TWI667482B - Pushing apparatus for test handler - Google Patents

Abstract

The invention relates to a pressurizing device for a test sorter that supports testing of semiconductor devices. In the pressing device for a test and sorting machine of the present invention, the pressing plate is pressed so that one end of the matching plate and the corresponding facing surface of the first guide rail have a first gap and the other end of the matching plate corresponds to the second rail. The matching plate is fixed such that the facing surface has a second pitch, or the matching plate is fixed such that a virtual reference line parallel to the mounting and dismounting movement direction of the matching plate and passing through the matching plate becomes a reference for the thermal expansion or thermal contraction of the matching plate The shortest distance between the virtual reference line and the center point of the matching plate is less than the shortest distance between the virtual reference line and each side end of the matching plate, or the virtual reference line passes through the center point.

Description

   Pressurizing device for test sorter   

The present invention relates to a pressurizing device for a test sorter, and more particularly to a pressurizing device for a test sorter capable of coping with thermal expansion or contraction.

After the plurality of semiconductor devices produced are tested by the tester, they are divided into good products and defective products, and only good products are shipped.

The electrical connection between the tester and the semiconductor device is achieved by a test sorter. The present invention is a technology capable of coping with thermal expansion or thermal contraction during a high temperature test or a low temperature test. The technology of the test sorter related to this invention is disclosed in Korean Published Patent Nos. 10-2013-0079701, 10-2014-0147902, and Korean Granted Patent No. 10-0709114.

The test and sorting machine includes a loading device, a soak chamber, a test chamber, a pressurizing device, a desoak chamber, and an unloading device.

The loading device moves a plurality of semiconductor devices to be tested loaded on a customer tray to a test tray located at a loading position.

The soaking chamber is used to apply thermal stimulation to a plurality of semiconductor devices loaded in a test tray from a loading position. The produced semiconductor device can be tested at normal temperature, but it also needs to consider the environment with poor thermal properties, so in most cases the test will be performed at high or low temperature. In order to apply such thermal stimulation, a soaking chamber is provided.

The test chamber provides a space capable of testing a plurality of semiconductor devices loaded on a test tray passing through the soaking chamber. For this purpose, the tester is combined with the test chamber side.

The pressing device presses the plurality of semiconductor devices of the test tray located at the test position in the test chamber to the test socket side of the tester, so that the semiconductor devices can be electrically connected to the test socket. The present invention is closely related to such a pressurizing device, so it will be described in more detail with reference to FIG. 1.

The heat removal chamber is used to remove thermal stimuli from semiconductor devices loaded in a test tray from the test chamber. Therefore, the semiconductor device whose thermal stimulation is removed in the heat removal chamber can be appropriately unloaded by the unloading device.

The unloading device unloads a plurality of semiconductor devices from a test tray entering the unloading position and moves to an empty customer tray.

For reference, the test tray has a plurality of inserts for placing semiconductor devices and is moved by a plurality of transfer devices along a closed loop path that passes through the loading position, the testing position, and the unloading position and is connected to the loading position. Among them, the insert is set in a manner that can be slightly moved, regardless of tolerance, thermal deformation, etc., to achieve accurate position setting between the semiconductor device and the test socket.

On the other hand, a schematic side view of FIG. 1 illustrates an operation in which the semiconductor device D is electrically connected to the test socket TS through the pressurizing device 100.

Part (a) of FIG. 1 illustrates a state in which the semiconductor device D is depressurized, and part (b) of FIG. 1 illustrates that the semiconductor device D is pressurized toward the tester (TESTER) side by the pressing device 100 and the semiconductor device D and Test the state of the TS socket electrical connection.

The pressing device 100 basically includes a matching plate 110, a pressing plate 120, a driving source 130, a first holding rail 141, and a second holding rail 142.

The matching board 110 pressurizes the semiconductor device D mounted on the test tray TT to the test socket TS side of the tester. To this end, the matching plate 110 includes a plurality of pressing portions 111 and a setting plate 112.

The pressing portion 111 is in contact with the semiconductor device D during the pressing operation, and presses the semiconductor device D toward the test socket TS. Therefore, the number of the pressing portions 111 on the matching plate 110 is the same as the number of the plurality of interposers IS provided on the test tray TT and the plurality of semiconductor devices D mounted on the plurality of interposers IS.

A plurality of pressing portions 111 are provided on the setting plate 112. The upper TE portion serving as one end portion of the setting plate 112 is held by the first holding rail 141, and the lower portion BE portion serving as the other end portion thereof is held by the second holding rail. 142 hold.

The pressure plate 120 is used for fixing the matching plate 110 and transmitting the pressure power generated by the driving source 130 to the matching plate 110.

