TWI664748B - Ｌｅｄ系統 - Google Patents
Ｌｅｄ系統 Download PDFInfo
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- TWI664748B TWI664748B TW105114551A TW105114551A TWI664748B TW I664748 B TWI664748 B TW I664748B TW 105114551 A TW105114551 A TW 105114551A TW 105114551 A TW105114551 A TW 105114551A TW I664748 B TWI664748 B TW I664748B
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- Prior art keywords
- oxide
- active material
- led
- led system
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- 239000011149 active material Substances 0.000 claims abstract description 25
- 239000000203 mixture Substances 0.000 claims abstract description 25
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000843 powder Substances 0.000 claims abstract description 24
- 229910052709 silver Inorganic materials 0.000 claims abstract description 23
- 239000004332 silver Substances 0.000 claims abstract description 22
- 230000003287 optical effect Effects 0.000 claims abstract description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 10
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims abstract description 10
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000292 calcium oxide Substances 0.000 claims abstract description 7
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000005751 Copper oxide Substances 0.000 claims abstract description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- 229910000431 copper oxide Inorganic materials 0.000 claims abstract description 5
- 229910001923 silver oxide Inorganic materials 0.000 claims abstract description 5
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 5
- 239000011701 zinc Substances 0.000 claims abstract description 5
- 239000011787 zinc oxide Substances 0.000 claims abstract description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 6
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000007937 lozenge Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 2
- 229910003445 palladium oxide Inorganic materials 0.000 claims description 2
- 239000006187 pill Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- -1 polysiloxane Polymers 0.000 claims description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- JQPTYAILLJKUCY-UHFFFAOYSA-N palladium(ii) oxide Chemical compound [O-2].[Pd+2] JQPTYAILLJKUCY-UHFFFAOYSA-N 0.000 claims 1
- 239000000523 sample Substances 0.000 description 22
