TWI700553B - 硬化性組成物、硬化膜及顯示裝置 - Google Patents
硬化性組成物、硬化膜及顯示裝置 Download PDFInfo
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- TWI700553B TWI700553B TW108106809A TW108106809A TWI700553B TW I700553 B TWI700553 B TW I700553B TW 108106809 A TW108106809 A TW 108106809A TW 108106809 A TW108106809 A TW 108106809A TW I700553 B TWI700553 B TW I700553B
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Abstract
以光微影法,由以往的硬化性組成物形成硬化圖案時,有顯像後的硬化圖案之殘膜率偏低的問題。殘膜率係指下式(z)所表示之值。
殘膜率(%)=Td/Te×100 (z)[式(z)中,Td是表示硬化圖案之膜厚,Te是表示光照射後的組成物層之膜厚]
本發明係關於一種含有量子點、聚合起始劑及聚合性化合物的硬化性組成物,其中,聚合起始劑含有選自肟化合物、醯基膦化合物、三
Description
本發明係有關含有量子點之硬化性組成物及顯示裝置。
專利文獻1中記載有由半導體超微粒(量子點)、溶劑及可聚合的單體所形成之硬化性組成物。
[專利文獻1]日本特開平10-186426號公報
由專利文獻1所述之硬化性組成物,以光微影法形成硬化圖案時,有顯像後的硬化圖案之殘膜率偏低的問題。此處,硬化圖案係指在基板的一部份形成硬化膜者。又,殘膜率係指下式(z)所表示之值。
殘膜率(%)=Td/Te×100 (z)[式(z)中,Td係表示硬化圖案之膜厚,Te係表示光照射後 的組成物層之膜厚]
本發明,係包含以下的發明。
[3]如[1]或[2]項所述之硬化性組成物,其中,聚合起始劑含有肟化合物。
[4]如[1]至[3]項中任何一項所述之硬化性組成物,其中,量子點含有選自12族元素與16族元素之化合物、13族元素與15族元素之化合物、及14族元素與16族元素之化合物所形成之群組中的至少一種。
[5]如[1]至[4]項中任何一項所述之硬化性組成物,其係更含有樹脂。
[6]一種硬化膜,其係由[1]至[5]項中任何一項所述之硬化性組成物形成者。
[7]一種顯示裝置,其係含有[6]項所述之硬化膜。
若藉由本發明的硬化性組成物,顯像時可以高殘膜率獲得硬化圖案,並且使該硬化圖案發光時的量子 產率優異。
本發明的硬化性組成物,係包含量子點(A)、聚合性化合物(B)及聚合起始劑(C)。
量子點係粒徑1nm至100nm左右的半導體微粒,且為利用半導體帶隙(band gap)吸收紫外光或可見光而發光之微粒。
就量子點而言,以化學式可分別舉出:CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、HgS、HgSe、HgTe、CdHgTe、CdSeS、CdSeTe、CdSTe、ZnSeS、ZnSeTe、ZnSTe、HgSeS、HgSeTe、HgSTe、CdZnS、CdZnSe、CdZnTe、CdHgS、CdHgSe、CdHgTe、HgZnS、HgZnSe、HgZnTe、CdZnSeS、CdZnSeTe、CdZnSTe、CdHgSeS、CdHgSeTe、CdHgSTe、HgZnSeS、HgZnSeTe及HgZnSTe等12族元素與16族元素之化合物;GaN、GaP、GaAs、AlN、AlP、AlAs、InN、InP、InAs、GaNP、GaNAs、GaPAs、AlNP、AlNAs、AlPAs、InNP、InNAs、InPAs、GaAlNP、GaAlNAs、GaAlPAs、GaInNP、GaInNAs、GaInPAs、InAlNP、InAlNAs及InAlPAs等13族元素與15族元素之化合物;PdS及PbSe等14族元素與16族元素之化合物等。
量子點含有S(硫原子)或Se(硒原子)時,也可使用經金 屬氧化物或有機物表面修飾的量子點。藉由使用已表面修飾的量子點,可防止因形成有機層的材料中之反應成份所致之S或Se被抽出。
又,量子點也可組合上述的化合物而形成核殼結構。就此種組合而言,可舉出核為CdSe(硒化鎘)、殼為ZnS(硫化鋅)的微粒等。
量子點的能量狀態取決於其大小,故可藉由改變粒徑而自由地選擇發光波長。例如,在僅由CdSe構成的量子點時,粒徑為2.3nm、3.0nm、3.8nm、4.6nm時的螢光光譜之波峰波長,分別是528nm、570nm、592nm、637nm。又,自量子點發出之光,光譜幅度狹窄,藉由將具有此種陡峭的波峰之光組合,擴大顯示裝置可顯示之色域。並且,量子點的響應性高,可有效利用自光源發射的光。
本發明的硬化性組成物,可僅含有藉由自光源發射的光而發出特定波長之光的量子點,也可組合並含有2種以上發出不同波長的光之量子點。前述特定波長的光,可列舉:例如紅色光、綠色光及藍色光。
相對於固形份,量子點(A)的含有率,係以1至50質量%為佳,並以5至40質量%更佳。本說明書所稱之固形份,係指將後述的溶劑(E)及其他的溶劑除外之硬化性組成物成份之合計。組成物中的固形份之含有率,可用液體層析或氣體層析等已知的分析方式測定。
聚合性化合物(B),係可藉由後述的聚合起始劑(C)所產生之活性自由基、酸等而聚合的化合物。此種化合物,可列舉:例如具有乙烯性不飽和鍵的化合物等,並以(甲基)丙烯酸酯化合物為佳。
又,本說明書中,「(甲基)丙烯酸」係表示選自丙烯酸及甲基丙烯酸所形成之群組中的至少1種。「(甲基)丙烯醯基」及「(甲基)丙烯酸酯」等標記,也具有相同的意義。
其中,聚合性化合物(B)係以具有3個以上乙烯性不飽和鍵的聚合性化合物為佳。此種聚合性化合物,可列舉:例如三羥甲基丙烷三(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯、三新戊四醇八(甲基)丙烯酸酯、三新戊四醇七(甲基)丙烯酸酯、四新戊四醇十(甲基)丙烯酸酯、四新戊四醇九(甲基)丙烯酸酯、參(2-(甲基)丙醯基氧基乙基)異三聚氰酸酯、乙二醇改質新戊四醇四(甲基)丙烯酸酯、乙二醇改質二新戊四醇六(甲基)丙烯酸酯、丙二醇改質新戊四醇四(甲基)丙烯酸酯、丙二醇改質二新戊四醇六(甲基)丙烯酸酯、己內酯改質新戊四醇四(甲基)丙烯酸酯、己內酯改質二新戊四醇六(甲基)丙烯酸酯等。
聚合性化合物(B)的重量平均分子量,係以150至2,900為佳,並以250至1,500更佳。
相對於固形份,聚合性化合物(B)的含有率, 係以7至65質量%為佳,並以13至60質量%更佳,而以17至55質量%又更佳。聚合性化合物(B)的含有率為前述的範圍內時,有硬化圖案的殘膜率及硬化圖案的耐藥品性更為提高之傾向。
