TWI692555B - 鑲嵌特徵中之由下而上填充 - Google Patents

鑲嵌特徵中之由下而上填充 Download PDF

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Publication number
TWI692555B
TWI692555B TW103129240A TW103129240A TWI692555B TW I692555 B TWI692555 B TW I692555B TW 103129240 A TW103129240 A TW 103129240A TW 103129240 A TW103129240 A TW 103129240A TW I692555 B TWI692555 B TW I692555B
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TW
Taiwan
Prior art keywords
copper
electrolyte
substrate
electroplating
current
Prior art date
Application number
TW103129240A
Other languages
English (en)
Chinese (zh)
Other versions
TW201529906A (zh
Inventor
朱煥豐
強納森Ｄ 李德
Original Assignee
美商蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW201529906A publication Critical patent/TW201529906A/zh
Application granted granted Critical
Publication of TWI692555B publication Critical patent/TWI692555B/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
TW103129240A 2013-08-26 2014-08-25 鑲嵌特徵中之由下而上填充 TWI692555B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/010,404 US20150053565A1 (en) 2013-08-26 2013-08-26 Bottom-up fill in damascene features
US14/010,404 2013-08-26

Publications (2)

Publication Number Publication Date
TW201529906A TW201529906A (zh) 2015-08-01
TWI692555B true TWI692555B (zh) 2020-05-01

Family

ID=52479389

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103129240A TWI692555B (zh) 2013-08-26 2014-08-25 鑲嵌特徵中之由下而上填充
TW108129091A TWI697589B (zh) 2013-08-26 2014-08-25 鑲嵌特徵中之由下而上填充

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW108129091A TWI697589B (zh) 2013-08-26 2014-08-25 鑲嵌特徵中之由下而上填充

Country Status (3)

Country Link
US (1) US20150053565A1 (ko)
KR (1) KR102309859B1 (ko)
TW (2) TWI692555B (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120261254A1 (en) 2011-04-15 2012-10-18 Reid Jonathan D Method and apparatus for filling interconnect structures
US20150322587A1 (en) * 2014-05-09 2015-11-12 Applied Materials, Inc. Super conformal plating
US9777386B2 (en) * 2015-03-19 2017-10-03 Lam Research Corporation Chemistry additives and process for cobalt film electrodeposition
JP2018517793A (ja) 2015-04-28 2018-07-05 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 電気めっき浴用の添加剤としてのビス無水物及びジアミンの反応生成物
EP3359709B1 (en) * 2015-10-08 2020-07-29 Rohm and Haas Electronic Materials LLC Copper electroplating baths containing compounds of reaction products of amines and polyacrylamides
US10329683B2 (en) 2016-11-03 2019-06-25 Lam Research Corporation Process for optimizing cobalt electrofill using sacrificial oxidants
US10000860B1 (en) * 2016-12-15 2018-06-19 Applied Materials, Inc. Methods of electrochemical deposition for void-free gap fill
TW202204696A (zh) * 2020-04-07 2022-02-01 美商蘭姆研究公司 來自鹼性電鍍溶液的電填充
US11842958B2 (en) * 2022-03-18 2023-12-12 Chun-Ming Lin Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure

Citations (5)

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Publication number Priority date Publication date Assignee Title
CN1342220A (zh) * 1998-10-14 2002-03-27 法拉第技术公司 应用调制电场在小深孔中的金属电淀积法
US6409903B1 (en) * 1999-12-21 2002-06-25 International Business Machines Corporation Multi-step potentiostatic/galvanostatic plating control
US20040072423A1 (en) * 2001-01-12 2004-04-15 Jacob Jorne Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features
US20060079084A1 (en) * 2002-01-10 2006-04-13 Semitool, Inc. Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatment
CN102124551A (zh) * 2008-08-18 2011-07-13 诺发系统有限公司 穿硅通孔填充工艺

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DE10016261C2 (de) * 2000-04-03 2002-08-29 Karlsruhe Forschzent Kompakte mikrowellentechnische Einrichtung zum Enteisen oder Vorbeugen einer Vereisung
US7624428B2 (en) * 2005-06-30 2009-11-24 Intel Corporation Apparatus and method for platform-independent identity manageability
FR2890983B1 (fr) * 2005-09-20 2007-12-14 Alchimer Sa Composition d'electrodeposition destinee au revetement d'une surface d'un substrat par un metal.
JP5232401B2 (ja) * 2007-04-05 2013-07-10 株式会社キャタラー 排ガス浄化用触媒
US8039388B1 (en) * 2010-03-24 2011-10-18 Taiwam Semiconductor Manufacturing Company, Ltd. Main spacer trim-back method for replacement gate process

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1342220A (zh) * 1998-10-14 2002-03-27 法拉第技术公司 应用调制电场在小深孔中的金属电淀积法
US6409903B1 (en) * 1999-12-21 2002-06-25 International Business Machines Corporation Multi-step potentiostatic/galvanostatic plating control
US20040072423A1 (en) * 2001-01-12 2004-04-15 Jacob Jorne Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features
US20060079084A1 (en) * 2002-01-10 2006-04-13 Semitool, Inc. Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatment
CN102124551A (zh) * 2008-08-18 2011-07-13 诺发系统有限公司 穿硅通孔填充工艺

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Franz Jahnel, Manual of Guitar Technology: The History and Technology of Plucked String Instruments, The Bold Strummer Ltd., January 2000. *

Also Published As

Publication number Publication date
TW202012709A (zh) 2020-04-01
US20150053565A1 (en) 2015-02-26
TW201529906A (zh) 2015-08-01
KR20150024292A (ko) 2015-03-06
KR102309859B1 (ko) 2021-10-07
TWI697589B (zh) 2020-07-01

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