TWI670318B - 環氧樹脂組成物、硬化物、纖維強化複合材料、纖維強化樹脂成形品、及纖維強化樹脂成形品之製造方法 - Google Patents

環氧樹脂組成物、硬化物、纖維強化複合材料、纖維強化樹脂成形品、及纖維強化樹脂成形品之製造方法 Download PDF

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Publication number
TWI670318B
TWI670318B TW104131581A TW104131581A TWI670318B TW I670318 B TWI670318 B TW I670318B TW 104131581 A TW104131581 A TW 104131581A TW 104131581 A TW104131581 A TW 104131581A TW I670318 B TWI670318 B TW I670318B
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TW
Taiwan
Prior art keywords
epoxy resin
fiber
resin composition
reinforced
molded article
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TW104131581A
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English (en)
Chinese (zh)
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TW201619281A (zh
Inventor
小林厚子
松井茂樹
谷井翔太
河崎顯人
森永邦裕
木村真實
林弘司
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日商迪愛生股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C08K5/053—Polyhydroxylic alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW104131581A 2014-09-25 2015-09-24 環氧樹脂組成物、硬化物、纖維強化複合材料、纖維強化樹脂成形品、及纖維強化樹脂成形品之製造方法 TWI670318B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-195129 2014-09-25
JP2014195129 2014-09-25

Publications (2)

Publication Number Publication Date
TW201619281A TW201619281A (zh) 2016-06-01
TWI670318B true TWI670318B (zh) 2019-09-01

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TW104131581A TWI670318B (zh) 2014-09-25 2015-09-24 環氧樹脂組成物、硬化物、纖維強化複合材料、纖維強化樹脂成形品、及纖維強化樹脂成形品之製造方法

Country Status (5)

