TWI707411B - 半導體封裝的連接系統 - Google Patents

半導體封裝的連接系統 Download PDF

Info

Publication number
TWI707411B
TWI707411B TW107115146A TW107115146A TWI707411B TW I707411 B TWI707411 B TW I707411B TW 107115146 A TW107115146 A TW 107115146A TW 107115146 A TW107115146 A TW 107115146A TW I707411 B TWI707411 B TW I707411B
Authority
TW
Taiwan
Prior art keywords
semiconductor package
layer
insulating layer
wiring layer
memory
Prior art date
Application number
TW107115146A
Other languages
English (en)
Chinese (zh)
Other versions
TW201911437A (zh
Inventor
李潤泰
金漢
金亨俊
Original Assignee
南韓商三星電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商三星電子股份有限公司 filed Critical 南韓商三星電子股份有限公司
Publication of TW201911437A publication Critical patent/TW201911437A/zh
Application granted granted Critical
Publication of TWI707411B publication Critical patent/TWI707411B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/073—Apertured devices mounted on one or more rods passed through the apertures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW107115146A 2017-08-04 2018-05-04 半導體封裝的連接系統 TWI707411B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2017-0099219 2017-08-04
??10-2017-0099219 2017-08-04
KR20170099219 2017-08-04
KR10-2017-0125377 2017-09-27
KR1020170125377A KR101942736B1 (ko) 2017-08-04 2017-09-27 반도체 패키지 연결 시스템
??10-2017-0125377 2017-09-27

Publications (2)

Publication Number Publication Date
TW201911437A TW201911437A (zh) 2019-03-16
TWI707411B true TWI707411B (zh) 2020-10-11

Family

ID=66281443

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107115146A TWI707411B (zh) 2017-08-04 2018-05-04 半導體封裝的連接系統

Country Status (2)

Country Link
KR (1) KR101942736B1 (ko)
TW (1) TWI707411B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11509038B2 (en) 2017-06-07 2022-11-22 Mediatek Inc. Semiconductor package having discrete antenna device
US10847869B2 (en) 2017-06-07 2020-11-24 Mediatek Inc. Semiconductor package having discrete antenna device
KR102586072B1 (ko) * 2019-05-21 2023-10-05 삼성전기주식회사 반도체 패키지 및 이를 포함하는 안테나 모듈
EP3745457A1 (en) * 2019-05-28 2020-12-02 Mediatek Inc. Semiconductor package having discrete antenna device
US11569156B2 (en) 2019-10-27 2023-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device, electronic device including the same, and manufacturing method thereof
DE102020108575B4 (de) * 2019-10-27 2023-07-06 Taiwan Semiconductor Manufacturing Co., Ltd. Halbleiter-bauelement, elektronische vorrichtung mit diesem und verfahren zu deren herstellung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160113115A1 (en) * 2014-10-21 2016-04-21 Heung Kyu Kwon SYSTEM OF PACKAGE (SoP) MODULE AND MOBILE COMPUTING DEVICE HAVING THE SoP
US20160161992A1 (en) * 2014-12-05 2016-06-09 Heung Kyu Kwon Package on packages and mobile computing devices having the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101266519B1 (ko) * 2011-06-30 2013-05-27 에스티에스반도체통신 주식회사 반도체 패키지 및 그 제조 방법
US9735134B2 (en) * 2014-03-12 2017-08-15 Taiwan Semiconductor Manufacturing Company, Ltd. Packages with through-vias having tapered ends
KR20160131170A (ko) * 2015-05-06 2016-11-16 에스케이하이닉스 주식회사 팬-아웃 메모리 패키지를 포함하는 패키지 온 패키지 타입의 반도체 장치
KR20170043427A (ko) * 2015-10-13 2017-04-21 삼성전기주식회사 전자부품 패키지 및 그 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160113115A1 (en) * 2014-10-21 2016-04-21 Heung Kyu Kwon SYSTEM OF PACKAGE (SoP) MODULE AND MOBILE COMPUTING DEVICE HAVING THE SoP
US20160161992A1 (en) * 2014-12-05 2016-06-09 Heung Kyu Kwon Package on packages and mobile computing devices having the same

Also Published As

Publication number Publication date
KR101942736B1 (ko) 2019-04-17
TW201911437A (zh) 2019-03-16

Similar Documents

Publication Publication Date Title
US10886192B2 (en) Semiconductor package
TWI645526B (zh) 扇出型半導體裝置
TWI651818B (zh) 扇出型半導體封裝
US10923464B2 (en) Connection system of semiconductor packages using a printed circuit board
TWI707411B (zh) 半導體封裝的連接系統
TW201919176A (zh) 扇出型半導體封裝
US10453821B2 (en) Connection system of semiconductor packages
TWI689229B (zh) 半導體封裝的連接系統
TWI699864B (zh) 天線模組
TWI772617B (zh) 扇出型半導體封裝
TWI709211B (zh) 扇出型組件封裝
TW202023105A (zh) 天線模組
TW201935651A (zh) 扇出型半導體封裝
TW201917831A (zh) 扇出型半導體封裝
TW201926587A (zh) 扇出型半導體封裝
TWI702704B (zh) 扇出型半導體封裝
TW201911505A (zh) 扇出型半導體封裝
TW201926602A (zh) 扇出型半導體封裝
TW201824467A (zh) 扇出型半導體封裝
TW201824471A (zh) 扇出型半導體封裝
TW201944560A (zh) 扇出型半導體封裝
TW201931534A (zh) 半導體封裝
TW202034460A (zh) 堆疊式封裝以及包含其的封裝連接系統
TW201929183A (zh) 扇出型半導體封裝
TWI689051B (zh) 扇出型半導體封裝