TWI666183B - 貼合基板之分斷方法及分斷裝置 - Google Patents

貼合基板之分斷方法及分斷裝置 Download PDF

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Publication number
TWI666183B
TWI666183B TW104114611A TW104114611A TWI666183B TW I666183 B TWI666183 B TW I666183B TW 104114611 A TW104114611 A TW 104114611A TW 104114611 A TW104114611 A TW 104114611A TW I666183 B TWI666183 B TW I666183B
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TW
Taiwan
Prior art keywords
substrate
brittle material
cutting
breaking
elastic body
Prior art date
Application number
TW104114611A
Other languages
English (en)
Chinese (zh)
Other versions
TW201604156A (zh
Inventor
村上健二
武田真和
橋本多市
田村健太
秀島護
五十川久司
栗山規由
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201604156A publication Critical patent/TW201604156A/zh
Application granted granted Critical
Publication of TWI666183B publication Critical patent/TWI666183B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
TW104114611A 2014-07-30 2015-05-07 貼合基板之分斷方法及分斷裝置 TWI666183B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014154627A JP2016030413A (ja) 2014-07-30 2014-07-30 貼り合わせ基板の分断方法及び分断装置
JP2014-154627 2014-07-30

Publications (2)

Publication Number Publication Date
TW201604156A TW201604156A (zh) 2016-02-01
TWI666183B true TWI666183B (zh) 2019-07-21

Family

ID=55248984

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104114611A TWI666183B (zh) 2014-07-30 2015-05-07 貼合基板之分斷方法及分斷裝置

Country Status (4)

Country Link
JP (1) JP2016030413A (ko)
KR (1) KR20160015145A (ko)
CN (1) CN105321878A (ko)
TW (1) TWI666183B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI715718B (zh) * 2016-02-26 2021-01-11 日商三星鑽石工業股份有限公司 脆性基板之分斷方法
CN107866917A (zh) * 2017-11-15 2018-04-03 四川永祥硅材料有限公司 自动粘棒流水线
CN108170308B (zh) * 2017-12-25 2020-12-01 业成科技（成都）有限公司 异形材料贴合对位方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124537A (ja) * 1998-10-21 2000-04-28 Sharp Corp 半導体レーザチップの製造方法とその方法に用いられる製造装置
JP2011121817A (ja) * 2009-12-10 2011-06-23 Seiko Instruments Inc 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100670600B1 (ko) * 2006-02-02 2007-01-17 주식회사 에스에프에이 스크라이브 장치
JP2010040621A (ja) 2008-08-01 2010-02-18 Toshiba Corp 固体撮像デバイス及びその製造方法
JP2012206869A (ja) * 2011-03-29 2012-10-25 Seiko Instruments Inc ガラス体の切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
JP2013247147A (ja) * 2012-05-23 2013-12-09 Hamamatsu Photonics Kk 加工対象物切断方法、加工対象物、及び、半導体素子
TWI583522B (zh) * 2012-10-25 2017-05-21 三星鑽石工業股份有限公司 Disassembly method of laminated ceramic substrate
JP6039363B2 (ja) 2012-10-26 2016-12-07 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124537A (ja) * 1998-10-21 2000-04-28 Sharp Corp 半導体レーザチップの製造方法とその方法に用いられる製造装置
JP2011121817A (ja) * 2009-12-10 2011-06-23 Seiko Instruments Inc 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計

Also Published As

Publication number Publication date
CN105321878A (zh) 2016-02-10
KR20160015145A (ko) 2016-02-12
JP2016030413A (ja) 2016-03-07
TW201604156A (zh) 2016-02-01

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