TWI706703B - 電子模組 - Google Patents
電子模組 Download PDFInfo
- Publication number
- TWI706703B TWI706703B TW107124257A TW107124257A TWI706703B TW I706703 B TWI706703 B TW I706703B TW 107124257 A TW107124257 A TW 107124257A TW 107124257 A TW107124257 A TW 107124257A TW I706703 B TWI706703 B TW I706703B
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- 239000000758 substrate Substances 0.000 claims abstract description 316
- 239000004020 conductor Substances 0.000 claims description 44
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- 239000000463 material Substances 0.000 description 17
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000002844 melting Methods 0.000 description 7
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- 229920005989 resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 238000000034 method Methods 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
本發明的電子模組包括:第一基板(11);第一電子元件(13),配置在所述第一基板(11)的一側上;第二基板(21),配置在所述第一電子元件(13)的一側上;以及定位部(200),從所述第一基板(11)向一側延伸並與所述第二基板(21)的邊緣部相抵接,或是從所述第二基板(21)向另一側延伸並與所述第一基板(11)的邊緣部相抵接。
Description
本發明涉及一種電子模組,其具有第一基板以及配置在第一基板上的第二基板。
以往,在封裝樹脂內配置有多個電子元件的電子模組已被普遍認知(例如,參照特開2014-45157號)。在這種電子模組中,有時會配置有:第一基板;配置在第一基板的一側的電子元件;以及配置在電子元件的一側的第二基板。
在採用這樣的第一基板和第二基板的情況下,特別是當第一基板和第二基板在面方向上的尺寸較大時,一般會使用夾具在防止第一基板與第二基板之間在面方向上產生位置偏移,進而使第一基板與第二基板之間保持平行。
本發明的目的是提供一種電子模組,其即便是在不使用夾具的情況下,也能夠使第一基板與第二基板之間保持平行。
本發明涉及的電子模組可以包括:第一基板;電子元件,配置在所述第一基板的一側上;第二基板,配置在所述電子元件的一側上;以及定位部,從所述第一基板向一側延伸並與所述第二基板的邊緣部相抵接,或是從所述第二基板向另一側延伸並與所述第一基板的邊緣部相抵接。
在本發明涉及的電子模組中,可以是:其中,所述定位部具有向邊緣內部突出的突出部,當所述定位部從所述第一基板向一側延伸並與所述第二基板的邊緣部相抵接時,所述突出部與所述第二基板的另一側的面相抵接,當所述定位部從所述第二基板向另一側延伸並與所述第一基板的邊緣部相抵接時,所述突出部與所述第一基板的一側的面相抵接。
在本發明涉及的電子模組中,可以進一步包括:第一導體層,配置在所述第一基板的一側;以及第二導體層,配置在所述第二基板的另一側,其中,當所述定位部從所述第一基板向一側延伸並與所述第二基板的邊緣部相抵接時,所述突出部與所述第二導體層的邊緣部相抵接,當所述定位部從所述第二基板向另一側延伸並與所述第一基板的邊緣部相抵接時,所述突出部與所述第一導體層的邊緣部相抵接。
在本發明涉及的電子模組中,可以是:其中,當所述定位部從所述第一基板向一側延伸並與所述第二基板的邊緣部相抵接時,所述定位部相對於所述第一基板的一側的面被固定,當所述定位部從所述第二基板向另一側延伸並與所述第一基板的邊緣部相抵接時,所述定位部相對於所述第二基板的另一側的面被固定。
在本發明涉及的電子模組中,可以是:其中,當所述定位部從所述第一基板向一側延伸並與所述第二基板的邊緣部相抵接時,所述定位部使用接合材料被固定在所述第一基板上,當所述定位部從所述第二基板向另一側延伸並與所述第一基板的邊緣部相抵接時,所述定位部使用接合材料被固定在所述第二基板上,所述電子元件使用導電性接合劑相對於所述第一基板或所述第二基板被固定,所述接合材料的熔點比所述導電性接合劑的熔點更高。
