JP2010175288A - Apparatus for inspecting electronic device and implement for holding electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device inspection apparatus which performs inspection of an electrical characteristic of the electronic device in a desired state of inclination. <P>SOLUTION: The electronic device inspection apparatus for inspecting the electronic device such as an acceleration sensor includes a temperature adjusting means 30 which performs temperature adjustment of the electronic device, a first shaft part 36 which is rotated by a first motor 35 around a first horizontal direction intersecting the vertical direction perpendicularly, as the axis, a holding means 28 which is rotated around the first horizontal direction as the axis, and a second shaft part 39 which rotates the first shaft part 36 to which the holding means 28 is fixed at an arbitrary angle by a second motor 38. According to this constitution, an implement 7 which holds the electronic device held by the holding means 28 can be inclined in arbitrary directions by two shafts consisting of the first shaft part 36 and the second shaft part 39. Therefore, the inspection of the electrical characteristic is performed in the state wherein the electronic device made to be at a prescribed temperature by the temperature adjusting means 30 is inclined in a desired arbitrary direction. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device inspection apparatus for inspecting electrical characteristics of an electronic device in a predetermined tilt state and a jig for holding the electronic device.

  In recent years, an acceleration sensor using MEMS (Micro Electro Mechanical Systems) technology has been mounted on an electronic device such as a mobile phone. These accelerometers are equipped with electronic devices for detecting the tilt angle, but the output voltage changes under the environment of individual differences, normal temperature, low temperature, high temperature, etc. In general, the electrical characteristics of manufactured electronic devices are inspected in an environment at a high temperature.

  Patent Document 1 discloses an inspection method and apparatus for inspecting the electrical characteristics of an electronic device at a predetermined inclination angle by changing the attitude of the electronic device in an environment of normal temperature, low temperature, and high temperature. Patent Document 2 discloses an inspection method and apparatus for inspecting electrical characteristics of an electronic device in a state where the electronic device is inclined at a predetermined angle.

JP 2006-292774 A JP 2005-326384 A

  In the inspection of the electrical characteristics of a general electronic device in the past, since the temperature of the electronic device is changed to a low temperature, a normal temperature, or a high temperature, for example, an electronic device that is extremely lowered to -30 ° C. is simply used. There is a concern that condensation will occur on the surface of the electronic device when the temperature is changed to room temperature such as 25 ° C., and if condensation occurs, it will adhere to the electronic device due to the operation of the device that transports the electronic device. There is a risk that the condensed dew may be scattered or dripped, resulting in failure of the apparatus or the electronic device.

  Further, in Patent Documents 1 and 2, when inspecting an electronic device to be inspected at a low temperature, a normal temperature, and a high temperature, a low-temperature adjustment inspection unit, a normal-temperature adjustment inspection unit, and a high-temperature adjustment inspection unit arranged linearly Since the electronic device is conveyed using a linearly arranged conveyor, the distance between the entrance of the conveyor for loading the electronic device and the exit for unloading is inevitably increased. When performing maintenance / inspection of whether or not the supply and collection operations of the electronic device are normally performed, it is necessary to move between the entrance and the exit of the conveyor, resulting in poor workability.

  In the inspection apparatus in Patent Documents 1 and 2, a single rotation measurement unit for tilting the electronic device is provided, and the held electronic device is rotated in a fixed direction by the rotation measurement unit, thereby 0 degree, Although it is possible to inspect the electrical characteristics of the electronic device at an angle of 90 degrees, 180 degrees, and 270 degrees, depending on the direction in which the electronic device is inclined, the inclination angle is the same. However, since the electrical characteristics of the electronic device change, in order to inspect the rotation direction in various directions, the orientation of the electronic device held by the rotation measurement unit must be manually adjusted so that it becomes the desired rotation direction. The inspection must be performed with the electronic device tilted in three directions: up / down, left / right, and front / rear. Uniwa, since would manually cause operations to replace the orientation detachable mounting direction of the electronic device, the inspection process will spend time, resulting in an increase in the cost of the product.

  The present invention has been made in view of the above problems, and provides an electronic device inspection apparatus and a jig for holding an electronic device that can inspect the electrical characteristics of the electronic device in a desired inclined state. Objective.

An electronic device inspection apparatus according to claim 1 comprises:
A first shaft portion rotated by a first motor with a first horizontal direction orthogonal to the vertical direction as an axis;
Clamping means which is rotated about the first horizontal direction by being fixed to the first shaft portion;
A holding member for rotatably holding the clamping means;
A second motor that rotates the first shaft portion, to which the clamping means is fixed, from the horizontal direction to an arbitrary angle with a second horizontal direction orthogonal to the first horizontal direction as an axis. With the shaft part of,
The jig holding the electronic device held by the holding means can be rotated about the first shaft portion and the second shaft portion as an axial direction, so that the jig is attached to the holding means. And an inspection unit that inspects the electrical characteristics of the electronic device held through the device while being inclined at an arbitrary angle.

