TWI682440B - 半導體裝置的製造方法 - Google Patents

半導體裝置的製造方法 Download PDF

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Publication number
TWI682440B
TWI682440B TW105118781A TW105118781A TWI682440B TW I682440 B TWI682440 B TW I682440B TW 105118781 A TW105118781 A TW 105118781A TW 105118781 A TW105118781 A TW 105118781A TW I682440 B TWI682440 B TW I682440B
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TW
Taiwan
Prior art keywords
layer
photoresist layer
polycrystalline silicon
photoresist
manufacturing
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TW105118781A
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English (en)
Chinese (zh)
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TW201705228A (zh
Inventor
桜井仁美
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日商艾普凌科有限公司
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Publication of TW201705228A publication Critical patent/TW201705228A/zh
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Publication of TWI682440B publication Critical patent/TWI682440B/zh

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  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
TW105118781A 2015-06-30 2016-06-15 半導體裝置的製造方法 TWI682440B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015-131483 2015-06-30
JP2015131483 2015-06-30
JP2016040080A JP6736314B2 (ja) 2015-06-30 2016-03-02 半導体装置の製造方法
JP2016-040080 2016-03-02

Publications (2)

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TW201705228A TW201705228A (zh) 2017-02-01
TWI682440B true TWI682440B (zh) 2020-01-11

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TW105118781A TWI682440B (zh) 2015-06-30 2016-06-15 半導體裝置的製造方法

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JP (1) JP6736314B2 (ja)
TW (1) TWI682440B (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW405174B (en) * 1996-09-20 2000-09-11 Hitachi Ltd Process for manufacturing semiconductor integrated circuit device
TW580733B (en) * 1998-09-09 2004-03-21 Fujitsu Ltd Dry etching process and a fabrication process of a semiconductor device using such a dry etching process
TW200407998A (en) * 2002-08-14 2004-05-16 Lam Res Corp Method and compositions for hardening photoresist in etching processes
US20100044798A1 (en) * 2008-06-09 2010-02-25 Taiwan Semiconductor Manufacturing Company, Ltd. Transistor device and a method of manufacturing the same
US20150301454A1 (en) * 2014-04-16 2015-10-22 Canon Kabushiki Kaisha Semiconductor device manufacturing method and resist pattern forming method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW405174B (en) * 1996-09-20 2000-09-11 Hitachi Ltd Process for manufacturing semiconductor integrated circuit device
TW580733B (en) * 1998-09-09 2004-03-21 Fujitsu Ltd Dry etching process and a fabrication process of a semiconductor device using such a dry etching process
TW200407998A (en) * 2002-08-14 2004-05-16 Lam Res Corp Method and compositions for hardening photoresist in etching processes
US20100044798A1 (en) * 2008-06-09 2010-02-25 Taiwan Semiconductor Manufacturing Company, Ltd. Transistor device and a method of manufacturing the same
US20150301454A1 (en) * 2014-04-16 2015-10-22 Canon Kabushiki Kaisha Semiconductor device manufacturing method and resist pattern forming method

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Publication number Publication date
JP2017017308A (ja) 2017-01-19
TW201705228A (zh) 2017-02-01
JP6736314B2 (ja) 2020-08-05

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