在本發明涉及的電子模組中,可以是:其中,所述定位部由引線框構成,所述定位部具有:在面方向上延伸的引線框基端部;以及藉由引線框彎曲部配置在所述引線框基端部上的,並且向一側或另一側延伸的引線框延伸部。
在本發明涉及的電子模組中,可以是:其中,所述定位部的前端部呈錐形。
在本發明涉及的電子模組中,可以是:其中,所述電子元件具有:第一電子元件以及配置在所述第一電子元件的一側的第二電子元件,在所述第一電子元件與所述第二電子元件之間,配置有將所述第一電子元件與所述第二電子元件電連接的第一連接體。
作為本發明的一種態樣,在採用配置有:從第一基板向一側延伸並與第二基板的邊緣部相抵接、或是從第二基板向另一側延伸並與第一基板的邊緣部相抵接的定位部的態樣的情況下,即便是在不使用夾具的情況下,也能夠防止第一基板與第二基板之間在面方向上產生位置偏移,進而使第一基板與第二基板之間保持平行。
5:導電性接合劑
11:第一基板
12:第一導體層
13:第一電子元件
13g:第一柵極端子
13s:第一源極端子
19:第一散熱板
21:第二基板
22:第二導體層
23:第二電子元件
23g:第二柵極端子
23s:第二源極端子
29:第二散熱板
60:第一連接體
61:第一頭部
62:第一柱部
64:第一溝槽部
65:支撐部
70:第二連接體
71:第二頭部
72:第二柱部
75:延伸部
80:第三連接體
81:第三頭部
82:第三柱部
85:連接件
90:封裝部
95:連接件
100:端子
200:定位部
210:第一定位構件
211:第一突出部
211a:凹部
216:引線框延伸部
217:第一引線框基端部
218:引線框彎曲部
220:第二定位構件
221:第二突出部
240:接合材料
300:引線框
第1圖(a)是可在本發明第一實施方式中使用的電子模組的縱截面圖,第1圖(b)是第1圖(a)中的電子模組的平面圖。第1圖(b)中未圖示有封裝部,在第1圖(b)之後的圖式中,凡是平面圖以及底面圖中均未圖示有封裝部。
第2圖是可在本發明第一實施方式中使用的電子模組的縱截面圖,圖中展示的是與第1圖所示的態樣不同的電子模組。
第3圖是可在本發明第一實施方式中使用的電子模組的縱截面圖,圖中展示的是與第1圖以及第2圖所示的態樣不同的電子模組。
第4圖是可在本發明第一實施方式中使用的第一連接體的平面圖。
第5圖(a)是可在本發明第一實施方式中使用的另一種態樣的電子模組的縱截面圖,第5圖(b)是第5圖(a)中所示的電子模組的平面圖。
第6圖(a)是可在本發明第二實施方式中使用的電子模組的縱截面圖,第6圖(b)是第6圖(a)中所示的電子模組的底面圖。
第7圖(a)是可在本發明第三實施方式中使用的電子模組的縱截面圖,第7圖(b)是第1圖(a)中所示的電子模組的平面圖。
第8圖(a)是可在本發明第三實施方式中使用的電子模組的縱截面圖,第8圖(b)是第7圖(a)中所示的電子模組的底面圖。
第9圖(a)是可在本發明第四實施方式中使用的電子模組的縱截面圖,第9圖(b)是第9圖(a)中所示的電子模組的平面圖。
第10圖(a)是可在本發明第五實施方式中使用的電子模組的縱截面圖,第10圖(b)是第10圖(a)中所示的電子模組的平面圖。
第11圖是可在本發明第六實施方式中使用的引線框的平面圖,圖中假設性地圖示有用於配置第二基板的預定位置和切割預定線。
第12圖展示的是對第11圖所示的引線框進行切割後藉由折彎形成第一定位部後的態樣的平面圖。
第13圖(a)是可在本發明第六實施方式中使用的,由引線框構成的定位部的縱截面圖,第13圖(b)是可在本發明第六實施方式中使用的,由引線框構成的另一個態樣的定位部的縱截面圖。
第14圖是可在本發明第七實施方式中使用的第一連接體的平面圖。
第15圖是可在本發明第八實施方式中使用的第二連接體的縱截面圖。
第一實施方式
《構成》
在本實施方式中,「一側」指的是第1圖(a)中的上方側,“「另一側」指的是第1圖(a)中的下方側。另外,將第1圖(a)中的上下方向稱為「第一方向」、左右方向稱為「第二方向」以及紙面的表裡方向稱為「第三方向」。將包含第二方向以及第三方向的面內方向稱為「面方向」,將從一側進行觀看稱為「從平面看」。
本實施方式中的電子模組,可以具有第一電子單元以及第二電子單元。
如第1圖(a)所示,第一電子單元可以具有:第一基板11、配置在第一基板11的一側的多個第一導體層12以及配置在第一導體層12的一側的第一電子元件13。第一電子元件13可以是開關元件,也可以是控制元件。當第一電子元件13是開關元件時,可以為MOSFET或IGBT等。第一電子元件13以及後述的第二電子元件23可以分別由各自的半導體元件構成,作為半導體材料,可以
是矽、碳化矽、氮化鎵等。第一電子元件13的另一側的面可以藉由焊錫等導電性接合劑5與第一導體層12相連接。
如第1圖(a)所示,第二電子單元也可以具有:第二基板21、配置在第二基板21的另一側的多個第二導體層22以及配置在第二導體層22的另一側的第二電子元件23。第二電子元件23的一側的面可以藉由焊錫等導電性接合劑5與第一導體層12相連接。
