TWI658980B - 晶舟構造 - Google Patents

晶舟構造 Download PDF

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Publication number
TWI658980B
TWI658980B TW106102281A TW106102281A TWI658980B TW I658980 B TWI658980 B TW I658980B TW 106102281 A TW106102281 A TW 106102281A TW 106102281 A TW106102281 A TW 106102281A TW I658980 B TWI658980 B TW I658980B
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carrier
item
patent application
boat structure
wafer
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TW106102281A
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TW201827320A (zh
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Chien-Ming Kuo
郭建銘
Hung-Ching Chang
張泓清
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Chipbond Technology Corporation
頎邦科技股份有限公司
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Application filed by Chipbond Technology Corporation, 頎邦科技股份有限公司 filed Critical Chipbond Technology Corporation
Priority to TW106102281A priority Critical patent/TWI658980B/zh
Priority to US15/456,652 priority patent/US10242899B2/en
Priority to KR1020170031030A priority patent/KR20180086101A/ko
Priority to CN201710150197.0A priority patent/CN108336005B/zh
Priority to JP2017048298A priority patent/JP6322741B1/ja
Publication of TW201827320A publication Critical patent/TW201827320A/zh
Application granted granted Critical
Publication of TWI658980B publication Critical patent/TWI658980B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一種晶舟構造，其用以存放晶圓，該晶舟構造包含一殼體及複數個載體，該載體用以承載一晶圓，該載體活動地樞接於該殼體的一軸桿，該載體可選擇性地容置於該殼體的一容置空間中或離開該容置空間，以利拿取或存放該晶圓。

