TWI684580B - 二胺及其利用 - Google Patents

二胺及其利用 Download PDF

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Publication number
TWI684580B
TWI684580B TW105109816A TW105109816A TWI684580B TW I684580 B TWI684580 B TW I684580B TW 105109816 A TW105109816 A TW 105109816A TW 105109816 A TW105109816 A TW 105109816A TW I684580 B TWI684580 B TW I684580B
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TW
Taiwan
Prior art keywords
formula
polyimide
diamine
film
carbon atoms
Prior art date
Application number
TW105109816A
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English (en)
Chinese (zh)
Other versions
TW201710234A (zh
Inventor
葉鎭嘉
何邦慶
近藤光正
Original Assignee
日商日產化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商日產化學工業股份有限公司 filed Critical 日商日產化學工業股份有限公司
Publication of TW201710234A publication Critical patent/TW201710234A/zh
Application granted granted Critical
Publication of TWI684580B publication Critical patent/TWI684580B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C205/00—Compounds containing nitro groups bound to a carbon skeleton
    • C07C205/49—Compounds containing nitro groups bound to a carbon skeleton the carbon skeleton being further substituted by carboxyl groups
    • C07C205/57—Compounds containing nitro groups bound to a carbon skeleton the carbon skeleton being further substituted by carboxyl groups having nitro groups and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C227/00—Preparation of compounds containing amino and carboxyl groups bound to the same carbon skeleton
    • C07C227/04—Formation of amino groups in compounds containing carboxyl groups
    • C07C227/06—Formation of amino groups in compounds containing carboxyl groups by addition or substitution reactions, without increasing the number of carbon atoms in the carbon skeleton of the acid
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C229/00—Compounds containing amino and carboxyl groups bound to the same carbon skeleton
    • C07C229/52—Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
    • C07C229/54—Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring
    • C07C229/60—Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring with amino and carboxyl groups bound in meta- or para- positions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07B—GENERAL METHODS OF ORGANIC CHEMISTRY; APPARATUS THEREFOR
    • C07B61/00—Other general methods

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
TW105109816A 2015-03-25 2016-03-25 二胺及其利用 TWI684580B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2015062790 2015-03-25
JP2015-062790 2015-03-25
JP2015185776 2015-09-18
JP2015-185776 2015-09-18
JP2016012560 2016-01-26
JP2016-012560 2016-01-26

Publications (2)

Publication Number Publication Date
TW201710234A TW201710234A (zh) 2017-03-16
TWI684580B true TWI684580B (zh) 2020-02-11

Family

ID=56977556

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105109816A TWI684580B (zh) 2015-03-25 2016-03-25 二胺及其利用

Country Status (5)

Country Link
JP (1) JP6748378B2 (ja)
KR (1) KR102557784B1 (ja)
CN (1) CN107614483B (ja)
TW (1) TWI684580B (ja)
WO (1) WO2016153064A1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017098936A1 (ja) * 2015-12-09 2017-06-15 株式会社カネカ ポリアミド酸、ポリイミド、ポリアミド酸溶液、ポリイミド積層体、フレキシブルデバイス基板、及びそれらの製造方法
CN108463454B (zh) * 2016-01-14 2021-03-12 日产化学工业株式会社 二胺及其利用
TWI725236B (zh) * 2016-09-28 2021-04-21 日產化學工業股份有限公司 二胺及其之利用
KR20200093078A (ko) * 2017-12-28 2020-08-04 우베 고산 가부시키가이샤 폴리이미드, 폴리이미드 용액 조성물, 폴리이미드 필름 및 기판
CN112513141B (zh) * 2018-06-20 2024-01-05 杜邦电子公司 用于电子装置中的聚合物
WO2020018617A1 (en) * 2018-07-20 2020-01-23 Dupont Electronics, Inc. Polymers for use in electronic devices
TWI832882B (zh) 2018-08-08 2024-02-21 美商杜邦電子股份有限公司 用於電子裝置中之聚合物
US12065543B2 (en) 2019-02-01 2024-08-20 Lg Chem, Ltd. Polyimide-based polymer film, substrate for display device, and optical device using the same
WO2020175671A1 (ja) 2019-02-28 2020-09-03 富士フイルム株式会社 ポリマー及びその製造方法、このポリマーを用いたガス分離膜、ガス分離モジュール、及びガス分離装置、並びにｍ－フェニレンジアミン化合物
JP6999611B2 (ja) * 2019-02-28 2022-01-18 富士フイルム株式会社 ポリマー及びその製造方法、このポリマーを用いたガス分離膜、ガス分離モジュール、及びガス分離装置、並びにｍ－フェニレンジアミン化合物
CN111960960B (zh) * 2019-05-20 2022-12-30 广东生益科技股份有限公司 二胺化合物、其制备方法、热固性树脂组合物及其应用
CN113387817A (zh) * 2021-07-27 2021-09-14 中国科学院长春应用化学研究所 一种含氟芳香二胺化合物及其制备方法和无色透明聚酰亚胺薄膜
CN115770494A (zh) * 2021-09-07 2023-03-10 中国石油化工股份有限公司 聚酰亚胺复合气体分离膜及其制备方法和应用
CN115869788B (zh) * 2021-09-27 2023-07-14 中国石油化工股份有限公司 具有三蝶烯基结构的聚酰亚胺无规共聚物及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008308433A (ja) * 2007-06-14 2008-12-25 Idemitsu Kosan Co Ltd トリプチセン構造を有する化合物、フォトレジスト基材及びフォトレジスト組成物
TW200907013A (en) * 2007-08-03 2009-02-16 Chien-Hong Cheng Triptycene derivatives and their application