如第2圖所示,第一電子元件13的一側可以配置有第一連接體60。第一連接體60可以藉由焊錫等導電性接合劑5(第2圖中未圖示)與第一電子元件13的一側的面相連接。在第2圖所示的態樣中,第一電子元件13與第二電子元件23之間配置有第一連接體60,並且第一電子元件13與第二電子元件23之間藉由第一連接體60電連接。
如第2圖所示,第二電子元件23的另一側可以配置有第二連接體70。第二連接體70可以藉由焊錫等導電性接合劑5與第二電子元件23的一側的面以及第二導體層22的另一側的面相連接。
藉由將第一電子元件13通過導電性接合劑5與配置在第一基板11上的第一導體層12連接,從而將第一電子元件13相對於第一基板11進行固定。同樣的,藉由將第二電子元件23通過導電性接合劑5與配置在第二基板21上的第二導體層22連接,從而將第二電子元件23相對於第二基板21進行固定。
第二電子元件23可以是開關元件,也可以是控制元件。當第二電子元件23是開關元件時,可以為MOSFET或IGBT等。
如第2圖所示,第一連接體60可以具有第一頭部61以及從第一頭部61向另一側延伸的第一柱部62。第二連接體70可以具有第二頭部71以及從第
二頭部71向另一側延伸的第二柱部72。第一連接體60的截面可以大致呈T字形,第二連接體70的截面也可以大致呈T字形。
作為第一基板11以及第二基板21,可以採用陶瓷基板和絕緣樹脂層等材料。作為導電性接合劑5,除了焊錫以外,還可以使用以Ag和Cu為主要成分的材料。作為第一基板11和第二基板21,例如可以使用經過將電路圖案化後的金屬基板,此情況下,第一基板11和第二基板21可以兼做第一導體層12、第二導體層22來使用。
如第1圖(a)所示,電子模組可以具有上述由將第一電子元件13、第二電子元件23、第一連接體60、第二連接體70、第一導體層12、以及第二導體層22等進行封裝的封裝樹脂等構成的封裝部90。在第一基板11的另一側可以配置有有銅板等構成的第一散熱板19。在第二基板21的一側可以配置有銅板等構成的第二散熱板29。
第一導體層12或第二導體層22可以與端子部100相連接,端子部100的前端部露出於封裝部90的外部,並可與外部裝置相連接。第1圖(b)所示的端子部100向一側彎曲,其前端向第1圖(b)紙面的正面側延伸。
另外,可配置有從第一基板11向一側延伸並與第二基板21的邊緣部相抵接的定位部200。定位部200可以具有多個第一定位構件210。在本實施方式中,將採用配置有四個第一定位構件210的態樣來進行說明,不過也不僅限於此,也可以配置有兩個、三個或五個以上的第一定位構件210。
第一基板11以及第二基板21可以各自大致呈矩形。如第1圖(b)所示,第一定位構件210可以對應各個邊(四個邊)配置。但並不僅限於此,第一定
位構件210也可以對應兩個邊或三個邊配置,還可以在一個邊(例如長邊)上配置有兩個以上的第一定位構件210。
第一定位構件210也可以配置在各個邊的中央部。在本實施方式中,「中央部」是指沿邊五等分後的中央區域。在本實施方式中「大致矩形」是指具有相向的兩條邊的四角形,例如也可以帶有圓弧形的角部。另外,不必將第一定位構件210配置在第二基板21的各個邊的中央部,也可以只將多個第一定位構件210中的一部分配置在第二基板21的邊的中央部,而將其餘的第一定位構件210則配置在第二基板21的邊的中央部以外的角部一側。
如第1圖(a)所示,定位部200的各個第一定位構件210可以具有向邊緣內部突出的第一突出部211。第一突出部211可以與第二基板21的另一側的面相抵接。如第2圖以及第3圖所示,第一突出部211也可以與第二導體層22的邊緣部相抵接。
如第5圖所示,第一突出部211還可以不與第二基板21的另一側的面相抵接,而是與第二導體層22的另一側的面相抵接。
另外,第一突出部211不必配置在每個第一定位構件210上,也可以只在多個第一定位構件210中的一部分上配置第一突出部211,而其餘的第一定位構件210上則不配置第一定位構件210。作為一例,在用於支撐第二基板21的相向的一對邊(例如長邊)的兩個第一定位構件210上配置有第一突出部211,而在用於支撐另一對邊(例如短邊)的第一定位構件210上則不配置有第一突出部211。
還可以與上述態樣不同,不配置有第一突出部211。此情況下,只藉由定位部200將第二基板21相對於第一基板11進行面方向上的定位。
定位部200的第一定位構件210可以使用接合材料240相對於第一基板11進行固定。接合材料240的熔點可以比導電性接合劑5的熔點更高。
定位部200的第一定位構件210可以藉由接合材料240來接合在第一基板11的一側的面(第1圖中上方的面)上從而進行固定。當採用此態樣時,第一基板11在面方向上的大小可以比第二基板21在面方向上的大小更大。另外,第一定位構件210還可以藉由接合材料240來接合在第一導體層12上(參照第5圖)。此態樣下,第一定位構件210同樣相對於第一基板11的一側的面被固定。
如第2圖所示,可以在第一頭部61的一側的面上配置第一溝槽部64。第一溝槽部64從平面看(在面方向上)可以配置在第一柱部62邊緣外側,其可以配置在邊緣外側的一部分上,也可以配置在整個邊緣外側上。可以在第一頭部61的一側的面上的第一溝槽部64的邊緣內側配置有焊錫等導電性接合劑,也可以藉由導電性接合劑5配置有第二電子元件23。