Description

晶舟構造
本發明是關於一種晶舟構造，其用以存放半導體晶圓。
在半導體製程中，為了保護晶圓，會將晶圓存放於一晶舟中，以利存放或運輸。
在習知的技術中，是在該晶舟上設有一儲存槽，並將晶圓存放於該儲存槽中，而存取晶圓的方式有垂直抽放方式及水平抽放方式，但不論是垂直抽放方式及水平抽放方式，皆不利於操作人員或機械手臂拿取。
以垂直抽放方式來說，由於晶圓是以立式存放於該儲存槽中，因此拿取晶圓時，必須以垂直方式拿取，否則容易碰觸相鄰的晶圓，而造成晶圓碎裂，此外在存放或拿取晶圓時，若拿取不當則會造成晶圓掉落而損毀。
以水平抽放方式來說，由於晶圓是以水平方式存放於該儲存槽中，因此在抽離晶圓時，會造成該晶圓摩擦該晶舟，相同地若拿取不當也會造成晶圓掉落而損毀。
本發明的目的，是藉由複數個載體活動地樞接於一殼體的一軸桿，使各該載體的一承載座可選擇性地被容置於該殼體的一容置空間中或離開該容置空間，以利拿取或存放晶圓。
本發明的一種晶舟構造包含一殼體及複數個載體，該殼體具有一軸桿及一容置空間，各該載體具有一樞接孔及一承載座，該承載座用以承載一晶圓，該載體以該樞接孔活動地樞接於該軸桿，該載體以該軸桿選擇性地擺動，使該承載座容置於該容置空間中或離開該容置空間。
本發明藉由該載體活動地樞接於該軸桿，因此當欲存放該晶圓時，該載體以該軸桿擺動並使該承載座離開該容置空間，以顯露出該承載座，即可將該晶圓存放於該承載座上，當該晶圓存放於該承載座後，該載體再以該軸桿擺動，使該晶圓隨著該承載座容置於該容置空間中。
當欲拿取存放在該承載座的該晶圓時，相同地，該載體以該軸桿擺動並使該承載座離開該容置空間，以顯露出存放在該承載座的該晶圓，即可拿取存放於該承載座的該晶圓。
本發明的該晶舟構造藉由該載體活動地樞接於該軸桿，使得該些承載座可分別顯露於該殼體外，因此不會造成存放或拿取該晶圓時，碰撞相鄰的晶圓而損壞或造成該晶圓掉落。
請參閱第1、2及3圖，本發明的一種晶舟構造100，其用以儲放複數個晶圓W，該晶舟構造100包含一殼體110及複數個載體120，該殼體110具有一軸桿111及一容置空間112，各該載體120分別具有一樞接孔121及一承載座122，該承載座122用以承載該晶圓W(請參閱第3圖)，該載體120以該樞接孔121活動地樞接於該軸桿111，該載體120以該軸桿111為中心選擇性地擺動，以使該承載座122容置於該容置空間112中或離開該容置空間112，較佳地，該載體120設有一標記125，該標記125可選自於計數標記，如數字，以利於操作人員辨識，而不需逐一計算。
請參閱第2、3、4及5圖，該承載座122具有一框體122a及一容置槽122b，該框體122a環繞該容置槽122b，該載體120具有一樞接部124，該樞接部124連接該承載座122的該框體122a，該樞接孔121設於該樞接部124。
請參閱第2、4及5圖，在本實施例中，該晶舟構造100包含複數個間隔件130及複數個軸承140，各該間隔件130設置於軸桿111且位於相鄰的二個載體120之間，該軸承140具有一穿孔141，該軸承140結合於該載體120的該樞接部124，在本實施例中，該軸承140以結合件(圖未繪出，如螺絲)鎖固於該樞接部124，該穿孔141對應該樞接孔121，該軸桿111貫穿該樞接孔121及該穿孔141，該載體120以該軸承140樞接於該軸桿111，在本實施例中，該間隔件130位於相鄰的二個樞接部124之間，其用以間隔相鄰的二個載體120，使相鄰的二個載體 120具有一間隔距離，且必要時，可依需求更換該間隔件130，以藉由該間隔件130調整相鄰的二個載體120之間的間隔距離。
請參閱第2、5及6圖，該殼體110具有一第一限位桿113，當該載體120以該軸桿111為中心擺動，使該承載座122離開該容置空間112後，該樞接部124被擋止於該第一限位桿113，在本實施例中，該樞接部124設有一第一磁體M1，當該樞接部124被擋止於該第一限位桿113時，該樞接部124以該第一磁體M1吸附於該第一限位桿113，以避免不當外力觸動該載體120，而使該承載座122容置該容置空間112，且可避免該載體120產生晃動而造成該晶圓W掉落。
請參閱第1及2圖，在本實施例中，該載體120具有一握把部123，該握把部123連接該承載座122的該框體122a，該握把部123可供操作人員握持，以驅動該載體120選擇性地擺動，較佳地，該標記125設置於該握把部123。
請參閱第3圖，該框體122a具有一第一開口122c及一內側壁122e，在本實施例中，該內側壁122e為一傾斜側壁，該內側壁122e的壁面朝向該第一開口122c，該第一開口122c連通該容置槽122b，該容置槽122b用以容置該晶圓W，在本實施例中，該第一開口122c實質為一圓形開口，該第一開口122c的直徑不小於該晶圓W的直徑，較佳地，該承載座122具有一載板122d，該載板122d連接該框體122a，且該載板122d位於該容置槽122b中，該載板122d用以承載該晶圓W。
請參閱第2、5及6圖，在本實施例中，該框體122a具有至少一取放孔122f，該取放孔122f側向連通該容置槽122b，當操作人員欲拿取或存放該晶圓W時，該取放孔122f可供操作人員的手容置，以穩固的將該晶圓W由該承載座122中取出，或將該晶圓W存放於該承載座122中。
請參閱第1、2及5圖，該殼體110具有一第二限位桿114，該容置空間112具有一第二開口112a，該第二開口112a位於該軸桿111與該第二限位桿114之間，當該承載座122容置於該容置空間112時，該握把部123被擋止於第二限位桿114，且該握把部123位於該容置空間112外。
請參閱第2、5及6圖，在本實施例中，該握把部123設有一第二磁體M2，當該承載座122容置於該容置空間112且該握把部123被擋止於該第二限位桿114時，該握把部123以該第二磁體M2吸附於該第二限位桿114，以避免不當外力驅動該載體120，而使承載座122離開該容置空間112。
請參閱第1、2、4及5圖，該殼體110具有一支撐件115，該支撐件115具有複數個支撐部115a，當該載體120容置於該容置空間112時，該支撐部115a支撐該承載座122，請參閱第4及5圖，較佳地，該軸桿111、該第二限位桿114及該支撐件115構成一三角形支撐架(請參閱第5圖，圖式中以點-鏈線連接表示)，當該載體120以該軸桿111為中心選擇性地擺動至該容置空間112中，由於該樞接孔121樞接於該軸桿111、該握把部123被擋止於該第二限位桿114及該承載座122被該支撐件115支撐，因此使得該載體120可穩固地容置於該容置空間112中。
請參閱第1、2、5及6圖，該晶舟構造100其另包含一擋止桿150，該擋止桿150活動地樞接於該殼體110，請參閱第5圖，當該承載座122容置於該容置空間112時，該握把部123被限位於該第二限位桿114與該擋止桿150之間，以避免該承載座122因不當外力驅動而離開該容置空間112，請參閱第5及6圖，當欲驅動該承載座122時，將該擋止桿150擺動並脫離該握把部123，即可驅動該承載座122，使該承載座122離開該容置空間112，以利存取該晶圓W。
本發明之保護範圍當視後附之申請專利範圍所界定者為準，任何熟知此項技藝者，在不脫離本發明之精神和範圍內所作之任何變化與修改，均屬於本發明之保護範圍。
100‧‧‧晶舟構造
110‧‧‧殼體
111‧‧‧軸桿
112‧‧‧容置空間
112a‧‧‧第二開口
113‧‧‧第一限位桿
114‧‧‧第二限位桿
115‧‧‧支撐件
115a‧‧‧支撐部
120‧‧‧載體
121‧‧‧樞接孔
122‧‧‧承載座
122a‧‧‧框體
122b‧‧‧容置槽
122c‧‧‧第一開口
122d‧‧‧載板
122e‧‧‧內側壁
122f‧‧‧取放孔
123‧‧‧握把部
124‧‧‧樞接部
125‧‧‧標記
130‧‧‧間隔件
140‧‧‧軸承
141‧‧‧穿孔
150‧‧‧擋止桿
W‧‧‧晶圓
M1‧‧‧第一磁體
M2‧‧‧第二磁體
第1圖：本發明「晶舟構造」的立體圖。
第2圖：本發明「晶舟構造」的立體分解圖。
第3圖：本發明「晶舟構造的承載座」的剖視圖。
第4圖：本發明「晶舟構造」的剖視圖。
第5、6圖：本發明「晶舟構造」的作動示意圖。

