TWI670326B - 光與濕氣硬化型樹脂組成物、電子零件用接著劑、及顯示元件用接著劑 - Google Patents

光與濕氣硬化型樹脂組成物、電子零件用接著劑、及顯示元件用接著劑 Download PDF

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Publication number
TWI670326B
TWI670326B TW104115187A TW104115187A TWI670326B TW I670326 B TWI670326 B TW I670326B TW 104115187 A TW104115187 A TW 104115187A TW 104115187 A TW104115187 A TW 104115187A TW I670326 B TWI670326 B TW I670326B
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TW
Taiwan
Prior art keywords
moisture
light
resin composition
meth
compound
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TW104115187A
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English (en)
Chinese (zh)
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TW201600558A (zh
Inventor
結城彰
高橋徹
木田拓身
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日商積水化學工業股份有限公司
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Publication of TW201600558A publication Critical patent/TW201600558A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
TW104115187A 2014-05-13 2015-05-13 光與濕氣硬化型樹脂組成物、電子零件用接著劑、及顯示元件用接著劑 TWI670326B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014099743 2014-05-13
JPJP2014-099743 2014-05-13

Publications (2)

Publication Number Publication Date
TW201600558A TW201600558A (zh) 2016-01-01
TWI670326B true TWI670326B (zh) 2019-09-01

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ID=54479910

Family Applications (1)

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TW104115187A TWI670326B (zh) 2014-05-13 2015-05-13 光與濕氣硬化型樹脂組成物、電子零件用接著劑、及顯示元件用接著劑

Country Status (5)

Country Link
JP (2) JP5844504B1 (ja)
KR (1) KR102320903B1 (ja)
CN (2) CN105814094B (ja)
TW (1) TWI670326B (ja)
WO (1) WO2015174371A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016163353A1 (ja) * 2015-04-09 2016-10-13 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
WO2016167305A1 (ja) * 2015-04-17 2016-10-20 積水化学工業株式会社 硬化体、電子部品、表示素子、及び、光湿気硬化型樹脂組成物
WO2017094831A1 (ja) * 2015-12-02 2017-06-08 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
KR102326096B1 (ko) * 2016-08-09 2021-11-12 세키스이가가쿠 고교가부시키가이샤 접착제 조성물, 경화체, 전자 부품 및 조립 부품
WO2018087743A1 (ja) * 2016-11-14 2018-05-17 積水化学工業株式会社 湿気硬化型樹脂組成物及び組立部品
JP7088838B2 (ja) * 2017-08-18 2022-06-21 積水化学工業株式会社 湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
JP7228088B2 (ja) * 2018-10-09 2023-02-24 Dic株式会社 樹脂組成物及び該樹脂組成物から形成される物品
JP7205149B2 (ja) * 2018-10-09 2023-01-17 Dic株式会社 樹脂組成物及び該樹脂組成物から形成される物品
WO2022114186A1 (ja) * 2020-11-30 2022-06-02 積水化学工業株式会社 湿気硬化性樹脂組成物、及び電子機器用接着剤
CN115353810B (zh) * 2022-09-08 2024-01-30 杭州之江有机硅化工有限公司 一种uv和湿气双重固化胶粘剂及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006169348A (ja) * 2004-12-15 2006-06-29 Konishi Co Ltd 硬化性樹脂組成物
JP2013241508A (ja) * 2012-05-18 2013-12-05 Toagosei Co Ltd プラスチック製フィルム又はシート用活性エネルギー線硬化型接着剤組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0249347B2 (ja) * 1983-08-01 1990-10-29 Toa Gosei Chem Ind Sukuriininsatsutokoseinoyoimizubunsangatakanatsusetsuchakuzai
JP2000159851A (ja) * 1998-11-24 2000-06-13 Asahi Glass Co Ltd 常温硬化性組成物
JP3713160B2 (ja) * 1999-03-25 2005-11-02 積水化学工業株式会社 光重合性組成物、湿気硬化型粘接着性シート、及び部材の接合方法
JP3637565B2 (ja) * 2001-02-20 2005-04-13 大日本インキ化学工業株式会社 揺変性湿気硬化型ウレタン組成物
JP2005187615A (ja) * 2003-12-25 2005-07-14 Yunimatekku Kk 紫外線硬化型アクリル系組成物
JP4445305B2 (ja) * 2004-03-26 2010-04-07 美和ロック株式会社 鍵保管装置
JP5228370B2 (ja) 2007-04-27 2013-07-03 東亞合成株式会社 一液湿気硬化型ウレタン系ホットメルト接着剤組成物及びその使用方法
CN103703087B (zh) * 2011-07-22 2015-09-09 H.B.富勒公司 用在电子器件上的单组分双固化粘合剂
JP6061728B2 (ja) * 2013-02-27 2017-01-18 株式会社オートネットワーク技術研究所 ラジカル、アニオン併用型光硬化材料
JP5758958B2 (ja) * 2013-08-07 2015-08-05 株式会社オートネットワーク技術研究所 紫外線硬化性組成物及びこれを用いた硬化物
CN103525355B (zh) * 2013-10-16 2015-02-18 烟台德邦科技有限公司 一种液晶电视边框用紫外光固化胶及其制备方法
KR102323651B1 (ko) * 2013-10-18 2021-11-08 세키스이가가쿠 고교가부시키가이샤 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006169348A (ja) * 2004-12-15 2006-06-29 Konishi Co Ltd 硬化性樹脂組成物
JP2013241508A (ja) * 2012-05-18 2013-12-05 Toagosei Co Ltd プラスチック製フィルム又はシート用活性エネルギー線硬化型接着剤組成物

Also Published As

Publication number Publication date
CN105814094A (zh) 2016-07-27
KR20170008714A (ko) 2017-01-24
WO2015174371A1 (ja) 2015-11-19
KR102320903B1 (ko) 2021-11-02
TW201600558A (zh) 2016-01-01
JP2016065247A (ja) 2016-04-28
CN109679031A (zh) 2019-04-26
JPWO2015174371A1 (ja) 2017-04-20
CN105814094B (zh) 2019-01-18
JP5844504B1 (ja) 2016-01-20

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