  According to the electronic device inspection apparatus of the first aspect, the electronic device sandwiched by the sandwiching means is rotated (X ′, Y ′, Z ′ rotation) about the first shaft portion and the second shaft portion. ), And the first shaft portion is rotated and tilted to a desired position with the second shaft portion as an axis, so that two axes including the first and second shaft portions are used. Thus, the electronic device held by the holding means can be freely tilted in all directions so that there is no direction in which the electronic device cannot be directed. Therefore, the inspection can be performed in a state where the electronic device is freely tilted in any desired direction.

An electronic device inspection apparatus according to claim 2 is the electronic device inspection apparatus according to claim 1,
A temperature adjusting means for heating or cooling the electronic device in a state where the jig holding the electronic device is held is provided in the holding means.

  According to the electronic device inspection apparatus of the second aspect, the inspection of the electronic device tilted in an arbitrary direction can be performed in a state of being cooled to normal temperature, low temperature, or cooled by heating or cooling of the temperature adjusting means.

An electronic device inspection apparatus according to claim 3 is the method of claim 2,
In such a state that the electronic device is held at normal temperature, low sound, high temperature by the temperature adjusting means, and the electronic device held in the jig can be inspected in the predetermined direction, the electrical characteristics can be inspected.
As the inspection unit,
A room temperature inspection unit for inspecting the electronic device at room temperature;
A low temperature inspection unit for inspecting the electronic device at a low temperature lower than the normal temperature; and
And a high-temperature inspection unit that inspects the electronic device at a temperature higher than the normal temperature.

  According to the electronic device inspection apparatus of claim 3, since the room temperature inspection unit, the low temperature inspection unit, and the high temperature inspection unit are provided as the inspection unit configured in the electronic device inspection apparatus, The electrical characteristics can be inspected at a high temperature.

The electronic device inspection apparatus according to claim 4 is the electronic device inspection apparatus according to claim 3,
The room temperature of the electronic device that is brought to room temperature by the room temperature inspection unit is 15 ° C. or more and 35 ° C. or less.

  According to the electronic device inspection apparatus of claim 4, an inspection of an electronic device in a normal temperature state of 15 ° C. or more and 35 ° C. or less, an inspection of an electronic device in a higher high temperature state, and an inspection of an electronic device in a low temperature state lower than normal temperature are performed. be able to.

The electronic device inspection apparatus according to claim 5 is any one of claims 1 to 4,
A mounting recess for storing the electronic device, and a leaf spring insertion recess for storing a leaf spring operated with one side as a fulcrum, are formed continuously to the jig,
As the jig is clamped by the clamping means, an actuating means for elastically contacting the leaf spring to the electronic device accommodated in the mounting recess is provided in the clamping means.

  According to the electronic device inspection apparatus of claim 5, as the clamping means clamps the jig, the operating means elastically contacts and positions the electronic device via the leaf spring, so that the electronic device is positioned with respect to the jig. It can be reliably held so as not to shift.

The jig for holding the electronic device according to claim 6 is described in claim 5,
A mounting recess housing the electronic device;
A leaf spring insertion recess that accommodates a leaf spring that is connected to the mounting recess and actuated with one side as a fulcrum;
Forming a pin insertion hole in the jig for inserting and removing a leaf spring operating pin serving as the operating means for pressing the leaf spring accommodated in the leaf spring insertion recess;
When the leaf spring operating pin is inserted into the pin insertion hole as the jig is held by the holding means,
The leaf spring is depressed by the leaf spring operation pin so that the leaf spring is elastically contacted with the electronic device accommodated in the placement recess. Thus, the pin insertion hole is formed.

  According to the jig for holding the electronic device according to claim 6, the plate spring operating pin of the holding means is inserted into the pin insertion hole formed in the jig as the holding means holds the jig. A pin insertion hole through which the leaf spring operating pin is inserted is formed continuously to the leaf spring insertion recess so that the spring is in a position to elastically contact the electronic device accommodated in the placement recess. On the other hand, the electronic device accommodated in the mounting recess can be held so as not to be displaced.