Claims (16)

  1. 一種晶舟構造，包含：一殼體，具有一軸桿及一容置空間；以及複數個載體，各該載體具有一樞接孔及一承載座，該承載座用以承載一晶圓，該載體以該樞接孔活動地樞接於該軸桿，該載體以該軸桿選擇性地擺動，使該承載座容置於該容置空間中或離開該容置空間，其中該承載座具有一框體及一容置槽，該框體環繞該容置槽，該框體具有一第一開口，該第一開口連通該容置槽，該容置槽用以容置該晶圓，該載體具有一握把部，該握把部連接該承載座的該框體，該殼體具有一第二限位桿，該容置空間具有一第二開口，該第二開口位於該軸桿與該第二限位桿之間，當該承載座容置於該容置空間時，該握把部被擋止於該第二限位桿，且當該握把部被擋止於該第二限位桿時，該握把部位於該容置空間外。
  2. 如申請專利範圍第1項所述之晶舟構造，其中該第一開口實質為一圓形開口，該第一開口的直徑不小於該晶圓的直徑。
  3. 如申請專利範圍第2項所述之晶舟構造，其中該承載座具有一載板，該載板連接該框體，且該載板位於該容置槽中，該載板用以承載該晶圓。
  4. 如申請專利範圍第1項所述之晶舟構造，其中該框體的一內側壁為一傾斜側壁，該內側壁的壁面朝向該第一開口。
  5. 如申請專利範圍第1項所述之晶舟構造，其中該握把部設有一第二磁體，當該握把部被擋止於該第二限位桿時，該握把部以該第二磁體吸附於該第二限位桿。
  6. 如申請專利範圍第1項所述之晶舟構造，其中該殼體具有一第一限位桿，該載體具有一樞接部，該樞接部連接該承載座的該框體，該樞接孔設於該樞接部，當該承載座離開該容置空間後，該樞接部被擋止於該第一限位桿。
  7. 如申請專利範圍第6項所述之晶舟構造，其中該樞接部設有一第一磁體，當該樞接部被擋止於該第一限位桿時，該樞接部以該第一磁體吸附於該第一限位桿。
  8. 如申請專利範圍第1項所述之晶舟構造，其中該殼體具有一支撐件，該支撐件具有複數個支撐部，當該載體容置於該容置空間時，該支撐部支撐該承載座。
  9. 如申請專利範圍第8項所述之晶舟構造，其中該殼體具有一第二限位桿，該容置空間具有一第二開口，該第二開口位於該軸桿與該第二限位桿之間，該軸桿、該第二限位桿及該支撐件構成一三角形支撐架。
  10. 如申請專利範圍第1項所述之晶舟構造，其另包含複數個間隔件，該間隔件設置於軸桿且位於相鄰的二個載體之間。
  11. 如申請專利範圍第10項所述之晶舟構造，其中該載體具有一樞接部，該樞接孔設於該樞接部，該間隔件位於相鄰的二個樞接部之間。
  12. 如申請專利範圍第1項所述之晶舟構造，其另包含複數個軸承，該軸承具有一穿孔，該軸承結合於該載體的一樞接部，該樞接孔設於該樞接部，該穿孔對應該樞接孔，該軸桿貫穿該樞接孔及該穿孔。
  13. 如申請專利範圍第1項所述之晶舟構造，其中該框體具有至少一取放孔，該取放孔側向連通該容置槽。
  14. 如申請專利範圍第1項所述之晶舟構造，其另包含一擋止桿，該擋止桿活動地樞接於該殼體，當該承載座容置於該容置空間時，該握把部被限位於該第二限位桿與該擋止桿之間。
  15. 如申請專利範圍第1項所述之晶舟構造，其中該載體設有一標記。
  16. 如申請專利範圍第15項所述之晶舟構造，其中該載體具有一握把部，該標記設置於該握把部。
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KR1020170031030A KR20180086101A (ko) 2017-01-20 2017-03-13 웨이퍼 카세트 구조
CN201710150197.0A CN108336005B (zh) 2017-01-20 2017-03-14 晶舟构造
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