Country Link
JP (1) JP5954516B1 (ko)
KR (1) KR102309169B1 (ko)
CN (1) CN106715581B (ko)
TW (1) TWI670318B (ko)
WO (1) WO2016047357A1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6809014B2 (ja) * 2016-04-18 2021-01-06 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法
TWI752057B (zh) 2016-07-20 2022-01-11 日商昭和電工材料股份有限公司 使用高頻帶的訊號的電子機器用複合薄膜、印刷線路板及其製造方法
US11292871B2 (en) 2017-06-09 2022-04-05 Hexion Inc. Epoxy resin systems for composites
CN107353396A (zh) * 2017-07-19 2017-11-17 黄山市恒泰化工有限公司 一种氨基功能化双酚a类环氧树脂的制备
KR20210090183A (ko) * 2018-11-14 2021-07-19 나가세케무텍쿠스가부시키가이샤 경화성 수지 조성물 및 경화성 시트
JP2020084118A (ja) * 2018-11-29 2020-06-04 株式会社ダイセル 樹脂組成物、及びその製造方法
WO2020250957A1 (ja) * 2019-06-14 2020-12-17 Dic株式会社 エポキシ樹脂組成物、硬化物、繊維強化複合材料、プリプレグ及びトウプリプレグ
CN110305610B (zh) * 2019-07-08 2021-08-31 保光(天津)汽车零部件有限公司 一种粘接锌镁铝镀层钢板的减震膨胀胶及其制备方法
WO2021010654A1 (ko) * 2019-07-12 2021-01-21 주식회사 삼양사 무수당 알코올-알킬렌 글리콜 조성물, 무수당 알코올 기반 우레탄 변성 폴리올 조성물, 및 에폭시 수지 조성물을 위한 이들의 용도
US20220251285A1 (en) * 2019-08-06 2022-08-11 Dic Corporation Curable composition, cured product, fiber-reinforced composite material, and molded article
JP7006853B2 (ja) * 2019-11-14 2022-01-24 Dic株式会社 硬化性組成物、硬化物、繊維強化複合材料、成形品及びその製造方法
JP7443838B2 (ja) * 2020-03-10 2024-03-06 日本ポリエチレン株式会社 樹脂組成物及び該樹脂組成物を用いた熱可逆架橋性成形体の製造方法
CN111826105B (zh) * 2020-06-11 2022-04-15 北京康美特科技股份有限公司 一种led用封装胶及其使用方法和应用
CN112275441A (zh) * 2020-09-15 2021-01-29 江西铭鑫冶金设备有限公司 一种废旧印刷电路板破碎后的树脂粉材质的螺旋溜槽及其制作工艺
CN115232585B (zh) * 2022-06-24 2023-11-24 同济大学 一种耐湿热水解的单组分环氧树脂组合物及其制备方法和应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223598A (en) * 1990-07-30 1993-06-29 Teijin Limited Plural liquid pack type, heat-curable polyisocyanate-polyol-polyepoxy resin composition and process for producing a shaped resin article therefrom
JP2010222408A (ja) * 2009-03-19 2010-10-07 Panasonic Electric Works Co Ltd フレキシブルプリント配線板用樹脂組成物、樹脂フィルム、プリプレグ、樹脂付き金属箔、フレキシブルプリント配線板
TW201311807A (zh) * 2011-07-20 2013-03-16 Daicel Corp 硬化性環氧樹脂組成物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2613330B2 (ja) * 1990-07-30 1997-05-28 帝人株式会社 多液型熱硬化性樹脂組成物及び硬化樹脂成形物の製造法
US5629379A (en) * 1994-09-27 1997-05-13 Harper; John D. Anhydride-hardened epoxy resin with polybutadiene-maleic anhydride adduct
US5962586A (en) * 1994-09-27 1999-10-05 Harper; John D. Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct
TW548312B (en) * 1999-06-30 2003-08-21 Nippon Zeon Corp Curable composition, and cured article
JP3767679B2 (ja) * 2001-01-17 2006-04-19 信越化学工業株式会社 高分子化合物、レジスト材料及びパターン形成方法
JP2002212320A (ja) * 2001-01-23 2002-07-31 Toray Ind Inc プリプレグおよび極低温タンク
EP1325937B2 (en) 2001-03-30 2014-08-06 Toray Industries, Inc. Epoxy resin composition, process for producing fiber -reinforced composite materials and fiber-reinforced composite materials
TWI278481B (en) * 2002-04-16 2007-04-11 Hitachi Chemical Co Ltd Thermosetting resin composition, prepreg and laminate using the same
JP5028903B2 (ja) 2006-08-09 2012-09-19 東レ株式会社 引き抜き成形繊維強化複合材料
KR20100058521A (ko) * 2007-08-02 2010-06-03 다우 글로벌 테크놀로지스 인크. 열경화된 완충재
JP5540487B2 (ja) * 2007-09-25 2014-07-02 日立化成株式会社 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP5353449B2 (ja) * 2008-05-28 2013-11-27 日立化成株式会社 半導体装置の製造方法、半導体封止用接着剤及び半導体装置
JP2010275374A (ja) * 2009-05-26 2010-12-09 Panasonic Electric Works Co Ltd フレキシブルプリント配線板用樹脂組成物、樹脂フィルム、プリプレグ、樹脂付き金属箔、フレキシブルプリント配線板
CN102516708B (zh) * 2011-11-25 2014-07-02 中国电力科学研究院 一种用于电网输电线路导线的复合芯及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223598A (en) * 1990-07-30 1993-06-29 Teijin Limited Plural liquid pack type, heat-curable polyisocyanate-polyol-polyepoxy resin composition and process for producing a shaped resin article therefrom
JP2010222408A (ja) * 2009-03-19 2010-10-07 Panasonic Electric Works Co Ltd フレキシブルプリント配線板用樹脂組成物、樹脂フィルム、プリプレグ、樹脂付き金属箔、フレキシブルプリント配線板
TW201311807A (zh) * 2011-07-20 2013-03-16 Daicel Corp 硬化性環氧樹脂組成物

Also Published As

Publication number Publication date
WO2016047357A1 (ja) 2016-03-31
TW201619281A (zh) 2016-06-01
CN106715581A (zh) 2017-05-24
JP5954516B1 (ja) 2016-07-20
KR102309169B1 (ko) 2021-10-08
CN106715581B (zh) 2019-01-15
KR20170065498A (ko) 2017-06-13
JPWO2016047357A1 (ja) 2017-04-27

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