The driving source 130 advances or retreats the pressure plate 120, and finally advances the matching plate 110 fixed to the pressure plate 120 in the direction of the tester or in the opposite direction. At this time, if the driving source 130 advances the matching plate 110, as shown in part (b) of FIG. 1, the semiconductor device D presses the semiconductor device toward the test socket TS side through the pressing portion 111. When 110 is retracted, as shown in part (a) of FIG. 1, the pressure applied to the semiconductor device D by the pressing portion 111 is eliminated.

The first holding rail 141 holds the upper TE portion of the matching plate 110, and the second holding rail 142 holds the lower BE portion of the matching plate 110. Such a first holding rail 141 and a second holding rail 142 can also guide the movement of the matching plate 110 when the matching plate 110 is detached from the pressure plate 120, and thus they can also be named guide rails.

On the other hand, the semiconductor device D needs to be tested in a high-temperature or low-temperature environment. Therefore, the matching plate 110 made of a metal material undergoes thermal expansion or thermal contraction according to the test temperature environment. Therefore, the plurality of pressing portions 111 also move a distance of thermal expansion or thermal contraction at each position. In this case, due to the difference in thermal deformation between the test tray TT and the matching plate 110, the pressing portion 111 moves to a position beyond the moving range of the insert IS, so that the pressing portion 111 may not be able to accurately press the semiconductor device D. In addition, the electrical connection between the semiconductor device D and the tester may be defective, and the test socket TS, the insert IS, or the semiconductor device D may be damaged. In particular, as the size of the semiconductor device D becomes very small and the pitch between the plurality of terminals provided in the semiconductor device D also becomes minute, such a problem becomes larger and more frequent. Therefore, it is necessary to reduce the position change rate of the pressing portion 111 according to the thermal deformation of the matching plate 110 as much as possible.

In general, since the position of the matching plate 110 needs to be accurately set, the entire alignment is performed using one of the two holding rails 141 and 142 as a reference. For example, as shown in FIG. 1, in a vertical sorter in which the semiconductor device D and the tester are electrically connected when the test tray TT stands in a vertical manner, the second grip of the lower end portion of the matching plate 110 will be gripped by gravity. The track 142 is used as a reference to align the matching plates. Therefore, it can be seen from the enlarged parts A and B of FIG. 1 that the lower end (BE, the same as the lower end of the setting plate) of the matching plate 110 is in contact with the upper surface (TF) of the corresponding facing surface of the second holding rail 142. The upper end of the matching plate 110 (TE, which is the same as the upper end of the setting plate) is disposed in such a manner as to have a certain distance G from the bottom surface BF of the corresponding facing surface of the first holding rail 141. The distance G between the upper end TE of the matching plate 110 and the bottom surface BF of the first holding rail 141 is set in consideration of the difference in thermal deformation between the matching plate 110 and the pressure plate 120 at a high temperature.

However, as shown in FIG. 1, if the lower end BE of the matching plate 110 is supported by the second holding rail 142, the thermal deformation reference line of the matching plate 110 becomes the lower end BE of the matching plate 110. Therefore, the positional displacement of the upper end TE of the matching plate 110 according to the thermal deformation is large, and as a matter of course, the positional displacement of the pressing portion 111 adjacent to the upper end TE of the matching plate 110 is also large. Therefore, according to various conditions such as the size of the matching plate 110 or the difference in thermal deformation between the test tray TT and the matching plate 110, the pressing portion 111 adjacent to the upper end TE of the matching plate 110 may exceed the movement permission range of the insert IS. In this case, the problems described above based on thermal deformation will be even greater. The thermal deformation reference line means a fixed line whose position is fixed during thermal deformation.

Therefore, the applicant of the present application has proposed a technique of setting a thermal deformation reference line between two matching plates through Korean Patent Application No. 10-2014-0168691 (hereinafter referred to as "prior art").

However, the prior art is a structural design in which two matching plates are provided correspondingly on one test tray, and it can be appropriately applied when the width of the two matching plates is reduced by using the reference line as a reference. It is difficult to appropriately apply when the widths of the two matching plates are increased. The reason is that when the width of each of the two matching plates is large with the reference line as a reference, the position of the pressing portion having a large distance from the reference line naturally changes greatly, so the problems mentioned above still exist.

An object of the present invention is to provide a technique for minimizing a change in the position of a pressing portion where a maximum position shift occurs among a plurality of pressing portions of a matching plate during thermal expansion or thermal contraction.

The pressurizing device for a test sorting machine according to the first embodiment of the present invention includes a matching plate that presses a plurality of semiconductor devices loaded on a test tray toward a plurality of test socket sides of a tester to cause the semiconductor devices and The tester is electrically connected; a pressure plate is used to fixedly set the matching plate to advance or retreat in a direction in which the semiconductor device is pressurized; a driving source is used to move the pressure plate forward or backward; a first guide rail, When the matching plate is mounted and removed, guide one end portion of the matching plate; and a second guide rail, when the matching plate is mounted and removed, guide the other end portion of the matching plate, The pressing plate has at least one fixing unit, and the at least one fixing unit fixes the matching plate so that one end of the matching plate and a corresponding facing surface of the first rail have a first distance and another of the matching plate The side end and the corresponding facing surface of the second guide rail have a second distance, and the matching plate has a distance corresponding to that of the at least one fixed unit. Corresponds to a unit that is fixed to the pressing plate.