聚合起始劑(C)係藉由光或熱的作用產生活性自由基、酸等而可開始聚合反應的化合物,含有選自肟化合物、聯咪唑化合物、三化合物及醯基膦化合物所形成之群組中的至少一種。其中,以含有肟化合物為佳。使用此等聚合起始劑時,硬化圖案的殘膜率變高。
前述肟化合物,係以O-醯基肟化合物為佳,且係具有式(d1)所表示之部份結構的化合物。以下,*是表示鍵結鍵。
前述肟化合物,可列舉:例如N-苯甲醯基氧基-1-(4-苯基硫基苯基)丁烷-1-酮-2-亞胺、N-苯甲醯基氧基 -1-(4-苯基硫基苯基)辛烷-1-酮-2-亞胺、N-苯甲醯基氧基-1-(4-苯基硫基苯基)-3-環戊基丙烷-1-酮-2-亞胺、N-乙醯氧基-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]乙烷-1-亞胺、N-乙醯氧基-1-[9-乙基-6-{2-甲基-4-(3,3-二甲基-2,4-二氧雜環戊基甲基氧基)苯甲醯基}-9H-咔唑-3-基]乙烷-1-亞胺、N-乙醯氧基-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基1-3-環戊基丙烷-1-亞胺、N-苯甲醯基氧基-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]-3-環戊基丙烷-1-酮-2-亞胺;日本特開2011-132215號公報、國際公開2008/78678號、國際公開2008/78686號、國際公開2012/132558號所述之化合物等。也可使用Irgacure OXE01、OXE02(以上,BASF公司製)、N-1919(ADEKA公司製)等市售品。
其中,肟化合物係以選自N-苯甲醯基氧基-1-(4-苯基硫基苯基)丁烷-1-酮-2-亞胺、N-苯甲醯基氧基-1-(4-苯基硫基苯基)辛烷-1-酮-2-亞胺、N-苯甲醯基氧基-1-(4-苯基硫基苯基)-3-環戊基丙烷-1-酮-2-亞胺及N-乙醯氧基-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]乙烷-1-亞胺所形成之群組中的至少一種為佳,並以N-苯甲醯基氧基-1-(4-苯基硫基苯基)辛烷-1-酮-2-亞胺及/或N-乙醯氧基-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]乙烷-1-亞胺更佳。
前述聯咪唑化合物,係例如式(d5)所表示的化合物。
碳數6至10之芳基,可列舉:例如苯基、甲苯基、二甲苯基、乙基苯基及萘基等,並以苯基為佳。
取代基,可列舉:例如鹵素原子、碳數1至4的烷氧基等。鹵素原子,可列舉:例如氟原子、氯原子、溴原子、碘原子等,並以氯原子為佳。碳數1至4的烷氧基,可列舉:例如甲氧基、乙氧基、丙氧基、丁氧基等,並以甲氧基為佳。
前述聯咪唑化合物,可列舉:例如2,2'-雙(2-氯苯基)-4,4',5,5'-四苯基聯咪唑、2,2'-雙(2-氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑、2,2'-雙(2,3-二氯苯基)-4,4',5,5'-四苯基聯咪唑、2,2'-雙(2-氯苯基)-4,4',5,5'-四苯基聯咪唑、2,2'-雙(2-氯苯基)-4,4',5,5'-四(烷氧基苯基)聯咪唑、2,2'-雙(2-氯苯基)-4,4',5,5'-四(二烷氧基苯基)聯咪唑、2,2'-雙(2-氯苯基)-4,4',5,5'-四(三烷氧基苯基)聯咪唑、4,4',5,5'-位之苯基經烷氧羰基取代的咪唑化合物等。此等化合物,係記載於例如日本特開平06-75372號公報、日本特開平06-75373號公報、日本特公昭48-38403號公報、日本特開昭62-174204號公報、日本特開平7-10913號公報等。其中,以下述式所表示的化合物或此等之混合物為佳。
前述三化合物,可列舉:例如2,4-雙(三氯甲基)-6-(4-甲氧基苯基)-1,3,5-三、2,4-雙(三氯甲基)-6-(4-甲氧基萘基)-1,3,5-三、2,4-雙(三氯甲基)-6-胡椒基-1,3,5-三、2,4-雙(三氯甲基)-6-(4-甲氧基苯乙烯基)-1,3,5-三、2,4-雙(三氯甲基)-6-[2-(5-甲基呋喃-2-基)乙烯基]-1,3,5-三、2,4-雙(三氯甲基)-6-[2-(呋喃-2-基)乙烯基]-1,3,5-三、2,4-雙(三氯甲基)-6-[2-(4-二乙基胺基-2-甲基苯基)乙烯基]-1,3,5-三、2,4-雙(三氯甲基)-6-[2-(3,4-二甲氧基苯基)乙烯基]-1,3,5-三等。其中,以2,4-雙(三氯甲基)-6-胡椒基-1,3,5-三為佳。
前述醯基膦化合物,可舉出雙(2,4,6-三甲基苯甲醯基)-苯基膦氧化物、(2,4,6-三甲基苯甲醯基)二苯基膦氧化物等。
2個以上的聚合起始劑之組合,可以是將結構不同的同種化合物組合,也可以是將不同種的化合物組合。將同種的化合物組合時,係以肟化合物彼此之間的組 合為佳,並以O-醯基肟化合物且具有式(d1)所表示的部份結構之化合物彼此之間的組合更佳。此種組合之例,可舉出N-苯甲醯基氧基-1-(4-苯基硫基苯基)辛烷-1-酮-2-亞胺及N-乙醯氧基-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]乙烷-1-亞胺之組合。此時,N-苯甲醯基氧基-1-(4-苯基硫基苯基)辛烷-1-酮-2-亞胺及N-乙醯氧基-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]乙烷-1-亞胺之調配比,係以10:90至90:10為佳,並以30:70至70:30更佳,而以30:70至50:50又更佳。
就已知的聚合起始劑而言,可舉出安息香、安息香甲醚、安息香乙醚、安息香異丙醚及安息香異丁醚等安息香化合物;二苯甲酮、鄰-苯甲醯基苯甲酸甲酯、4-苯基二苯甲酮、4-苯甲醯基-4’-甲基二苯基硫化物、3,3’,4,4’-四(第三丁基過氧羰基)二苯甲酮、2,4,6-三甲基二苯甲酮及4,4’-雙(二乙基胺基)二苯甲酮等二苯甲酮化合物;9,10-菲醌、2-乙基蒽醌及莰醌等醌化合物;10-丁基-2-氯吖啶酮、二苯乙二酮(benzil)、苯基乙醛酸甲酯、二茂鈦化合物等。
相對於聚合性化合物(B)100質量份,聚合起始劑(C)的含量係以0.1至300質量份為佳,並以0.1至200 質量份更佳。硬化性組成物含有後述的樹脂(D)時,相對於後述的樹脂(D)及聚合性化合物(B)之合計量100質量份,聚合起始劑(C)的含量係以0.1至30質量份為佳,並以1至20質量份更佳。聚合起始劑(C)的含量為前述的範圍內時,因有高感度化而縮短曝光時間之傾向,故硬化膜的生產性提高。
可視需要而一併使用聚合起始助劑(C1)。聚合起始助劑(C1),係用以促進藉由聚合起始劑而開始聚合的聚合性化合物的聚合之化合物,或增感劑。含有聚合起始助劑(C1)時,通常係與聚合起始劑組合使用。就聚合起始助劑(C1)而言,可舉出胺化合物、烷氧基蒽化合物、噻噸酮(thioxanthone)化合物及羧酸化合物等。
