TWI701745B - 異質整合組裝結構及其製造方法 - Google Patents

異質整合組裝結構及其製造方法 Download PDF

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TWI701745B
TWI701745B TW108130777A TW108130777A TWI701745B TW I701745 B TWI701745 B TW I701745B TW 108130777 A TW108130777 A TW 108130777A TW 108130777 A TW108130777 A TW 108130777A TW I701745 B TWI701745 B TW I701745B
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layer
die
substrate
assembly structure
integrated assembly
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TW108130777A
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TW202010026A (zh
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林育民
林昂櫻
吳昇財
張道智
駱韋仲
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財團法人工業技術研究院
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10156—Shape being other than a cuboid at the periphery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

Abstract

一種異質整合組裝結構，包括基底、晶粒、鈍化層、第一重佈線層、第二重佈線層以及連接部。晶粒安裝於所述基底上。晶粒具有主動面與非主動面。主動面具有接墊。鈍化層覆蓋所述晶粒的側壁與表面，裸露出所述接墊的表面。第一重佈線層位於鈍化層上，電性連接接墊。第二重佈線層位於基底上，與晶粒相鄰。連接部連接第一重佈線層與第二重佈線層。

Description

異質整合組裝結構及其製造方法
本發明是有關於一種異質整合組裝結構及其製造方法。
隨著電子裝置的輕薄化，目前的趨勢正致力於將異質的半導體的組件直接連接而減少中介基底的使用，一方面可減少半導體封裝的尺寸，同時可縮短電性通路，提升半導體封裝中的運算速度。傳統的異質組裝方式為在高溫下進行焊接，但高溫會影響晶片的性能。因應更先進的需求並避免傳統焊接連接的高溫影響晶片性能，需要持續尋求新的組裝方法。
本發明提出一種異質整合組裝結構，包括基底、晶粒、鈍化層、第一重佈線層、第二重佈線層以及連接部。晶粒安裝於所述基底上。晶粒具有主動面與非主動面。主動面具有接墊。鈍化層覆蓋所述晶粒的側壁與表面，裸露出所述接墊的表面。第一重佈線層位於鈍化層上，電性連接接墊。第二重佈線層位於基底上，與晶粒相鄰。連接部連接第一重佈線層與第二重佈線層。
本發明還提出一種異質整合組裝結構的製造方法，包括提供晶圓，所述晶圓包括多個晶粒，其中每一所述晶粒具有主動面與非主動面，所述主動面具有接墊。在所述晶粒之間形成缺口，所述缺口裸露出所述晶粒的第一側壁。在所述晶圓上形成鈍化層，覆蓋所述晶粒的表面，裸露出所述接墊的表面。於所述鈍化層上形成第一重佈線層，電性連接所述接墊。進行切割製程，使所述晶圓上的所述晶粒彼此分離。將所述晶粒安裝於基底上，所述基底上具有第二重佈線層。形成連接部，連接所述第一重佈線層與所述第二重佈線層。
基於上述，本發明實施例之方法可以採用低溫的方式進行接合。此外，本發明以採用晶圓級或面板級製程來進行多個晶粒的安裝。此外，利用液體狀的黏著層或是藉由液滴可以在安裝時具有自行對準組裝的功效。
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。
第一晶粒的製作