  According to the present invention, the electronic device held by the clamping means by the two shafts including the first and second shaft portions is freely tilted in all directions so that there is no direction in which the electronic device cannot be directed, and the electronic device is in any desired direction. Can be inspected in a state in which is tilted freely. Therefore, when inspecting the direction in which the electronic device is inclined in a desired inclination state, as in the past, in order to change the inclination direction of the electronic device manually, the complicated operation of changing the direction by attaching and detaching the attachment direction Can be eliminated, and the inspection of the electrical characteristics of the electronic device can be performed efficiently in a short time, so that the cost of the product can be kept low.

  Furthermore, the inspection of the electronic device tilted in the desired direction by the temperature adjusting means, the normal temperature inspection unit, the low temperature inspection unit, the high temperature inspection unit, etc. Since it can be performed in a state where the temperature is higher than the normal temperature, the electrical characteristics of the electronic device under each of these environments can be determined.

  Further, as the clamping means clamps the jig, the leaf spring can be elastically contacted with the electronic device, and the electronic device can be securely held so as not to be displaced with respect to the jig. Characteristic inspection can be performed with high accuracy.

It is a top view which shows the electronic device test | inspection apparatus which test | inspects the electrical property of the electronic device of an example of this invention. It is a side view which shows the state which looked at the normal temperature test | inspection unit comprised by the electronic device test | inspection apparatus from the side same as the above. It is an enlarged side view which shows the principal part of a normal temperature inspection unit same as the above. It is a top view which shows the state which looked at the normal temperature inspection unit from the top same as the above. It is a perspective view which shows a normal temperature test | inspection unit of the state which has arrange | positioned clamping means to the Y-axis direction same as the above. It is a perspective view which shows the normal temperature test | inspection unit of the state which has arrange | positioned the clamping means to Z-axis direction and rotated 90 degree | times to the downward side same as the above. It is a perspective view which shows the normal temperature test | inspection unit of the state which has arrange | positioned the clamping means to the Y-axis direction and rotated 90 degree | times same as the above. It is a perspective view which shows the normal temperature test | inspection unit of the state which has arrange | positioned the clamping means to Z-axis direction and rotated 90 degree | times upwards same as the above. It is a perspective view which shows a normal temperature test | inspection unit of the state which has arrange | positioned clamping means to the Y-axis direction same as the above. It is a perspective view which shows the normal temperature test | inspection unit of the state which has arrange | positioned the clamping means to the Y-axis direction and rotated 90 degree | times same as the above. It is a perspective view which shows the normal temperature test | inspection unit of the state which has arrange | positioned the clamping means to the Y-axis direction and rotated 180 degree | times same as the above. It is a top view which shows the jig | tool holding a some electronic device same as the above. It is an enlarged plan view which shows the principal part of a jig | tool same as the above. It is an enlarged plan view which shows the state which hold | maintained the electronic device to the jig same as the above.

  An embodiment as the best mode for carrying out the present invention will be described below. Needless to say, the present invention can be easily applied to configurations other than those described in the embodiments without departing from the spirit of the invention.

  FIG. 1 is a plan view showing an electronic device inspection apparatus for inspecting electrical characteristics of an electronic device such as an acceleration sensor and an inclination angle sensor using a MEMS (Micro Electro Mechanical Systems) technique. As shown in FIG. 1, the electronic device inspection apparatus 1 includes a substantially disk that is rotatably held by a machine base 3 by a servo motor 2 serving as a drive source and that is rotated about a vertical rotation shaft 4. -Shaped turntable 5, a robot 8 for supplying an electronic device 6 to be inspected to a jig 7 held on the turntable 5 at a load position a and collecting it from an unload position b, and three inspections to be described later The unit (normal temperature inspection unit 10, low temperature inspection unit 11, high temperature inspection unit 12) and these three inspection units 10, 11, 12 are inclined at an angle of 0 degrees to 180 degrees or the like and are set to a predetermined temperature. The inspection result information of the electronic device 6 is corrected (correction calculation) and at the same time, the inspection result information of the electronic device 6 is written to the corresponding electronic device 6. After the normal temperature inspection of the electronic device 6 by the normal temperature inspection unit 10 by the calibration device 13 as a data recording means, the printing device 14 such as a laser mark device that prints the product name / Lot number etc. on the electronic device 6, it is conveyed by the turntable 5. A dry air supply chamber 15 that suppresses dew condensation of the electronic device, and first and second preheating means 16 and 17 are provided. The jig 7 is anodized and has an insulating property, and the appearance is formed in a flat rectangular shape. The rotating shaft portion is formed on the outer peripheral side of the turntable 5. The jig 7 is detachably held at an interval of 18 degrees centering on 4.