就前述胺化合物而言,可舉出三乙醇胺、甲基二乙醇胺、三異丙醇胺、4-二甲基胺基苯甲酸甲酯、4-二甲基胺基苯甲酸乙酯、4-二甲基胺基苯甲酸異戊酯、苯甲酸2-二甲基胺基乙酯、4-二甲基胺基苯甲酸2-乙基己酯、N,N-二甲基對甲苯胺、4,4'-雙(二甲基胺基)二苯甲酮(通稱米其勒酮(Michler's ketone))、4,4'-雙(二乙基胺基)二苯甲酮、4,4'-雙(乙基甲基胺基)二苯甲酮等,其中以4,4'-雙(二乙基胺基)二苯甲酮為佳。也可使用EAB-F(保土谷化學工業(股)製)等市售品。
就前述烷氧基蒽化合物而言,可舉出9,10-二 甲氧基蒽、2-乙基-9,10-二甲氧基蒽、9,10-二乙氧基蒽、2-乙基-9,10-二乙氧基蒽、9,10-二丁氧基蒽、2-乙基-9,10-二丁氧基蒽等。
就前述噻噸酮化合物而言,可舉出2-異丙基噻噸酮、4-異丙基噻噸酮、2,4-二乙基噻噸酮、2,4-二氯噻噸酮、1-氯-4-丙氧基噻噸酮等。
就前述羧酸化合物而言,可舉出苯基硫基乙酸、甲基苯基硫基乙酸、乙基苯基硫基乙酸、甲基乙基苯基硫基乙酸、二甲基苯基硫基乙酸、甲氧基苯基硫基乙酸、二甲氧基苯基硫基乙酸、氯苯基硫基乙酸、二氯苯基硫基乙酸、N-苯基甘胺酸、苯氧基乙酸、萘基硫代乙酸、N-萘基甘胺酸、萘氧基乙酸等。
含有聚合起始助劑(C1)時,相對於聚合性化合物(B)100質量份,聚合起始助劑(C1)的含量係以0.1至300質量份為佳,並以0.1至200質量份更佳。硬化性組成物含有後述的樹脂(D)時,相對於樹脂(D)及聚合性化合物(B)之合計量100質量份,聚合起始助劑(C1)的含量係以0.1至30質量份為佳,並以1至20質量份更佳。聚合起始助劑(C1)的含量為此範圍內時,有可以更高感度形成硬化膜之傾向。
本發明的硬化性組成物,在上述成分之外,以含有樹脂(D)、溶劑(E)及/或調平劑(F)為佳。
樹脂(D)係以鹼可溶性樹脂為佳。就樹脂(D)而言,可 列舉:例如以下的樹脂[K1]至[K4]。
樹脂[K1]:選自不飽和羧酸及不飽和羧酸酐所形成之群組中的至少1種(a)(以下亦稱為「(a)」)、與可和(a)共聚合的單體(c)(但,與(a)不同。以下亦稱為「(c)」)共聚合而成之樹脂、樹脂[K2]:在(a)與(c)之共聚合物中使具有碳數2至4的環狀醚結構與乙烯性不飽和鍵之單體(b)(以下亦稱為「(b)」)反應而成之樹脂、樹脂[K3]:在(b)與(c)之共聚合物中使(a)反應而成之樹脂、樹脂[K4]:在(b)與(c)之共聚合物中使(a)反應,再使羧酸酐反應而成之樹脂。
就(a)而言,可列舉:例如丙烯酸、甲基丙烯酸、巴豆酸、鄰-、間-、對-乙烯基苯甲酸等不飽和單羧酸類;順丁烯二酸、反丁烯二酸、檸康酸、中康酸、衣康酸、3-乙烯基鄰苯二甲酸、4-乙烯基鄰苯二甲酸、3,4,5,6-四氫鄰苯二甲酸、1,2,3,6-四氫鄰苯二甲酸、二甲基四氫鄰苯二甲酸、1,4-環己烯二羧酸等不飽和二羧酸類;甲基-5-降冰片烯-2,3-二羧酸、5-羧基雙環[2.2.1]庚-2-烯、5,6-二羧基雙環[2.2.1]庚-2-烯、5-羧基-5-甲基雙環[2.2.1]庚-2-烯、5-羧基-5-乙基雙環[2.2.1]庚-2-烯、5-羧基-6-甲基雙環[2.2.1]庚-2-烯、5-羧基-6-乙基雙環[2.2.1]庚-2-烯等含有羧基的雙環不飽和化合物類; 順丁烯二酸酐、檸康酸酐、衣康酸酐、3-乙烯基鄰苯二甲酸酐、4-乙烯基鄰苯二甲酸酐、3,4,5,6-四氫鄰苯二甲酸酐、1,2,3,6-四氫鄰苯二甲酸酐、二甲基四氫鄰苯二甲酸酐、5,6-二羧基雙環[2.2.1]庚-2-烯酐等不飽和二羧酸酐類;琥珀酸單[2-(甲基)丙烯醯基氧基乙基]酯、鄰苯二甲酸單[2-(甲基)丙烯醯基氧基乙基]酯等2元以上的多元羧酸之不飽和單[(甲基)丙烯醯氧基烷基]酯類;如α-(羥基甲基)丙烯酸之在同一分子中含有羥基及羧基的不飽和丙烯酸酯類等。
此等之中,就共聚合反應性之觀點或獲得的樹脂對鹼水溶液之溶解性之觀點而言,係以丙烯酸、甲基丙烯酸、順丁烯二酸酐等為佳。
就(b)而言,例如具有碳數2至4的環狀醚結構(例如選自環氧乙烷環、氧雜環丁烷環及四氫呋喃環所形成群組中的至少1種)與乙烯性不飽和鍵之單體。(b)係以具有碳數2至4的環狀醚結構與(甲基)丙烯醯基氧基的單體為佳。
就(b)而言,可舉出(甲基)丙烯酸環氧丙酯、(甲基)丙烯酸β-甲基環氧丙酯、(甲基)丙烯酸β-乙基環氧丙酯、環氧丙基乙烯基醚、鄰-乙烯基苯甲基環氧丙醚、間-乙烯基苯甲基環氧丙醚、對-乙烯基苯甲基環氧丙醚、α-甲基-鄰-乙烯基苯甲基環氧丙醚、α-甲基-間-乙烯基苯甲基環氧丙醚、α-甲基-對-乙烯基苯甲基環氧丙醚、2,3-雙(環氧丙氧基甲基)苯乙烯、2,4-雙(環氧丙氧基甲基)苯乙 烯、2,5-雙(環氧丙氧基甲基)苯乙烯、2,6-雙(環氧丙氧基甲基)苯乙烯、2,3,4-參(環氧丙氧基甲基)苯乙烯、2,3,5-參(環氧丙氧基甲基)苯乙烯、2,3,6-參(環氧丙氧基甲基)苯乙烯、3,4,5-參(環氧丙氧基甲基)苯乙烯、2,4,6-參(環氧丙氧基甲基)苯乙烯等具有環氧乙烷環與乙烯性不飽和鍵之單體;3-甲基-3-甲基丙烯醯基氧基甲基氧雜環丁烷、3-甲基-3-丙烯醯基氧基甲基氧雜環丁烷、3-乙基-3-甲基丙烯醯基氧基甲基氧雜環丁烷、3-乙基-3-丙烯醯基氧基甲基氧雜環丁烷、3-甲基-3-甲基丙烯醯基氧基乙基氧雜環丁烷、3-甲基-3-丙烯醯基氧基乙基氧雜環丁烷、3-乙基-3-甲基丙烯醯基氧基乙基氧雜環丁烷、3-乙基-3-丙烯醯基氧基乙基氧雜環丁烷等具有氧雜環丁烷環與乙烯性不飽和鍵之單體;丙烯酸四氫呋喃甲酯(例如,VISCOAT V # 150,大阪有機化學工業(股)製)、甲基丙烯酸四氫呋喃甲酯等具有四氫呋喃環與乙烯性不飽和鍵之單體。
由(b)在製造樹脂[K2]至[K4]時之反應性高,且不易殘留未反應的(b)來看,(b)係以具有環氧乙烷環與乙烯性不飽和鍵之單體為佳。