如第2圖所示,可以使用與第二電子元件23的後述第二柵極端子23g等端子相連接的連接件85。但又不限於此態樣,也可使用如第3圖所示的第三連接體80。第三連接體80具有第三頭部81以及從第三頭部81向另一側延伸的第三柱部82。第三連接體80,可藉由焊錫等導電性接合劑5(第3圖中未圖示)與第二導體層22的另一的面以及第二電子元件23的一側的面連接。
如第4圖所示,從平面看,第一電子元件13可以採用從第一頭部61露出的態樣。當第一電子元件13為MOSFET等開關元件的情況下,從平面看可以在從第一頭部61露出的部分上配置第一柵極端子13g等。同時,當第二電子元件23為MOSFET等開關元件的情況下,可以一側的面上配置第二柵極端子23g等。如第4圖所示,在第一電子元件13的一側的面上具有第一柵極端子13g與第
一源極端子13s,在第二電子元件23的一側的面上具有第二柵極端子23g與第二源極端子23s。此情況下,第二連接體70可以藉由導電性接合劑5與第二電子元件23的第二源極端子23s相連接,連接件85可以藉由導電性接合劑5與第二電子元件23的第二柵極端子23g相連接。另外,第一連接體60可以藉由導電性接合劑5將第一電子元件13的第一源極端子13s與配置在第二電子元件23的另一側的第二漏極端子連接。配置第一電子元件13的另一側的第一漏極端子可以藉由導電性接合劑5與第一導體層12相連接。第一電子元件13的第一柵極端子13g可以藉由導電性接合劑5與連接件95(參照第2圖以及第3圖)相連接,該連接件95可以藉由導電性接合劑5與第一導體層12相連接。
當第一電子元件13以及第二電子元件23中僅任意一方為開關元件時,可以考慮將載置在第一連接體60上的第二電子元件23作為發熱量較低的控制元件,而將第一電子元件13設為開關元件。反之,也可以考慮將載置在第一連接體60上的第二電子元件23作為開關元件,而將第一電子元件13設為發熱量較低的控制元件。
端子部100與第一導體層12和第二導體層22的接合,不僅可使用焊錫等導電性接合劑5來進行,也可使用雷射焊接、以及超音波接合方式來進行。
《作用‧效果》
接下來,將對由上述結構構成的本實施方式的作用以及效果進行說明。另外,可以將在《作用‧效果》中說明的任何態樣適用於上述結構。
如第1圖(a)等所示,在採用配置有從第一基板11向一側延伸並與第二基板21的邊緣部相抵接的定位部200的態樣的情況下,就能夠在不另行使用夾具的情況下,將第二基板21相對於第一基板11在面方向上進行定位,進而有
利於使第一基板11與第二基板21之間保持平行。也就是說,藉由將第二基板21相對於第一基板11在面方向上進行定位,就能夠防止第一基板11相對於第二基板21在面方向上產生位置偏移,其結果就是,能夠防止第一基板11相對於第二基板21在第一方向上產生傾斜。
在以往的態樣中,考慮到需要使第一基板11與第二基板21之間保持平行,因此就必須將夾具與第一基板11和第二基板21的面方向上的大小設置為同等程度。但是,當像這樣將夾具設置得較大時,例如在將焊錫等導電性接合劑5在融化(回流)時就會因加熱導致夾具本身產生熱漲。特別是當藉由夾具在第一方向上對第一基板11和第二基板21進行定位時,一旦夾具本身產生熱漲,就會成為第一基板11和第二基板21產生翹曲變形的原因。因此從這一點來說,當採用本實施方式中的定位部200的情況下,由於定位部200本身的尺寸並不大,因此即便是在施加熱量的情況下其熱漲的量也不會變大,這樣就能夠防止第一基板11和第二基板21產生翹曲變形。
另外,當藉由夾具在第一方向上對第一基板11和第二基板21進行定位時,一旦為了防止第一基板11和第二基板21產生翹曲變形而將夾具的尺寸公差設定得較松緩,則會導致第一基板11與第二基板21之間難以保持平行。因此從這一點來說,當採用本實施方式中的定位部200的情況下,有利於既能夠在第一基板11與第二基板21之間保持平行的同時,防止第一基板11和第二基板21產生翹曲變形。而且這些效果會在第一基板11和第二基板21在面方向上的尺寸越大時變得越大。因此,當採用在面方向上配置有多個第一電子元件13和第二電子元件23的態樣時,本實施方式就會變得特別有效果。
當採用定位部200具有多個第一定位構件210的態樣的情況下,就能夠利用多個第一定位構件210來更正確地進行定位。
當採用第二基板21呈大致矩形,並且對應第一定位構件210的各個邊(四邊)配置的態樣的情況下,由於能夠在第二基板21的各個邊處進行定位,因此能夠更加切實地防止第二基板21相對於第一基板11在面方向上產生位置偏移。
當第一定位構件210被配置各個邊的中央部時,有利於將第二基板21相對於第一基板11均衡地進行定位。
當第一定位構件210上配置有第一突出部211時,在第一方向上也能夠將第二基板21進行定位,從而能夠使第二基板21與第一基板11之間的距離設置在固定距離以上。像這樣藉由在第一方向上也能夠進行定位,就能夠使用於連接第一電子元件13和第二電子元件23的焊錫等導電性接合劑5的厚度設置在固定值以上,從而有利於提高產品的可靠性。尤其是,當在各個第一定位構件210上配置有第一突出部211的情況下,有利於能夠更加切實地在第一方向上將第二基板21進行定位。如前述般,第1圖(a)中所示的第一突出部211可以與第二基板21的另一側的面相抵接,也可以如第5圖(a)所示與第二導體層22的另一側的面相抵接。