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58208322A (ja) 1982-05-31 1983-12-05 Japan Synthetic Rubber Co Ltd ポリイミド化合物の製造方法
JPS60188427A (ja) 1984-03-09 1985-09-25 Nissan Chem Ind Ltd 新規なポリイミド樹脂及びその製造方法
JP2004359599A (ja) * 2003-06-04 2004-12-24 Hitachi Chem Co Ltd トリプチセンジアミンの製造方法
JP2006001968A (ja) 2004-06-15 2006-01-05 Hitachi Chem Co Ltd トリプチセン骨格を有するポリアミド酸、ポリイミド樹脂及びこれを用いた光学部品
EP2518124B1 (en) 2009-12-22 2021-04-07 Akebono Brake Industry Co., Ltd. Method for producing a friction material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008308433A (ja) * 2007-06-14 2008-12-25 Idemitsu Kosan Co Ltd トリプチセン構造を有する化合物、フォトレジスト基材及びフォトレジスト組成物
TW200907013A (en) * 2007-08-03 2009-02-16 Chien-Hong Cheng Triptycene derivatives and their application

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
A Threshold for Charge Transfer in Aromatic Interactions? A Quantitative Study of π-Stacking Interactions, J. Org. Chem., vol.70, 2005, pp.10532-10537.
Preparation and characterization of heat-resistant polyimide/titanium dioxide nanocomposite films containing triptycene side units by sol-gel processes, High Performance Polymers, vol.26, 2014, pp.373-380.
Preparation and characterization of heat-resistant polyimide/titanium dioxide nanocomposite films containing triptycene side units by sol-gel processes, High Performance Polymers, vol.26, 2014, pp.373-380. Solid-State Molecular Folding and Supramolecular Structures of Triptycene-Derived Secondary Dicarboxamides, J. Org. Chem., vol.67, 2002, pp.7343-7354. The Strength of Parallel-Displaced Arene-Arene Interactions in Chloroform, J. Org. Chem., vol.70, 2005, pp.3641-3644. A Threshold for Charge Transfer in Aromatic Interactions? A Quantitative Study of π-Stacking Interactions, J. Org. Chem., vol.70, 2005, pp.10532-10537. *
Solid-State Molecular Folding and Supramolecular Structures of Triptycene-Derived Secondary Dicarboxamides, J. Org. Chem., vol.67, 2002, pp.7343-7354.
The Strength of Parallel-Displaced Arene-Arene Interactions in Chloroform, J. Org. Chem., vol.70, 2005, pp.3641-3644.

Also Published As

Publication number Publication date
WO2016153064A1 (ja) 2016-09-29
KR20170131514A (ko) 2017-11-29
CN107614483A (zh) 2018-01-19
KR102557784B1 (ko) 2023-07-20
JP6748378B2 (ja) 2020-09-02
TW201710234A (zh) 2017-03-16
CN107614483B (zh) 2020-07-31
JPWO2016153064A1 (ja) 2018-01-25

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