- 229910052717 sulfur Inorganic materials 0.000 description 18
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 17
- 239000011593 sulfur Substances 0.000 description 17
- 239000007789 gas Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 10
- 229910052736 halogen Inorganic materials 0.000 description 9
- 150000002367 halogens Chemical class 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000000460 chlorine Substances 0.000 description 7
- 230000035515 penetration Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 6
- 229910052801 chlorine Inorganic materials 0.000 description 6
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 125000004429 atom Chemical group 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 5
- 238000006731 degradation reaction Methods 0.000 description 5
- 239000003344 environmental pollutant Substances 0.000 description 5
- 231100000719 pollutant Toxicity 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000009931 harmful effect Effects 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 239000003440 toxic substance Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 231100000614 poison Toxicity 0.000 description 3
- 125000004434 sulfur atom Chemical group 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007596 consolidation process Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 239000002594 sorbent Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000012855 volatile organic compound Substances 0.000 description 2
- AZUYLZMQTIKGSC-UHFFFAOYSA-N 1-[6-[4-(5-chloro-6-methyl-1H-indazol-4-yl)-5-methyl-3-(1-methylindazol-5-yl)pyrazol-1-yl]-2-azaspiro[3.3]heptan-2-yl]prop-2-en-1-one Chemical compound ClC=1C(=C2C=NNC2=CC=1C)C=1C(=NN(C=1C)C1CC2(CN(C2)C(C=C)=O)C1)C=1C=C2C=NN(C2=CC=1)C AZUYLZMQTIKGSC-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012053 enzymatic serum creatinine assay Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000003230 hygroscopic agent Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- HBEQXAKJSGXAIQ-UHFFFAOYSA-N oxopalladium Chemical compound [Pd]=O HBEQXAKJSGXAIQ-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
- B01J20/04—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising compounds of alkali metals, alkaline earth metals or magnesium
- B01J20/041—Oxides or hydroxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