A pressurizing device for a test sorter according to a second embodiment of the present invention includes a matching plate that presses a plurality of semiconductor devices loaded on a test tray toward a plurality of test socket sides of a tester to cause the semiconductor devices and The tester is electrically connected; the pressure plate is used to fixedly set the matching plate to advance or retreat in the direction of pressing the semiconductor device; the driving source is used to move the pressure plate forward or backward, the pressure plate There is at least one fixed unit, and the at least one fixed unit fixes the matching plate so that a virtual reference line parallel to the mounting and dismounting movement direction of the matching plate and passing through the matching plate becomes a reference for the thermal expansion or thermal contraction of the matching plate The matching plate has at least one corresponding unit corresponding to the at least one fixed unit to be fixedly disposed on the pressure plate, and a shortest distance between the virtual reference line and a center point of the matching plate is smaller than the virtual reference. The shortest distance between the line and the two sides of the matching plate, or the virtual reference line Through said center point.

The fixing unit is a protruding pin, and the corresponding unit is an insertion groove into which the protruding pin is inserted, and the insertion groove is formed on a line passing by the virtual reference line.

In the pressurizing device for a test and sorting machine according to the first embodiment or the second embodiment, the fixing unit may be a protruding pin, and the corresponding unit may be an insertion slot into which the protruding pin is inserted. The direction of removal and movement of the matching plate is protruding, so that the arbitrary movement of the above matching plate in the direction of pressing the semiconductor device is restricted.

In the pressurizing device for a test and sorting machine according to the first embodiment or the second embodiment, the fixing unit may be a first protruding pin and a second protruding pin, and the corresponding unit may be the one through which the first protruding pin is inserted. The first insertion groove and the second insertion groove into which the second protruding pin is inserted, the first protruding pin may protrude in a direction that presses the semiconductor device, and the second protruding pin may protrude in a direction in which the matching plate is removed and moved. .

In the pressurizing device for a test and sorting machine according to the first embodiment or the second embodiment, the matching plates are provided with a plurality, and among the plurality of matching plates, a distance between a plurality of ends facing each other is different. When the thermal expansion or thermal contraction changes, the positions of the plurality of ends facing each other change. In this case, each of the plurality of matching plates corresponds to a test tray 1: 1.

According to the present invention, when thermal contraction or thermal expansion occurs, position changes occur at both ends of the matching plate, so the amount of position change at both ends is smaller than the amount of position change that may occur at the other end when one side segment is fixed. As a result, the positional movement of the pressing portion that causes the largest positional change can also occur within the movement range of the insert. Therefore, it is possible to ensure accurate electrical connection between the semiconductor device and the tester, and also to prevent damage to the test socket, the insert, the semiconductor device, and the like.

