TWI675423B - 異物除去裝置 - Google Patents
異物除去裝置 Download PDFInfo
- Publication number
- TWI675423B TWI675423B TW106119735A TW106119735A TWI675423B TW I675423 B TWI675423 B TW I675423B TW 106119735 A TW106119735 A TW 106119735A TW 106119735 A TW106119735 A TW 106119735A TW I675423 B TWI675423 B TW I675423B
- Authority
- TW
- Taiwan
- Prior art keywords
- carbon dioxide
- foreign matter
- chamber
- removing device
- dioxide particles
- Prior art date
Links
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 146
- 239000002245 particle Substances 0.000 claims abstract description 83
- 229910002092 carbon dioxide Inorganic materials 0.000 claims abstract description 54
- 239000001569 carbon dioxide Substances 0.000 claims abstract description 54
- 239000007787 solid Substances 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 11
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 56
- 235000011089 carbon dioxide Nutrition 0.000 abstract description 38
- 239000004065 semiconductor Substances 0.000 abstract description 20
- 238000004140 cleaning Methods 0.000 description 25
- 239000000463 material Substances 0.000 description 16
- 239000012530 fluid Substances 0.000 description 12
- 239000013078 crystal Substances 0.000 description 7
- 239000007921 spray Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP2016-117573 | 2016-06-14 | ||
| JP2016117573A JP6389988B2 (ja) | 2016-06-14 | 2016-06-14 | 異物除去装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201810448A TW201810448A (zh) | 2018-03-16 |
| TWI675423B true TWI675423B (zh) | 2019-10-21 |
Family
ID=60664074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106119735A TWI675423B (zh) | 2016-06-14 | 2017-06-14 | 異物除去裝置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6389988B2 (ko) |
| KR (1) | KR102133214B1 (ko) |
| CN (1) | CN109564865B (ko) |
| TW (1) | TWI675423B (ko) |
| WO (1) | WO2017217252A1 (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7129793B2 (ja) * | 2018-03-06 | 2022-09-02 | シャープ株式会社 | 接合装置 |
| CN110091256A (zh) * | 2019-06-12 | 2019-08-06 | 上海悦威电子设备有限公司 | 一种液态二氧化碳清洗设备 |
| KR102232036B1 (ko) * | 2019-08-27 | 2021-03-25 | 세메스 주식회사 | 약액 토출 장치 |
| DE102019129446A1 (de) * | 2019-10-31 | 2021-05-06 | Krones Ag | Vorrichtung und Verfahren zur Kopfrauminertisierung und Produktrestentfernung bei Flaschen |
| CN110700163A (zh) * | 2019-11-13 | 2020-01-17 | 华南理工大学广州学院 | 一种基于干冰微爆炸的隧道清洗机的喷头装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009099772A (ja) * | 2007-10-17 | 2009-05-07 | Iwatani Internatl Corp | 洗浄装置 |
| JP2011167822A (ja) * | 2010-02-22 | 2011-09-01 | Cool Technos:Kk | ドライアイススノー洗浄装置用噴射ノズル |
| WO2014076794A1 (ja) * | 2012-11-15 | 2014-05-22 | 三菱重工業株式会社 | 付着物除去装置と、該付着物除去装置を用いた蒸着システムおよび除去方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000117201A (ja) * | 1998-10-12 | 2000-04-25 | Sony Corp | 洗浄装置及び洗浄方法 |