就(c)而言,可列舉:例如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸十二烷酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸2-甲基環己酯、(甲基)丙烯酸三環 [5.2.1.02,6]癸烷-8-基酯(該技術領域的常用名:(甲基)丙烯酸二環戊烷酯或(甲基)丙烯酸三環癸酯)、(甲基)丙烯酸三環[5.2.1.02,6]癸烯-8-基酯(該技術領域的常用名:(甲基)丙烯酸二環戊烯酯)、(甲基)丙烯酸二環戊烷基氧基乙酯、(甲基)丙烯酸異冰片酯、(甲基)丙烯酸金剛烷酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸炔丙酯、(甲基)丙烯酸苯酯、(甲基)丙烯酸萘酯、(甲基)丙烯酸苯甲酯等(甲基)丙烯酸酯類;(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯等含有羥基的(甲基)丙烯酸酯類;順丁烯二酸二乙酯、反丁烯二酸二乙酯、衣康酸二乙酯等二羧酸二酯;雙環[2.2.1]庚-2-烯、5-甲基雙環[2.2.1]庚-2-烯、5-乙基雙環[2.2.1]庚-2-烯、5-羥基雙環[2.2.1]庚-2-烯、5-羥基甲基雙環[2.2.1]庚-2-烯、5-(2'-羥基乙基)雙環[2.2.1]庚-2-烯、5-甲氧基雙環[2.2.1]庚-2-烯、5-乙氧基雙環[2.2.1]庚-2-烯、5,6-二羥基雙環[2.2.1]庚-2-烯、5,6-二(羥基甲基)雙環[2.2.1]庚-2-烯、5,6-二(2'-羥基乙基)雙環[2.2.1]庚-2-烯、5,6-二甲氧基雙環[2.2.1]庚-2-烯、5,6-二乙氧基雙環[2.2.1]庚-2-烯、5-羥基-5-甲基雙環[2.2.1]庚-2-烯、5-羥基-5-乙基雙環[2.2.1]庚-2-烯、5-羥基甲基-5-甲基雙環[2.2.1]庚-2-烯、5-第三丁氧基羰基雙環[2.2.1]庚-2-烯、5-環己氧基羰基雙環[2.2.1]庚-2-烯、5-苯氧基羰基雙環[2.2.1]庚-2-烯、5,6-雙(第三丁氧基羰基)雙環[2.2.1]庚-2-烯、5,6-雙(環己氧基羰基)雙環[2.2.1]庚-2-烯等雙環不飽和化合物類; N-苯基順丁烯二醯亞胺、N-環己基順丁烯二醯亞胺、N-苯甲基順丁烯二醯亞胺、N-琥珀醯亞胺基-3-順丁烯二醯亞胺苯甲酸酯、N-琥珀醯亞胺基-4-順丁烯二醯亞胺丁酸酯、N-琥珀醯亞胺基-6-順丁烯二醯亞胺己酸酯、N-琥珀醯亞胺基-3-順丁烯二醯亞胺丙酸酯、N-(9-吖啶基)順丁烯二醯亞胺等二羰基醯亞胺衍生物類;苯乙烯、α-甲基苯乙烯、間-甲基苯乙烯、對-甲基苯乙烯、乙烯基甲苯、對-甲氧基苯乙烯、丙烯腈、甲基丙烯腈、氯乙烯、偏二氯乙烯、丙烯醯胺、甲基丙烯醯胺、乙酸乙烯酯、1,3-丁二烯、異戊二烯、2,3-二甲基-1,3-丁二烯等。
就共聚合反應性及耐熱性之觀點而言,此等之中係以苯乙烯、乙烯基甲苯、N-苯基順丁烯二醯亞胺、N-環己基順丁烯二醯亞胺、N-苯甲基順丁烯二醯亞胺、雙環[2.2.1]庚-2-烯等為佳。
樹脂[K1]中,以構成樹脂[K1]的全結構單元為基準,來自各單體的結構單元之比率,係以來自(a)的結構單元為2至70莫耳%且來自(c)的結構單元為30至98莫耳%為佳。同時,以來自(a)的結構單元為10至70莫耳%且來自(c)的結構單元為30至90莫耳%更佳。
樹脂[K1]的結構單元之比率為上述範圍時,有硬化性組成物的保存安定性、形成硬化圖案時的顯像性、及獲得的硬化圖案之耐溶劑性優良之傾向。
樹脂[K1],例如可參考文獻「高分子合成的 實驗法」(大津隆行著 發行所(股)化學同人 第1版第1刷 1972年3月1日發行)所述之方法及該文獻所述之參考文獻而製造。
具體上,可列舉:分別將預定量的(a)及(c)、聚合起始劑及溶劑放入反應容器中,例如藉由以氮氣取代氧氣而成為脫氧周圍環境氣體,一邊攪拌一邊加熱及保溫的方法。又,此處使用的聚合起始劑及溶劑,並無特別的限制,可使用該領域中通常使用者。例如,就聚合起始劑而言,可列舉:偶氮化合物(2,2'-偶氮雙異丁腈、2,2'-偶氮雙(2,4-二甲基戊腈)等)或有機過氧化物(苯甲醯基過氧化物等)。就溶劑而言,只要是溶解各單體者即可,作為可包含在本發明的硬化性組成物中之溶劑(E)可列舉後述溶劑等。
又,所得的共聚合物,可直接使用反應後的溶液,也可使用經濃縮或稀釋的溶液,也可使用以再沉澱等方法而作為固體(粉體)取出者。尤其是,此聚合時的溶劑,因可藉由使用後述的溶劑(E)而將反應後的溶液直接使用於本發明的硬化性組成物之調製中,故可簡化本發明的硬化性組成物之製造步驟。
樹脂[K2],可藉由獲得(a)與(c)之共聚合物,將(b)所具有的碳數2至4之環狀醚加成在來自(a)的羧酸及/或羧酸酐而製造。
首先,以與樹脂[K1]的製造方法所述之方法同樣地製造(a)與(c)之共聚合物。此時,來自各別結構單元的比率, 係以與樹脂[K1]中所列舉者相同的比率為佳。
其次,在前述共聚合物中的來自(a)之羧酸及/或羧酸酐的部份,使(b)所具有的碳數2至4之環狀醚加成反應。
接著在(a)與(c)的共聚合物之製造後,將燒瓶內的周圍環境氣體由氮氣取代成空氣,將(b)、羧酸或羧酸酐與環狀醚之間的反應之反應觸媒(例如參(二甲基胺基甲基)酚等)及聚合抑制劑(例如氫醌)等放入燒瓶內,以例如60至130℃反應1至10小時,即可製造樹脂[K2]。
相對於(a)100莫耳,(b)的使用量係以5至80莫耳為佳,並以10至75莫耳更佳。藉由設在此範圍,而有硬化性組成物的保存安定性、形成硬化圖案時的顯像性,以及所得的硬化圖案之耐溶劑性、耐熱性、機械強度及感度的平衡變得良好之傾向。
相對於(a)、(b)及(c)的合計量100質量份,前述反應觸媒的使用量,係以0.001至5質量份為佳。相對於(a)、(b)及(c)的合計量100質量份,前述聚合抑制劑的使用量係以0.001至5質量份為佳。
製備方法、反應溫度及時間等反應條件,可考量製造設備或聚合而產生的發熱量等而適宜地調整。又,與聚合條件相同,可考量製造設備或聚合而產生的發熱量等而適宜地調整製備方法或反應溫度。
樹脂[K3],第一階段係與上述樹脂[K1]的製造方法相同,而獲得(b)與(c)的共聚合物。與上述相同,所得 的共聚合物,可直接使用反應後的溶液,也可使用經濃縮或稀釋的溶液,也可使用以再沉澱等方法而作為固體(粉體)取出者。
相對於構成前述共聚合物的全結構單元之合計莫耳數,來自(b)及(c)的結構單元之比率,係以分別來自(b)的結構單元為5至95莫耳%,且來自(c)的結構單元為5至95莫耳%為佳。同時,係以來自(b)的結構單元為10至90莫耳%,且來自(c)的結構單元為10至90莫耳%更佳。
並且,可用與樹脂[K2]的製造方法相同之條件,藉由在(b)與(c)的共聚合物所具有的來自(b)之環狀醚中使(a)所具有的羧酸或羧酸酐加成反應,獲得樹脂[K3]。
相對於(b)100莫耳,在前述共聚合物中反應的(a)之使用量係以5至80莫耳為佳。
樹脂[K4],係在樹脂[K3]中再使羧酸酐反應的樹脂。在藉由環狀醚與羧酸或羧酸酐之反應而產生的羥基中,使羧酸酐加成反應。
就羧酸酐而言,可舉出順丁烯二酸酐、檸康酸酐、衣康酸酐、3-乙烯基鄰苯二甲酸酐、4-乙烯基鄰苯二甲酸酐、3,4,5,6-四氫鄰苯二甲酸酐、1,2,3,6-四氫鄰苯二甲酸酐、二甲基四氫鄰苯二甲酸酐、5,6-二羧基雙環[2.2.1]庚-2-烯酐等。相對於(a)之使用量1莫耳,羧酸酐之使用量係以0.5至1莫耳為佳。
