TWI659510B - 電子裝置及其製造方法 - Google Patents

電子裝置及其製造方法 Download PDF

Info

Publication number
TWI659510B
TWI659510B TW106132788A TW106132788A TWI659510B TW I659510 B TWI659510 B TW I659510B TW 106132788 A TW106132788 A TW 106132788A TW 106132788 A TW106132788 A TW 106132788A TW I659510 B TWI659510 B TW I659510B
Authority
TW
Taiwan
Prior art keywords
electronic component
conductive layer
thermally conductive
molded body
resin molded
Prior art date
Application number
TW106132788A
Other languages
English (en)
Chinese (zh)
Other versions
TW201814853A (zh
Inventor
Wakahiro Kawai
川井若浩
Original Assignee
Omron Corporation
日商歐姆龍股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corporation, 日商歐姆龍股份有限公司 filed Critical Omron Corporation
Publication of TW201814853A publication Critical patent/TW201814853A/zh
Application granted granted Critical
Publication of TWI659510B publication Critical patent/TWI659510B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW106132788A 2016-10-14 2017-09-25 電子裝置及其製造方法 TWI659510B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016202796A JP6610497B2 (ja) 2016-10-14 2016-10-14 電子装置およびその製造方法
JP2016-202796 2016-10-14

Publications (2)

Publication Number Publication Date
TW201814853A TW201814853A (zh) 2018-04-16
TWI659510B true TWI659510B (zh) 2019-05-11

Family

ID=61905396

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106132788A TWI659510B (zh) 2016-10-14 2017-09-25 電子裝置及其製造方法

Country Status (6)

Country Link
US (1) US10879145B2 (https=)
EP (1) EP3528600B1 (https=)
JP (1) JP6610497B2 (https=)
CN (1) CN109691242B (https=)
TW (1) TWI659510B (https=)
WO (1) WO2018070192A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6589100B1 (ja) * 2018-06-08 2019-10-16 株式会社Ｌｉｂｅｒａｗａｒｅ フレーム組立体
JP7339517B2 (ja) 2019-09-12 2023-09-06 日亜化学工業株式会社 発光装置の製造方法および発光装置
CN120659453A (zh) 2019-11-22 2025-09-16 日亚化学工业株式会社 发光模块

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1567574A (zh) * 2003-06-30 2005-01-19 矽品精密工业股份有限公司 具有散热件的半导体封装件
CN1602555A (zh) * 2001-04-10 2005-03-30 奥斯兰姆奥普托半导体有限责任公司 辐射元件的芯片引线架、辐射元件及其制造方法
TWM507138U (zh) * 2015-03-25 2015-08-11 Polytronics Technology Corp 散熱電路板
TW201606954A (zh) * 2014-04-22 2016-02-16 歐姆龍股份有限公司 埋設電子零件的樹脂構造體及其製造方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68927295T2 (de) * 1988-07-08 1997-05-07 Oki Electric Ind Co Ltd Kunstharzversiegeltes halbleiterbauelement
US5157480A (en) * 1991-02-06 1992-10-20 Motorola, Inc. Semiconductor device having dual electrical contact sites
JPH07142627A (ja) * 1993-11-18 1995-06-02 Fujitsu Ltd 半導体装置及びその製造方法
EP1213754A3 (en) * 1994-03-18 2005-05-25 Hitachi Chemical Co., Ltd. Fabrication process of semiconductor package and semiconductor package
US6001671A (en) * 1996-04-18 1999-12-14 Tessera, Inc. Methods for manufacturing a semiconductor package having a sacrificial layer
JP3837215B2 (ja) * 1997-10-09 2006-10-25 三菱電機株式会社 個別半導体装置およびその製造方法
JP4326035B2 (ja) 1997-11-28 2009-09-02 ソニー株式会社 電子機器及び電子機器の放熱構造
TW434760B (en) * 1998-02-20 2001-05-16 United Microelectronics Corp Interlaced grid type package structure and its manufacturing method
JP2000151162A (ja) 1998-11-11 2000-05-30 Tamagawa Seiki Co Ltd 電子部品の放熱方法及び装置
EP1030366B1 (en) * 1999-02-15 2005-10-19 Mitsubishi Gas Chemical Company, Inc. Printed wiring board for semiconductor plastic package
JP4078033B2 (ja) * 1999-03-26 2008-04-23 株式会社ルネサステクノロジ 半導体モジュールの実装方法
JP2000340210A (ja) 1999-05-25 2000-12-08 Sanyo Electric Co Ltd 電気エネルギー蓄積デバイス
JP3715190B2 (ja) 2000-09-28 2005-11-09 シャープ株式会社 電子機器の放熱構造
JP3894091B2 (ja) * 2002-10-11 2007-03-14 ソニー株式会社 Ｉｃチップ内蔵多層基板及びその製造方法
US7816769B2 (en) * 2006-08-28 2010-10-19 Atmel Corporation Stackable packages for three-dimensional packaging of semiconductor dice
JP2008091714A (ja) * 2006-10-03 2008-04-17 Rohm Co Ltd 半導体装置
US20080176359A1 (en) * 2007-01-18 2008-07-24 Nokia Corporation Method For Manufacturing Of Electronics Package
JP2009224445A (ja) * 2008-03-14 2009-10-01 Panasonic Corp 回路モジュールとその製造方法
US8154116B2 (en) 2008-11-03 2012-04-10 HeadwayTechnologies, Inc. Layered chip package with heat sink
JP5359550B2 (ja) * 2009-05-22 2013-12-04 オムロン株式会社 電子部品実装装置の製造方法
US8334584B2 (en) * 2009-09-18 2012-12-18 Stats Chippac Ltd. Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof
US9398694B2 (en) * 2011-01-18 2016-07-19 Sony Corporation Method of manufacturing a package for embedding one or more electronic components
JP5813467B2 (ja) * 2011-11-07 2015-11-17 新光電気工業株式会社 基板、発光装置及び基板の製造方法
WO2014097641A1 (ja) * 2012-12-21 2014-06-26 パナソニック株式会社 電子部品パッケージおよびその製造方法
JP2014127522A (ja) 2012-12-25 2014-07-07 Keihin Corp プリント基板の放熱構造
JP2014187233A (ja) 2013-03-25 2014-10-02 Panasonic Corp 放熱シートおよびこれを用いた放熱構造
JP2016092300A (ja) * 2014-11-07 2016-05-23 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
CN204560112U (zh) * 2015-04-28 2015-08-12 东莞市零度导热材料有限公司 一种增大接触面积的导热垫片
DE102016105581A1 (de) * 2016-03-24 2017-09-28 Infineon Technologies Ag Umleiten von Lotmaterial zu einer visuell prüfbaren Packungsoberfläche
CN205546396U (zh) * 2016-04-20 2016-08-31 广东工业大学 用于手机的功率放大封装组件

