite to the probe card 32, and the conveying mechanism is a first conveying wheel 221 and a second conveying wheel 222 The carrier tape 42 of the conveyor with a plurality of electronic components 41A, 41B, 41C, 41D to be tested is displaced in the Z direction to between the first attaching member 231 and the second attaching member 232.

Please refer to Figures 6 and 7, the bonding unit uses a pressing cylinder 233 to drive the second bonding member 232 to move in the X direction relative to the first bonding member 231, so that the panel 2322 of the second bonding member 232 presses against the carrier tape 42 , The carrier tape 42 is pressed against the first attaching member 231, that is, the electronic component 41A of the carrier tape 42 to be tested is pressed against the second temperature guiding component 2315 of the test area L2, and the plurality of carrier tapes 42 are to be tested The electronic components 41B, 41C, 41D are attached to different parts of the first temperature guiding component 2314 in the pre-temperature zone L1, because the refrigerant in the flow channel 2311 will flow through the first temperature guiding component 2314 in the pre-temperature zone L1 and the test zone L2. The second temperature guide member 2315 enables the first temperature guide member 2314 and the second temperature guide member 2315 to conduct the temperature of the refrigerant. The temperature control unit uses the first temperature guide member 2314 in the pre-temperature zone L1 to conduct the temperature of the refrigerant in the flow channel 2311 Pre-warm multiple electronic components under test 41B, 41C , 41D, so that the plurality of electronic components 41B, 41C, 41D to be tested on the carrier tape 42 can start to cool down during the loading process and have not reached the test area L2. The temperature control unit uses the second temperature guiding component 2315 of the test area L2 The temperature of the refrigerant in the flow channel 2311 is transmitted to the electronic component 41A to be tested, so that the electronic component 41A to be tested is located in a simulated low-temperature test environment; then the carrying mechanism is driven by the motor 211 through the screw seat of the screw seat group 212 to drive the moving frame 213 in the X direction Moving forward, the moving frame 213 drives the conveying mechanism, the attaching unit, the temperature control unit and the carrier tape 42 with the electronic components 41A, 41B, 41C, 41D to move synchronously for the probe of the probe card 32 of the test device 30 321 passes through the opening 2321 of the second attaching member 232 and precisely contacts the contact 421 on the carrier tape 42 , The electronic component 41A is electrically connected, so that the electronic component 41A performs the test operation in a simulated preset low temperature environment; however, the carrier tape 42 carries a plurality of electronic components 41A, 41B, 41C, and 41D each time to move and change a position, when the electronic Each time the components 41B, 41C, and 41D move against the first temperature guide member 2314 in the pre-heating zone L1, the electronic components 41B, 41C, 41D will be preheated by different parts of the first temperature guide member 2314 once, in other words, In the path where the carrier tape 42 conveys a plurality of electronic components 41B, 41C, 41D, the plurality of electronic components 41B, 41C, 41D can undergo multiple gradual cooling in the pre-temperature zone L1 to shorten the plurality of electronic components 41B, 41C , 41D is cooled to the preset test temperature, so that when the electronic components 41B, 41C, 41D are sequentially displaced to the second temperature guiding component 2315 of the test area L2, the test operation can be performed quickly, thereby improving the test production efficiency.

Please refer to Figures 8 and 9, which are the second embodiment of the temperature control unit of the present invention. The difference from the first embodiment is that the temperature control unit is set as a heating element in the pre-temperature zone L1 of the first attachment member 231 The first temperature control 234, and a plurality of first temperature guide parts 2314A, 2314B, 2314C are arranged in the pre-temperature zone L1, and the plurality of first temperature guide parts 2314A, 2314B, 2314C conduct the preheating of the first temperature control 234 Set the temperature to a plurality of electronic components, and set a second temperature control 235 as a heating element in the test area L2 of the first bonding member 231, and set a second temperature guide member 2315A in the test area L2, the second The temperature guide component 2315A conducts the preset temperature of the second temperature control 235 to the electronic component for testing the electronic component in a simulated high temperature test environment. A plurality of first temperature guide components 2314A, 2314B, 2314C and a second temperature guide component The area of 2315A is equal to or smaller than the area of the electronic component to prevent temperature from being conducted to the carrier tape on the peripheral side of the electronic component. Furthermore, the temperature control unit is provided on the peripheral side of the first and second temperature-conducting parts At least one temperature insulation element 236 to prevent the temperature of the temperature control from being transferred to the carrier tape, thereby ensuring the flatness of the carrier tape , So that the electronic components and contacts of the carrier tape are accurately located at the preset test positions. Furthermore, the temperature insulating member 236 can be assembled to the bonding member or to a fixture with a first temperature guide component and a second temperature guide component. Or the bonding part made of heat insulating material can be used as the temperature insulating part. The foregoing method can prevent the heat transfer to the carrier tape from parts other than the first and second temperature guide parts; in this embodiment, the temperature control unit A temperature insulating member 236 is attached to the first attachment member 231 and located on the peripheral sides of the first temperature guiding members 2314A, 2314B, 2314C and the second temperature guiding member 2315A to avoid the first temperature control 234 and the second temperature The temperature of the control 235 directly or indirectly affects the flatness of the carrier tape.