就樹脂(D)而言,具體上可舉出:(甲基)丙烯 酸苯甲酯/(甲基)丙烯酸共聚合物、苯乙烯/(甲基)丙烯酸共聚合物等樹脂[K1];在(甲基)丙烯酸苯甲酯/(甲基)丙烯酸共聚合物中加成有(甲基)丙烯酸環氧丙酯之樹脂、在(甲基)丙烯酸三環癸酯/苯乙烯/(甲基)丙烯酸共聚合物中加成有(甲基)丙烯酸環氧丙酯之樹脂、在(甲基)丙烯酸三環癸酯/(甲基)丙烯酸苯甲酯/(甲基)丙烯酸共聚合物中加成有(甲基)丙烯酸環氧丙酯之樹脂等樹脂[K2];在(甲基)丙烯酸三環癸酯/(甲基)丙烯酸環氧丙酯之共聚合物中使(甲基)丙烯酸反應而成之樹脂、在(甲基)丙烯酸三環癸酯/苯乙烯/(甲基)丙烯酸環氧丙酯之共聚合物中使(甲基)丙烯酸反應而成之樹脂等樹脂[K3];在(甲基)丙烯酸三環癸酯/(甲基)丙烯酸環氧丙酯之共聚合物中使(甲基)丙烯酸反應而成之樹脂中,再使四氫鄰苯二甲酸酐反應而成之樹脂等樹脂[K4]等。
其中,就樹脂(D)而言,係以含有選自樹脂[K2]、樹脂[K3]及樹脂[K4]所形成之群組中的至少一種為佳。
樹脂(D)的換算聚苯乙烯之重量平均分子量,係以3,000至100,000為佳,並以5,000至50,000更佳,而以5,000至30,000又更佳。分子量為前述的範圍內時,因硬化膜的硬度提高、硬化圖案的殘膜率變高、組成物層中的未曝光部之對顯像液的溶解性良好,故有硬化圖案的解像度提高之傾向。
樹脂(D)的分子量分布[重量平均分子量(Mw)/數量平均分子量(Mn)]係以1.1至6為佳,並以1.2至4更佳。
樹脂(D)的酸價係以50至170mg-KOH/g為佳,並以60至150mg-KOH/g更佳,而以70至135mg-KOH/g又更佳。此處的酸價係作為中和1g之樹脂(D)時所需的氫氧化鉀之量(mg)而測定之值,例如可藉由使用氫氧化鉀水溶液滴定而求得。
相對於固形份的總量,樹脂(D)之含量是以7至65質量%為佳,並以13至65質量%更佳,而以17至55質量%又更佳。樹脂(D)的含量為前述的範圍內時,有硬化圖案的解像度及硬化圖案的殘膜率更為提高之傾向。
溶劑(E),只要是溶解聚合性化合物(B)、聚合起始劑(C)及樹脂(D)者即無特別的限制,可使用該領域中通常使用的溶劑。可列舉:例如酯溶劑(分子內含有-COO-,不含-O-之溶劑)、醚溶劑(分子內含有-O-,不含-COO-之溶劑)、醚酯溶劑(分子內含有-COO-與-O-之溶劑)、酮溶劑(分子內含有-CO-,不含-COO-之溶劑)、醇溶劑(分子內含有OH,不含-O-、-CO-及-COO-之溶劑)、芳香族烴溶劑、醯胺溶劑、二甲基亞碸等。
就酯溶劑而言,可舉出乳酸甲酯、乳酸乙酯、乳酸正丁酯、2-羥基異丁酸甲酯、乙酸乙酯、乙酸正丁酯、乙酸異丁酯、甲酸正戊酯、乙酸異戊酯、丙酸正丁酯、丁酸異丙酯、丁酸乙酯、丁酸正丁酯、丙酮酸甲酯、丙酮酸乙酯、丙酮酸丙酯、乙醯乙酸甲酯、乙醯乙酸乙酯、環己 醇乙酸酯及γ-丁內酯等。
就醚溶劑而言,可舉出乙二醇單甲醚、乙二醇單乙醚、乙二醇單丙醚、乙二醇單丁醚、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇單丁醚、丙二醇單甲醚、丙二醇單乙醚、丙二醇單丙醚、丙二醇單丁醚、3-甲氧基-1-丁醇、3-甲氧基-3-甲基丁醇、四氫呋喃、四氫吡喃、1,4-二烷、二乙二醇二甲醚、二乙二醇二乙醚、二乙二醇甲基乙基醚、二乙二醇二丙醚、二乙二醇二丁醚、苯甲醚、苯乙醚及甲基苯甲醚等。
就醚酯溶劑而言,可舉出甲氧基乙酸甲酯、甲氧基乙酸乙酯、甲氧基乙酸丁酯、乙氧基乙酸甲酯、乙氧基乙酸乙酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、2-甲氧基丙酸甲酯、2-甲氧基丙酸乙酯、2-甲氧基丙酸丙酯、2-乙氧基丙酸甲酯、2-乙氧基丙酸乙酯、2-甲氧基-2-甲基丙酸甲酯、2-乙氧基-2-甲基丙酸乙酯、乙酸3-甲氧基丁酯、乙酸3-甲基-3-甲氧基丁酯、丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯、丙二醇單丙醚乙酸酯、乙二醇單甲醚乙酸酯、乙二醇單乙醚乙酸酯、二乙二醇單乙醚乙酸酯及二乙二醇單丁醚乙酸酯等。
就酮溶劑而言,可舉出4-羥基-4-甲基-2-戊酮、丙酮、2-丁酮、2-庚酮、3-庚酮、4-庚酮、4-甲基-2-戊酮、環戊酮、環己酮及異佛酮等。
就醇溶劑而言,可舉出甲醇、乙醇、丙醇、 丁醇、己醇、環己醇、乙二醇、丙二醇及甘油等。
就芳香族烴溶劑而言,可舉出苯、甲苯、二甲苯及均三甲苯等。
就醯胺溶劑而言,可舉出N,N-二甲基甲醯胺、N,N-二甲基乙醯胺及N-甲基吡咯啶酮等。
就溶劑而言,係以丙二醇單甲醚乙酸酯、乳酸乙酯、丙二醇單甲醚、3-乙氧基丙酸乙酯、乙二醇單甲醚、二乙二醇單甲醚、二乙二醇單乙醚、4-羥基-4-甲基-2-戊酮或甲苯為佳。
相對於硬化性組成物的總量,溶劑(E)之含有率係以70至95質量%為佳,並以75至92質量%更佳。換言之,硬化性組成物的固形份,係以5至30質量%為佳,並以8至25質量%更佳。溶劑(E)的含量為前述範圍內時,有塗布時的組成物層之平坦性更為良好,同時容易形成適切膜厚的硬化膜之傾向。
就調平劑(F)而言,可舉出聚矽氧系界面活性劑、氟系界面活性劑及具有氟原子的聚矽氧系界面活性劑等。此等也可在側鏈具有聚合性基。
就聚矽氧系界面活性劑而言,可舉出分子內具有矽氧烷鍵之界面活性劑等。具體上,可舉出Toray Silicone DC3PA、同名SH7PA、同名DC11PA、同名SH21PA、同名SH28PA、同名SH29PA、同名SH30PA、同名SH8400(商品 名:東麗‧道康寧(Toray Dow Corning)(股)製);KP321、KP322、KP323、KP324、KP326、KP340、KP341(信越化學工業(股)製);TSF400、TSF401、TSF410、TSF4300、TSF4440、TSF4445、TSF4446、TSF4452及TSF4460(日本邁圖高新材料集團(Momentive Performance Materials Japan LLC)製)等。
就前述氟系界面活性劑而言,可舉出分子內具有氟碳鏈之界面活性劑等。具體上,可舉出Fluorad(註冊商標)FC430、同名FC431(住友3M(股)製);Megafac(註冊商標)F142D、同名F171、同名F172、同名F173、同名F177、同名F183、同名F554、同名R30、同名RS-718-K(DIC(股)製);Eftop(註冊商標)EF301、同名EF303、同名EF351、同名EF352(三菱材料電子化成(股)製);Surflon(註冊商標)S381、同名S382、同名SC101、同名SC105(旭硝子(股)製)及E5844(大金精密化學(Daikin Fine Chemical)研究所(股)製)等。
就前述具有氟原子的聚矽氧系界面活性劑而言,可舉出分子內具有矽氧烷鍵及氟碳鏈之界面活性劑等。具體上,可舉出Megafae(註冊商標)R08、同名BL20、同名F475、同名F477及同名F443(DIC(股)製)等。
相對於硬化性組成物的總量,調平劑(F)之含量係0.001質量%以上0.2質量%以下,並以0.002質量%以上0.1質量%以下為佳,而以0.01質量%以上0.05質量%以下更佳。調平劑(F)之含量為前述範圍內時,可使硬化膜的平坦性更為良好。