請參照圖1A，提供晶圓40a。晶圓40a包括多個彼此連接的晶片10a（chip）。晶片10a可分別為記憶體晶片、邏輯晶片、數位晶片、類比晶片、感測器晶片（sensor chip）、無線射頻晶片（wireless and radio frequency chip）、發光二極體(LED) 、微機電元件（MEMS device）或電壓調節器晶片等。感測器晶片可為影像感測器晶片或壓力感測器或空氣微粒感測器…等，至少包括電荷耦合元件（CCD）或互補金氧半導體影像感測器（CMOS image sensor）。晶片10a可為相同類型的晶片或不同類型的晶片。晶片10a可藉由晶片切割製程沿切割道58分隔開。
在一些實施例中，晶圓40a可包括基底50、元件層52、金屬化結構54以及多個接墊56。金屬化結構54包括介電層以及位於介電層中的金屬內連線結構（圖中未示出）。換句話說，晶片10a分別包括基底50、元件層52、金屬化結構54以及多個接墊56。接墊56藉由金屬化結構54的金屬內連線結構與位於元件層52之中的元件電性連接。
基底50是半導體基底，例如矽基底。舉例來說，基底50是塊狀（bulk）矽基底、摻雜矽基底、未摻雜矽基底或絕緣體上覆矽（silicon-on-insulator，SOI）基底。摻雜矽基底的摻質可為P型摻質、N型摻雜質，或N型摻質與P型摻雜質的組合。基底50也可以其他半導體材料形成。所述其他半導體材料包括矽鍺、碳化矽、砷化鎵或其類似物，但不限於此。基底40中還可包括主動區及隔離結構（圖中未示出）。
元件層（device layer）52包括形成在基底40的主動區上的多種元件（圖中未示出）。在一些實施例中，所述元件包括主動元件、被動元件或主動元件與被動元件的組合。在一些實施例中，舉例來說，所述元件包括積體電路元件。在一些實施例中，所述元件例如為電晶體、二極體、光電二極體、電容器、電阻器、熔絲元件或其他類似元件。也就是說，晶圓40a是形成有元件的晶圓，而非載體。金屬化結構54形成在基底50及元件層52上。在一些實施例中，金屬化結構54包括多層介電層以及形成在多層介電層中的金屬內連線結構。所述金屬內連線結構與元件層52中的元件電性連接，其包括多層金屬線及多個插塞。
接墊56形成在金屬化結構54上，並且於金屬化結構54中的金屬內連線結構電性連接，以提供元件層52中的元件的外部連接。接墊56的材料可包括金屬或金屬合金，例如鎳（Ni）、錫（Sn）、鈀（Pd）、釩（V）、鈷（Co）、金（Au）、銅（Cu）、銀（Ag）、鋁(Al)或者這些金屬組成的多層疊構、其合金或其複合材料等，但不限於此。接墊56的頂面與金屬化結構54的頂面形成晶圓40a的主動面80a。在一些實施例中，所述主動面80a被稱為晶圓40a的第一表面（或稱為前表面），而晶圓40a的第二表面（或稱為背表面）（即，底表面）與第一表面相對，又稱為非主動面82a。
請參照圖1B，在晶圓40a上形成具有頂通孔（top via hole）的鈍化層60。頂通孔裸露出部分的接墊56的表面。鈍化層60覆蓋金屬化結構54的表面以及另一部分的接墊56的表面。鈍化層60層可為單層結構或多層結構。鈍化層60包含絕緣材料，例如氧化矽、氮化矽、聚合物或其組合。所述聚合物為例如聚苯並噁唑（PBO）、聚醯亞胺（Polyimide, PI）、苯並環丁烯（BCB）、環氧樹脂(Epoxy)其組合或其類似物。
請繼續參照圖1B，於鈍化層60上形成第一重佈線層62。第一重佈線層62又可以稱為第一線路層。第一重佈線層62與接墊56電性連接。第一重佈線層62包括彼此連接的多個通孔（via）64和多個第一跡線（trace）66。通孔64縱向延伸，穿過鈍化層60，以連接接墊56。第一跡線66分別位於鈍化層60上，並且分別在鈍化層60的頂面上水平方向上延伸。在一些實施例中，通孔64的橫截面形狀是正方形、矩形或倒梯形。在一些實施例中，通孔64的底角δ是鈍角或直角。
第一重佈線層62的材料包括金屬，例如銅、鎳、鈦、鋁、鈀、金及其組合等。第一重佈線層62可以藉由電鍍或無電鍍製程形成。在一些實施例中，第一重佈線層62包括晶種層（未示出）和在其上形成的金屬層（未示出）。晶種層（seed layer）可以是金屬種子層，例如銅晶種層。在一些實施例中，晶種層包括第一金屬層（例如鈦層）以及第二金屬層（例如第一金屬層上的銅層）。晶種層上的金屬層可以是銅或其他合適的金屬。
請繼續參照圖1B，在晶圓40a上形成多個保護層70。保護層70覆蓋位於晶片10a的中心區的鈍化層60與第一重佈線層62。保護層70裸露出每一晶片10a邊緣區的鈍化層60與第一跡線66的末端（第一端）66E1。保護層70的材料與鈍化層60的材料不同。保護層70可為單層結構或多層結構。保護層70可以是絕緣材料。保護層70可以是無機材料或是有機材料，例如氧化矽、氮化矽、聚合物或其組合。所述聚合物為例如聚苯並噁唑（PBO）、聚醯亞胺（Polyimide, PI）、苯並環丁烯（BCB）、其組合或其類似物。