- B01J20/28002—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their physical properties
- B01J20/28004—Sorbent size or size distribution, e.g. particle size
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- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
- B01J20/28002—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their physical properties
- B01J20/28004—Sorbent size or size distribution, e.g. particle size
- B01J20/28007—Sorbent size or size distribution, e.g. particle size with size in the range 1-100 nanometers, e.g. nanosized particles, nanofibers, nanotubes, nanowires or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
- B01J20/28014—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their form
- B01J20/28016—Particle form
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- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
- B01J20/28014—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their form
- B01J20/2803—Sorbents comprising a binder, e.g. for forming aggregated, agglomerated or granulated products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
- B01J20/28054—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their surface properties or porosity
- B01J20/28057—Surface area, e.g. B.E.T specific surface area
- B01J20/28059—Surface area, e.g. B.E.T specific surface area being less than 100 m2/g
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Nanotechnology (AREA)
- Led Device Packages (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Separation Of Gases By Adsorption (AREA)
Abstract
本發明揭示一種含有活性組成物的非氣密密封式發光二極體(light-emitting diode；LED)系統，該活性組成物的量為每cm2之系統光學窗面積0.06mg與2.5mg之間，該活性組成物含有呈粉末形式之活性材料，其中至少75wt%之該活性材料係選自活性碳、銀、銅、鋅、氧化銅、氧化鋅、氧化鈣、氧化銀中之一或多者。
Description
本發明係關於含有活性組成物之發光二極體(light-emitting diode；LED)系統。活性組成物之目的係去除諸如硫或鹵素(特定參考氯)、含硫及含鹵素揮發性化合物的有害物質。
已知LED係利用一些半導體材料之光學性質以藉助於電子-電洞再結合產生光子的光電裝置。將電子與電洞透過以下兩個區注入至再結合區域中：一個區含有n型摻雜劑用於電子，另一區含有p型摻雜劑用於電洞，以便達成所謂的p-n接面。
LED光發射係藉由半導體材料及/或藉由一或多個發光材料(磷光體)判定及界定，該等發光材料各自在明確界定之可見光譜區中發射，藉由該等發光材料之適當組合實現不同色彩。舉例而言，可藉由組合紅色LED、綠色LED及藍色LED獲得白色光，或可使用單個發藍色/UV LED激勵鄰近磷光體重新發射較長波長之光，使得具有磷光體之單個LED可具有且呈現適當色譜，諸如黃色或黃色與紅色，其與來自LED之藍色發射組合產生白色光。
基本上，LED係半導體材料薄片(通常被稱作「晶粒」)，磷光體分散於該半導體材料薄片上方，該薄片連接至合適結構以用於供電
及熱耗散。接著藉由聚合囊封體保護該晶粒，且此系統通常已知為LED封裝。
出於本發明之目的，術語LED系統涵蓋安裝於傳統基板上方且用標準聚矽氧或環氧樹脂囊封之簡單LED封裝，以及由LED封裝及諸如散熱片、反射器、擴散器、燈泡或外部包封的額外組件組成之照明裝置兩者。
