TWI699420B - 半導體加工用膠帶 - Google Patents

半導體加工用膠帶 Download PDF

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Publication number
TWI699420B
TWI699420B TW105109373A TW105109373A TWI699420B TW I699420 B TWI699420 B TW I699420B TW 105109373 A TW105109373 A TW 105109373A TW 105109373 A TW105109373 A TW 105109373A TW I699420 B TWI699420 B TW I699420B
Authority
TW
Taiwan
Prior art keywords
wafer
tape
adhesive layer
semiconductor processing
aforementioned
Prior art date
Application number
TW105109373A
Other languages
English (en)
Chinese (zh)
Other versions
TW201702334A (zh
Inventor
佐野透
杉山二朗
青山真沙美
Original Assignee
日商古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商古河電氣工業股份有限公司 filed Critical 日商古河電氣工業股份有限公司
Publication of TW201702334A publication Critical patent/TW201702334A/zh
Application granted granted Critical
Publication of TWI699420B publication Critical patent/TWI699420B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
  • Laser Beam Processing (AREA)
TW105109373A 2015-03-24 2016-03-24 半導體加工用膠帶 TWI699420B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015060783 2015-03-24
JP2015-060783 2015-03-24

Publications (2)

Publication Number Publication Date
TW201702334A TW201702334A (zh) 2017-01-16
TWI699420B true TWI699420B (zh) 2020-07-21

Family

ID=56977489

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105109373A TWI699420B (zh) 2015-03-24 2016-03-24 半導體加工用膠帶

Country Status (7)

Country Link
JP (1) JP6230730B2 (ko)
KR (1) KR102007111B1 (ko)
CN (1) CN107431002B (ko)
MY (1) MY181315A (ko)
SG (1) SG11201707829WA (ko)
TW (1) TWI699420B (ko)
WO (1) WO2016152957A1 (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6577341B2 (ja) * 2015-11-13 2019-09-18 日東電工株式会社 積層体および半導体装置の製造方法
WO2018083986A1 (ja) * 2016-11-02 2018-05-11 リンテック株式会社 ステルスダイシング用粘着シート
JP7041476B2 (ja) * 2017-07-04 2022-03-24 日東電工株式会社 ダイシングテープおよびダイシングダイボンドフィルム
MY187307A (en) * 2018-03-28 2021-09-21 Furukawa Electric Co Ltd Tape for semiconductor processing
SG11201906507PA (en) * 2018-03-28 2019-11-28 Furukawa Electric Co Ltd Tape for semiconductor processing
JP6535117B1 (ja) 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
JP6535119B1 (ja) 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
JP6535118B1 (ja) 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
JP2020092157A (ja) * 2018-12-05 2020-06-11 日東電工株式会社 ダイシングダイボンドフィルム
TWI677932B (zh) * 2019-02-01 2019-11-21 相豐科技股份有限公司 拉伸膜擴張方法及其膜擴張機
CN111524848A (zh) * 2019-02-01 2020-08-11 相丰科技股份有限公司 拉伸膜扩张方法及膜扩张机
JP7269095B2 (ja) 2019-05-29 2023-05-08 古河電気工業株式会社 ガラス加工用テープ
JP7060548B2 (ja) 2019-05-29 2022-04-26 古河電気工業株式会社 ガラス加工用テープ
JP7269096B2 (ja) 2019-05-29 2023-05-08 古河電気工業株式会社 ガラス加工用テープ
JP7060547B2 (ja) 2019-05-29 2022-04-26 古河電気工業株式会社 ガラス加工用テープ
JP7446773B2 (ja) * 2019-11-07 2024-03-11 日東電工株式会社 ダイシングテープ及びダイシングダイボンドフィルム
JP2024000458A (ja) 2022-06-20 2024-01-05 マクセル株式会社 ダイシングテープおよびダイシングテープを使用する、半導体チップおよび半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200426934A (en) * 2003-04-08 2004-12-01 Teijin Dupont Films Japan Ltd Base film for semiconductor wafer processing
TW201202382A (en) * 2010-03-31 2012-01-16 Furukawa Electric Co Ltd Wafer processing tape

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4947564B2 (ja) * 2000-01-21 2012-06-06 日東電工株式会社 半導体ウエハ加工用粘着シート
JP2003138228A (ja) * 2001-11-02 2003-05-14 Nitto Denko Corp 半導体ウエハ保護用粘着シート
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP4342775B2 (ja) * 2002-07-31 2009-10-14 日東電工株式会社 透明導電性フィルム用表面保護フィルム及びその製造方法並びに表面保護フィルム付き透明導電性フィルム
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
JP4566527B2 (ja) * 2003-08-08 2010-10-20 日東電工株式会社 再剥離型粘着シート
JP4754278B2 (ja) 2005-06-23 2011-08-24 リンテック株式会社 チップ体の製造方法
JP5323779B2 (ja) * 2010-07-26 2013-10-23 古河電気工業株式会社 ウエハ加工用テープ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200426934A (en) * 2003-04-08 2004-12-01 Teijin Dupont Films Japan Ltd Base film for semiconductor wafer processing
TW201202382A (en) * 2010-03-31 2012-01-16 Furukawa Electric Co Ltd Wafer processing tape

Also Published As

Publication number Publication date
WO2016152957A1 (ja) 2016-09-29
CN107431002A (zh) 2017-12-01
KR20170131504A (ko) 2017-11-29
JPWO2016152957A1 (ja) 2017-05-25
KR102007111B1 (ko) 2019-08-02
SG11201707829WA (en) 2017-10-30
CN107431002B (zh) 2020-09-11
JP6230730B2 (ja) 2017-11-15
TW201702334A (zh) 2017-01-16
MY181315A (en) 2020-12-21

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