請參照圖1C與圖1D，進行晶圓40a的切割製程，沿切割道58將多個晶片10a彼此分離，以形成多個第一晶粒12a。
第一晶粒12a的主動面80a的中心區CA被保護層70覆蓋。第一晶粒12a的主動面80a的邊緣區EA未被保護層70覆蓋，而裸露出第一重佈線層62的末端。換言之，第一重佈線層62位於中心區CA之中的部分，亦即連接接墊56的第一跡線66的末端（第二端）66E2以及第一跡線66的主體部66S被保護層70覆蓋。第一重佈線層62位於邊緣區EA之中的另一部分，亦即第一跡線66的末端（第一端）66E1未被保護層70覆蓋，而裸露出來。
第一晶粒12a具有垂直的側壁S1，且被裸露出來。換言之，第一跡線66的末端66E1、鈍化層60、金屬化結構54、元件層52以及基底50的側壁大致共平面，而形成垂直的側壁S1。
第二晶粒的製作
請參照圖2A與圖2B，依照製作第一晶粒12a的方式，提供晶圓40b，並在晶圓40b上形成鈍化層60、第一重佈線層62與保護層70。
請參照圖2C，在進行切割製程之前，從晶片10b的非主動面82b的向主動面80b進行預切晶圓製程，以在晶圓40b的切割道58周圍形成缺口72。缺口72相鄰的兩個晶片10b局部地分離。缺口72裸露出晶片10b的側壁。缺口72的剖面形狀例如是呈倒V字型。缺口74的深度D1可以小於、等於或是大於基底50的總厚度T1。請參照圖2D與圖2E，進行切割製程，使晶圓40b上的晶片10b彼此完全分離，以形成多個第二晶粒12b。請參照圖2D與圖2E，第二晶粒12b的主動面80b投影在基底50的表面上的面積大於非主動面82b投影在基底50表面上的面積。
第二晶粒12b的主動面80b的中心區CA被保護層70覆蓋。第二晶粒12b的主動面80b的邊緣區EA未被保護層70覆蓋，而裸露出部分的第一重佈線層62。換言之，第一重佈線層62位於中心區CA之中的部分，亦即連接接墊56的第一跡線66的末端（第二端）66E2以及第一跡線66的主體部66S被保護層70覆蓋。第一重佈線層62位於邊緣區EA之中的另一部分，亦即第一跡線66的末端（第一端）66E1未被保護層70覆蓋，而裸露出來。
第二晶粒12b具有傾斜的側壁S2。側壁S2與基底50的底面（非主動面82b）所夾的內角α為鈍角。第二晶粒12b的側壁S2裸露出來，而未被保護層70以及鈍化層60覆蓋。
第三晶粒的製作
請參照圖3A，提供晶圓40c。晶圓40c包括多個彼此連接的晶片10c。晶圓40c、晶片10c分別與晶圓40a、晶片10a相似。每一晶片10c具有主動面80c與非主動面82c。主動面80c具有接墊56。
請參照圖3B，從晶片10c的主動面80c向非主動面82c進行預切晶圓製程，以在晶圓40c的切割道58周圍形成缺口74。缺口74分離相鄰的兩個晶片10c。缺口74的剖面形狀例如是呈V字型。缺口74裸露出晶片10c的側壁S3。非主動面82c與側壁S3所夾的內角β為銳角。缺口74延伸至晶圓40c的基底50之中。在基底50中的缺口74的深度D2可以小於、等於或是大於基底50的總厚度T1。
請參照圖3C，在進行預切晶圓製程之後，在晶圓40c上形成鈍化層60與第一重佈線層62。鈍化層60覆蓋晶片10c的表面以及缺口74所裸露的側壁S3，並且鈍化層60的頂通孔裸露出接墊56的表面。第一重佈線層62形成在晶片10c以及缺口74上的鈍化層60上，並且與接墊56電性連接。
請參照圖3C，在晶圓40c上形成多個保護層70。保護層70覆蓋位於晶片10c的中心區的鈍化層60與第一重佈線層62。保護層70裸露出晶片10c的邊緣區以及側壁S3上的鈍化層60與第一跡線66。
請參照圖3D與圖3E，自缺口74處進行切割製程，使晶圓40c上的晶片10c彼此分離，以形成多個第三晶粒12c。第三晶粒12c的主動面80c投影在基底50的表面上的面積小於非主動面82c投影在基底50的表面上的面積。第三晶粒12c具有傾斜的側壁S3。側壁S3被鈍化層60覆蓋，且側壁S3上的鈍化層60上有第一重佈線層62。
第三晶粒12c的主動面80c的中心區CA被保護層70覆蓋。第三晶粒12c的邊緣區EA以及側壁S3未被保護層70覆蓋，而裸露出部分的鈍化層60以及部分的第一重佈線層62。換言之，第一跡線66位於中心區CA之中的部分，亦即連接接墊56的第一跡線66的末端（第二端）66E2以及第一跡線66的主體部66S被保護層70覆蓋。第一跡線66位於邊緣區EA以及側壁S3上的部分66p以及末端（第一端）66E1未被保護層70覆蓋，而裸露出來。