又,本發明的硬化性組成物中,也可視需要而更含有填充劑、其他的高分子化合物、密著促進劑、抗氧化劑、光安定劑、鏈轉移劑等該技術領域中已知的添加劑。
本發明的硬化膜,係可藉由將本發明的硬化性組成物塗布在基板,以光或熱的作用使其硬化而得。本發明的硬化膜,可形成在上述基板全面上,也可形成在上述基板的一部份上(即硬化圖案)。在上述基板的一部份上形成硬化膜之方法,可舉出光微影法、噴墨法、印刷法等。其中,以光微影法為佳。光微影法,係將本發明的硬化性組成物塗布在基板,並視需要使其乾燥而形成組成物層,隔著光罩將該組成物層曝光,而顯像之方法。
在基板全面上形成硬化膜的方法,可舉出將本發明的硬化性組成物塗布在基板上,視需要使其乾燥而形成組成物層,將該組成物層加熱及/或對該組成物層全面曝光的方法。
就基板而言,可舉出石英玻璃、硼矽酸玻璃、氧化鋁矽酸鹽玻璃、表面經二氧化矽塗布的鈉鈣玻璃等玻璃板,或聚碳酸酯、聚甲基丙烯酸甲酯、聚對苯二甲酸乙二酯等樹脂板,聚矽氧、在前述基板上形成有鋁、銀、銀/銅/鈀合金薄膜等者等。
以光微影法形成硬化圖案,可用已知或常用 的裝置或條件進行。例如,可如下述方式製作。
首先,將硬化性組成物塗布在基板上,藉加熱乾燥(預焙)及/或減壓乾燥而去除溶劑等揮發性成份,獲得組成物層。塗布方法,可舉出旋轉塗布法、細縫塗布法、細縫與旋轉塗布法等。
進行加熱乾燥時的溫度,係以30至120℃為佳,並以50至110℃更佳。又,加熱時間係以10秒至60分鐘為佳,並以30秒至30分鐘更佳。
進行減壓乾燥時,係以50至150Pa的壓力下、20至25℃的溫度範圍進行為佳。
組成物層之膜厚並無特別的限制,只要配合目標硬化圖案之膜厚而適宜地選擇即可。
接著,組成物層係隔著用以形成目標硬化圖案之光罩而曝光。該光罩上的圖案並無特別的限制。
曝光時使用的光源,係以產生250至450nm波長的光之光源為佳。例如,可自該波長的光,配合聚合起始劑的吸收波長,藉由帶通濾波器選擇性地取出436nm附近、408nm附近或365nm附近的光。具體上,可舉出水銀燈、發光二極體、金屬鹵素燈、鹵素燈等。
為了使平行光線均勻地照射在曝光面全體,或為了能精確定位光罩與已形成組成物層的基板,係以使用光罩對準器(mask aligner)及步進機(stepper)等曝光裝置為佳。已曝光的組成物層,係藉由使該組成物層中含有的聚合性化合物等聚合而硬化。
藉由使曝光後的組成物層與顯像液接觸而顯像,使組成物層的未曝光部份溶解於顯像液中而去除,而得硬化圖案。就顯像液而言,可列舉:例如氫氧化鉀、碳酸氫鈉、碳酸鈉、氫氧化四甲基銨等鹼性化合物的水溶液或有機溶劑。鹼性化合物在水溶液中的濃度,係以0.01至10質量%為佳,並以0.03至5質量%更佳。就有機溶劑而言,可舉出與上述的溶劑(E)相同者。並且,顯像液也可含有界面活性劑。
顯像方法,可以是覆液法(puddle method)、浸漬法及噴霧法等中之任一種方法。並且顯像時可使基板傾斜成任意角度。
並以對由顯像而得的硬化圖案進一步進行加熱(後焙)為佳。加熱溫度係以150至250℃為佳,並以160至235℃更佳。加熱時間係以1至120分鐘為佳,並以10至60分鐘更佳。藉由顯像後進行加熱,因可使硬化圖案中含有的未反應之聚合性化合物等進行聚合,故可得耐藥品性更優的硬化圖案。
藉由對硬化膜照射紫外光或可見光,本發明的硬化膜發出與照射光不同波長的光。形成本發明的硬化膜時使用的硬化性組成物中,可藉由選擇該硬化性組成物中含有的量子點之成份或粒徑,而選擇發光之光的波長。
本發明的硬化膜,因如同上述具有轉換照射光的波長之機能,故可利用作為顯示裝置的色轉換層。此種顯示裝置,可列舉:例如日本特開2006-309219號公報、日本特 開2006-310303號公報、日本特開2013-15812號公報、日本特開2009-251129號公報、日本特開2014-2363號公報等所述之顯示裝置。
本發明的硬化性組成物,因顯像時可以高殘膜率獲得硬化圖案,並且使該硬化圖案發光時的量子產率優異,故有用作為顯示裝置的色轉換層,尤其是液晶顯示裝置的色轉換層。
以下,以實施例更詳細地說明本發明。
例中的「%」及「份」,係質量%及質量份,除非另有說明。
在具備攪拌裝置、滴液漏斗、冷凝器、溫度計及導氣管的燒瓶中,加入100份的丙二醇單甲醚乙酸酯,一邊取代氮氣一邊攪拌,昇溫至120℃。接著,在由40份的甲基丙烯酸苯甲酯及20份的甲基丙烯酸所形成之單體混合物中,相對於100份的單體混合物添加1份的聚合起始劑2,2’-偶氮雙(2,4-二甲基戊腈),並將已添加1份的聚合起始劑2,2’-偶氮雙(2,4-二甲基戊腈)者,花費2小時由滴液漏斗滴入至燒瓶中,並且以120℃攪拌2小時,獲得共聚合物溶液。接著,將燒瓶內取代成空氣,將10份的甲基丙烯酸環氧丙酯、0.44份的三苯基膦及0.08份的甲基氫醌投入上述共聚合物溶液中,再以120℃繼續反應,使固形份 酸價成為130KOHmg/g時結束反應。在其中,加入80份的丙二醇單甲醚乙酸酯,藉此獲得固形份30%的樹脂D1溶液。樹脂D1的重量平均分子量係3.0×104。
樹脂的重量平均分子量(Mw)之測定,係藉由GPC法,以下述的條件進行。
裝置;K2479(島津製作所(股)製)
管柱;SHIMADZU Shim-pack GPC-80M
管柱溫度;40℃
溶劑;四氫呋喃
流速;1.0mL/分鐘
檢測器;R1
校正用標準物質;TSK標準聚苯乙烯(TSK STANDARD POLYSTYRENE)F-40、F-4、F-288、A-2500、A-500(東曹(TOSOH)(股)製)
硬化性組成物的調製中,係分別使用以下者。
CZ520:NN-LABS公司製的量子點,10%甲苯分散液,核殼型(核:CdSe、殼:ZnS)。
CZ620:NN-LABS公司製的量子點,10%甲苯分散液,核殼型(核:CdSe、殼:ZnS)。
KAYARAD(註冊商標)DPHA:日本化藥(股)製,二新 戊四醇六丙烯酸酯。
Irgacure(註冊商標)OXE 01:BASF公司製之肟化合物,N-苯甲醯基氧基-1-(4-苯基硫基苯基)辛烷-1-酮-2-亞胺。
B-CIM:保土谷化學(股)製之聯咪唑化合物,2,2’-雙(2-氯苯基)-4,4’,5,5’-四苯基-1,2’-聯咪唑。
Irgacure(註冊商標)OXE 02:BASF公司製之肟化合物,N-乙醯氧基-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]乙烷-1-亞胺。
Irgacure(註冊商標)819:BASF公司製之醯基膦化合物,雙(2,4,6-三甲基苯甲醯基)-苯基膦氧化物。
EAB-F:保土谷化學工業(股)製,4,4’-雙(二乙基胺基)二苯甲酮。
Toray Silicone SH8400:東麗‧道康寧(股)之商品,聚醚改質矽油。