一旦第一基板11和第二基板21在面方向上的尺寸變大就容易產生翹曲或變形。因此從這一點來說,當配置有上述第一突出部211時就有利於防止基板的翹曲和變形。
如第2圖以及第3圖所示,當第一突出部211與第二基板21的另一側的面相抵接,並且還與第二導體層22的邊緣部相抵接時,有利於也能夠藉由第一突出部211在面方向上進行定位。
藉由使用接合材料240將第一定位構件210相對於第一基板11進行固定,有利於只需將第一定位構件210安裝在以前已被利用的第一基板11上。當採用接合材料240的熔點高於電子模組內用於連接的焊錫等導電性接合劑5的熔點時,即便是在進行使導電性接合劑5再融化的步驟時,也能夠防止第一定位構件210相對於第一基板11的固定發生鬆動。這樣一來,在使導電性接合劑5再融化後,就能夠防止第二基板21與第一基板11之間產生位置偏移。當將第一定位構件210相對於第一基板11進行固定時,除了高熔點的焊錫之外,還可以使用金屬奈米粒子或超聲波接合和雷射接合等方法。
當定位部200被固定在第一基板11的一側的面上時,由於只需將定位部200被固定在第一基板11的一側的面上即可,因此有利於簡化製造步驟。另外,也可以不必將定位部200被固定在第一基板11的一側的面上,例如還可以藉由接合材料240將定位部200固定在第一基板11的側面上。
如第2圖以及第3圖所示當採用第一連接體60時,就能夠藉由第一連接體60在第一基板11和第二基板21的邊緣內部將第一基板11與第二基板21之間的距離保持在固定值以上。這樣一來,即便是在採用面方向上尺寸較大的第一基板11和第二基板21時,也能夠更加切實地防止第一基板11和第二基板21出現翹曲或變形。
同樣的,當採用第二連接體70時,也能夠藉由第二連接體70在第一基板11和第二基板21的邊緣內部將第一基板11與第二基板21之間的距離保持
在固定值以上。這樣一來,即便是在採用面方向上尺寸較大的第一基板11和第二基板21時,也能夠更加切實地防止第一基板11和第二基板21出現翹曲或變形。
另外,雖然在第2圖以及第3圖中使用了第一連接體60以及第二連接體70,但也可以不使用第一連接體60以及第二連接體70(參照第1圖(a)以及第5圖(a))。
第二實施方式
接下來,對本發明的第二實施方式進行說明。
雖然在第一實施方式中,定位部200是從第一基板11向一側延伸並與第二基板21的邊緣部相抵接,但在本實施方式中,如第6圖所示,定位部200是從第二基板21向另一側延伸並與第一基板11的邊緣部相抵接。關於本實施方式中的其他結構,由於與第一實施方式相同,因此能夠採用第一實施方式中已進行過說明的的任何一種態樣。另外,已在第一實施方式中說明的構件在本實施方式中將使用同一符號。
如上述般,在本實施方式中,能夠採用第一實施方式中已進行過說明的的任何一種態樣,因此定位部200可以具有多個第二定位構件220。第二定位構件220上可以配置第二突出部221。第二突出部221可以與第一基板11的一側的面相抵接。第二突出部221還可以與第一導體層12的邊緣部相抵接。
第二定位構件220也可以被固定在第二基板21的另一側的面上。當採用此態樣時,第二基板21的面方向上的大小可以比第一基板11的面方向上的大小更大。
根據本實施方式,就能夠使用從第二基板21向第一基板11延伸的定位部200的第二定位構件220來將第一基板11相對於第二基板21進行定位。因
此,例如當在設計上或是製造步驟上需要時,就可以考慮不採用第一實施方式中的態樣,而是採用本實施方式中的態樣。
第三實施方式
接下來,對本發明的第三實施方式進行說明。
在本實施方式中,如第7圖以及第8圖所示,同時使用了:從第一基板11向一側延伸並與第二基板21的邊緣部相抵接的第一定位構件210,以及從第二基板21向另一側延伸並與第一基板11的邊緣部相抵接的第二定位構件220。關於本實施方式中的其他結構,由於與上述各實施方式相同,因此能夠採用上述各實施方式中已進行過說明的的任何一種態樣。另外,已在上述各實施方式中說明的構件在本實施方式中將使用同一符號。
如上述般,在本實施方式中,也同樣能夠採用第一實施方式以及第二實施方式中已進行過說明的的任何一態樣,並且在本實施方式中,也可以在第一定位構件210上可以配置第一突出部211,並且在第二定位構件220上配置第二突出部221。
配置在第一定位構件210上的第一突出部211可以與第二基板21的另一側的面相抵接。第一突出部211還可以與第二導體層22的邊緣部相抵接。配置在第二定位構件220上的第二突出部221可以與第一基板11的一側的面相抵接。第二突出部221還可以與第一導體層12的邊緣部相抵接。
作為在本實施方式中的一例,如第7圖以及第8圖所示,也可以使用兩個第一定位構件210和兩個第二定位構件220。此情況下,可以將一對第一定位構件210配置在第一基板11的相向的邊上,並且將一對第二定位構件220配置在第二基板21的相向的邊上。但有不僅限於此,例如,還可以將兩個第一定