100‧‧‧Pressure device

110, 210‧‧‧ matching board

111, 211‧‧‧Pressing section

112, 212‧‧‧setting board

120‧‧‧Pressure plate

130‧‧‧Drive source

141‧‧‧First holding track

142‧‧‧Second grip track

200‧‧‧Pressure device / pressurizing device for test sorting machine

210B‧‧‧ Lower Matching Plate

210T‧‧‧Upper matching board

212a‧‧‧First insertion slot

212b‧‧‧Handle hole

212c‧‧‧Motion restriction hole

212d‧‧‧moving restriction slot

213‧‧‧Fixed parts

213a‧‧‧Second insertion slot

220‧‧‧Pressure plate

221‧‧‧The first prominent pin

222‧‧‧Second prominent pin

223‧‧‧Motion limiter

223a‧‧‧Limiting plate

224‧‧‧Positioning Beads

230‧‧‧Drive source

241‧‧‧First rail

242‧‧‧Second Rail

B‧‧‧ beads

D‧‧‧semiconductor device

G‧‧‧Pitch

G ₁ ‧‧‧ first pitch

G ₂ ‧‧‧Second Spacing

O ₁ , O ₂ , O ₃ ‧‧‧ center point

S0 ₁ , S0 ₂ , S ₁₀ , S ₁₁ , S ₁₂ , S ₂₀ , S ₂₁ ‧‧‧ shortest distance

BE, BE ₁ , BE ₂ ‧‧‧

BF‧‧‧ Underside

CP, CP ₁ , CP ₂ ‧‧‧ center point

CT ₁ 、 CT ₂ ‧‧‧Customer tray

DC‧‧‧De-heating chamber

GP, GP ₁ ‧‧‧Guide

GR ₁ ~ GR ₄ ‧‧‧Guide

IS‧‧‧ Insert

LA‧‧‧Loading device

LP‧‧‧Loading position

RP‧‧‧Excess

SC‧‧‧Homogeneous chamber

SL, SL ₁ , SL ₂ ‧‧‧ Virtual baseline

SP, SP ₁ ‧‧‧ Setting section

TC‧‧‧Test chamber

TE, TE ₁ , TE ₂ ‧‧‧

TF‧‧‧upper side

TH‧‧‧Test Sorting Machine

TP‧‧‧Test location

TS‧‧‧Test socket

TT‧‧‧test tray

UA, UP‧‧‧ unloading device

Parts (a) and (b) of FIG. 1 are reference diagrams for explaining a conventional pressurizing device for a test sorter.

2 is a conceptual plan view of a test sorter to which the pressurizing device for a test sorter of the present invention can be applied.

Fig. 3 is a cut-away perspective view of a pressurizing device for a test sorter applied in Fig. 2.

FIG. 4 is a cut-away perspective view of a matching plate used in the pressurizing device for the test sorter of FIG. 3.

FIG. 5 is a reference diagram for explaining a first insertion groove formed in the matching plate of FIG. 4.

FIG. 6 is a reference diagram for explaining a second insertion groove formed in the matching plate of FIG. 4.

FIG. 7 is a front view of the matching board of FIG. 4.

FIG. 8 is a reference diagram of the present invention for explaining a case where a plurality of matching plates are provided.

FIG. 9 is a cut-away perspective view of a pressure plate applied to the pressure device for the test sorter of FIG. 3.

FIG. 10 is a cross-sectional view for explaining the operating characteristics of the present invention.

FIG. 11 is a reference diagram for explaining a preferred application example of the present invention.

The preferred embodiments of the present invention will be described in detail with reference to the drawings. For the sake of brevity of description, descriptions of repetitive or substantially the same structures are omitted or compressed as much as possible.

Brief description of the test sorter

FIG. 2 is a conceptual plan view of a test sorter TH to which a pressurizing device 200 (hereinafter simply referred to as a pressurizing device) for a test sorter of the present invention can be applied.

The test sorting machine TH includes a loading device LA, a soaking chamber SC, a test chamber TC, a pressurizing device 200, a heat removing chamber DC, and an unloading device UA.

The loading device LA moves a plurality of semiconductor devices to be tested loaded on the customer tray CT ₁ to a test tray located at a loading position LP.

The soaking chamber SC is used to apply thermal stimulation to a plurality of semiconductor devices loaded on the test tray TT from the loading position LP.

The test chamber TC provides a space capable of testing a plurality of semiconductor devices loaded on a test tray TT passing through the soaking chamber SC.

The pressurizing device 200 presses the plurality of semiconductor devices of the test tray TT located at the test position TP in the test chamber TC to the test socket side of the tester, so that the semiconductor devices can be electrically connected to the test socket. This pressurizing device has the features to be described in this specification, and is therefore described in a catalog.

The heat removal chamber DC is used to remove a thermal stimulus from a semiconductor device mounted on a test tray TT from the test chamber TC.

The unloading device UA unloads a plurality of semiconductor devices from the test tray TT entering the unloading position UP and moves to the empty customer tray CT ₂ .

Of course, the test tray TT moves along a closed loop path that passes through the loading position LP, the test position TP, and the unloading position UP and is connected to the loading position LP.

For reference, the test sorter TH of FIG. 2 described above is a vertical sorter in which the semiconductor device and the tester are electrically connected when the test tray stands in a vertical manner.

Explanation of the pressurizing device

FIG. 3 is a cut-away perspective view of the pressure device 200 applied to the test sorter TH of FIG. 2.

Referring to FIG. 3, the pressure device 200 of the present invention includes a matching plate 210, a pressure plate 220, a driving source 230, a first guide rail 241, and a second guide rail 242.

The matching board 210 pressurizes the semiconductor device mounted on the test tray TT toward the test socket side. To this end, the matching plate 210 includes a plurality of pressing portions 211, a setting plate 212, and a fixing member 213 arranged in a matrix form as shown in the cut-away view of FIG. 4.

The pressing portion 211 is in contact with the semiconductor device during the pressing operation, and presses the semiconductor device toward the test socket side.

A plurality of pressing portions 211 are provided on the setting plate 212 in a matrix form. A first insertion groove 212a, a handle hole 212b, a movement restriction hole 212c, and a movement restriction groove 212d are formed in the installation plate 212.

The first insertion groove 212a is located at a right portion of the installation plate 212, and as shown in FIG. Such a first insertion groove 212a can be divided into a guide portion GP, a setting portion SP, and a redundant portion RP, and a first protruding pin 221 located in a pressure plate 220 described later is inserted.