第四晶粒的製作
請參照圖4A，提供晶圓40d。晶圓40d包括多個彼此連接的晶片10d。晶圓40d、晶片10d分別與晶圓40a、晶片10a相似。每一晶片10d具有主動面80d與非主動面82d。主動面80d具有接墊56。
請參照圖4B，從晶片10d的主動面80a向非主動面82a進行微影與蝕刻製程，以在晶圓40的切割道58周圍形成缺口76。缺口76將相鄰的兩個晶片10d部分分離。缺口76的剖面形狀例如是呈U字型。依據蝕刻製程的不同，缺口76的形狀可以有些微不同。以非等向性蝕刻製程所形成的缺口76的側壁S4大致為垂直平面或傾協平面。側壁S4與晶圓40d的基底50的表面的夾角θ1為銳角或直角。缺口76延伸到基底50中。在基底50中的缺口76的深度D3小於基底50的總厚度T1。請參照圖4C，在所述晶圓40上形成鈍化層60，覆蓋晶片10d的表面以及缺口76的側壁S4與底面，裸露出接墊56的表面。於鈍化層60上形成第一重佈線層62，電性連接接墊56。第一重佈線層62覆蓋接墊56的表面，並延伸覆蓋晶片10d的邊緣上的鈍化層60以及缺口76上的部分的鈍化層60。
請參照圖4D，自缺口76的底面進行切割製程，使晶圓40上的晶片10d彼此分離，以形成多個第四晶粒12d。
第四晶粒12d的主動面80a投影在基底50的表面上的面積小於非主動面82a投影在基底50的表面上的面積。第四晶粒12d具有階梯狀的側壁St4。階梯狀的側壁St4包括第一側壁S41與第二側壁S42。第一側壁S41與非主動面82a的夾角γ1可以是直角。第一側壁S41裸露出基底50，其未被鈍化層60覆蓋，也未被第一重佈線層62覆蓋。第二側壁S42與基底50的表面的夾角θ1為銳角或直角。第二側壁S41被鈍化層60覆蓋，且第二側壁S41上的鈍化層60上有第一重佈線層62。
第四晶粒12d的主動面80d的中心區CA被保護層70覆蓋。第四晶粒12d的邊緣區EA以及側壁St4未被保護層70覆蓋，而裸露出部分的鈍化層60以及部分的第一重佈線層62。換言之，第一跡線66位於中心區CA之中的部分，亦即連接接墊56的第一跡線66的末端（第二端）66E2以及第一跡線66的主體部66S被保護層70覆蓋。第一跡線66位於邊緣區EA以及側壁St4上的部分66p以及末端（第一端）66E1未被保護層70覆蓋，而裸露出來。
第五晶粒的製作
請參照圖5A至5C，第五晶粒12e的製作方法與第四晶粒12d的製作方法相似，差異點在於缺口78是以微影製程與等向性蝕刻製程形成。以等向性蝕刻製程所形成的缺口78的剖面形狀例如是呈U字型，但缺口78具有弧狀的側壁S5。缺口78的側壁S5與基底50的表面的夾角θ2為直角或鈍角。在缺口78延伸到基底50中。基底50中的缺口78的深度D4小於基底50的總厚度T1。
請參照圖5D與圖5E，自缺口78的底面進行切割製程，使晶圓40e上的晶片10e彼此分離，以形成多個第五晶粒12e。
第五晶粒12e與第四晶粒12d相似。第五晶粒12e的主動面80e投影在基底50的表面上的面積小於非主動面82a投影在基底50的表面上的面積，且第五晶粒12e也是具有階梯狀的側壁St5。階梯狀的側壁St5包括第一側壁S51與第二側壁S52。第一側壁S51與非主動面82a的夾角γ2可以是直角。第一側壁S51裸露出基底50，其未被鈍化層60覆蓋，也未被第一重佈線層62覆蓋。第二側壁S52與基底50的表面的夾角θ2為直角或鈍角。第二側壁S52被鈍化層60覆蓋，並且第二側壁S52上的鈍化層60上覆有第一重佈線層62。
請參照圖12，在以上第一晶粒12a、第二晶粒12b、第三晶粒12c、第四晶粒12d以及第五晶粒12e的製作的過程中，可以在進行切割之前，在保護層70的上方或是基底50的上方形成突起物75，如圖12中的晶粒12a’、12b’、12c’、12c’’、12d’以及12e’。突起物75可以是由介電材料、半導體材料或金屬材質製作。突起物75的形成方法例如是利用微影與蝕刻製程。突起物75可以提供組裝過程中取放晶片的自由度。此外，在組裝後，突起物75可以做為架構的一部分。
上述的晶粒可以採用晶圓級或面板級製程來安裝在基底上，可以採用批次的方式，同時將多個晶粒安裝在基底上，然而，為了簡化起見，以下的實施例以單一個晶粒來說明之。
第一實施例
