TWI701346B - 經塗佈的彈性組分 - Google Patents

經塗佈的彈性組分 Download PDF

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Publication number
TWI701346B
TWI701346B TW105133024A TW105133024A TWI701346B TW I701346 B TWI701346 B TW I701346B TW 105133024 A TW105133024 A TW 105133024A TW 105133024 A TW105133024 A TW 105133024A TW I701346 B TWI701346 B TW I701346B
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TW
Taiwan
Prior art keywords
coating
coated
elastic component
item
refractory metal
Prior art date
Application number
TW105133024A
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English (en)
Chinese (zh)
Other versions
TW201728766A (zh
Inventor
哈拉德 胡斯頓堡爾
Original Assignee
奧地利商攀時歐洲公司
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Publication date
Application filed by 奧地利商攀時歐洲公司 filed Critical 奧地利商攀時歐洲公司
Publication of TW201728766A publication Critical patent/TW201728766A/zh
Application granted granted Critical
Publication of TWI701346B publication Critical patent/TWI701346B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/82—Electrodes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/81—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Physical Vapour Deposition (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Photovoltaic Devices (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
TW105133024A 2015-11-27 2016-10-13 經塗佈的彈性組分 TWI701346B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATGM350/2015U AT15048U1 (de) 2015-11-27 2015-11-27 Beschichtetes flexibles Bauteil
ATGM350/2015 2015-11-27

Publications (2)

Publication Number Publication Date
TW201728766A TW201728766A (zh) 2017-08-16
TWI701346B true TWI701346B (zh) 2020-08-11

Family

ID=57227195

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105133024A TWI701346B (zh) 2015-11-27 2016-10-13 經塗佈的彈性組分

Country Status (6)

Country Link
JP (1) JP6908223B2 (https=)
KR (1) KR102578294B1 (https=)
CN (1) CN108292667B (https=)
AT (1) AT15048U1 (https=)
TW (1) TWI701346B (https=)
WO (1) WO2017087998A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT15574U3 (de) 2017-05-11 2018-05-15 Plansee Se Flexibles Bauteil mit Schichtaufbau mit metallischer Lage
JP7598888B2 (ja) 2019-06-26 2024-12-12 アプライド マテリアルズ インコーポレイテッド 折り畳み式ディスプレイ用の可撓性多層カバーレンズ積層体
US11550364B2 (en) * 2019-11-01 2023-01-10 Motorola Mobility Llc Flexible display with preformed curvilinear foldable substrate and corresponding electronic devices and methods
CN116855888B (zh) * 2023-07-25 2025-10-14 北京师范大学 一种柔性高熵合金涂层及其制备方法和应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1293969A1 (en) * 2001-09-14 2003-03-19 Fuji Photo Film Co., Ltd. Magnetic recording medium

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4228405B2 (ja) * 1998-01-22 2009-02-25 東洋紡績株式会社 金属薄膜積層フィルムおよび該フィルムを用いたフレキシブルプリント配線板
JP4197206B2 (ja) * 1998-12-25 2008-12-17 シャープ株式会社 積層金属配線及び薄膜トランジスタ基板、並びにそれらの製造方法
JP2001174613A (ja) * 1999-12-21 2001-06-29 Mitsui Chemicals Inc 反射部材
JP2003099917A (ja) * 2001-09-21 2003-04-04 Fuji Photo Film Co Ltd 磁気記録媒体
EP1813439B1 (en) * 2006-01-27 2013-01-09 European Central Bank Electronic security means for security documents using a thermoelectric power generator
AT11941U1 (de) 2010-02-12 2011-07-15 Plansee Metall Gmbh Berührungssensoranordnung
KR20130082234A (ko) * 2012-01-11 2013-07-19 도레이첨단소재 주식회사 자성체를 포함하는 플렉시블 기판 및 이를 사용한 플렉시블 디스플레이의 제조방법
JP5685558B2 (ja) * 2012-04-19 2015-03-18 株式会社東芝 表示装置
US9121100B2 (en) 2012-12-14 2015-09-01 Intermolecular, Inc. Silver based conductive layer for flexible electronics
US9299472B2 (en) * 2013-06-06 2016-03-29 H.C. Starck Inc. Copper-alloy barrier layers for metallization in thin-film transistors and flat panel displays
US20150014663A1 (en) * 2013-07-11 2015-01-15 Korea Institute Of Science And Technology Organic light emitting display apparatus and the method for manufacturing the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1293969A1 (en) * 2001-09-14 2003-03-19 Fuji Photo Film Co., Ltd. Magnetic recording medium

Also Published As

Publication number Publication date
KR102578294B1 (ko) 2023-09-13
CN108292667A (zh) 2018-07-17
AT15048U1 (de) 2016-11-15
JP2018538571A (ja) 2018-12-27
JP6908223B2 (ja) 2021-07-21
WO2017087998A1 (de) 2017-06-01
CN108292667B (zh) 2022-06-14
TW201728766A (zh) 2017-08-16
KR20180087267A (ko) 2018-08-01

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