When the matching plate 210 is provided, the guide portion GP guides the movement of the matching plate 210 moving horizontally in the vertical direction so that the matching plate 210 is set at a set height. For this reason, the guide portion GP has an inclination in which the width thereof expands toward the right direction, which is the direction in which the matching plate 210 device moves.

When the setting of the matching plate 210 is ended, the setting portion SP causes the matching plate 210 to be accurately set at the set height. Therefore, the setting portion SP is formed in a horizontal form to prevent vertical movement of the matching plate 210 due to gravity. Such a setting portion SP needs to have a first protruding pin 221 which can be located at the length of the setting portion SP regardless of whether thermal expansion or thermal contraction occurs at normal temperature or low temperature.

The redundant portion RP is further extended from the setting portion SP to the left, and is formed in consideration of the length of the matching plate 210 that has been installed due to thermal expansion due to high temperature.

In FIG. 5, O ₁ is the center point of the first protruding pin 221 at normal temperature, O ₂ is the center point of the first protruding pin 221 at low temperature, and O ₃ is the center point of the first protruding pin 221 at high temperature. In this example, for the convenience of explanation and understanding, the reference that distinguishes the guiding part GP, the setting part SP, and the redundant part RP is used as the position of the central points O ₁ , O ₂ , and O ₃ .

For reference, the positions of the center points O ₁ , O ₂ , and O ₃ in FIG. 5 and the description thereof are merely used to explain the first protruding pin 221 in the relative relationship between the first protruding pin 221 and the first insertion groove 212 a. Positional relationship with the first insertion groove 212a. That is, as shown in FIG. 5, the position of the first insertion groove 212 a is stopped and the manner in which the first protruding pin 221 is moved is merely used for clear explanation and understanding. Actually, the first insertion groove 212 a is thermally deformed. And the first protruding pin 221 both move. At this time, the position movement of the first insertion groove 212a of the matching plate 210 made of metal is larger than the position movement of the first protruding pin 221. Therefore, compared with the first insertion groove 212a, the moving amount of the first protruding pin 221 is small. If the thermal deformation coefficient of the pressure plate is theoretically 0, the position of the first protruding pin can be fixed. In this case, O ₁ = O ₂ = O ₃ . Therefore, it is preferable that the first protruding pin 221 is fixed and the first insertion groove 212a is moved. However, in order to clearly explain the guide portion GP, the setting portion SP, and the redundant portion RP through FIG. The manner in which a protruding pin 221 moves is shown.

A handle hole 212b is formed at a left portion of the setting plate 212 for an operator to hold the matching plate 210 by hand.

The movement restricting hole 212c is located on the left side of the installation plate 212 and directly on the right side of the handle hole 212b. The movement restriction hole 212c is long in the up-down direction and narrow in width in the left-right direction. Such a movement restriction hole 212c is used to exclude the possibility that the matching plate 210 mounted on the pressure plate 220 may be removed in the left direction due to an operation impact or an unexpected external force. Of course, a plurality of movement restriction holes 212c may be provided according to the embodiment.

The movement restriction groove 212d is located at a lower portion of the setting plate 212, and is the same as the movement restriction hole 212c, and is used to prevent the matching plate 210 from being arbitrarily removed when receiving an operation impact or an unexpected external force. Of course, the movement restricting groove 212d is used as a position setting unit that sets the position of the matching plate 210 when the matching plate 210 is detached and attached. Similarly, a plurality of movement limiting grooves 212d may be provided according to the embodiment.

The fixing member 213 is located at the left center portion of the installation plate 212 and slightly to the right of the handle hole 212b, and protrudes toward the rear side of the pressure plate 220, and a second insertion groove 213a is formed at the rear protruding portion.

As shown in the cross-sectional view of FIG. 6, the second insertion groove 213 a is formed by the fixing member 213 penetrating along the direction in which the matching plate 210 is detached and moved (the left-right direction in the drawing). Insertion groove 213a of the second guide portion may be divided into GP ₁ and a setting section SP _1, the pressing plate rear-described second pin projection 222 is inserted 220. This guide portion 213a of the second groove GP ₁ also has a more in the right direction, the width of the expansion inclination. Wherein the guide portion 213a of the second groove portion SP GP ₁ and setting the role and function of the guide portion ₁ and a setting section SP GP first insertion groove 212a is the same, so description thereof will be omitted.

FIG. 7 is a front view of the matching plate 210, and is a reference diagram for explaining the formation positions of the first insertion groove 212a and the second insertion groove 213a.

