TWI709521B - Attaching mechanism of conveying device and testing equipment for its application - Google Patents

Abstract

A sticking mechanism of a conveying device includes a sticking unit and a temperature control unit. The sticking unit uses at least one sticking piece to support a carrier tape with electronic components. The temperature control unit is arranged on the sticking piece, and Equipped with temperature control and temperature guide parts, the temperature guide part conducts the temperature of the temperature control to the electronic components; when the electronic components are attached to the corresponding temperature guide parts on the bonding parts by the carrier tape, the temperature control unit is used The temperature guide component conducts the temperature of the temperature control to the electronic components, so that the electronic components on the carrier tape perform test operations in an environment that simulates the preset operating temperature, so as to achieve the practical benefit of improving the test performance.

Description

Attaching mechanism of conveying device and testing equipment for its application

The present invention provides a bonding mechanism that enables electronic components on a carrier tape to perform test operations in a simulated preset operating temperature environment, thereby improving test performance.

Nowadays, electronic components are becoming more and more precise and miniaturized, and they are assembled on a carrier tape made of flexible material (such as a film carrier tape). To ensure the quality of the electronic components, the industry uses test equipment to test the electronic components on the carrier tape. Please refer to Figure 1. The test equipment is equipped with a test device 11 with a probe card 111, and a conveying device 12 is arranged behind the test device 11. The conveying device 12 is equipped with an X direction A movable frame 121 for displacement. The movable frame 121 is equipped with two upper chain wheels 122 and a lower chain wheel 123 on the conveyor belt 13, and a plurality of electronic components 14 to be tested are arranged on the carrier belt 13, and the electronic components 14 are electrically connected by wires The contact points of the carrier tape 13 are provided with multiple holes on both sides of the carrier tape 13 to fit the upper sprocket of the upper sprocket 122 and the lower sprocket of the lower sprocket 123, and a fixed one on the moving frame 121 The attaching member 124 for the carrier tape 13 to abut against; during testing, the moving frame 121 of the conveying device 12 drives the carrier tape 13 with the electronic component 14 to move in the X direction toward the probe card 111 of the testing device 11, so that the electronic component 14 The side contact is electrically connected to the probe of the probe card 111 to perform the test operation; however, when the electronic component 14 is actually used in the future , May be in a low temperature environment or a high temperature environment. Although this test equipment can perform electrical tests on the electronic components 14, it cannot test the electronic components 14 on the carrier tape 13 in simulating the actual low or high temperature environment in the future. In other words, it is impossible to ensure the quality of the electronic component 14 in actual use in a low temperature environment or a high temperature environment in the future, so that the test accuracy and test quality cannot be improved.

The first object of the present invention is to provide a pasting mechanism of a conveying device, including a pasting unit and a temperature control unit. The pasting unit uses at least one pasting member to support a carrier tape with electronic components. The temperature control unit It is arranged on the bonding part, and is provided with a temperature control and a temperature guide component. The temperature guide part conducts the temperature of the temperature control to the electronic component; the carrier tape is used to carry the electronic component to the corresponding guide When temperature components, the temperature control unit uses the temperature guide components to transfer the temperature of the temperature control to the electronic components, so that the electronic components on the carrier tape can perform test operations in a simulated preset operating temperature environment to achieve practical benefits of improving test performance .

The second objective of the present invention is to provide a bonding mechanism for a conveying device, wherein the temperature control unit is provided with a temperature insulation member on the peripheral side of the temperature guide component to prevent the temperature of the temperature control from being transferred to the carrier tape, thereby ensuring The flatness of the carrier tape enables the electronic components and contacts of the carrier tape to be accurately located at the preset test positions, achieving the practical benefit of improving the test quality.

The third objective of the present invention is to provide an electronic component testing equipment using a conveying device, including a machine, a testing device, a conveying device, and a central control device. The test device is arranged on the machine and is provided with at least one tester. In order to perform test operations on electronic components, the conveying device is arranged on the machine table, and is equipped with a carrying mechanism, a conveying mechanism, and the bonding mechanism of the present invention to convey the carrier tape of the electronic components, and the bonding mechanism is used for warming Control electronic components. The central control device is used to control and integrate the actions of various devices to perform automated operations and achieve practical benefits of improving test performance.

In order to enable your reviewer to have a better understanding of the present invention, a preferred embodiment is given in conjunction with the drawings. The details are as follows:

Please refer to Figures 2, 3, and 4, the conveying device 20 of the present invention includes a bearing mechanism, a conveying mechanism, and the attaching mechanism of the present invention; the bearing mechanism is provided with at least one bearing drive driven in a first direction (such as the X direction) The movable frame of displacement, furthermore, the carrying drive can be a cylinder, a linear motor or a motor and a transmission group. The carrying drive can be fixed on the frame or driven by the transport drive as the first and second Displacement in three directions (such as X-Z-Y directions); in this embodiment, the load-bearing driver includes a motor 211 and a transmission group. The motor 211 drives a transmission group that is arranged in the X direction and is the screw and screw seat group 212. The screw base of the screw base group 212 is connected to drive a moving frame 213 for displacement in the X direction.

The conveying mechanism is assembled on the moving frame 213 of the carrying mechanism, and the moving frame 213 is provided with a first conveying wheel 221 and a second conveying wheel 222 to convey a carrier tape with electronic components; in this embodiment , The first conveying wheel 221 and the second conveying wheel 222 are gears with transmission teeth, and are arranged up and down , The first conveyor wheel 221 is used to engage a carrier tape with electronic components, and carry the carrier tape for displacement in the Z direction , The second conveying wheel 222 outputs a carrier tape with electronic components.

The attaching mechanism of the present invention is arranged on the carrying mechanism and includes an attaching unit and a temperature control unit. The attaching unit is provided with at least one attaching piece for supporting a carrier tape with electronic components; , The sticking part can be fixedly configured or driven by a sticking driver to move in at least one direction. The sticking driver can be a pressure cylinder, a linear motor or a motor and a transmission group. For example, the sticking unit can be fixed on the movable frame 213. For example, the attaching unit can be provided with two attaching pieces. One attaching piece is fixed to the moving frame 213, and the other attaching piece is driven by the attaching driver to move in the X direction, so that the two attaching pieces can be supported. And clamping carrier tape positioning The first embodiment of the attaching unit of the present invention includes a first attaching piece 231 and a second attaching piece 232, the first attaching piece 231 is fixed to the movable frame 213, and the second attaching piece 232 is located at the first At least one opening 2321 is provided on the front of the attaching member 231 for exposing the electronic components of the carrier tape; further, the second attaching member 232 can be provided with two panels arranged in the Z direction, and the two panels can be held An opening 2321 is formed at an appropriate pitch , Or the second attaching member 232 is provided with a through hole as an opening 2321 on a panel arranged in the Z direction, and both of the foregoing two types can be used to expose the electronic components of the carrier tape; in this embodiment, The second bonding member 232 is provided with two panels 2322 arranged in the Z direction, and the two panels 2322 are kept at an appropriate distance to form an opening 2321. The second bonding member 232 is driven by the bonding driver to move in the X direction. The connecting driver is a pressing cylinder 233 and is assembled on the moving frame 213 to drive the second connecting member 232 to move in the X direction relative to the first connecting member 231.

The temperature control unit is arranged on the bonding part and is provided with a temperature control and a temperature guide component. The temperature guide component conducts the temperature of the temperature control to the electronic component for testing the electronic component in a simulated high temperature or low temperature test environment. The temperature control can be a refrigerating chip, a heating element or a carrier with a fluid. The temperature guide component can be an independent element or a part of the temperature control, or a part of a bonding part, for example, it can be attached to The connecting piece is assembled with a jig with a temperature-conducting part, and the temperature-conducting part of the jig transfers the temperature of the temperature control to the electronic component; for example, one side of the temperature control (such as a cooling chip or a heating element) is used as the temperature-conducting part. Contact conducts temperature to electronic components; for example, forming a temperature-conducting component on the bonding part to transfer the temperature of the temperature control to the electronic component; and the area of the thermal-conducting component is equal to or smaller than the area of the electronic component to avoid temperature conduction to the electronic component The carrier tape portion on the peripheral side; in this embodiment, the temperature control unit is provided with a first temperature control 241 as a heating element on the first attaching member 231 for testing electronic components in a simulated high temperature test environment. The control unit is provided with a first temperature guide member 2311 on the first bonding member 231, and the first temperature guide member 2311 is a bump for guiding the temperature of the first temperature control 241 in the first bonding member 231 Electronic components that are warm to the carrier tape; in addition, the temperature control unit is provided with at least one temperature insulating member 242 on the peripheral side of the temperature guide component to prevent the temperature of the first temperature control 241 from being transferred to the carrier tape, thereby ensuring the carrier tape The flatness enables the electronic components and contacts of the carrier tape to be accurately located at the preset test positions. Furthermore, the temperature-insulating member 242 can be assembled to the bonding part, or to a fixture with temperature-conducting parts, or to heat insulation The bonding parts made of materials are used as temperature insulating parts. The aforementioned methods can prevent the temperature from conducting the temperature to the carrier tape at parts other than the temperature guide parts; in this embodiment, the temperature control unit is attached to the first bonding part 231 and is located at the first A temperature insulating member 242 is provided on the peripheral side of the temperature guide member 2311 to prevent the temperature of the first temperature control 241 from directly or indirectly affecting the flatness of the carrier tape.

Please refer to Figures 5 and 7, a schematic diagram of the conveying device 20 applied to electronic component testing equipment. The testing device 30 of the testing equipment is assembled on the carrier plate 31 with a tester which is a probe card 32, and the probe card 32 has test electronic components. The probe 321; the conveying device 20 is disposed behind the testing device 30, and the opening 2321 of the second attachment 232 is opposite to the probe card 32, and the conveying mechanism is the first conveying wheel 221 and the second conveying The carrier tape 42 of the wheel 222 conveying a plurality of electronic components 41 to be tested is displaced in the Z direction to between the first attaching piece 231 and the second attaching piece 232, and makes the electronic component 41 on the carrier tape 42 relative to the first The first temperature guiding component 2311 of the attaching piece 231.

Please refer to Figures 6 and 7, the bonding unit uses a pressing cylinder 233 to drive the second bonding member 232 to move in the X direction relative to the first bonding member 231, so that the panel 2322 of the second bonding member 232 presses against the carrier tape 42 , The carrier tape 42 is attached to the temperature insulating member 242 on the first attachment member 231, and the electronic component 41 on the carrier tape 42 is attached to the first temperature guide member 2311 of the first attachment member 231, and the temperature is controlled The unit can use the first temperature guiding component 2311 to conduct the preset temperature of the first temperature control 241 to the electronic component 41. Since the carrier tape 42 is a flexible and bendable film tape, in order to improve the flatness of the carrier tape 42, The area of the first temperature guide member 2311 is smaller than the area of the electronic component 41 to prevent the first temperature guide member 2311 from contacting the part of the carrier tape 42 on the peripheral side of the electronic component 41. In other words, the temperature insulating member 242 blocks the first temperature control The temperature of 241 is conducted to the carrier tape 42 around the electronic component 41 , To maintain the flatness of the carrier tape 42, thereby improving the test positioning accuracy of the electronic components 41 and the contacts 421; then the carrier mechanism is driven by the motor 211 through the screw seat of the screw seat group 212 to drive the moving frame 213 to move forward in the X direction. The moving rack 213 drives the conveying mechanism, the attaching unit, the temperature control unit and the carrier tape 42 with the electronic component 41 to move synchronously, so that the electronic component 41 and the contact point on the carrier tape 42 can be maintained while the carrier tape 42 is kept flat. 421 is accurately located at the preset test position, and the probe 321 of the probe card 32 of the test device 30 passes through the opening 2321 of the second attachment member 232 to precisely contact the contact 421 on the carrier tape 42 to electrically connect the electronics The component 41 is combined with the temperature control unit to use the first temperature control 241 and the first temperature guide component 2311 to conduct the temperature electronic component 41, so that the electronic component 41 performs the test operation in a simulated preset operating temperature environment, so as to effectively improve the test quality. benefit.

Please refer to Figures 8 and 9, which are the second embodiment of the temperature control unit of the present invention. The difference from the first embodiment is that the temperature control unit is provided with a second temperature guide member 2323 on the second attachment member 232. The second temperature guide part 2323 is matched with the second temperature control 243, which can conduct the preset temperature to the electronic components, and further , The second temperature control 243 can be assembled on the back surface or inside of the second temperature guide member 2323, and the height position of the contact surface of the second temperature guide member 2323 is lower than the height position of the contact surface of the second bonding member 232, so that The contact surface of the second bonding member 232 can be crimped to the carrier tape 42 and to prevent pressure loss of electronic components; in this embodiment, the temperature control unit is made of a temperature insulating material (such as engineering plastic) to make the second bonding member 232. Make the second bonding member 232 a temperature insulating member, the temperature control unit is provided with a second temperature guiding member 2323 on the second bonding member 232, and a second heating member is arranged inside the second temperature guiding member 2323 Temperature control 243.

Please refer to Figures 10 and 11, the attaching unit drives the second attaching member 232 to move in the X direction with respect to the first attaching member 231 by the pressing cylinder 233, so that the second attaching member 232 is pressed against the carrier tape 42, and The second temperature guide member 2323 is attached to the electronic component 41 on the carrier tape 42, and the second temperature control 243 of the bonding unit uses the second temperature guide member 2323 to conduct the preset temperature to the electronic component 41; then the carrying mechanism is The motor 211 drives the moving frame 213 to move forward in the X direction through the screw seat of the screw and screw seat group 212. The moving frame 213 drives the conveying mechanism, attaching unit, temperature control unit and carrier tape 42 with electronic components 41 to move synchronously, and test The probe 321 of the probe card 32 of the device 30 passes through the opening 2321 of the second attachment member 232 and precisely contacts the contact 421 on the carrier tape 42 to electrically connect the electronic component 41. The temperature control unit uses the second The temperature control 243 and the second temperature guiding component 2323 enable the electronic component 41 to perform a test operation in a simulated preset operating temperature environment, thereby effectively improving the test quality.

Please refer to Figures 2, 3, 4, and 12, the conveying device 20 is applied to electronic component testing equipment, including a machine 50, a testing device 30, a conveying device 20 and a central control device (not shown). The testing device 30 It is assembled on the machine 50 and is provided with at least a pair of testers for testing electronic components. In this embodiment, the tester is provided with a probe card 32 for testing electronic components. The conveying device 20 is arranged on the machine. The table 50 is provided with a supporting mechanism, a conveying mechanism, and the attaching mechanism of the present invention. The first conveying wheel 221 and the second conveying wheel 222 of the conveying mechanism are assembled on the moving frame 213 of the supporting mechanism to convey electronic components. Carrier tape. The attaching mechanism of the present invention includes an attaching unit and a temperature control unit. The attaching unit is assembled on the carrier mechanism and is provided with a first attaching member 231 and a second attaching member 232 to position the carrier tape. The temperature control unit is assembled in the attaching unit, and is provided with a first temperature control 241 and a first temperature guide component 2311, with temperature-controlled electronic components, the carrier mechanism carries the conveying mechanism, the attaching mechanism and the carrier with electronic components With displacement, the contact points on the carrier tape accurately contact the probes of the probe card 32. The probe card 32 is electrically connected to electronic components to perform test operations. The central control device is used to control and integrate the actions of various devices. Perform automated operations to achieve practical benefits of enhancing operational efficiency.