Please refer to Figures 10 and 11, the bonding unit drives the second bonding member 232 to move in the X direction relative to the first bonding member 231 by the pressing cylinder 233, so that the panel 2322 of the second bonding member 232 presses against the carrier tape 42 , The carrier tape 42 is attached to the temperature insulating member 236 on the first attaching member 231, the electronic component 41A on the carrier tape 42 is attached to the second temperature guiding member 2315A of the first attaching member 231, and the carrier The plurality of electronic components 41B, 41C, 41D on the belt 42 are respectively attached to the plurality of first temperature guiding parts 2314A, 2314B, 2314C of the first bonding part 231, and the temperature control unit can use the plurality of first temperature guiding parts 2314A, 2314B, and 2314C conduct the preset temperature of the first temperature control 234 to the plurality of electronic components 41B, 41C, 41D, so as to transport the plurality of electronic components 41A, 41B, 41C, 41D in the path of the carrier tape 42 to make The plurality of electronic components 41B, 41C, 41D undergo multiple gradual heating in the pre-temperature zone L1 to shorten the plurality of electronic components 41B , 41C, 41D are heated to the preset test temperature. The temperature control unit uses the second temperature guide 2315A to conduct the temperature of the second temperature control 235 to the electronic component 41A, so that the electronic component 41A is simulated in the test area L2 The test operation is performed in a preset high-temperature environment; since the carrier tape 42 is a flexible and bendable film tape body, in order to improve the flatness of the carrier tape 42, a plurality of first temperature guide parts 2314A, 2314B, 2314C and second temperature guide parts 2315A The area is smaller than the area of the plurality of electronic components 41A, 41B, 41C, 41D, so as to prevent the plurality of first temperature guiding parts 2314A, 2314B, 2314C and the second temperature guiding part 2315A from contacting the plurality of electronic components 41A, 41B, 41C, Part of the carrier tape 42 on the side of 41D, in other words, the temperature insulator 236 blocks the temperature of the plurality of first temperature guide components 2314A, 2314B, 2314C and the second temperature guide component 2315A from being conducted to the carrier tape 42 to keep the carrier tape 42 The flatness improves the testing and positioning accuracy of a plurality of electronic components 41A, 41B, 41C, 41D and contacts 421; then the carrying mechanism is driven by the motor 211 through the screw seat of the screw and screw seat group 212 to drive the moving frame 213 forward in the X direction Displacement, the moving frame 213 drives the conveying mechanism, attaching unit, temperature control unit, and the carrier tape 42 with electronic components 41A, 41B, 41C, 41D to move synchronously, so that the electronic component 41A can be made to keep the carrier tape 42 flat. , 41B, 41C, 41D and the contact point 421 on the carrier tape 42 are accurately located at the preset test position, and the probe 321 of the probe card 32 of the test device 30 passes through the opening 2321 of the second attachment member 232 to make precise contact The contact 421 on the carrier tape 42 is electrically connected to the electronic component 41A, so that the electronic component 41A performs a test operation in a simulated preset high-temperature environment, achieving the practical benefit of effectively improving the test quality.

Furthermore, with the exception of the above implementation, the bonding unit can also be divided into a pre-temperature zone and a test zone on the second bonding part. The second bonding part can be made of engineering plastic material and become a temperature insulation part. The temperature control unit is attached to The pre-heating area of the second bonding part is provided with a first temperature guiding component, and the test area is provided with a second temperature guiding component , In addition, a first temperature control and a second temperature control are arranged inside or behind the first temperature guide component and the second temperature guide component; the plurality of electronic components on the carrier tape are attached to the first temperature guide of the pre-temperature zone The first temperature control uses the first temperature guide component to pre-warm the electronic components. When the electronic component is attached to the second temperature guide component in the test area, the second temperature control uses the second temperature guide component to make the electronic component Performing test operations in a simulated preset operating temperature environment not only improves the test quality, but also shortens the operating time of temperature-controlled electronic components, so as to improve test production efficiency.