After passing through the center point CP of the matching plate 210 and drawing a horizontal virtual reference line SL in the left-right direction of the direction in which the matching plate 210 is disassembled and moved, the first insertion groove 212a and the second insertion groove 213a are located when viewed from the front. The line through which the virtual reference line SL passes. The matching plate 210 is fixed to the pressure plate 220 through the first insertion groove 212a and the second insertion groove 213a. Therefore, when thermal expansion or thermal contraction occurs, the position passed by the virtual reference line SL is fixed without moving in the vertical direction. The virtual reference line SL is used as a reference, and the upper part and the lower part move position up and down, respectively, according to the degree of thermal expansion or thermal contraction. That is, the thermal expansion or contraction in the up-down direction of the matching plate 210 is formed by using a virtual reference line SL passing through the center point CP as a fixed line. Therefore, the shortest distances S0 ₁ , S0 ₂ from the center point CP to both ends TE and BE Similarly, the position change amount of the upper end TE and the lower end BE of the matching plate 210 is only 1/2 (half) of the change amount of the entire upper and lower lengths of the matching plate 210.

On the other hand, when it is necessary to consider other cases where the matching plates 210 are provided, as shown in FIG. 8, the virtual reference lines SL ₁ , SL ₂ can also pass upward or downward from each center point CP ₁ , CP ₂ . Tilt position. In this case, to minimize the need to match the upper end plate 210T and the lower end BE TE _{1. 1,} the upper end plate 210B of the lower side matching the TE ₂ and a lower end position change amount BE _2. Therefore, it is necessary to set the positions of the upper ends TE ₁ and TE ₂ and the lower ends BE ₁ and BE ₂ of the matching plates 210T and 210B on the upper and lower sides to change. At this time, preferably, the shortest distance S ₁₀ between the center point CP ₁ of the upper matching plate 210T and the virtual reference line SL ₁ inclined upward is smaller than the virtual reference line SL ₁ and the upper end TE ₁ of the upper matching plate 210T. The shortest distance S ₁₁ between them can minimize the position variation of the lower end BE ₁ of the upper matching plate 210T. Similarly, preferably, the shortest distance S ₂₀ between the center point CP _{2 of the} lower matching plate 210B and the virtual reference line SL ₂ is smaller than the distance between the virtual reference line SL ₂ and the lower end BE ₂ of the lower matching plate 210B. The shortest distance S ₂₁ can minimize the change in position of the upper end TE ₂ of the lower matching plate 210B. Of course, the shortest distance S ₁₀ between the center point CP ₁ of the upper matching plate 210T and the virtual reference line SL ₁ is smaller than the shortest distance S ₁₂ between the virtual reference line SL ₁ and the lower end BE ₁ of the upper matching plate 210T. matching side plate 210B of the center point of the CP ₂ with the virtual reference line SL is the shortest distance S between ₂₂₀ smaller than the virtual reference line SL ₂ and the lower side of the upper end plate 210B matching the shortest distance between the TE ₂ S2 _2. Of course, as shown in FIG. 8, preferably, when a plurality of matching plates 210T and 210B are provided, the plurality of virtual reference lines SL ₁ and SL ₂ pass through the center points CP _{1 of the} matching plates 210T and 210B, respectively. , CP ₂ , so that the position changes of the upper ends TE ₁ and TE ₂ and the lower ends BE ₁ and BE ₂ of the respective matching plates 210T and 210B are also the same, so as to minimize the value of the maximum change amount.

The pressure plate 220 is used to fix the matching plate 210 and transmit power generated in the driving source 230 to the matching plate 210. For this reason, as shown in a partially exploded view of FIG. 9, the pressure plate 220 includes a first protruding pin 221, a second protruding pin 222, a movement limiter 223, and a positioning plunger 224 (ball plunger).

The first protruding pin 221 is located at a right portion of the pressure plate 220 and protrudes forward in a direction in which the pressure plate 220 moves during a pressure operation. As described above, the first protruding pin 221 is inserted into the first insertion groove 212a.

The second protruding pin 222 is located at a left portion of the pressure plate 220. Such a second protruding pin 222 projects in a direction corresponding to the direction in which the second insertion groove 213a is formed, and is projected to the left of the direction in which the matching plate 210 is removed when the matching plate 210 is replaced. Therefore, if the second protruding pin 222 is inserted into the second insertion groove 213a, the second protruding pin 222 prevents the matching plate 210 from being arbitrarily moved or removed in the forward direction, which is the direction in which the pressure plate 220 can be moved forward or backward. .

When the matching plate 210 receives an external force such as an operation impact, the movement limiter 223 restricts the matching plate 210 from moving in the left direction. To this end, the movement restrictor 223 has a restriction plate 223a that moves in the front-rear direction.

The restriction plate 223a is a unit for restricting the matching plate 210 from being removed in the left direction. Such a restriction plate 223a is inserted into the movement restriction hole 212c when moving forward, thereby restricting the matching plate 210 from moving in the left-right direction, and is released from the movement restriction hole 212c when moving backward, so that the matching plate 210 can be moved to the left. tear down.