請參照圖6A，提供基底100。基底100的材料可以是有機材料或是無機材料。基底100可為封裝基板例如可撓式基板、軟性基板、中介基板或印刷電路板等。或者，基底100可例如是包含多個半導體晶片的半導體晶圓或包含多個晶粒的重構晶圓（reconstructed wafer）。基底100可為例如半導體晶粒或形成有半導體積體電路的半導體晶片，包括記憶體晶片、邏輯晶片、數位晶片、類比晶片、感測器晶片、無線射頻晶片或電壓調節器晶片等。其中感測器晶片可為影像感測器晶片，至少包括電荷耦合元件或互補金氧半導體影像感測器。
在基底100上形成第二重佈線層102。在一些實施例中，在基底100和第二重佈線層102之間還包括介電層，或更包括其他的元件層。第二重佈線層102又稱為第二線路層。第二重佈線層102可以包括通孔（未示出）與跡線106。第二重佈線層102的材料包括金屬，例如銅、鎳、鈦及其組合等。第二重佈線層1022可以藉由電鍍或無電鍍製程形成。在一些實施例中，第二重佈線層102包括晶種層（未示出）和在其上形成的金屬層（未示出）。晶種層可以是金屬種子層，例如銅晶種層。在一些實施例中，晶種層包括第一金屬層（例如鈦層）以及第二金屬層（例如第一金屬層上的銅層）。晶種層上的金屬層可以是銅或其他合適的金屬。
請參照圖6B，移除部分的基底100以及部分的第二重佈線層102，以在基底100中形成多個凹槽（cavity）104。移除部分基底100的方法例如是進行微影製程與蝕刻製程。凹槽104的底角σ的角度例如是直角或是鈍角。
請參照圖6B，在基底100上形成保護層105。保護層105覆蓋部分的第二重佈線層102。保護層105裸露出凹槽104周圍的的第二重佈線層102的跡線106的末端106E。保護層105的材料可以與保護層70的材料相同或相異。保護層105可為單層結構或多層結構。保護層105可以是絕緣材料。保護層105可以是無機材料或是有機材料，例如氧化矽、氮化矽、聚合物或其組合。所述聚合物為例如聚苯並噁唑（PBO）、聚醯亞胺、苯並環丁烯（BCB）、其組合或其類似物。
請參照圖6C，在基底100的凹槽104之中形成黏著層116a。黏著層116a的材料可以是有機材料或是無機材料。有機材料例如是環氧樹脂、聚二甲基矽氧烷（PDMS）等。無機材料包括氧化物，例如是氧化矽。在一些實例中，黏著層116a可以是以固態狀的方式形成在基底100的凹槽104之中。在另一些實施例中，黏著層116a可以是以液態狀的方式形成在基底100的凹槽104之中，並且可以在後續將晶粒放置在凹槽104之後，藉由加熱以固化之。
請參照圖6C，以拾取與放置（pick and place）的方式將多個第一晶粒12a的非主動面82a朝向基底100，使第一晶粒12a安裝於多個凹槽104之中。第一晶粒12a的主動面80a上的第一重佈線層62的末端66E1對準基底100上的第二重佈線層102的跡線106的末端106E，並且使第一晶粒12a的非主動面82a與凹槽104之中的黏著層116a接觸。在黏著層116a為液態狀的實施例中，在將第一晶粒12a放置於凹槽104之後，藉由低溫加熱以固化之。藉由黏著層116a厚度/體積的適當控制，可以避免溢膠，並且黏著層116a固化之後，可以使得第一重佈線層62的表面與第二重佈線層102的表面大致在相同的高度。在一實施例中，第一重佈線層62的表面與第二重佈線層102的表面共平面。
請參照圖6D與圖6E，在第一重佈線層62的末端66E1與第二重佈線層102的跡線106的末端106E形成連接部108a，以連接第一重佈線層62與第二重佈線層102。形成連接部108a的方法可以包括電鍍、無電鍍等。在以電鍍或無電鍍形成連接部108a的實施例中，在製程初期，在第一重佈線層62的末端66E1與第二重佈線層102的跡線106的末端106E分別形成第一導體材料與第二導體材料。第一導體材料環繞包覆第一重佈線層62的末端66E1的頂面與側壁。第二導體材料環繞包覆第二重佈線層102的跡線106的末端106E的頂面與側壁。在製程後期，第一導體材料與第二導體材料逐漸向外成長而彼此接觸連接之後，即可形成連接部108a。換言之，藉由電鍍、無電鍍的方式，連接部108a可以自行對準第一重佈線層62的末端66E1與第二重佈線層102的跡線106的末端106E。進行電鍍、無電鍍製程的溫度相當低，例如是攝氏100度以下，因此，晶粒可以以低溫的方式接合在基底100上。
在以電鍍或無電鍍形成連接部108a的實施例中，連接部108a覆蓋第一重佈線層62的末端66E1的頂面與側壁以及第二重佈線層102的跡線106的末端106E的頂面與側壁。因此，連接部108a的寬度W31大於第一重佈線層62的跡線的66寬度W11，且大於第二重佈線層102的寬度W21。此外，連接部108a的形狀例如是呈不規則狀或是具有弧形的輪廓。