LED系統相對於傳統光源呈現增強的光發射及較長操作壽命，但可歸因於可自外部環境滲透(例如，來自波紋紙板或有機橡膠封裝之硫)或可自LED材料(諸如焊膏、印刷電路板(Printed Circuit Board；PCB)及襯墊材料)釋放之硫或鹵素(諸如氯)之存在而經歷效能衰減且顯現可靠性問題。更具體而言，LED系統之高操作溫度可導致釋放大量氯，氯與硫一起可分散於整個系統中，與鍍銀之反射表面反應，使其變黑，或與銀觸點反應，導致形成Ag2S及AgCl，改變其光學及/或電學性質。
為了解決此等問題，LED製造商嘗試最大程度避免使用釋放硫及/或鹵素之材料，但此導致在LED系統設計及製造中(例如)由於利用特定類型之PCB而使生產起來可為相當昂貴的約束。此外，不可能完全避免此等物質在LED之操作壽命期間滲透及釋放，因而LED將遭遇漸進式衰減，甚至在其實際使用之前，在作為庫存保存於擱架上時，就遭遇衰減。
如已概述，LED系統之主要降級原因中之一者係與存在於大氣中且即使低濃度仍可誘發上述光學及電學性質衰減之硫或鹵素(特定參考氯)及其化合物的滲透有關。特定而言，在一些受污染區中，空氣中之S化合物或Cl化合物的含量可顯著高於平均值(例如，在接近於公路的
一些區中或在隧道中，H2S濃度可高於10ppb)，且透過非氣密密封式LED系統之擴散可導致加速降級之問題。硫化氫(H2S)結果係可影響LED系統之效能的最有害污染物之一，因而下文的本發明之描述主要參考污染物H2S，但當然，其亦涉及與其他S化合物或鹵素化合物有關之所有效應。
本發明之目標為提供一種能夠解決此等問題之LED系統，且在其第一態樣中，本發明係一種LED系統，其具有光學窗及非氣密密封之內部體積，此意謂當H2S外部體積濃度係10ppb時，進入該內部體積之H2S為5.5×10-4微克/天與1.9×10-1微克/天之間，且該LED系統在該內部體積中含有活性組成物，該活性組成物的量為每cm2之系統光學窗面積0.06mg與2.5mg之間，該活性組成物含有呈粉末形式之活性材料，其中至少75wt%之該活性材料係選自活性碳、銀、銅、鋅、氧化銅、氧化鋅、氧化鈣、氧化銀中之一或多者。
較佳地，該或該等活性材料粉末(在使用活性材料之混合物之情形下)之平均大小在0.1μm與20μm之間。對於非球形粉末，該大小係指最大顆粒尺寸。
較佳地，每cm2之光學窗面積的該活性組成物的量係在0.1mg與1mg之間。
用於室外應用之LED系統可為氣密密封、開放式或非氣密
密封的。
氣密密封式系統可遭遇在LED系統內之光學組件上水蒸氣冷凝的問題：儘管系統為密封的，已知濕氣可緩慢地穿過系統部件透入，且因此可發生與H2O累積及光學渾濁化有關之問題；因而，氣密密封式系統必須考慮濕氣透入且需要特定設計以避免水蒸氣冷凝，此增加複雜性及成本。
開放式系統旨在藉助於與外部環境交換空氣而容易地進行LED熱管理，諸如在CREE工業對所謂的4Flow Filament冷卻對流技術之最近開發中；該氣體交換程度亦使有毒物質在燈內之滯留時間減至最小，但彼等有毒物質仍然影響LED操作。
最後為非氣密式系統，亦即，仍然具有與外部環境之有限氣體交換的封閉系統；在先前技術中，諸如在美國專利申請案2013/092969中，氣體交換被視為關於提供氣密密封之障礙的折中方案，且吸氣劑被描述為用於應付與歸因於非氣密密封而與外部環境之有限氣體交換相關聯之濕氣及/或氧的構件。
本發明入已判定具有受控制氣體滲透範圍之非氣密密封式系統中之透入與用於硫/鹵素有毒化合物去除之活性組成物量之間的恰當平衡，從而允許保證水蒸氣蒸發及遷移至外部環境的與外部環境之氣體交換以及最大活性化合物效率。在正常LED系統操作期間之加熱有利於氣體交換，即使該氣體交換不足以在熱管理房面產生任何益處，此係因為氣體交換比在開放式系統組態中低得多。
本發明因而係對於揭示於美國專利申請案2014/168526(描
述可有效地插入於LED系統中之活性組成物量之大得多的範圍)中之內容的改進。
氣體交換亦避免可由系統組件排氣的揮發性有機化合物(volatile organic compound；VOC)冷凝，且因此亦避免後續渾濁化。
本發明人已判定同時考慮濕氣冷凝問題與含硫污染物(亦即，H2S，且更一般而言，硫揮發性化合物)之存在的恰當平衡，此係因為根據本發明之LED系統屬於非氣密密封類型之裝置(亦即，允許與外部環境之有限氣體交換的裝置)，且能夠避免與以上污染物有關之有害效應，同時確保適當濕氣交換且克服水蒸氣冷凝問題。
因而，根據本發明之LED系統未必需要存在吸濕氣劑。因而，此解決方案不同於揭示於美國專利申請案2013/092969中之解決方案，美國專利申請案2013/092969集中於具有極低氧氣及濕氣透入之密封式LED裝置，描述吸氧氣及/或濕氣劑以彌補非完美氣密密封之缺陷。特定而言，根據本發明之系統經設計成具有有限但有意義的氣體交換，確保水蒸氣之足夠流入及流出，且不同於美國專利申請案2013/092969，此類氣體交換(因而包括作為所要效應且並非有害現象之濕氣交換)係系統之恰當操作所需要的。在根據本發明之非氣密性程度下，通用吸濕氣劑之存在將充當濃縮器，導致在LED接通期間大量氣體釋放，以及隨之而來的歸因於霧化之光發射降級。實際上，通用吸濕氣/氧氣劑將達成與環境之平衡壓力，但由於LED操作以及隨之而來的加熱之效應，溫度增加將誘發新的較高平衡壓力並伴有固有的氣體釋放。舉例而言，在70℃下，自吸氣劑釋放對應於每cm3之內系統自由體積約0.2mg之少量水就足以產生飽和水蒸氣且開始水冷凝。
重要的是要強調，進入至LED系統之內部體積中的H2S將隨外部H2S濃度增減，例如，在加速測試之情形下，外部環境可調節為在10ppm(亦即，為相對於給定參考濃度之1000倍的濃度)下，且因此H2S之透入量將相應增加至介於5.5×10-1微克/天與1.9×102微克/天之間的範圍。可藉由不同手段(諸如使用外部可透入容器或可透入壁)或藉由幾乎不可透入但具有一些小開口/針孔或使用可透入密封墊(諸如基於聚矽氧之密封墊)之容器達成LED系統之內氣氛與外部環境之間的此程度的相互作用。