The positioning bead 224 supports the bead B inserted into the movement restriction groove 212d by being moved forward or backward by a spring, so that the bead B retreats when an external force of more than a predetermined level occurs, and if the external force does not exist, the bead B keeps advancing. status. Therefore, when the matching plate 210 is moved from the left direction to the right direction due to an external force applied by an operator or the like during the installation operation, the beads B are retracted so that the matching plate 210 is guided by the first guide rail 241 and the second guide rail 242, thereby allowing Move to the right. In addition, if the bead B is inserted into the movement restriction groove 212d, an external force is no longer applied by the operator or the like. Therefore, the bead B restricts the matching plate 210 from arbitrarily moving in the left-right direction. In this respect, the positioning beads 224 contribute to the setting of the mounting end position of the matching plate 210.

As described above, the first protruding pin 221, the second protruding pin 222, the movement limiter 223, and the positioning bead 224 of the pressure plate 220 function as a fixing unit for fixing the matching plate 210. The insertion groove 212a, the second insertion groove 213a, the movement restriction hole 212c, and the movement restriction groove 212d function as corresponding units corresponding to the respective fixed units.

The driving source 230 advances or retreats the pressure plate 220 in the front-rear direction, and finally advances the matching plate 210 fixedly provided on the pressure plate 220 to the front as the tester side direction or to the rear as the opposite direction. Of course, if the driving source 230 advances the matching plate 210, the pressing portion 211 presses the semiconductor device toward the test socket side, and if the matching plate 210 moves backward, the pressure applied to the semiconductor device by the pressing portion 211 is removed.

The first guide rail 241 and the second guide rail 242 are used to guide the detachable movement of the matching plate 210.

The first guide rail 241 guides the upper TE portion that is one end of the matching plate 210, and the second guide 242 guides the lower BE portion that is the other end of the matching plate 210.

As can be referenced in FIG. 10, under the action of a plurality of fixed units and a plurality of corresponding units, when the fixing plate 210 is fixed and installed by the matching plate 210, the upper end TE of the matching plate 210 corresponds to the first guide rail 241. The bottom surface BF of the facing surface maintains the first pitch G ₁ , and the lower end BE of the matching plate 210 and the upper surface TF of the corresponding facing surface of the second guide rail 242 maintain the second pitch G ₂ . That is, the upper end TE and the lower end BE of the matching plate 210 are separated from the corresponding facing surfaces of the first guide rail 241 and the second guide rail 242, respectively. Therefore, when the thermal deformation occurs, using the virtual reference line SL as a fixed line, both the upper end TE and the lower end BE of the matching plate 210 can undergo position shift changes. In this embodiment, it is considered that a virtual reference line SL that is horizontal along the left-right direction passes the center point CP of the matching plate 210 to make the positions of the upper end TE and the lower end BE of the matching plate 210 the same, so it is preferable that The first pitch G ₁ and the second pitch G ₂ are also the same.

According to the present invention as described above, when the matching plate 210 is mounted, the upper TE portion and the lower BE portion of the matching plate 210 are guided by the first guide rail 241 and the second guide rail 242, respectively, and move from the left direction to the right direction. After the operator transmits the first restricting force from the matching plate 210 according to the action of the positioning bead 224, the operator confirms the matching of the matching plate 210 with the second restricting force inserted by the bead B of the positioning bead 224 into the movement restriction groove 212d. Accurate setting position. Among them, the first limiting force is the force that the matching plate 210 receives when one side of the matching plate 210 is in contact with the beads B of the positioning beads 224 for the first time, and the operator pushes the matching plate 210 against the force. The second limiting force is a force that the matching plate 210 receives as the bead B is inserted into the movement limiting groove 212d. Next, the operator further advances the matching plate 210. Due to the function of the first protruding pin 221, the first insertion groove 212a, the second protruding pin 222, and the second insertion groove 2132, the matching plate 210 ascends the guide portions GP and GP ₁ . In the vertical displacement, the lower end BE of the matching plate 210 is separated from the upper surface TF which is the corresponding facing surface of the second guide rail 242. Of course, the upper end TE of the matching plate 210 is separated from the bottom surface BF which is the corresponding facing surface of the first guide rail 241. As described above, when the matching plate 210 is mounted, thermal expansion or contraction occurs due to high or low temperature, and then the upper end TE and the lower end BE of the matching plate 210 are moved in the up-down direction based on the virtual reference line SL. In addition, such a positional movement of the upper end TE and the lower end BE does not exceed the movement range of the insert IS provided on the test tray TT, which is different from the past. Therefore, the reliability of the electrical connection between the semiconductor device and the tester can be ensured. Prevents damage to various components.