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1602555A (zh) * 2001-04-10 2005-03-30 奥斯兰姆奥普托半导体有限责任公司 辐射元件的芯片引线架、辐射元件及其制造方法
CN1567574A (zh) * 2003-06-30 2005-01-19 矽品精密工业股份有限公司 具有散热件的半导体封装件
TW201606954A (zh) * 2014-04-22 2016-02-16 歐姆龍股份有限公司 埋設電子零件的樹脂構造體及其製造方法
TWM507138U (zh) * 2015-03-25 2015-08-11 Polytronics Technology Corp 散熱電路板

Also Published As

Publication number Publication date
JP6610497B2 (ja) 2019-11-27
US20190259679A1 (en) 2019-08-22
WO2018070192A1 (ja) 2018-04-19
EP3528600A1 (en) 2019-08-21
CN109691242B (zh) 2021-08-17
US10879145B2 (en) 2020-12-29
CN109691242A (zh) 2019-04-26
TW201814853A (zh) 2018-04-16
EP3528600B1 (en) 2022-03-09
EP3528600A4 (en) 2020-01-08
JP2018064060A (ja) 2018-04-19

Similar Documents

Publication Publication Date Title
TWI567896B (zh) 三維空間封裝結構及其製造方法
US9955591B2 (en) Circuit substrate and method for manufacturing the same
TWI602270B (zh) 晶片埋入式印刷電路板及應用印刷電路板之半導體封裝及其製造方法
CN101253627B (zh) 电路装置及其制造方法
JP5940799B2 (ja) 電子部品搭載用パッケージ及び電子部品パッケージ並びにそれらの製造方法
EP2624320B1 (en) Led module
TWI659510B (zh) 電子裝置及其製造方法
JP4833683B2 (ja) 光源モジュールの製造方法及び液晶表示装置の製造方法
KR20150074649A (ko) 반도체 패키지 및 그 제조 방법
CN103124468A (zh) 金属基覆铜层压板和使用其制造金属芯印刷电路板的方法
US20060011383A1 (en) Multi-layered circuit board assembly
JP4545022B2 (ja) 回路装置およびその製造方法
CN101419957A (zh) 半导体器件及其制造方法
JP2008187144A (ja) 回路装置およびその製造方法
US20250132219A1 (en) Semiconductor device, method for manufacturing semiconductor device, and thermally conductive sheet for semiconductor device
JP6312527B2 (ja) 放熱板を備えた電子部品の実装構造
TWI683405B (zh) 電子裝置及其製造方法
JP2015012161A (ja) 電子装置
CN107749408A (zh) 一种弹性导热件露出封装结构
KR101129073B1 (ko) 열방출형 반도체 패키지
TW201644341A (zh) 電路結構體以及製造方法
KR20150093500A (ko) 패키지 기판, 이를 이용한 반도체 패키지
JP3733181B2 (ja) 半導体搭載用基板及びその製造方法
KR20110024686A (ko) 방열기판 및 그 제조방법
JP5307704B2 (ja) 配線板および配線板の製造法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees