TWI668172B - 元件處理器 - Google Patents

元件處理器 Download PDF

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Publication number
TWI668172B
TWI668172B TW106100462A TW106100462A TWI668172B TW I668172 B TWI668172 B TW I668172B TW 106100462 A TW106100462 A TW 106100462A TW 106100462 A TW106100462 A TW 106100462A TW I668172 B TWI668172 B TW I668172B
Authority
TW
Taiwan
Prior art keywords
transfer tool
component
pickup
unloading
loading
Prior art date
Application number
TW106100462A
Other languages
English (en)
Chinese (zh)
Other versions
TW201805220A (zh
Inventor
柳弘俊
Original Assignee
南韓商宰體有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商宰體有限公司 filed Critical 南韓商宰體有限公司
Publication of TW201805220A publication Critical patent/TW201805220A/zh
Application granted granted Critical
Publication of TWI668172B publication Critical patent/TWI668172B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW106100462A 2016-01-07 2017-01-06 元件處理器 TWI668172B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??10-2016-0002136 2016-01-07
KR20160002136 2016-01-07

Publications (2)

Publication Number Publication Date
TW201805220A TW201805220A (zh) 2018-02-16
TWI668172B true TWI668172B (zh) 2019-08-11

Family

ID=59274106

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106100462A TWI668172B (zh) 2016-01-07 2017-01-06 元件處理器

Country Status (4)

Country Link
KR (1) KR102633105B1 (fr)
CN (1) CN108701633A (fr)
TW (1) TWI668172B (fr)
WO (1) WO2017119786A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102430018B1 (ko) * 2017-12-20 2022-08-05 엘지디스플레이 주식회사 이송 헤드 어셈블리 및 발광소자 이송장치
CN110127280B (zh) * 2019-06-03 2021-06-15 苏州雷霆光电科技有限公司 一种用于led封装的光学性质测量器
WO2021091478A1 (fr) 2019-11-08 2021-05-14 Semiconductor Technologies & Instruments Pte Ltd Manipulateur de composants
KR102211372B1 (ko) * 2020-02-07 2021-02-03 (주)대호테크 렌즈 및 금형 이송 시스템

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140144121A (ko) * 2013-06-07 2014-12-18 (주)제이티 소자핸들러
KR20150122031A (ko) * 2014-04-22 2015-10-30 (주)제이티 이송툴모듈, 니들핀 조립체, 및 그를 가지는 소자핸들러

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10125743A (ja) * 1996-10-24 1998-05-15 Sony Corp 半導体装置の検査装置
KR100491304B1 (ko) * 2003-09-18 2005-05-24 미래산업 주식회사 번인 테스터용 소팅 핸들러
KR100627300B1 (ko) * 2005-04-01 2006-09-25 엘에스전선 주식회사 픽업 간격 조절 이송 장치
US8167524B2 (en) * 2007-11-16 2012-05-01 Asm Assembly Automation Ltd Handling system for inspecting and sorting electronic components
KR101428522B1 (ko) * 2008-05-21 2014-08-12 주식회사 원익아이피에스 진공처리시스템, 진공처리시스템에 사용되는 버퍼모듈 및진공처리시스템의 트레이 이송방법
KR101052726B1 (ko) * 2009-12-24 2011-08-01 (주)제이티 소자핸들러
KR101711497B1 (ko) * 2010-10-29 2017-03-02 삼성전자주식회사 반도체 칩 실장 장치
KR20120046633A (ko) * 2010-11-02 2012-05-10 삼성전자주식회사 반도체 패키지 몰딩 시스템 및 몰딩 방법
KR101338182B1 (ko) * 2011-03-18 2013-12-09 (주)제이티 엘이디소자 소팅장치
WO2013129872A1 (fr) * 2012-02-29 2013-09-06 (주)제이티 Appareil permettant de tester des éléments
KR102104051B1 (ko) * 2013-09-10 2020-04-23 (주)제이티 소자핸들러
KR20150057372A (ko) * 2013-11-19 2015-05-28 (주)제이티 소자핸들러
KR101496796B1 (ko) * 2014-03-07 2015-02-27 (주)제이티 소자핸들러 및 소자핸들링방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140144121A (ko) * 2013-06-07 2014-12-18 (주)제이티 소자핸들러
KR20150122031A (ko) * 2014-04-22 2015-10-30 (주)제이티 이송툴모듈, 니들핀 조립체, 및 그를 가지는 소자핸들러

Also Published As

Publication number Publication date
KR20170082992A (ko) 2017-07-17
WO2017119786A1 (fr) 2017-07-13
CN108701633A (zh) 2018-10-23
TW201805220A (zh) 2018-02-16
KR102633105B1 (ko) 2024-02-02

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