For reference, FIG. 11 shows a correspondence relationship between the upper matching plate 210T, the lower matching plate 210B, and the test tray TT when two upper matching plates 210T and 210B are applied. One upper and lower matching plate 210T / 210B corresponds to one test tray TT 1: 1. In this way, one upper and lower matching plate 210T / 210B corresponds to one test tray TT. Therefore, the area of the upper matching plate 210T and the lower matching plate 210B is wide, and the position of the edge portion where the thermal deformation occurs is large. In this case, the present invention can be suitably applied. Looking at the enlarged part, it can be seen that the upper and lower ends TE ₁ / TE ₂ and BE ₁ / BE _{2 of} each matching plate 210T / 210B are from the corresponding facing surfaces BF ₁ / BF ₂ , TF _{1 of the} guide rails GR ₁ to GR ₄ / TF ₂ separated. Of course, the present invention is optionally extended to a case where the plurality of matching plates 210 correspond to the plurality of test trays TT.

On the other hand, the above embodiment is described by taking the case of the vertical test sorter TH as an example, but the pressure device 200 according to the present invention can also be applied to the semiconductor device and the tester in a state where the test tray TT is horizontal. Connected horizontal test sorter.

As described above, the present invention is specifically described by referring to the embodiments of the drawings. However, the above embodiments are only described by taking the preferred embodiments of the present invention as an example. It cannot be understood that the present invention is limited to the above embodiments. The scope of the right of the invention should be understood according to the scope of protection of the invention and its equivalent scope.

Claims (7)

A pressurizing device for a vertical test sorting machine, in which the test tray stands vertically and the semiconductor device is electrically connected to the tester. The aforementioned pressurizing device for the vertical test sorting machine includes: a matching plate; The plurality of semiconductor devices are pressurized toward the test socket side of the tester to electrically connect the semiconductor device and the tester; the pressure plate is used to fix the aforementioned matching plate and can press the semiconductor device in a direction Forward or backward; a driving source for moving the pressure plate forward or backward; a first guide rail for guiding one end portion of the matching plate when the matching plate is moved in and out; and a second guide rail when the When the matching plate is moved, the other end portion of the matching plate is guided; the pressing plate has at least one fixing unit, and the at least one fixing unit fixes the matching plate to make one of the matching plates The side end and the corresponding facing surface of the first guide rail have a first distance, and the other end of the matching plate is opposite to the second guide rail. The corresponding facing surface having a second pitch; the match plate having the at least one fixing unit corresponding to at least one corresponding means, fixed to the pressing plate is provided. A pressurizing device for a test sorting machine includes: a matching plate that presses a plurality of semiconductor devices loaded on a test tray toward a plurality of test socket sides of a tester to electrically connect the semiconductor devices and the tester; A plate for fixing the aforementioned matching plate, capable of advancing or retreating in a direction in which the semiconductor device is pressurized; a driving source for advancing or retreating the pressure plate; the pressure plate having at least one fixing unit, At least one fixing unit fixes the matching plate so that the virtual reference line parallel to the mounting and dismounting movement direction of the matching plate and passing through the matching plate becomes a reference for thermal expansion or thermal contraction of the matching plate; At least one corresponding unit corresponding to at least one fixed unit is fixedly disposed on the pressure plate; the shortest distance between the virtual reference line and the center point of the matching plate is smaller than each of the virtual reference line and the matching plate The shortest distance between the two ends, or the aforementioned virtual reference line passes through the aforementioned center point. The pressurizing device for a test and sorting machine according to claim 2, wherein the fixed unit is a protruding pin; the corresponding unit is an insertion slot into which the protruding pin is inserted; the insertion slot is formed on a line through which the virtual reference line passes . The pressurizing device for a test and sorting machine according to claim 1 or 2, wherein the fixed unit is a protruding pin; the corresponding unit is an insertion slot into which the protruding pin is inserted; and the direction in which the protruding pin is removed and moved toward the matching plate. The protrusion makes the arbitrary movement of the aforementioned matching plate in the direction of pressing the semiconductor device restricted. The pressurizing device for a test and sorting machine according to claim 1 or 2, wherein the fixing unit is a first protruding pin and a second protruding pin, and the corresponding unit is a first insertion groove and A second insertion groove into which the second protruding pin is inserted; the first protruding pin projects in a direction in which the semiconductor device is pressed, and the second protruding pin projects in a direction in which the matching plate is removed and moved. The pressurizing device for a test and sorting machine as described in claim 1 or 2, wherein the aforementioned matching plates are provided with a plurality; in the aforementioned plurality of matching plates, when the distance between the plural ends facing each other is due to thermal expansion or heat When the contraction changes, the positions of the plurality of ends facing each other change. The pressurizing device for a test and sorting machine according to claim 6, wherein the plurality of the aforementioned matching plates respectively correspond to one test tray 1: 1.