KR102578294B1 - 코팅된 연성 부품 - Google Patents

코팅된 연성 부품 Download PDF

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Publication number
KR102578294B1
KR102578294B1 KR1020187014865A KR20187014865A KR102578294B1 KR 102578294 B1 KR102578294 B1 KR 102578294B1 KR 1020187014865 A KR1020187014865 A KR 1020187014865A KR 20187014865 A KR20187014865 A KR 20187014865A KR 102578294 B1 KR102578294 B1 KR 102578294B1
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South Korea
Prior art keywords
coating
flexible
electronic component
coated
molybdenum
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English (en)
Korean (ko)
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KR20180087267A (ko
Inventor
하랄트 쾨슈텐바우어
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플란제 에스이
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/82—Electrodes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/81—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Physical Vapour Deposition (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Photovoltaic Devices (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
KR1020187014865A 2015-11-27 2016-10-24 코팅된 연성 부품 Active KR102578294B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM350/2015U AT15048U1 (de) 2015-11-27 2015-11-27 Beschichtetes flexibles Bauteil
ATGM350/2015 2015-11-27
PCT/AT2016/000094 WO2017087998A1 (de) 2015-11-27 2016-10-24 Beschichtetes flexibles bauteil

Publications (2)

Publication Number Publication Date
KR20180087267A KR20180087267A (ko) 2018-08-01
KR102578294B1 true KR102578294B1 (ko) 2023-09-13

Family

ID=57227195

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187014865A Active KR102578294B1 (ko) 2015-11-27 2016-10-24 코팅된 연성 부품

Country Status (6)

Country Link
JP (1) JP6908223B2 (https=)
KR (1) KR102578294B1 (https=)
CN (1) CN108292667B (https=)
AT (1) AT15048U1 (https=)
TW (1) TWI701346B (https=)
WO (1) WO2017087998A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT15574U3 (de) 2017-05-11 2018-05-15 Plansee Se Flexibles Bauteil mit Schichtaufbau mit metallischer Lage
JP7598888B2 (ja) 2019-06-26 2024-12-12 アプライド マテリアルズ インコーポレイテッド 折り畳み式ディスプレイ用の可撓性多層カバーレンズ積層体
US11550364B2 (en) * 2019-11-01 2023-01-10 Motorola Mobility Llc Flexible display with preformed curvilinear foldable substrate and corresponding electronic devices and methods
CN116855888B (zh) * 2023-07-25 2025-10-14 北京师范大学 一种柔性高熵合金涂层及其制备方法和应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001174613A (ja) * 1999-12-21 2001-06-29 Mitsui Chemicals Inc 反射部材

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4228405B2 (ja) * 1998-01-22 2009-02-25 東洋紡績株式会社 金属薄膜積層フィルムおよび該フィルムを用いたフレキシブルプリント配線板
JP4197206B2 (ja) * 1998-12-25 2008-12-17 シャープ株式会社 積層金属配線及び薄膜トランジスタ基板、並びにそれらの製造方法
US20030134151A1 (en) * 2001-09-14 2003-07-17 Fuji Photo Film Co., Ltd. Magnetic recording medium
JP2003099917A (ja) * 2001-09-21 2003-04-04 Fuji Photo Film Co Ltd 磁気記録媒体
EP1813439B1 (en) * 2006-01-27 2013-01-09 European Central Bank Electronic security means for security documents using a thermoelectric power generator
AT11941U1 (de) 2010-02-12 2011-07-15 Plansee Metall Gmbh Berührungssensoranordnung
KR20130082234A (ko) * 2012-01-11 2013-07-19 도레이첨단소재 주식회사 자성체를 포함하는 플렉시블 기판 및 이를 사용한 플렉시블 디스플레이의 제조방법
JP5685558B2 (ja) * 2012-04-19 2015-03-18 株式会社東芝 表示装置
US9121100B2 (en) 2012-12-14 2015-09-01 Intermolecular, Inc. Silver based conductive layer for flexible electronics
US9299472B2 (en) * 2013-06-06 2016-03-29 H.C. Starck Inc. Copper-alloy barrier layers for metallization in thin-film transistors and flat panel displays
US20150014663A1 (en) * 2013-07-11 2015-01-15 Korea Institute Of Science And Technology Organic light emitting display apparatus and the method for manufacturing the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001174613A (ja) * 1999-12-21 2001-06-29 Mitsui Chemicals Inc 反射部材

Also Published As

Publication number Publication date
CN108292667A (zh) 2018-07-17
AT15048U1 (de) 2016-11-15
JP2018538571A (ja) 2018-12-27
JP6908223B2 (ja) 2021-07-21
WO2017087998A1 (de) 2017-06-01
CN108292667B (zh) 2022-06-14
TWI701346B (zh) 2020-08-11
TW201728766A (zh) 2017-08-16
KR20180087267A (ko) 2018-08-01

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