將240份的(A)量子點"CZ520"及24份的東亞合成(股)製之"TO-1382"(二新戊四醇五丙烯酸酯與琥珀酸之單酯化物、二新戊四醇六丙烯酸酯以及二新戊四醇五丙烯酸酯之 混合物)混合,藉由珠磨機使量子點充分分散而調製成量子點分散液。接著,將40份的(B)聚合性化合物"KAYARAD DPHA"、8份的(C)聚合起始劑"Irgacure OXE 01"、60份的(D)樹脂之樹脂D1(換算固形份)、654份的(E)溶劑之丙二醇單甲醚乙酸酯及0.1份的(F)調平劑"Toray Silicone SH8400"混合,獲得硬化性組成物。
將240份的(A)量子點"CZ520"及24份的東亞合成(股)製之"TO-1382"混合,藉由珠磨機使量子點充分分散而調製成量子點分散液。接著,將40份的(B)聚合性化合物"KAYARAD DPHA"、7份的(C)聚合起始劑"B-CIM"、1份的(C1)聚合起始助劑"EAB-F"、60份的(D)樹脂之樹脂D1(換算固形份)、654份的(E)溶劑之丙二醇單甲醚乙酸酯及0.1份的(F)調平劑"Toray Silicone SH8400"混合,獲得硬化性組成物。
將240份的(A)量子點"CZ520"及24份的東亞合成(股)製之"TO-1382"混合,藉由珠磨機使量子點充分分散而調製成量子點分散液。接著,將40份的(B)聚合性化合物"KAYARAD DPHA"、8份的(C)聚合起始劑"Irgacure 819”、60份的(D)樹脂之樹脂D1(換算固形份)、654份的(E)溶劑之丙二醇單甲醚乙酸酯及0.1份的(F)調平劑"Toray Silicone SH8400"混合,獲得硬化性組成物。
將240份的(A)量子點"CZ520"及24份的東亞合成(股)製之"TO-1382"混合,藉由珠磨機使量子點充分分散而調製成量子點分散液。接著,將40份的(B)聚合性化合物"KAYARAD DPHA"、8份的(C)聚合起始劑"Triazine PP"、60份的(D)樹脂之樹脂D1(換算固形份)、654份的(E)溶劑之丙二醇單甲醚乙酸酯及0.1份的(F)調平劑"Toray Silicone SH8400"混合,獲得硬化性組成物。
將270.7份的(A)量子點"CZ620"及24份的東亞合成(股)製之"TO-1382"混合,藉由珠磨機使量子點充分分散而調製成量子點分散液。接著,將40份的(B)聚合性化合物"KAYARAD DPHA"、8份的(C)聚合起始劑"Irgacure OXE 01"、60份的(D)樹脂之樹脂D1(換算固形份)、393份的(E)溶劑之丙二醇單甲醚乙酸酯及0.2份的(F)調平劑"Toray Silicone SH8400"混合,獲得硬化性組成物。
除了將(C)聚合起始劑"Irgacure OXE 01"的調配量變更為10份以外,其餘與實施例5相同,獲得硬化性組成物。
除了將(C)聚合起始劑"Irgacure OXE 01"的調配量變更為12份以外,其餘與實施例5相同,獲得硬化性組成物。
除了使用"Irgacure OXE 02"作為(C)聚合起始劑以外,其餘與實施例5相同,獲得硬化性組成物。
除了將(C)聚合起始劑"Irgacure OXE 02"的調配量變更為10份以外,其餘與實施例8相同,獲得硬化性組成物。
除了將(C)聚合起始劑"Irgacure OXE 02"的調配量變更為12份以外,其餘與實施例8相同,獲得硬化性組成物。
除了混合12份的"Irgacure 819"作為(C)聚合起始劑以外,其餘與實施例5相同,獲得硬化性組成物。
除了混合12份的"Triazine PP"作為(C)聚合起始劑以外,其餘與實施例5相同,獲得硬化性組成物。
除了使用3.6份的"Irgacure OXE 01"及8.4份的"Irgacure OXE 02"作為(C)聚合起始劑以外,其餘與實施例5相同,獲得硬化性組成物。
除了分別將(C)聚合起始劑"Irgacure OXE 01"的調配量變更為6.0份及"Irgacure OXE 02"的調配量變更為6.0份以外,其餘與實施例13相同,獲得硬化性組成物。
除了分別將(C)聚合起始劑"Irgacure OXE 01"的調配量變更為8.4份及"Irgacure OXE 02"的調配量變更為3.6份以外,其餘與實施例13相同,獲得硬化性組成物。
除了使用6.0份的"Irgacure OXE 01"及6.0份的"Irgacure 819"作為(C)聚合起始劑以外,其餘與實施例13相同,獲得硬化性組成物。
除了使用6.0份的"Irgacure OXE 01"及6.0份的"Triazine PP"作為(C)聚合起始劑以外,其餘與實施例13相同,獲得硬化性組成物。
除了使用6.0份的"Irgacure OXE 02"及6.0份的"Irgacure 819"作為(C)聚合起始劑以外,其餘與實施例13相同,獲得硬化性組成物。
除了使用6.0份的"Irgacure OXE 02"及6.0份的"Triazine PP"作為(C)聚合起始劑以外,其餘與實施例13相同,獲得硬化性組成物。
將220份的(A)量子點"CZ520"及22份的BYK Chemie Japan(股)製的"DISPERBYK-180(主成分:含酸基的共聚合物之烷基醇銨鹽(alkylol ammonium salt))"混合,藉由珠磨機使量子點充分分散而調製成量子點分散液。接著,將100份的(B)聚合性化合物"KAYARAD DPHA"、677份的(E)溶劑之丙二醇單甲醚乙酸酯及0.1份的(F)調平劑"Toray Silicone SH8400"混合,獲得硬化性組成物。
以旋轉塗布法,將硬化性組成物塗布在5cm見方的玻璃基板(Eagle 2000,康寧公司製)上之後,以100℃預焙1分鐘而獲得組成物層。放冷後,利用曝光機(TME-150RSK; 拓普康(Topcon)(股)製),於大氣環境下以150mJ/cm2的曝光量(365nm基準)光照射組成物層全面。光照射後,使其以23℃浸漬在水性顯顯像液(含有非離子系界面活性劑0.12%及氫氧化鉀0.04%之水溶液)中60秒,水洗後,於烤爐中以200℃進行後焙10分鐘後,藉此獲得硬化膜。
藉由膜厚測定裝置(DEKTAK3,日本真空技術(股)製)測定所得的硬化膜之膜厚。
對硬化性組成物的調製中使用的量子點分散液,以使波長450nm中的吸光度成為0.4之方式添加甲苯,製作成稀釋分散液。藉由螢光量子產率測定裝置(C9920-02G,浜松Photonics(股)製),對該稀釋分散液與上述獲得的硬化膜,分別測定激發波長450nm中的量子產率。
由測定的量子產率以下述式(y)計算出量子產率比。
量子產率比=Qf/Qs×100 (y)[式(y)中,Qf是表示硬化膜的量子產率,Qs是表示量子點稀釋分散液的量子產率]
於暗室下將波長350nm的UV燈照射在所得的硬化膜上,以目視觀察硬化膜的發光色。
以旋轉塗布法將硬化性組成物塗布在5cm見方的玻璃基板(Eagle 2000,康寧公司製)上之後,以100℃預焙1分鐘而得組成物層。放冷後,將形成有組成物層的基板與石英玻璃製光罩之間隔設為100μm,藉由曝光機(TME-150RSK,拓普康(股)製),於大氣環境下,隔著光罩以80mJ/cm2的曝光量(365nm基準)光照射在組成物層上。光罩係使用形成有100μm線和間隔(line and space)圖案者。光照射後的組成物層之膜厚,係以膜厚測定裝置(DEKTAK3,日本真空技術(股)製)測定。
接著,藉由使光照射後的形成有組成物層之基板以23℃浸漬在水性顯像液(含有非離子系界面活性劑0.12%及氫氧化鉀0.04%的水溶液)中60秒並顯像,水洗後,獲得硬化圖案。以膜厚測定裝置(DEKTAK3,日本真空技術(股)製))測定所得的硬化圖案之膜厚。
由式(z)求得硬化圖案的殘膜率。只要殘膜率為90%以上,即可判斷硬化性組成物的感度良好。
殘膜率(%)=Td/Te×100 (z)[式(z)中,Td是表示硬化圖案的膜厚,Te是表示光照射後的組成物層之膜厚]
又,在比較例的硬化性組成物中,因光照射後的組成物層全部溶解於顯像液中,未能在基板上獲得硬化圖案,故不能觀察量子產率比及發光色。
若藉由本發明的硬化性組成物,顯像時可以高殘膜率獲得硬化圖案,並且使該硬化圖案發光時的量子產率優異。
Claims (8)
- 一種硬化性組成物,係含有量子點、聚合起始劑及聚合性化合物,其中,前述聚合起始劑至少含有肟化合物;相對於硬化性組成物中的固形份,前述量子點的含有率為5至40質量%;前述聚合性化合物係包含具有3個以上乙烯性不飽和鍵且重量平均分子量為150至1,500的化合物。
- 如申請專利範圍第1至3項中任一項所述之硬化性組成物,其中,量子點含有選自12族元素與16族元素之化合物、13族元素與15族元素之化合物、及14族元素與16族元素之化合物所形成之群組中的至少一種。
- 如申請專利範圍第1至3項中任一項所述之硬化性組成物,其係更含有樹脂。
- 如申請專利範圍第4項所述之硬化性組成物,其更含有樹脂。
- 一種硬化膜,其係由申請專利範圍第1至6項中任一項所述之硬化性組成物形成者。
- 一種顯示裝置,其係含有申請專利範圍第7項所述之硬化膜。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002241509A (ja) * | 2001-02-22 | 2002-08-28 | Mitsubishi Chemicals Corp | 超微粒子ドメインを含有する面状樹脂成形体 |
WO2012164284A2 (en) * | 2011-05-31 | 2012-12-06 | Nanoco Technologies Limited | Semiconductor nanoparticle - based materials for use in light emitting diodes, optoelectronic displays and the like |
CN103728837A (zh) * | 2013-12-30 | 2014-04-16 | 京东方科技集团股份有限公司 | 感光树脂组合物及用感光树脂组合物制备量子点图案的方法 |
TW201423264A (zh) * | 2012-09-28 | 2014-06-16 | Taiyo Ink Mfg Co Ltd | 光硬化性樹脂組成物、印刷配線板、及光硬化性樹脂組成物之製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10186426A (ja) | 1996-10-24 | 1998-07-14 | Mitsui Chem Inc | 光重合性樹脂組成物 |
US7381516B2 (en) * | 2002-10-02 | 2008-06-03 | 3M Innovative Properties Company | Multiphoton photosensitization system |
JP3932866B2 (ja) * | 2001-11-07 | 2007-06-20 | 三菱化学株式会社 | 重合性液体組成物 |
JP5186848B2 (ja) * | 2007-09-10 | 2013-04-24 | 住友ベークライト株式会社 | 複合体組成物、及びこれを架橋させてなる成形硬化物 |
JP5546801B2 (ja) * | 2008-06-10 | 2014-07-09 | 富士フイルム株式会社 | 紫外光レーザー露光用感光性樹脂組成物、パターン形成方法、その方法を用いて製造したカラーフィルタ、カラーフィルタの製造方法および液晶表示装置 |
JP2010139692A (ja) * | 2008-12-11 | 2010-06-24 | Toppan Printing Co Ltd | 感光性着色組成物、及びそれを用いるカラーフィルタ基板の製造方法 |
JP2012103453A (ja) * | 2010-11-10 | 2012-05-31 | Toyo Ink Sc Holdings Co Ltd | 感光性樹脂組成物およびタッチパネル用絶縁膜 |
JP6379671B2 (ja) * | 2013-06-24 | 2018-08-29 | Jsr株式会社 | 硬化性樹脂組成物、硬化膜、発光素子、波長変換フィルムおよび発光層の形成方法 |
KR102197936B1 (ko) * | 2013-06-24 | 2021-01-04 | 제이에스알 가부시끼가이샤 | 경화성 수지 조성물, 경화막, 발광 소자, 파장 변환 필름 및 발광층의 형성 방법 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002241509A (ja) * | 2001-02-22 | 2002-08-28 | Mitsubishi Chemicals Corp | 超微粒子ドメインを含有する面状樹脂成形体 |
WO2012164284A2 (en) * | 2011-05-31 | 2012-12-06 | Nanoco Technologies Limited | Semiconductor nanoparticle - based materials for use in light emitting diodes, optoelectronic displays and the like |
TW201423264A (zh) * | 2012-09-28 | 2014-06-16 | Taiyo Ink Mfg Co Ltd | 光硬化性樹脂組成物、印刷配線板、及光硬化性樹脂組成物之製造方法 |
CN103728837A (zh) * | 2013-12-30 | 2014-04-16 | 京东方科技集团股份有限公司 | 感光树脂组合物及用感光树脂组合物制备量子点图案的方法 |
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