根據本發明之LED系統之主要益處為確保有效去除可滲透且影響該LED系統之效能的氣態有毒物質，防止由色彩改變及反射表面降級以及由銀觸點(若存在)之電特性更改造成之照明效能衰減。
根據本發明之LED系統之另一相關益處係由自由選擇所採用材料而不需考慮可能產生硫及鹵素(主要為氯但並非僅為氯)來提供，使得該系統更可靠、更簡易且同時製造起來較不昂貴。
存在於根據本發明之LED系統中之活性組成物中所含有的活性材料較佳地以具有高於70m2/g之高比表面積之粉末形式使用。
此外，本發明人已發現在LED系統內使用活性碳、銀、銅、鋅、氧化銅、氧化鋅、氧化鈣、氧化銀作為活性組成物中所含有之活性材料的主要組分不僅確保了自室溫直至100℃下的硫及鹵素去除，而且即使在係最大LED操作溫度的130℃下，該等組分仍將不釋放此類污染物。
此係關於硫吸附劑之額外性質，硫吸附劑諸如常見且廣泛使用之矽膠，其僅保證在低溫下之良好吸附能力且在低於100℃已具有可逆釋放，如在由M.Suzuki編著之圖書「Fundamentals of adsorption」(東京大學，
1993)第294頁中所證明。此外，發現以介於總活性材料量之1wt%與25wt%之間的累計百分比將較小量之氧化鈰、氧化鐵、氧化錳、氧化鈀、氧化錫或其組合添加至主要活性材料可改進針對所描述污染物之去除作用。
活性材料通常置放於LED系統內距離晶粒或距離晶粒陣列等於或小於2cm之距離處，此確保且最大化針對LED系統之較敏感組件(亦即，銀反射塗層及銀觸點(若存在銀觸點))之保護作用。
按原樣呈粉末形式之活性材料的適合組態係在容器內。此組態之實例為熟習此項技術者所眾所周知的，且可例如在皆在申請人名下且教示內容以引用方式併入本文中之歐洲專利1851783及2408942中發現。
作為替代方案，活性組成物可以壓縮粉末形式使用。在此情形下，較佳形狀為丸劑及錠劑，且在此情形下，亦可在歐洲專利2408942中發現額外細節。
在此情形下亦較佳地按原樣直接置放於接近於LED晶粒(或LED晶粒陣列)處之活性組成物之另一較佳組態呈粉末形式，較佳為分散於適合聚合基質中之高比表面積粉末(70m2/g)。較佳基質係選自含聚矽氧樹脂或含聚矽氧-環氧樹脂或含聚矽氧-丙烯酸酯樹脂。作為替代方案，活性組成物可應用於適合的支撐件或條帶(較佳地金屬條帶)上。在一較佳實施例中，活性組成物分散於例如聚合基質中，且較佳地分散於含聚矽氧樹脂中，沈積及黏著於支撐件上，如在申請人名下之歐洲專利1595930中所描述。
在另一較佳組態中，活性材料呈分散於在晶粒上方置放之囊封聚合樹脂中之高比表面積活性粉末形式，其中以不顯著地更改樹脂透明
度之方式選擇粉末尺寸及濃度。舉例而言，高比表面積活性粉末可以在0.1wt%與12wt%之間、較佳地1.5wt%與8wt%之間的濃度分散於樹脂中。在此具體實施例中，較佳樹脂係聚矽氧。
一般而言，本發明涵蓋粉末以原樣使用的情況，但亦可藉助於適合化學試劑(黏合劑)或藉助於適合固結處理(例如，諸如燒結之熱處理)以適合地分散及黏合方式有利地使用。
將藉助於以下非限制性實施例進一步說明本發明。
實例1a：樣本製備
將銀層或銀塗層應用於不鏽鋼基板上，製備數個樣本，每一基板具有12.5cm2之表面。所應用銀層或塗層之平均厚度係5μm，且覆蓋係一致的。在數個樣本點上平均化所量測報告值。依據基板在沈積及固結前後的重量差計算所沈積銀之重量，針對基質之殘餘物校正該重量。
比較樣本C1由膠合於不鏽鋼基板上之銀箔組成；樣本上之銀的比負荷(specific load)係5.2mg/cm2，其表示在上文參考之美國專利申請案2014/168526中描述之解決方案，因為此量對應於在一半的基板表面上之具有10微米厚度之銀層。
使用由小Ag顆粒、黏著劑及分散劑之組合組成之銀膏，藉由刀片刮抹以約5μm之厚度沈積且在90分鐘內在空氣中在250℃下固結該銀膏，製備其他樣本；藉由使此等組分之相對量變化，製得具有銀的最終平均比負荷之不同樣本，更具體而言，具有2.9mg/cm2之比較樣本C2以及具有2.0mg/cm2之樣本S1。
此外，藉由以刀片刮抹方式沈積且在90分鐘內在空氣中在
250℃下固結銀粉末與氣體可透入含聚矽氧樹脂及揮發性溶劑混合而得之膏，製備具有較低銀含量之樣本；藉由使此等組分之相對量變化，製得具有銀的最終平均比負荷之不同樣本，更具體而言，具有0.8mg/cm2之樣本S2、具有0.5mg/cm2之樣本S3、具有0.08mg/cm2之樣本S4以及具有0.005mg/cm2之最終樣本C3。
實例1b：樣本表徵
已評價所製備樣本的隨Ag比負荷而變的關於對硫之吸附能力的相對效能。藉助於在具有220cc/min流量之氮載氣中之4ppm濃度的H2S流，在容納所有樣本之約1公升的室中遞送硫。所有樣本已暴露在相同條件下歷時15小時之相同時間。
在表1中展示所獲得之結果，報告了樣本ID、平均銀負荷以及藉由經校準能量色散X射線(Energy-Dispersive X-ray；EDX)探針在樣本上量測之S原子相對於Ag原子之相對量，因而指示不同樣本效率。
有可能觀測到，僅對於根據本發明之樣本，存在高於1%之效率，最佳樣本(S2)比根據美國專利申請案2014/168526製得之樣本C1所達成的效率高幾乎兩個數量級。識別了效率的下限：1% S/Ag原子比率被視為確保所採用的解決方案(亦鑒於對光學窗面積之指定約束條件)不僅