Please refer to Figures 2, 3, 4, and 12, the conveying device 20 is applied to electronic component testing equipment, including a machine 50, a testing device 30, a conveying device 20 and a central control device (not shown). The testing device 30 It is assembled on the machine 50 and is provided with at least a pair of testers for testing electronic components. In this embodiment, the tester is provided with a probe card 32 for testing electronic components. The conveying device 20 is arranged on the machine. The table 50 is provided with a supporting mechanism, a conveying mechanism, and the attaching mechanism of the present invention. The first conveying wheel 221 and the second conveying wheel 222 of the conveying mechanism are assembled on the moving frame 213 of the supporting mechanism to convey electronic components. Carrier tape. The pasting mechanism of the present invention includes a pasting unit and a temperature control unit. The pasting unit is assembled on the carrier mechanism and is provided with at least one pasting member for pasting the carrier tape with electronic components. The pasting unit The bonding part is divided into a pre-temperature zone and a test zone. In this embodiment, the bonding unit is provided with a first bonding part 231 and a second bonding part 232 to position the carrier tape, and the first bonding part 231 The pre-temperature zone L1 and the test zone L2 are divided, and the temperature control unit is provided with at least one temperature control on the attachment part, and at least one first temperature guide component is arranged in the pre-temperature zone, and at least A second temperature guide component, at least one temperature control is used for pre-warming the electronic components on the carrier tape via the first temperature guide component, and the second temperature guide component supplies the electronic components in a simulated preset temperature test environment for testing; In this embodiment, the temperature control unit is provided with a flow channel 2311 inside the first attachment member 231, one end of the flow channel 2311 is connected to an input pipe 2312, and the input pipe 2312 is connected to a refrigerant supply device (not shown) to connect The refrigerant is input into the flow channel 2311, the other end of the flow channel 2311 is connected to the output pipe 2313 to output the refrigerant, and the temperature control unit is located in the pre-temperature zone L1 of the first attachment member 231 with a first temperature guide member 2314, The temperature guide member 2314 conducts the refrigerant temperature of the flow channel 2311 to pre-warm the electronic components. In addition, a second temperature guide member 2315 is provided in the test area L2 of the first bonding member 231, and the second temperature guide member 2315 conducts the flow channel 2311 The refrigerant temperature is in the electronic components, so that the electronic components can be tested in a simulated low temperature test environment; the carrying mechanism carries the conveying mechanism, the pasting mechanism and the carrier tape with electronic components to move, so that the contacts on the carrier tape accurately touch the probe The probe of the card 32, the probe card 32 is electrically connected to electronic components to perform test operations. The central control device is used to control and integrate the actions of various devices to perform automated operations and achieve the practical benefits of enhancing the operating performance.

[Learning]

11: Test device

111: Probe Card

12: Conveying device

121: mobile rack

122: upper sprocket

123: Lower sprocket

124: Sticker

13: carrier tape

14: Electronic components

[this invention]

20: Conveying device

211: Motor

212: Screw seat group

213: mobile rack

221: The first conveyor wheel

222: Second conveyor wheel

231: The first attachment

2311: runner

2312: input tube

2313: output tube

2314, 2314A, 2314B, 2314C: the first temperature guide component

2315, 2315A: second temperature guide component

232: The second attachment

2321: opening

2322: Panel

233: pressure cylinder

234: First temperature control

235: Second temperature control

236: temperature insulation

30: Test device

31: bearing plate

32: Probe card

321: Probe

41A, 41B, 41C, 41D: electronic components

42: carrier tape

421: Contact

50: machine

L1: Pre-temperature zone

L2: test area

Figure 1: Schematic diagram of the use of the conventional testing device and conveying device. Figure 2: A side view of the first embodiment of the conveying device of the present invention. Figure 3: An enlarged schematic diagram of part A of Figure 2. Figure 4: A front view of the first embodiment of the conveying device of the present invention. Figure 5: A schematic diagram of the use of the first embodiment of the conveying device of the present invention (1). Figure 6: A schematic diagram of the use of the first embodiment of the conveying device of the present invention (2). Figure 7: is an enlarged schematic diagram of part B of Figure 6. Figure 8: A schematic diagram of the second embodiment of the conveying device of the present invention. Figure 9: is an enlarged schematic view of part C of Figure 8. Figure 10: A schematic diagram of the second embodiment of the conveying device of the present invention. Figure 11: An enlarged schematic diagram of part D in Figure 10. Figure 12: A schematic diagram of the conveying device of the present invention applied to test equipment.