位構件210配置在第一基板11的相鄰的邊上,並且將兩個第二定位構件220配置在第二基板21的相鄰的邊上。
第一定位構件210可以被固定在第一基板11的一側的面上,第二定位構件220可以被固定在第二基板21的另一側的面上。在該態樣中,當一對第一定位構件210被配置在第一基板11的相向的邊上,並且一對第二定位構件220被配置在第二基板21的相向的邊上時,如第7圖所示,配置有兩個第一定位構件210的面方向(第二方向)上,第二基板21的長度可以短於第一基板11的長度,如第8圖所示,配置有兩個第二定位構件220的面方向(第三方向)上,第一基板11的長度可以短於第二基板21的長度。
另外,當兩個第一定位構件210被配置在第一基板11的相鄰的邊上,並且兩個第二定位構件220被配置在第二基板21的相鄰的邊上時,可以將第一基板11與第二基板21在面方向上以斜方向(第二方向與第三方向之間的方向)錯開配置。此情況下,兩個第一定位構件210與第二基板21的相鄰的兩個邊相抵接,並且兩個第二定位構件220被與第一基板11的相鄰的兩個邊相抵接。
根據本實施方式,就能夠同時利用第一定位構件210和第二定位構件220對第一基板11與第二基板21之間進行的相對位置的定位。
第四實施方式
接下來,對本發明的第四實施方式進行說明。
雖然在上述各實施方式中,沒有特別提及第一定位構件210和第二定位構件220的前端部的形狀,但在本實施方式中,如第9圖所示,定位部200的第一定位構件210和第二定位構件220的前端部呈錐形。關於本實施方式中的
其他結構,同樣能夠採用上述各實施方式中已進行過說明的的任何一種態樣。另外,已在上述各實施方式中說明的構件在本實施方式中將使用同一符號。
如本實施方式般,藉由採用定位部200的第一定位構件210和第二定位構件220的前端部呈錐形的態樣,就能夠更加容易地來進行面方向上的定位。具體來說,在第一實施方式涉及的態樣中,當第一定位構件210的前端部呈錐形時,在將第二基板21相對於第一基板11進行定位時,僅需要將第二基板21沿第一方向靠近第一基板11,就能夠將第二基板21沿第一定位構件210的前端部在面方向上錯開後進行定位。在第二實施方式涉及的態樣中,當第二定位構件220的前端部呈錐形時,在將第一基板11相對於第二基板21進行定位時,僅需要將第一基板11沿第一方向靠近第二基板21,就能夠將第一基板11沿第二定位構件220的前端部在面方向上錯開後進行定位。當採用第三實施方式涉及的態樣時也同樣如此。另外,在本實施方式中,如第9圖所示,配置在相向的邊上的第二定位構件220之間的間隔,比該相向的邊所對應的第一基板11和第二基板21的寬度方向上的長度更小。藉由採用這種態樣,就能夠使第一定位構件210和第二定位構件220上成錐形的部分與第一基板11和第二基板21的邊緣部相抵接,從而可在面方向上以及第一方向上進行定位。
第五實施方式
接下來,對本發明的第五實施方式進行說明。
在本各實施方式中,如第10圖所示,配置在相向的邊上的第一定位構件210和第二定位構件220之間的間隔,比該第一基板11和第二基板21更大,並且在第一定位構件210和第二定位構件220還配置有第一突出部211和第二突出部221。本實施方式中的其他結構與第四實施方式一樣。在本各實施方式
中,同樣能夠採用上述各實施方式中已進行過說明的的任何一種態樣。另外,已在上述各實施方式中說明的構件在本實施方式中將使用同一符號。
根據本實施方式,就能夠藉由第一定位構件210和第二定位構件220上成錐形的部分來引導第一基板11和第二基板21,並最終藉由第一突出部211和第二突出部221在第一基板11和第二基板21的面方向以及第一方向上進行定位。具體來說,在第一實施方式涉及的態樣中,當第一定位構件210的前端部呈錐形,並且配置有第一突出部211時,在將第二基板21相對於第一基板11進行定位時,僅需要將第二基板21沿第一方向靠近第一基板11,就能夠將第二基板21沿第一定位構件210的前端部在面方向上錯開,並且藉由第一突出部211來支撐第二基板21的另一側的面,從而將第二基板21相對於第一基板11在面方向上以及第一方向上進行定位。在第二實施方式涉及的態樣中,當第二定位構件220的前端部呈錐形,並且配置有第二突出部221時,在將第一基板11相對於第二基板21進行定位時,僅需要將第一基板11沿第一方向靠近第二基板21,就能夠將第一基板11沿第二定位構件220的前端部在面方向上錯開,並且藉由第二突出部221來支撐第一基板11的一側的面,從而將第一基板11相對於第二基板21在面方向上以及第一方向上進行定位。當採用第三實施方式涉及的態樣時也同樣如此。
第六實施方式
接下來,對本發明的第六實施方式進行說明。
雖然在上述各實施方式中,定位部200是藉由接合材料240被固定在第一基板11和第二基板21上的,但在本實施方式中,是藉由用於形成端子部100等的引線框300來構成定位部200的(參照第11圖以及第12圖)。關於本實施方式中的其他結構,同樣能夠採用上述各實施方式中已進行過說明的的任何一種