至此，形成了異質整合組裝結構180a。之後，可以將再進行切割製程。保護層70以及105可以在切割製程之前移除，或者保留下來。
第二實施例
請參照圖7A，以上述第一實例之方式提供基底100。基底100上有第二重佈線層102以及保護層105。基底100有多個凹槽104。
請參照圖7B，在基底100的凹槽104之中形成黏著層116b，並以拾取與放置的方式將多個第二晶粒12b非主動面82b朝向基底100，使安裝於凹槽104之中。第二晶粒12b的非主動面82b接觸黏著層116b，並且第一重佈線層62的末端66E對準第二重佈線層102的跡線106的末端106E。
請參照圖7C與7D，在第一重佈線層62的末端66E1的表面與側壁上以及第二重佈線層102的跡線106的末端106E的表面與側壁上形成連接部108b，以連接第一重佈線層62與第二重佈線層102。連接部108b的形成方法以及其輪廓與連接部108a的形成方法以及其輪廓相似，於此不再贅述。
至此，形成了異質整合組裝結構180b。之後，可以將再進行切割製程。異質整合組裝結構180b中的第二晶粒12b具有傾斜側壁S2。第二晶粒12b的主動面80a投影在基底50表面上的面積大於非主動面82a投影在基底50的表面上的面積。非主動面82a與側壁S2所夾的內角α為鈍角。黏著層116b不僅與晶粒的非主動面82a接觸，還與第二晶粒12b的側壁S2接觸。
第三實施例
請參照圖8A，提供具有平坦表面的基底100。在基底100上形成第二重佈線層102以及保護層105。
請參照圖8B，在基底100的第二重佈線層102之間的基底100上形成黏著層116c。黏著層116c可以是以液態狀的方式形成在基底100上。在一實施例中，液體狀的黏著層116c具有親水性（hydrophilic），第二重佈線層102具有疏水性（hydrophobic）。
請參照圖8B，以拾取與放置的方式將多個第三晶粒12c的非主動面82a朝向基底100，使第三晶粒12c安裝於基底的平坦面上。第三晶粒12c的非主動面82a與黏著層116c接觸，並且第三晶粒12c的側壁S3上的跡線66的末端66E1對準基底100上的第二重佈線層102的跡線106的末端106E。
請參照圖9A，在一實施例中，在進行安裝之前，黏著層116c為具有親水性的固體、膠體或是液體；第二重佈線層102為固體，且具有疏水性。
請參照圖9B，在黏著層116c上可以覆上親水性的液滴120a，例如是水滴。有些液滴120a覆蓋在第二重佈線層102上，如圖9B所示。
請參照圖9C，將第三晶粒12c安裝在基底100的黏著層116c上。若安裝時發生偏移，使得第三晶粒12c的偏移至第二重佈線層102上的液滴120a上。隨著時間的遞延，第三晶粒12c還是可以自行對準在第二重佈線層102之間的黏著層116c，而移動到第二重佈線層102之間，如圖9D所示。這是因為黏著層116c與第二重佈線層102具有不同的表面張力，隨著時間的遞延，覆蓋在第二重佈線層102上的部分的液滴120a會傾向與位於第二重佈線層102之間的另一部分的液滴120a聚集在一起，藉此，第三晶粒12c可以自行對準組裝在第二重佈線層102之間的黏著層116c上。之後，可以進行加熱製程，將液滴120a移除，使第三晶粒12c與黏著層116c接觸，而安裝在基底100上。
請參照圖8C與8D，將第三晶粒12c安裝在基底100上之後，在跡線66的末端66E1的表面與側壁上以及跡線106的末端106E的表面與側壁上形成連接部108c，以連接第一重佈線層62與第二重佈線層102。在一些實施例中，連接部108c還覆蓋第三晶粒12c的側壁S3上的跡線66的部分66p。形成連接部108c的方法的形成方法以及其輪廓與連接部108a的形成方法以及其輪廓相似，於此不再贅述。
至此，形成了異質整合組裝結構180c。之後，可以將再進行切割製程。
第四實施例
在第三實施例中，在進行安裝時，第三晶粒12c的非主動面82a朝向基底100。請參照圖10A與圖10B，在本實施例中，仍是以拾取與放置的方式將多個第三晶粒12c安裝於基底100之上。但是，在進行安裝時，第三晶粒12c的主動面80c朝向基底100，使第三晶粒12c的保護層70與黏著層116d接觸。在第三晶粒12c的側壁S3上的跡線66的部分66p與基底100上的跡線106對準。