20: Conveying device

211: Motor

212: Screw seat group

213: mobile rack

221: The first conveyor wheel

222: Second conveyor wheel

231: The first attachment

2311: runner

2312: input tube

2313: output tube

2314: The first temperature guide component

2315: second temperature guide component

232: The second attachment

2321: opening

2322: Panel

233: pressure cylinder

Claims (9)

A pasting mechanism of a conveying device, comprising: pasting unit: at least one pasting part is provided for pasting a carrier tape with a plurality of electronic components, and the pasting part is divided into a pre-temperature zone and a test zone; Temperature control unit: at least one temperature control unit is provided on at least one of the attachment parts, and at least one first temperature guide component is provided in the pre-temperature zone for the temperature control and at least one electronic component of the carrier tape The component performs heat exchange, and the at least one electronic component is pre-heated. The temperature control unit is provided with at least one second temperature guide component in the test area for heating the temperature control and at least another electronic component of the carrier tape Exchange so that the at least another electronic component is located in a test environment that simulates a preset temperature, and the temperature control unit is provided with at least one temperature insulating member on the peripheral side of the first temperature guide component and the second temperature guide component, the temperature insulation The parts are relative to the carrier tape, and avoid the heat exchange between the temperature control and the carrier tape to ensure the flatness of the carrier tape. According to the attachment mechanism of the conveying device described in item 1 of the scope of patent application, wherein the first temperature guide component and the second temperature guide component are provided on a jig or a part of the temperature control, or A part of the attachment. According to the sticking mechanism of the conveying device described in item 1 of the scope of patent application, the sticking unit includes a first sticking piece and a second sticking piece, and the first sticking piece is divided into the pre-temperature zone and In the test area, the temperature control unit is provided with at least one temperature control on the first attachment member, and the first temperature guide component is provided in the pre-temperature area, and the second temperature control unit is provided in the test area Temperature guide parts. According to the sticking mechanism of the conveying device described in item 1 of the scope of patent application, the sticking unit includes a first sticking piece and a second sticking piece, and the second sticking piece is divided into the pre-temperature zone and In the test zone, the temperature control unit is provided with at least one temperature control on the second attachment member, and the first temperature guide component is provided in the pre-temperature zone, and the second temperature control unit is provided in the test zone Temperature guide parts. According to the attachment mechanism of the conveying device described in claim 1, wherein the area of the first temperature guiding component and the second temperature guiding component of the temperature control unit is equal to or smaller than the area of the electronic component. According to the attachment mechanism of the conveying device described in item 1 of the scope of patent application, wherein the temperature insulation member is assembled to the attachment member or the attachment member made of heat insulation material is used as the temperature insulation member, or The attachment piece is provided with a jig with the first temperature guide component, the second temperature guide component and the temperature insulation component. According to the attachment mechanism of the conveying device described in item 1 of the scope of patent application, the temperature control of the temperature control unit is a refrigerating chip, a heating element or a carrier with fluid. According to the attachment mechanism of the conveying device described in item 1 of the scope of patent application, the conveying device further includes a bearing mechanism and a conveying mechanism. The bearing mechanism is provided with at least one moving frame driven by a bearing driver to move in a first direction. The conveying mechanism is assembled on the moving rack of the carrying mechanism, and the moving rack is provided with a first conveying wheel and a second conveying wheel to convey the carrier tape to the attaching unit, and the attaching unit is assembled on the moving rack . An electronic component testing equipment using a conveying device, including: a machine; a conveying device: is arranged on the machine, and includes a carrying mechanism, a conveying mechanism, and at least one According to the pasting mechanism of the conveying device described in item 1 of the scope of patent application, the carrier tape with electronic components is conveyed, and the pasting mechanism is used to temperature-control the electronic components; the testing device: is arranged on the machine and At least one tester is provided for testing the electronic component; the central control device: controls and integrates the actions of each device to perform automated operations.

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