  The turntable 5 in the present embodiment is configured to rotate in a fixed direction (counterclockwise shown in FIG. 1), and a plurality of the turntable 5 are placed at predetermined positions (a mounting recess 46 described later) of the jig 7 by the robot 8. The electronic device 6 is supplied, and a normal temperature inspection is performed in the middle of a substantially circular conveyance path between the load position a where the electronic device is supplied and the unload position b where the electronic device 6 is recovered. A unit 10, a low temperature inspection unit 11, and a high temperature inspection unit 12 are arranged along the outer periphery of the turntable 5.

  Reference numeral 20 denotes a tray device in which a plurality of electronic devices 6 to be inspected are stocked in advance, and the electronic devices 6 placed on the load tray 18 of the tray device 20 are placed on the load tray 18 by the robot 8 described above. While the mounted electronic device 6 is supplied to the jig 7 arranged at the load position a, the inspection result information of the electronic device 6 output to the calibration device 13 is a non-defective product that satisfies a predetermined condition. In this case, the robot 8 selects the non-defective electronic device 6 from the jig 7 disposed at the unloading position b by the rotation of the turntable 5 and transfers it to the non-defective tray 21, while the predetermined inspection condition is satisfied. In the case of a defective electronic device 6 that does not satisfy the condition, the robot 8 is transferred from the jig 7 disposed at the unloading position b to the defective product dedicated tray 22 and collected.

  2 is a side view showing the room temperature inspection unit as viewed from the side, FIG. 3 is an enlarged side view showing the main part of the room temperature inspection unit, and FIG. 4 is a plan view showing the room temperature inspection unit as viewed from above. is there. As shown in FIGS. 2 to 4, the room temperature inspection unit 10 is advanced and retracted along a guide rail 23 fixed to the machine base 3 and is transported by the rotation of the turntable 5. A clamping means 28 for clamping the tool 7 is provided. The clamping means 28 is provided with a probe device 24 provided at an upper portion thereof, and a support portion 25 slidable up and down, a holding means 28 including a holding portion 26 and the like. . The jig 7 that is horizontally held by the holding means 28 has the electronic device 6 formed by the lower surface of the temperature adjusting means 30 formed on the lower surface of the holding portion 26 and the upper surface of the probe device 24 as the support portion 25 slides upward. The electrical characteristics of the electronic device 6 are inspected in a state where the jig 7 is held, and the jig 7 holds the electronic device 6 from the turntable 5 to the room temperature inspection unit 10. When the jig 7 is handed over, the jig 7 locked to the locking claw 31 of the turntable 5 closest to the room temperature inspection unit 10 is clamped by the clamping means 28, and then the jig 7 is locked to the locking claw 31. Is removed from the turntable 5 and taken out to the room temperature inspection unit 10, and the room temperature inspection unit 10 is retracted by the guide rail 23 (to the left as shown in FIG. 2). 30 is heated (or cooled) by the plurality of electronic devices 6 held to the jig 7 is a normal temperature by it (25 ° C. in this embodiment).

  Here, the room temperature inspection unit 10 and the like will be described in more detail with reference to FIGS. As shown in these drawings, the room temperature inspection unit 10 is attached to a guide rail 23 fixed to the machine base 3 through a frame 43 so as to freely advance and retreat, and the axis of the first shaft portion 36 is the Y axis. While being able to rotate and move in the Z-axis direction from the direction, the axis of the second shaft portion 39 is held in the X-axis direction. In the room temperature inspection unit 10, the above-mentioned clamping means 28 is fixed to the tip of the first shaft portion 36 of the first motor 35. In FIG. It is rotatably held around the Y-axis direction as an axis. In addition, the first shaft portion 36 of the first motor 35 is rotatably held by a U-shaped holding member 37, and this holding member 37 is driven by a second motor 38. The second shaft portion 39 that is orthogonal to the first shaft portion 36 via the pulley 40 fixed to the second shaft portion 39 of the second motor 38, the drive transmission belt 41, and the driven pulley 42. The holding member 37 can be rotated about the X-axis direction of the axis.

  Further, as shown in FIG. 5, the holding member 37 is configured so that the first shaft portion 36 is moved from the state in which the jig 7 is held horizontally by the holding means 28 as shown in FIGS. 6 and 8. The first shaft portion 36 of the first motor 35 can be switched from the Y-axis direction to the vertical Z-axis direction, etc. The jig 7 sandwiched by the sandwiching means 28 is tilted three-dimensionally with the X axis, the Y axis, and the Z axis directions that are orthogonal to each other as two axes by the two axes 36 and the second shaft portion 39. Is possible. Although the room temperature inspection unit 10 has been described, the low temperature inspection unit 11 and the high temperature inspection unit 12 also have substantially the same configuration as the room temperature inspection unit 10, and the former room temperature inspection unit 11 has a room temperature inspection. The plurality of electronic devices 6 held on the jig 7 which has been brought to room temperature by the unit 10 are lowered in temperature (−20 ° C. in this embodiment) by the temperature adjusting means 30 of the low temperature inspection unit 11, and the latter high temperature inspection unit. 12, the plurality of electronic devices 6 held by the jig 7 that has been lowered in temperature by the low-temperature inspection unit 11 are heated to a high temperature (80 ° C. in this embodiment) by the temperature adjusting means 30 of the high-temperature inspection unit 12. The low temperature inspection unit 11 and the high temperature inspection unit 12 are different in function only from the room temperature inspection unit 10 described above. Description thereof is omitted.