| JP4802002B2 (ja) * | 2006-01-30 | 2011-10-26 | 芝浦メカトロニクス株式会社 | 基板の洗浄処理装置及び洗浄処理方法 |
| JP2009226290A (ja) * | 2008-03-21 | 2009-10-08 | Gurintekku Sanyo:Kk | 洗浄装置 |
| JP5889537B2 (ja) * | 2011-03-23 | 2016-03-22 | ファスフォードテクノロジ株式会社 | ダイボンダ |
| JP5540032B2 (ja) * | 2012-03-05 | 2014-07-02 | 富士フイルム株式会社 | ラビリンスシール、洗浄装置、洗浄方法、及び溶液製膜方法 |
| KR101731236B1 (ko) * | 2015-06-22 | 2017-05-02 | 주식회사 케이씨텍 | 기판 처리 장치 |
-
2016
- 2016-06-14 JP JP2016117573A patent/JP6389988B2/ja active Active
-
2017
- 2017-06-02 WO PCT/JP2017/020553 patent/WO2017217252A1/ja active Application Filing
- 2017-06-02 KR KR1020197001065A patent/KR102133214B1/ko active IP Right Grant
- 2017-06-02 CN CN201780049515.2A patent/CN109564865B/zh active Active
- 2017-06-14 TW TW106119735A patent/TWI675423B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009099772A (ja) * | 2007-10-17 | 2009-05-07 | Iwatani Internatl Corp | 洗浄装置 |
| JP2011167822A (ja) * | 2010-02-22 | 2011-09-01 | Cool Technos:Kk | ドライアイススノー洗浄装置用噴射ノズル |
| WO2014076794A1 (ja) * | 2012-11-15 | 2014-05-22 | 三菱重工業株式会社 | 付着物除去装置と、該付着物除去装置を用いた蒸着システムおよび除去方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017224664A (ja) | 2017-12-21 |
| CN109564865B (zh) | 2023-07-04 |
| KR20190019140A (ko) | 2019-02-26 |
| KR102133214B1 (ko) | 2020-07-13 |
| CN109564865A (zh) | 2019-04-02 |
| JP6389988B2 (ja) | 2018-09-19 |
| TW201810448A (zh) | 2018-03-16 |
| WO2017217252A1 (ja) | 2017-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI675423B (zh) | 異物除去裝置 | |
| JP4560486B2 (ja) | 基板付着物除去方法および基板乾燥方法並びにそれら方法を用いた基板付着物除去装置および基板乾燥装置 | |
| CN102211099B (zh) | 空气集尘装置 | |
| JP7065650B2 (ja) | ダイボンディング装置および半導体装置の製造方法 | |
| TWI568510B (zh) | 除塵噴嘴及除塵裝置 | |
| KR101271259B1 (ko) | 기판의 이물질 제거장치 | |
| TWI727271B (zh) | 接合裝置 | |
| TWI668061B (zh) | 異物除去裝置 | |
| JP5556023B2 (ja) | 吸着ヘッド、ワーク搬送装置及びワーク搬送方法、並びに、半導体チップ実装装置及び半導体チップ実装方法 | |
| US6474355B1 (en) | Particle removing vacuum system for assembly of FBGA packages | |
| KR20150088495A (ko) | 파티클의 비산 방지 기능이 구비된 공기 분사식 세정기 | |
| KR20190012584A (ko) | 에어 나이프 및 이를 포함하는 분진 제거 장치 | |
| KR20220077970A (ko) | 클리닝 유닛 및 이를 포함하는 기판 처리 장치 | |
| KR20210093500A (ko) | 다중 흡입구를 갖는 드라이 타입 초음파 클리너 | |
| TWI579222B (zh) | 氣流驅動晶圓取片之方法及其裝置 | |
| JP2008055398A (ja) | エアクリーナヘッドの断面構造 | |
| TWI415695B (zh) | 乾洗器以及乾洗系統 | |
| KR102130713B1 (ko) | 미세입자 세정용 냉각입자 생성장치 및 그 구동방법 | |
| JP4288367B2 (ja) | エアクリーナヘッドの噴出口の傾斜角度と吸込口の風量調整 | |
| JP2008194661A (ja) | エアクリーナヘッドの噴出口の噴出角度と吸込口の吸込角度と配置 | |
| KR101115988B1 (ko) | 칩 패드의 먼지제거시스템 | |
| KR20190075687A (ko) | 이물질 제거장치 | |
| JPH04282850A (ja) | 試料保持装置 | |
| JP2005313046A (ja) | 薄膜形成装置 | |
| KR101724451B1 (ko) | 수지 도포 장치에서 발생되는 퓸을 제거하는 장치 및 이를 포함하는 보호막형성 시스템 |