能夠移除一定量之S，而且具有可接受動態(如由在15小時之實驗持續時間之後達成及量測之S負荷所證明)之適合值。
實例2a：樣本製備
此實例在根據本發明之兩個實施例間做出比較；特定而言，以與S2相同之方法但以含有代替Ag粉末之氧化鈣(90% wt)與氧化鐵(10% wt)之粉末混合物的膏製備樣本S5。樣本S5具有0.3mg/cm2之活性組成物負荷以及5μm之塗層厚度。
實例2b：樣本表徵
類似於實例1b，已評價所製備樣本的關於對硫之吸附能力(表達為S原子相對於活性組成物原子(針對S2之Ag原子、針對S5之Ca+Fe原子)之相對量)的相對效能。在表2中報告結果。
如在表2中所展示，樣本S2及S5皆具有遠高於1%(S原子)/(活性組成物原子)比率之能力；即使S5具有較低活性組成物負荷，此樣本仍能夠達成較高效率，因此此特定解決方案(氧化鈣與氧化鐵組合)係根據本發明之較佳實施例。
Claims (13)
- 一種發光二極體(light-emitting diode；LED)系統，其具有光學窗及非氣密密封之內部體積，其中當H2S外部體積濃度係10ppb時，進入該內部體積之H2S在5.5×10-4微克/天與1.9×10-1微克/天之間，且該LED系統在該內部體積中含有活性組成物，該活性組成物的量為0.06mg/每cm2之系統光學窗面積與2.5mg/每cm2之系統光學窗面積之間，該活性組成物含有呈粉末形式之活性材料，該活性材料係選自活性碳、銀、銅、鋅、氧化銅、氧化鋅、氧化鈣、氧化銀中之一或多者，其量使得該活性碳、銀、銅、鋅、氧化銅、氧化鋅、氧化鈣、氧化銀中之一或多者占該活性材料之至少75wt%。
- 如申請專利範圍第1項之LED系統，其中該等活性材料粉末具有在0.1μm與20μm之間的平均大小。
- 如申請專利範圍第1項之LED系統，其中該活性材料含有選自氧化鈰、氧化鈀、氧化錫、氧化鐵、氧化錳中之一或多個額外物質，其量在該活性材料之1wt%與25wt%之間。
- 如申請專利範圍第1項之LED系統，其中該活性組成物的量為0.1mg/每cm2之光學窗面積與1mg/每cm2之光學窗面積之間。
- 如申請專利範圍第1項之LED系統，其中該活性材料呈具有70m2/g之比表面積的粉末形式。
- 如申請專利範圍第1項之LED系統，其中該等活性材料粉末保持於適合容器中。
- 如申請專利範圍第1項之LED系統，其中該等活性材料粉末被壓縮成單獨丸劑或錠劑形式。
- 如申請專利範圍第1項之LED系統，其中該等活性材料粉末分散於聚合基質中。
- 如申請專利範圍第8項之LED系統，其中含有該等活性材料粉末之該聚合基質沈積於支撐條帶上。
- 如申請專利範圍第8項之LED系統，其中該活性組成物中之該等活性材料粉末之濃度係在0.1wt%與12wt%之間。
- 如申請專利範圍第10項之LED系統，其中該活性組成物置放於LED晶粒上方以用於其囊封。
- 如申請專利範圍第8項之LED系統，其中該聚合基質係基於含聚矽氧或含聚矽氧-環氧樹脂或含聚矽氧-丙烯酸酯樹脂。
- 如申請專利範圍第9項之LED系統，其中該支撐條帶為金屬條帶。
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| ITUB20160888A1 (it) | 2016-02-19 | 2017-08-19 | Getters Spa | Sistema led |
| DE102018100598A1 (de) * | 2018-01-12 | 2019-07-18 | Osram Opto Semiconductors Gmbh | Verfahren zum steuern eines stromes einer leuchtdiode |
| RU192820U1 (ru) * | 2018-11-13 | 2019-10-02 | Василий Сергеевич Евтеев | Свето-информационное устройство |
| RU2724365C1 (ru) * | 2020-01-17 | 2020-06-23 | Общество с ограниченной ответственностью "ГиперРеклама" | Система и способ автоматизированного производства цифровых рекламных материалов |
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| JP6721612B2 (ja) | 2020-07-15 |
| WO2016181293A1 (en) | 2016-11-17 |
| EP3210244B1 (en) | 2017-12-20 |
| CN107580526A (zh) | 2018-01-12 |
| US20170256688A1 (en) | 2017-09-07 |
| EP3210244A1 (en) | 2017-08-30 |
| KR102283169B1 (ko) | 2021-07-30 |
| KR20180005664A (ko) | 2018-01-16 |
| US9818920B2 (en) | 2017-11-14 |
| PL3210244T3 (pl) | 2018-06-29 |
| TW201642495A (zh) | 2016-12-01 |
| JP2018517291A (ja) | 2018-06-28 |
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