  Next, the jig 7 for holding the plurality of electronic devices 6 will be further described below with reference to FIGS. 12 is a plan view showing a jig for holding a plurality of electronic devices, FIG. 13 is an enlarged plan view showing the main part of the jig, and FIG. 14 is an enlarged plan view showing a state in which the electronic device is held by the jig. It is. As shown in FIG. 12, the jig 7 has a pair of positioning holes 45 for positioning the jig 7, and the number of electronic devices 6 held by the jig 7 (in this embodiment, Corresponding to (24 places), 24 forming portions including a concave mounting recess 46 on which the electronic device 6 is mounted, a leaf spring insertion recess 47, and a pin insertion hole 48 are formed.

  As shown in FIG. 13, a leaf spring fulcrum portion 50 is provided on the base end portion side of the leaf spring insertion recess 47, and the leaf spring 51 inserted through the leaf spring insertion recess 47 is a leaf spring fulcrum portion. One is fixed by 50. As shown in FIG. 14, the electronic device 6 placed on the placement recess 46 has the leaf spring operation pin 52 inserted into the pin insertion hole 48 so that the tip of the leaf spring 51 is placed in the electronic device. 6 is pressed by the elastic force of the leaf spring 51, and the electronic device 6 is positioned and firmly held so as not to drop off from the jig 7. When inspecting the electrical characteristics of the electronic device 6, a contact probe (conductive contactor) 54 provided in the probe device 24 is inserted through the insertion hole 53 formed in the mounting recess 46, and the contact probe ( The conductive device 54 is connected to a terminal on one surface of the electronic device, so that the electronic device 6 held by the jig 7 is moved to a predetermined temperature (in this embodiment, 25 ° C. (normal temperature), −20 ° C. (Low temperature), 80 ° C. (high temperature)), and the X axis, the Y axis, and the Z axis as described above are rotated to a predetermined angle (X ′ rotation, Y ′ rotation, Z ′ rotation) and tilted ( The electrical characteristics are inspected at 0 degrees, 90 degrees, 180 degrees, and the like. X 'rotation refers to the rotation direction centered on the X axis, Y' rotation refers to the rotation direction centered on the Y axis, and Z 'rotation refers to the rotation direction centered on the Z axis. Define as a thing.

  Next, the inspection process of the electronic device 6 in the electronic device inspection apparatus 1 will be described.

  First, from the load tray 18 holding a plurality of electronic devices 6 stocked in the tray device 20, all the jigs 7 that are locked to the locking claws 31 of the turntable 5 and that are at the load position a are mounted. When the electronic device 6 is placed and filled in the mounting recess 46 by the robot 8, the turntable 5 is rotated counterclockwise about the rotation shaft portion 4 every 18 degrees. In the mounting recess 46 of the jig 7 transferred to the position a, the electronic devices 6 are sequentially mounted and filled in the same manner as described above.

  When the jig 7 on which the electronic device 6 is placed is transported to the room temperature inspection unit 10 as the turntable 5 rotates, the jig 7 is sandwiched in a horizontal state by the clamping means 28 of the room temperature inspection unit 10. Accordingly, the leaf spring operating pin 52 provided integrally with the temperature adjusting means 30 shown in FIG. 3 is inserted into the positioning hole 45 and the pin insertion hole 48 of the jig 7, and further the plate spring operating pin 52 is inserted into the pin. The tip of the leaf spring 51 is inserted into the hole 48 and elastically presses the corner on the side of the electronic device 6, and the electronic device 6 in the mounting recess 46 is positioned and firmly held, The contact probe 54 provided in the probe device 24 is brought into contact with the terminal of each electronic device 6 through the insertion hole 53, and the electronic device 6 held by the jig 7 and the jig 7 is held horizontally (see FIG. 5). Showing State).

  Then, when the jig 7 is removed from the locking claw 31, the room temperature inspection unit 10 is retracted by the guide rail 23 and retracted to a position where it does not contact the turntable 5, the jig 7 is moved to the room temperature inspection unit 10. The electronic device 6 held via is heated (or cooled) by the temperature adjusting means 30 to maintain a room temperature of 25 ° C., and in that state, the X-axis, Y-axis, and Z-axis are in three directions. The electrical characteristics of each electronic device 6 tilted at predetermined angles of 0 degrees, 90 degrees, and 180 degrees with each axis as an axis direction are inspected, and each inspection result information is passed through the probe device 24. Next, the room temperature inspection unit 10 is advanced along the guide rail 23, the jig 7 is returned to the original position on the turntable 5, and the engaging claw 31 is engaged again. Is held on the turn table 5 is.

  Subsequently, as the turntable 5 rotates, the jig 7 holding the plurality of electronic devices 6 is transferred into the dry air supply chamber 15 filled with dry air, and the electronic devices 6 are dried therein. When the jig 7 held by the electronic device 6 being dried is transported to the low temperature inspection unit 11, the jig 7 is held by the clamping means 28 of the low temperature inspection unit 11 as in the case of the normal temperature inspection unit 10. Accordingly, the leaf spring operating pin 52 provided integrally with the temperature adjusting means 30 is inserted into the positioning hole 45 and the pin insertion hole 48 of the jig 7, and the leaf spring operating pin 52 is further connected to the pin insertion hole 48. The tip of the leaf spring 51 elastically presses the corner on the side of the electronic device 6, and the electronic device 6 in the mounting recess 46 is positioned and firmly held, and the probe The contact probe 54 provided in the device 24 is brought into contact with the terminal of each electronic device 6 through the insertion hole 53, and the jig 7 and the electronic device 6 held by the jig 7 are held horizontally. The jig 7 is removed, and the low temperature inspection unit 11 is retracted by the guide rail 23 and retracted to a position where it does not come into contact with the turntable 5. The electronic device 6 held by the low-temperature inspection unit 11 via the jig 7 is cooled by the temperature adjusting means 30 so that a low temperature of −20 ° C. is maintained. The electrical characteristics of each electronic device 6 tilted at predetermined angles of 0 degrees, 90 degrees, and 180 degrees, with each of the three directions of the Z axis as the axial direction, are inspected. Is output to the calibration device 13, the low-temperature inspection unit 11 is advanced along the guide rail 23, the jig 7 is returned to the original position on the turntable 5, and is again locked by the locking claw 31. It is held in the table 5.

Subsequently, when the jig 7 holding the cooled electronic device 6 is conveyed to the high temperature inspection unit 12 along with the rotation of the turntable 5, similarly to the room temperature inspection unit 10 and the low temperature inspection unit 11. The jig 7 is clamped by the clamping means 28 of the high-temperature inspection unit 12, and accordingly, the leaf spring operating pin 52 provided integrally with the temperature adjusting means 30 in the positioning hole 45 and the pin insertion hole 48 of the jig 7. Is inserted, the leaf spring operating pin 52 is inserted into the pin insertion hole 48, the tip of the leaf spring 51 elastically presses the corner on the side of the electronic device 6, and the electrons in the mounting recess 46 are The device 6 is positioned and firmly held, and the contact probe 54 provided in the probe device 24 is brought into contact with the terminal of each electronic device 6 through the insertion hole 53 and held by the jig 7 and the jig 7. The electronic device 6 is held horizontally, the jig 7 is removed from the engaging claws 31, high-temperature inspection unit 12 is retracted by the guide rail 23 is retracted to a position not in contact with the turntable 5.
And the electronic device 6 held by the high temperature inspection unit 12 via the jig 7 is maintained at a high temperature of 80 ° C. by being heated by the temperature adjusting means 30. In this state, the X axis, Y axis, The electrical characteristics of each electronic device 6 tilted at predetermined angles of 0 degrees, 90 degrees, and 180 degrees with each of the three directions of the Z-axis as the axis direction are inspected, and information on each inspection result is obtained. Output to the calibration device 13, the high temperature inspection unit 12 is advanced along the guide rail 23, the jig 7 is returned to the original position on the turntable 5, and is again locked by the locking claw 31, and the turntable. Held at 5.

  Next, when the jig 7 holding the plurality of electronic devices 6 inspected in the order of normal temperature, low temperature, and high temperature is conveyed to the calibration device 13 as the turntable 5 rotates, the normal temperature inspection unit 10, Based on the inspection result information corresponding to each of the electronic devices 6 output from the low temperature inspection unit 11 and the high temperature inspection unit 12, writing and correction calculation of electrical characteristics are performed on each of the electronic devices.

  Subsequently, the jig 7 holding the plurality of electronic devices 6 inspected in the order of normal temperature, low temperature, and high temperature is transported to the printing apparatus 14 as the turntable 5 rotates, and satisfies a predetermined condition. In this case, an article name / lot number or the like (not shown) is given to the surface of the electronic device 6 by the printing device 14, and the electronic device 6 to which the item / lot number etc. is given is loaded by the robot 8 at the load position a. The unloading position b arranged in the vicinity is collected to the non-defective product tray 21. On the other hand, if the defective product does not satisfy the predetermined condition, the robot 8 collects the defective electronic device 6 from the unload position b to the defective product dedicated tray 22. And many inspections of the electronic device 6 are continuously performed by repeating such an operation process sequentially.

  As described above, according to an example of the present invention, the first motor 35 is rotated by the first motor 35 with the first horizontal direction (Y-axis direction) orthogonal to the vertical direction (Z-axis direction) as an axis. A shaft portion 36, a clamping means 28 that is fixed to the first shaft portion 36 and rotated around the first horizontal direction (Y-axis direction), and a first shaft to which the clamping means 28 is fixed The holding member 37 that rotatably holds the portion 36 and the first shaft portion 36 to which the clamping means 28 is fixed are orthogonal to the vertical direction (Z-axis direction) and the first horizontal direction (Y-axis direction). And a second shaft portion 39 that rotates in the vertical direction (Z-axis direction) or the like by the second motor 38 via the holding member 37 or the like with the second horizontal direction (X-axis direction) as an axis. The jig 7 holding the electronic device 6 sandwiched by the sandwiching means 28 is connected to the first It can be rotated in three directions (Y 'rotation, Z' rotation, X 'rotation) with the horizontal direction (Y-axis direction), vertical direction (Z-axis direction), and second horizontal direction (X-axis direction) as the axial direction. By doing so, it is possible to inspect the electrical characteristics of the electronic device 6 held by the clamping means 28 via the jig 7 in a state where the electronic device 6 is inclined in a predetermined direction. In addition, the first shaft portion 36 arranged in the first horizontal direction (Y-axis direction) is rotated to any angle other than the Y-axis direction with the second horizontal direction (X-axis direction) as the center. Since the second shaft portion 39 that can be moved is provided, the shaft center direction of the first shaft portion 36 can be arranged in the Z-axis direction, and it can be rotated to any other desired position. Can be arranged. Therefore, it becomes possible to freely tilt the electronic device 6 held by the holding means 28 in all directions so that there is no direction in which the electronic device 6 held by the holding means 28 cannot be directed using the two axes including the first and second shaft portions 36 and 39. The inspection can also be performed in a state where the electronic device 6 is freely tilted in any desired direction. Therefore, when the electronic device 6 is inspected by changing the tilt direction of the electronic device 6, it is possible to eliminate the troublesome work of changing the direction by attaching and detaching the mounting direction of the electronic device manually as in the past. Inspection of electrical characteristics can be performed efficiently in a short time, and the cost of the product can be reduced.

  Furthermore, the first horizontal direction (Y-axis direction), the vertical direction (Z-axis direction), and the second horizontal direction (X-axis direction) in a state where the electronic device 6 is brought to room temperature, low sound, and high temperature by the temperature adjusting means 30. The electronic device 6 is inspected at room temperature so that the electrical characteristics can be inspected with the electronic device 6 held in the jig 7 tilted in a predetermined direction. A unit 10, a low temperature inspection unit 11 for inspecting the electronic device 6 at a temperature lower than normal temperature, and a high temperature inspection unit 12 for inspecting the electronic device 6 at a temperature higher than normal temperature are provided. Since the temperature adjusting means 30 for heating or cooling the electronic device 6 is provided in each clamping means 28, the X axis, the Y axis, and the Z axis are tilted at 0 degrees, 90 degrees, and 180 degrees with respect to the axial directions. Electric Device 6 and the inspection of the electronic device 6 is inclined by rotating in any direction, by heating or cooling of the temperature adjusting means 30 can be carried out cold, cold, with chilled state. Therefore, it is possible to determine the electrical characteristics of the different electronic devices 6 in the environment.

  Further, a mounting recess 46 that accommodates the electronic device 6 and a leaf spring insertion recess 47 that accommodates a leaf spring 51 that is operated with one of them as a fulcrum are formed continuously with the jig 7, and are cured by the clamping means 28. As the tool 7 is sandwiched, a leaf spring operating pin 52 as an operating means for elastically contacting the leaf spring 51 against the electronic device 6 accommodated in the mounting recess 46 is provided in the sandwiching means 28, and the leaf spring operating pin When the leaf spring 51 is pressed by 52, the pin spring 51 is connected to the leaf spring insertion recess 47 so that the leaf spring 51 is elastically contacted with the electronic device 6 accommodated in the placement recess 46. Since the hole 48 is formed, the electronic device 6 accommodated in the mounting recess 46 can be securely held with respect to the jig 7 so that the electronic device 6 is not misaligned. Can do That.

  Although an example of the present invention has been described in detail above, the present invention is not limited to the above-described embodiment, and various modifications can be made. For example, in this embodiment, as shown in FIG. 1, since the first and second preheating means 16 and 17 are provided, the electronic device 6 together with the jig 7 is connected to the room temperature inspection unit 10 or the high temperature inspection unit 12. The electronic device 6 may be preheated in a previous stage in the middle of being rotated and conveyed. In this example, the high temperature was 80 ° C., the normal temperature was 25 ° C., and the low temperature was −20 ° C., but the high temperature was 70 ° C. to 90 ° C., the normal temperature was 15 ° C. to 35 ° C., and the low temperature was −30 to − The temperature may be set to 10 ° C or lower as appropriate, and when the temperature of high temperature, normal temperature, or low temperature is standardized, the temperature can be set to normal temperature, low temperature, or high temperature corresponding to the standard. Good. Further, when heating or cooling is performed by the temperature adjusting means 30 in the present embodiment, a Peltier element may be used as a cooling source / heating source, and if only a heating source is sufficient, a ceramic heater is provided. A heating plate or the like may be appropriately selected as the temperature adjusting means of the high temperature inspection unit 12.

1 Electronic Device Inspection Device 6 Electronic Device 7 Jig 10 Room Temperature Inspection Unit (Inspection Unit)
11 Low temperature inspection unit (inspection unit)
12 High temperature inspection unit (inspection unit)
28 clamping means 30 temperature adjusting means 35 first motor 36 first shaft part 37 holding member 38 second motor 39 second shaft part 46 mounting recess 47 leaf spring insertion recess 48 pin insertion hole 51 leaf spring 52 plate Spring operating pin (actuating means)

Claims (6)

A first shaft portion rotated by a first motor with a first horizontal direction orthogonal to the vertical direction as an axis;
Clamping means which is rotated about the first horizontal direction by being fixed to the first shaft portion;
A holding member for rotatably holding the clamping means;
A second motor that rotates the first shaft portion, to which the clamping means is fixed, from the horizontal direction to an arbitrary angle with a second horizontal direction orthogonal to the first horizontal direction as an axis. With the shaft part of,
The jig holding the electronic device held by the holding means can be rotated about the first shaft portion and the second shaft portion as an axial direction, so that the jig is attached to the holding means. An electronic device inspection apparatus comprising: an inspection unit that inspects the electrical characteristics of the electronic device held via the device in an inclined state at an arbitrary angle.   2. The electronic device inspection apparatus according to claim 1, wherein a temperature adjusting means for heating or cooling the electronic device in a state where the jig holding the electronic device is held is provided in the holding means. In such a state that the electronic device is held at normal temperature, low sound, high temperature by the temperature adjusting means, and the electronic device held in the jig can be inspected in the predetermined direction, the electrical characteristics can be inspected.
As the inspection unit,
A room temperature inspection unit for inspecting the electronic device at room temperature;
A low temperature inspection unit for inspecting the electronic device at a low temperature lower than the normal temperature; and
The electronic device inspection apparatus according to claim 2, further comprising a high temperature inspection unit that inspects the electronic device at a temperature higher than the room temperature.   The electronic device inspection apparatus according to claim 3, wherein a normal temperature of the electronic device that is brought to a normal temperature by the normal temperature inspection unit is 15 ° C. or more and 35 ° C. or less. A mounting recess for storing the electronic device, and a leaf spring insertion recess for storing a leaf spring operated with one side as a fulcrum, are formed continuously to the jig,
The operation means for elastically contacting the leaf spring to the electronic device accommodated in the mounting recess is provided in the clamping means as the jig is clamped by the clamping means. The electronic device inspection apparatus according to any one of 1 to 4. A mounting recess housing the electronic device;
A leaf spring insertion recess that accommodates a leaf spring that is connected to the mounting recess and actuated with one side as a fulcrum;
Forming a pin insertion hole in the jig for inserting and removing a leaf spring operating pin serving as the operating means for pressing the leaf spring accommodated in the leaf spring insertion recess;
When the leaf spring operating pin is inserted into the pin insertion hole as the jig is held by the holding means,
The leaf spring is depressed by the leaf spring operation pin so that the leaf spring is elastically contacted with the electronic device accommodated in the placement recess. The jig for holding an electronic device according to claim 5, wherein the pin insertion hole is formed.

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