請參照圖11A至11D，相似於第三實施例，在一實施例中，在進行安裝之前，黏著層116d可以是具有親水性的固體、膠體或是液體；第二重佈線層102為固體，且具有疏水性。在黏著層116d上覆上親水性的液滴120b，即使安裝第三晶粒12c時發生偏移，藉由表面張力不同的特性，第三晶粒12c藉由液滴120b移動，而自行對準組裝在第二重佈線層102之間的黏著層116d。之後，可以進行汽化製程，將液滴120b移除，使第三晶粒12c與黏著層116d接觸，而安裝在基底100上。
此外，在一些實施例中，為了提升第三晶粒12c與黏著層116d之間的黏著性，可以對第三晶粒12c的側壁S3上的第一重佈線層62以及鈍化層60進行表面處理，以增加其表面張力，使液滴120b不僅與第三晶粒12c的主動面80a接觸，而且還與第三晶粒12c的側壁S3上的第一重佈線層62以及鈍化層60接觸，如圖11D所示。表面處理例如是電漿清潔或者紫外線照射清潔。
之後，請參照圖10C與10D，將第三晶粒12c安裝在基底100上之後，在跡線66的部分66p的表面與側壁上以及跡線106的末端106E的表面與側壁上形成連接部108d，以連接第一重佈線層62與第二重佈線層102。在一些實施例中，連接部108d會延伸至保護層70邊緣，甚至與保護層70接觸。
至此，形成了異質整合組裝結構180d。之後，可以將再進行切割製程。
上述的第四晶粒12d與第五晶粒12e可以藉由黏著層安裝在具有凹槽的基底上，如上述第二實施例所述。
綜上所述，本發明可以藉由超低溫製程例如是電鍍或無電鍍的方式，可以在大氣環境下實現低溫接合。再者，本發明以採用晶圓級或面板級製程來進行多個晶粒的安裝。此外，利用液體狀的黏著層或是藉由液滴可以在安裝時具有自行對準組裝的功效。
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。
10a、10b、10c、10d、10e‧‧‧晶片 40a、40b、40c、40d、40e‧‧‧晶圓 12a‧‧‧第一晶粒 12b‧‧‧第二晶粒 12c‧‧‧第三晶粒 12d‧‧‧第四晶粒 12e‧‧‧第五晶粒 50、100‧‧‧基底 52‧‧‧元件層 54‧‧‧金屬化結構 56‧‧‧接墊 58‧‧‧切割道 60‧‧‧鈍化層 62‧‧‧第一重佈線層 64‧‧‧通孔 66‧‧‧第一跡線 66S‧‧‧主體部 66p‧‧‧部分 70、105‧‧‧保護層 72、74、76、78‧‧‧缺口 75‧‧‧突起物 102‧‧‧第二重佈線層 104‧‧‧凹槽 106‧‧‧跡線 120a、120b‧‧‧液滴 CA‧‧‧中心區 EA‧‧‧邊緣區 T1‧‧‧厚度 δ、σ‧‧‧底角 α、β‧‧‧內角 W11、W21、W31‧‧‧寬度 S41、S51‧‧‧第一側壁 S42、S52‧‧‧第二側壁 D1、D2、D3、D4‧‧‧深度 θ1、θ2、γ1、γ2‧‧‧夾角 St4、St5‧‧‧階梯狀的側壁 S1、S2、S3、S4、S5‧‧‧側壁 66E、66E1、66E2、106E‧‧‧末端 80a、80b、80c、80d‧‧‧主動面 82a、82b、82c、82d‧‧‧非主動面 108a、108b、108c、108d‧‧‧連接部 116a、116b、116c、116d‧‧‧黏著層 180a、180b、180c、180d‧‧‧異質整合組裝結構
圖1A至1C是依據本發明實例之第一晶粒的製造流程的剖面示意圖。 圖1D是圖1C的上視圖。 圖2A至2D是依據本發明實例之第二晶粒的製造流程的剖面示意圖。 圖2E是圖2D的上視圖。 圖3A至3D是依據本發明實例之第三晶粒的製造流程的剖面示意圖。 圖3E是圖3D的上視圖。 圖4A至4D是依據本發明實例之第四晶粒的製造流程的剖面示意圖。 圖4E是圖4D的上視圖。 圖5A至5D是依據本發明實例之第五晶粒的製造流程的剖面示意圖。 圖5E是圖5D的上視圖。 圖6A至6D是依據本發明第一實例之一種異質整合組裝結構的製造流程的剖面示意圖。 圖6E是圖6D的上視圖。 圖7A至7C是依據本發明第二實例之一種異質整合組裝結構的製造流程的剖面示意圖。 圖7D是圖7C的上視圖。 圖8A至8C是依據本發明第三實例之一種異質整合組裝結構的製造流程的剖面示意圖。 圖8D是圖8C的上視圖。 圖9A至9D是依據本發明實例之一種異質整合組裝結構的製造流程的剖面示意圖。 圖10A至10C是依據本發明第四實例之一種異質整合組裝結構的製造流程的剖面示意圖。 圖10D是圖10C的上視圖。 圖11A至11D是依據本發明實例之一種異質整合組裝結構的製造流程的剖面示意圖。 圖12是依據本發明實例之多個晶粒的剖面示意圖。