態樣。另外,已在上述各實施方式中說明的構件在本實施方式中將使用同一符號。
在本各實施方式中,藉由將引線框300在合適的部位上進行切割,然後再進行折彎,就能夠形成定位部200。具體來說,藉由在切割預定部位上對引線框300進行切割(參照第11圖),並向一側或另一側折彎,就能夠形成定位部200(參照第12圖)。
本各實施方式中的定位部200可以具有:在面方向上延伸的引線框基端部、以及藉由引線框彎曲部被設置在引線框基端部上的,並且向一側或另一側延伸的引線框延伸部。在第13圖所示的態樣中,具有:在面方向上延伸的第一引線框基端部217、以及藉由引線框彎曲部218被設置在第一引線框基端部217上的,並且向一側或另一側延伸的引線框延伸部216。
在本各實施方式中,當同樣設置有第一突出部211和第二突出部221時,只要在用於設置第一突出部211和第二突出部221的部位的相反一側的面上對引線框300進行敲擊或按壓即可。藉由像這樣對引線框300進行敲擊或按壓,就能夠形成第一突出部211和第二突出部221。此情況下,如第13圖(b)所示般,就能夠形成與第一突出部211和第二突出部221相對應的凹部211a。
另外,在第11圖至第13圖中,雖然使用了藉由引線框300來形成第一定位構件210的態樣來進行了說明,但如前述般,同樣可以採用上述各實施方式中已說明的任何一種態樣,藉由引線框300來形成第二定位構件220。
根據本實施方式,就能夠使用引線框300來形成定位部200,從而不必再使用接合材料240。
第七實施方式
接下來,對本發明的第七實施方式進行說明。
雖然在上述各實施方式中,使用了截面呈T字形的第一連接體60,但在本實施方式中,如第14圖所示,第一連接體60具有從第一頭部61向另一側延伸的四個支撐部65(65a-65d)。支撐部65與第一導體層12或第一基板11抵接。在本實施方式中,同樣能夠採用上述各實施方式中已進行過說明的任何一種態樣。另外,已在上述各實施方式中說明的構件在本實施方式中將使用同一符號來進行說明。
雖然在本實施方式是以使用四個支撐部65的態樣來進行說明的,但並不僅限於此,也可以使用一個、兩個、三個或五個以上的支撐部65。
在如本實施方式中設置從第一頭部61延伸的支撐部65時,在實際安裝第二電子元件23或實際安裝第二電子元件23之後,可以防止因第二電子元件23的重量導致的第一連接體60發生傾斜。另外,藉由使支撐部65與第一基板11或第一導體層12相抵接,還能夠提高其散熱性。特別是當支撐部65與第一導體層12相抵接時,有利於進一步提高散熱效果。
藉由如本實施方式般使用具有多個支撐部65的第一連接體60,就能夠在第一基板11和第二基板21的邊緣內部更加切實地在第一方向上進行定位。特別是,當採用第一突出部211和第二突出部221,並且採用具有多個支撐部65的第一連接體60時,就能夠一邊藉由第一突出部211和第二突出部221在第一基板11和第二基板21的邊緣內部在第一方向上進行定位,一邊藉由具有多個支撐部65的第一連接體60在第一基板11和第二基板21的邊緣內部在第一方向上進行定位。因此,即便是在採用在面方向上尺寸較大的第一基板11和第二基板21時,也能夠更加切實地防止第一基板11和第二基板21產生翹曲或變形。
另外,如第四實施方式般,即便是在:第一定位構件210和第二定位構件220的前端部呈錐形,並且配置在相向的邊上的第二定位構件220之間的間隔比第一基板11和第二基板21更小時,也能夠一邊藉由第一定位構件210和第二定位構件220的前端部在第一基板11和第二基板21的邊緣部在第一方向上進行定位,一邊藉由第一連接體60在第一基板11和第二基板21的邊緣內部在第一方向上進行定位。
第八實施方式
接下來,將對本發明中的第八實施方式進行說明。
雖然在上述各實施方式中,使用了具有第二柱部72且截面呈T字形的第二連接體70,但在本實施方式中,如第12圖所示,第二連接體70具有從第二頭部71向另一側延伸的延伸部75(75a、75b)。在本實施方式中,同樣能夠採用上述各實施方式中已進行過說明的的任何一種態樣。另外,已在上述各實施方式中說明的構件在本實施方式中將使用同一符號來進行說明。
雖然在本實施方式中對使用了兩個延伸部75的態樣進行說明,但並不僅限於此,也可以使用一個或三個以上的延伸部75。
根據本實施方式,由於配置有延伸部75,因此能夠有效地將來自於第二電子元件23的熱量進行散熱,並藉由第二連接體70實現高散熱性。在如本實施方式中設置多個延伸部75時,有利於進一步實現高散熱效果。
藉由如本實施方式般使用具有多個延伸部75的第二連接體70,就能夠在第一基板11和第二基板21的邊緣內部更加切實地在第一方向上進行定位。特別是,當採用第一突出部211和第二突出部221,並且採用具有多個延伸部75的第二連接體70時,就能夠一邊藉由第一突出部211和第二突出部221在第
一基板11和第二基板21的邊緣部在第一方向上進行定位,一邊藉由具有多個延伸部75的第二連接體70在第一基板11和第二基板21的邊緣內部在第一方向上進行定位。因此,即便是在採用在面方向上尺寸較大的第一基板11和第二基板21時,也能夠更加切實地防止第一基板11和第二基板21產生翹曲或變形。