[Learning]

11: Test device

111: Probe Card

12: Conveying device

121: mobile rack

122: upper sprocket

123: Lower sprocket

124: Sticker

13: carrier tape

14: Electronic components

[this invention]

20: Conveying device

211: Motor

212: Screw seat group

213: mobile rack

221: The first conveyor wheel

222: Second conveyor wheel

231: The first attachment

2311: The first temperature guide component

232: The second attachment

2321: opening

2322: Panel

2323: The second temperature guide component

233: pressure cylinder

241: First temperature control

242: temperature insulation

243: Second temperature control

30: Test device

31: bearing plate

32: Probe card

321: Probe

41: Electronic components

42: carrier tape

421: Contact

50: machine

Figure 1: Schematic diagram of the use of the conventional testing device and conveying device. Figure 2: A side view of the first embodiment of the conveying device of the present invention. Figure 3: An enlarged schematic diagram of part A of Figure 2. Figure 4: A front view of the first embodiment of the conveying device of the present invention. Figure 5: A schematic diagram of the use of the first embodiment of the delivery device of the present invention (1). Figure 6: A schematic diagram of the use of the first embodiment of the delivery device of the present invention (2). Figure 7: is an enlarged schematic diagram of part B of Figure 6. Figure 8: A schematic diagram of the second embodiment of the conveying device of the present invention. Figure 9: is an enlarged schematic view of part C of Figure 8. Figure 10: A schematic diagram of the second embodiment of the conveying device of the present invention. Figure 11: An enlarged schematic diagram of part D in Figure 10. Figure 12: A schematic diagram of the conveying device of the present invention applied to test equipment.

231: The first attachment

2311: The first temperature guide component

232: The second attachment

2321: opening

241: First temperature control

242: temperature insulation

32: Probe card

321: Probe

41: Electronic components

42: carrier tape

421: Contact

Claims (9)

A sticking mechanism of a conveying device, comprising: sticking unit: at least one sticking piece is provided for supporting a carrier tape with electronic components; temperature control unit: mounted on the sticking unit and provided with at least A temperature control and at least one temperature guide component, the temperature control is arranged on at least one of the attachment parts, the temperature guide component is for the temperature control and the electronic component of the carrier for heat exchange, and in the At least one temperature insulating member is arranged on the peripheral side of the temperature guide component, and the temperature insulating member is opposite to the carrier tape to avoid heat exchange between the temperature control and the carrier tape to ensure the flatness of the carrier tape. According to the attachment mechanism of the conveying device described in item 1 of the scope of patent application, the temperature control is a cooling chip, a heating element or a carrier with fluid. According to the attachment mechanism of the conveying device described in item 1 of the scope of patent application, wherein the temperature guide component is a part of the temperature control or a part of the attachment part, or is provided with a device on the attachment part The fixture for the temperature guide component. According to the attaching mechanism of the conveying device described in item 1 of the scope of patent application, the attaching unit includes a first attaching piece and a second attaching piece, and the temperature control unit is provided with the first attaching piece At least one is the first temperature control and at least one is the first temperature guide. According to the attaching mechanism of the conveying device described in item 1 of the scope of patent application, the attaching unit includes a first attaching piece and a second attaching piece, and the temperature control unit is provided with the second attaching piece At least one is the second temperature control and at least one is the second temperature guide. According to the attachment mechanism of the conveying device described in item 1 of the scope of patent application, the area of the temperature guide component of the temperature control unit is equal to or smaller than the area of the electronic component. According to the attachment mechanism of the conveying device described in item 1 of the scope of patent application, wherein the temperature insulation member is assembled to the attachment member or the attachment member made of heat insulation material is used as the temperature insulation member, or The attaching part is provided with a jig with the temperature guide part and the temperature insulation part. According to the attachment mechanism of the conveying device described in item 1 of the scope of patent application, the conveying device further includes a bearing mechanism and a conveying mechanism. The bearing mechanism is provided with at least one moving frame driven by a bearing driver to move in a first direction. The conveying mechanism is assembled on the moving rack of the carrying mechanism, and the moving rack is provided with a first conveying wheel and a second conveying wheel to convey the carrier tape to the attaching unit, and the attaching unit is assembled on the moving rack . An electronic component testing equipment using a conveying device, including: a machine; a conveying device: arranged on the machine, including a carrying mechanism, a conveying mechanism, and at least one attachment of the conveying device described in item 1 of the scope of patent application The mechanism is a carrier tape for conveying electronic components, and the bonding mechanism is used to temperature-control the electronic components; the testing device is arranged on the machine platform and is provided with at least one tester for testing the electronic components; center Control device: It controls and integrates the actions of various devices to perform automated operations.

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