50‧‧‧基底
56‧‧‧接墊
12a‧‧‧第一晶粒
62‧‧‧第一重佈線層
64‧‧‧通孔
66‧‧‧第一跡線
66E1、66E2、106E‧‧‧末端
66S‧‧‧主體部
70、105‧‧‧保護層
80a‧‧‧主動面
82a‧‧‧非主動面
102‧‧‧第二重佈線層
106‧‧‧跡線
180a‧‧‧異質整合組裝結構
CA‧‧‧中心區
EA‧‧‧邊緣區
W11、W21、W31‧‧‧寬度

Claims (19)

  1. 一種異質整合組裝結構，包括：基底；晶粒，安裝於所述基底上，其中所述晶粒具有主動面與非主動面，所述主動面具有接墊；鈍化層，覆蓋所述晶粒的側壁與表面，裸露出所述接墊的表面；第一重佈線層，位於所述鈍化層上，電性連接所述接墊；第二重佈線層，位於所述基底上，與所述晶粒相鄰；以及連接部，連接所述第一重佈線層與所述第二重佈線層，其中所述連接部的寬度大於所述第一重佈線層的寬度，且大於所述第二重佈線層的寬度。
  2. 如申請專利範圍第1項所述之異質整合組裝結構，更包括黏著層，位於所述晶粒與所述基底之間。
  3. 如申請專利範圍第2項所述之異質整合組裝結構，其中所述晶粒的所述非主動面與所述黏著層接觸。
  4. 如申請專利範圍第2項所述之異質整合組裝結構，其中所述晶粒的側壁與所述黏著層接觸。
  5. 如申請專利範圍第3項所述之異質整合組裝結構，其中所述晶粒的所述主動面比所述非主動面接近所述黏著層。
  6. 如申請專利範圍第2項所述之異質整合組裝結構，其中所述黏著層具有親水性。
  7. 如申請專利範圍第1項所述之異質整合組裝結構，其中所述基底具有凹槽，所述晶粒安裝於所述凹槽中。
  8. 如申請專利範圍第7項所述之異質整合組裝結構，其中所述晶粒的所述主動面的面積大於或等於所述非主動面的面積。
  9. 如申請專利範圍第1項所述之異質整合組裝結構，其中所述晶粒的所述主動面的面積小於所述非主動面的面積。
  10. 如申請專利範圍第1項所述之異質整合組裝結構，其中所述晶粒的具有垂直側壁、傾斜側壁、階梯側壁、弧形側壁或其組合。
  11. 一種異質整合組裝結構的製造方法，包括：提供晶圓，所述晶圓包括多個晶粒，其中每一所述晶粒具有主動面與非主動面，所述主動面具有接墊；在所述晶粒之間形成缺口，所述缺口裸露出所述晶粒的第一側壁；在所述晶圓上形成鈍化層，覆蓋所述晶粒的表面，裸露出所述接墊的表面；於所述鈍化層上形成第一重佈線層，電性連接所述接墊；進行切割製程，使所述晶圓上的所述晶粒彼此分離；將所述晶粒安裝於基底上，所述基底上具有第二重佈線層；以及形成連接部，連接所述第一重佈線層與所述第二重佈線層。
  12. 如申請專利範圍第11項所述的異質整合組裝結構的製造方法，其中所述形成連接部的方法包括：在所述所述鈍化層與所述第一重佈線層上形成第一保護層，裸露出所述第一重佈線層的第一末端；在所述基底與所述第二重佈線層上形成第二保護層，裸露出所述第二重佈線層的第二末端；以及以電鍍法或無電鍍法形成所述連接部。
  13. 如申請專利範圍第11項所述的異質整合組裝結構的製造方法，其中所述在所述晶粒之間形成所述多個缺口包括：在所述晶圓上形成所述鈍化層之前，從所述晶粒的所述主動面向所述非主動面進行預切所述晶圓製程，或是進行微影製程與蝕刻製程，且其中所述鈍化層更覆蓋所述晶圓的所述第一側壁。
  14. 如申請專利範圍第13項所述的異質整合組裝結構的製造方法，其中所述在所述晶粒之間形成所述多個缺口包括：在所述晶圓上形成所述鈍化層之後，從所述晶粒的所述非主動面向所述主動面進行預切所述晶圓製程。
  15. 如申請專利範圍第11項所述的異質整合組裝結構的製造方法，其中所述將所述晶粒安裝於所述基底上是藉由形成在所述基底上的黏著層。
  16. 如申請專利範圍第15項所述的異質整合組裝結構的製造方法，其中所述將所述晶粒安裝於所述基底上是藉由形成在所述基底上的所述黏著層以及所述黏著層上的液滴。
  17. 如申請專利範圍第15項所述之異質整合組裝結構的製造方法，其中所述晶粒的所述主動面比所述非主動面接近所述黏著層。
  18. 如申請專利範圍第15項所述之異質整合組裝結構的製造方法，其中所述晶粒的所述非主動面比所述主動面接近所述黏著層接觸。
  19. 如申請專利範圍第15項所述的異質整合組裝結構的製造方法，其中所述基底包括凹槽，且所述晶粒安裝於所述基底的所述凹槽中，且所述黏著層位於所述凹槽中。
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