另外,如第四實施方式般,即便是在:第一定位構件210和第二定位構件220的前端部呈錐形,並且配置在相向的邊上的第二定位構件220之間的間隔比第一基板11和第二基板21更小時,也能夠一邊藉由第一定位構件210和第二定位構件220的前端部在第一基板11和第二基板21的邊緣部在第一方向上進行定位,一邊藉由第二連接體70在第一基板11和第二基板21的邊緣內部在第一方向上進行定位。
最後,上述各實施方式、變形例中的記載以及圖式中揭露的圖式僅為用於說明申請專利範圍中記載的發明的一例,因此申請專利範圍中記載的發明不受上述實施方式或圖式中揭露的內容所限定。本申請最初的申請專利範圍中的記載僅僅是一個示例,可以根據說明書、圖式等的記載對申請專利範圍中的記載進行適宜的變更。
5:導電性接合劑
11:第一基板
12:第一導體層
13:第一電子元件
19:第一散熱板
21:第二基板
22:第二導體層
23:第二電子元件
29:第二散熱板
90:封裝部
100:端子
200:定位部
210:第一定位構件
211:第一突出部
240:接合材料
Claims (5)
- 一種電子模組,其包括:第一基板;電子元件,配置在該第一基板的一側上;第二基板,配置在該電子元件的一側上;以及定位部,從該第一基板向一側延伸並與該第二基板的邊緣部的側面相抵接,或是從該第二基板向另一側延伸並與該第一基板的邊緣部的側面相抵接,其中,該電子元件設置在該第一基板與該第二基板之間,該定位部由引線框構成,該定位部具有:在面方向上延伸的引線框基端部以及藉由引線框彎曲部配置在該引線框基端部上的,並且向一側或另一側延伸的引線框延伸部。
- 如申請專利範圍第1項所述之電子模組,其中該定位部具有向邊緣內部突出的突出部,當該定位部從該第一基板向一側延伸並與該第二基板的邊緣部相抵接時,該突出部與該第二基板的另一側的面相抵接,當該定位部從該第二基板向另一側延伸並與該第一基板的邊緣部相抵接時,該突出部與該第一基板的一側的面相抵接。
- 如申請專利範圍第1項所述之電子模組,其進一步包括:第一導體層,配置在該第一基板的一側;以及第二導體層,配置在該第二基板的另一側, 其中,當該定位部從該第一基板向一側延伸並與該第二基板的邊緣部相抵接時,突出部與該第二導體層的邊緣部相抵接,當該定位部從該第二基板向另一側延伸並與該第一基板的邊緣部相抵接時,該突出部與該第一導體層的邊緣部相抵接。
- 如申請專利範圍第1項所述之電子模組,其中該定位部的前端部呈錐形。
- 如申請專利範圍第1項所述之電子模組,其中該電子元件具有:第一電子元件以及配置在該第一電子元件的一側的第二電子元件,在該第一電子元件與該第二電子元件之間,配置有將該第一電子元件與該第二電子元件電連接的第一連接體。
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WOPCT/JP2017/025644 | 2017-07-14 | ||
PCT/JP2017/025644 WO2019012679A1 (ja) | 2017-07-14 | 2017-07-14 | 電子モジュール |
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- 2017-07-14 WO PCT/JP2017/025644 patent/WO2019012679A1/ja active Application Filing
- 2017-07-14 CN CN201780012830.8A patent/CN109699191A/zh active Pending
- 2017-07-14 US US16/077,905 patent/US20210202369A1/en not_active Abandoned
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2018
- 2018-07-12 NL NL2021293A patent/NL2021293B1/en active
- 2018-07-13 TW TW107124257A patent/TWI706703B/zh active
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WO2019012679A1 (ja) | 2019-01-17 |
JPWO2019012679A1 (ja) | 2019-07-18 |
US20210202369A1 (en) | 2021-07-01 |
NL2021293A (en) | 2019-01-25 |
JP6523567B1 (ja) | 2019-06-05 |
CN109699191A (zh) | 2019-04-30 |
NL2021293B1 (en) | 2019-05-22 |
TW201909711A (zh) | 2019-03-01 |
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