TWI651506B - Heat exchanger - Google Patents

Abstract

A heat exchange device is filled with a heat transfer medium in a piping unit, and the heat transfer medium is flowed to a heat sink through a cycle of a steam or gas pressurizer, a heat sink and a throttling device. A heat absorption surface is provided. The heat absorption surface can be in contact with a heat source, and the heat transfer medium flowing through the heat absorber will take away the heat of the heat source through the heat absorption surface. Moreover, the heat exchange device can be arranged in a device. The device has at least one power supply unit and at least one work unit. The work unit will form the heat source when it is in operation. The work unit is in contact with the heat absorption surface of the heat sink, directly performs heat absorption and can perform an effective heat exchange cycle. To achieve heat dissipation.

Description

Heat exchanger

The present invention relates to a heat exchange device, and is also applicable to equipment having the heat exchange device, such as the heat dissipation of a computer host, but the device having the heat exchange device is not limited to being applied only to a computer host.

According to the early heat dissipation systems, such as heat dissipation systems installed on a computer (central processing unit, central processing unit) and other chip heat sources, usually a fin with heat dissipation and heat conduction functions is usually installed on the top Fins, or heat sink fins, guide the heat source through the fins to complete a heat dissipation process, but the advancement of technology has reduced the contact area of the heat source and increased the operating speed, which further caused the entire heat source to generate heat. The temperature rises, using only the cooling fins. In addition to poor efficiency, because the computer's main body is semi-closed, it is not easy to dissipate heat. After long-term use, the internal dust accumulation will reduce the heat dissipation effect, so now there are More improvements to the cooling system.

At present, the industry has developed two heat dissipation methods. First, the first heat dissipation method is shown in Fig. 1. It is a liquid cooling system 40. The liquid cooling system 40 is directly processed by a central processing unit 50. After the device 51 is connected, a piping system 41 inputs a liquid having a lower temperature from the liquid cooling system 40 to a heat conducting portion 42 in contact with the central processing unit 51, and the liquid will absorb the heat generated by the central processing unit 51. The heat causes the temperature of the liquid to rise; then, the liquid is led out to a heat sink 43 via the pipe system 41, and the liquid in the heat sink 43 is dissipated through a heat sink fan 44. The temperature of the liquid is lowered, and then the liquid is transported to the liquid cooling system 40 and the heat conducting portion 42 through the pipeline system 41 again to generate an internal circulation and achieve the heat dissipation effect on the central processing unit 51.

However, with the cooling mechanism of the liquid cooling system 40, the flow cycle will be limited by the internal space of the computer mainframe 50, so the flow distance is usually short, and the wiring is fixed. In addition to the limited installation location, If the cycle is too short, the liquid at the heat-dissipating end 43 cannot effectively remove heat. Therefore, under a long-term use, the liquid flowing into the heat-conducting portion 42 will gradually heat up, and then the central processor 51 cannot be effectively cooled. effect.

Alternatively, for the second cooling method, please refer to the fan cooling system shown in FIG. 2, which is a host unit 60. The host unit 60 includes a central processing unit 51 and a graphics processing unit (GPU, graphics processing unit). A cooling fan 44 is provided on each of 62), and a row of fans 64 are provided on the host unit 60. Through the cooling fan 44, the heat generated by the central processing unit 51 and the graphics processor 62 can be guided out And, the hot air is discharged from the host unit 60 through the exhaust fan 64 to achieve a function of exhausting heat.

For the heat dissipation mechanism in the form of the cooling fan 44, the cooling fan 44 and the exhaust fan 64 need to maintain the running state during the booting process of the host unit 60 in order to produce good heat dissipation effect. However, the cooling fan 44 and the The exhaust fan 64 consumes a large amount of power. At the same time, the operation of the cooling fan 44 and the exhaust fan 64 also generates noise, and after a long period of use, the temperature of the central processing unit 51 and the graphics processor 62 will increase; in addition, The cooling fan 44 generates the flow of air to take away heat. The cooling fan 44 installed on the central processing unit 51 and the graphics processor 62 cannot directly perform effective heat removal for peripheral computing chips, so the overall cooling effect is achieved. limited.

In view of the fact that the above-mentioned traditional heat dissipation method still has many shortcomings in actual implementation, the present inventor has worked tirelessly, supplemented by rich professional knowledge and years of practical experience, and improved it based on this. this invention.

The main object of the present invention is to provide a heat exchange device for quickly and effectively lowering the temperature. The heat exchange device includes at least: a pipeline unit, which can be filled with a heat transfer medium; a vapor or gas pressure The steam or gas pressurizer is connected to the pipeline unit; a heat dissipation device, the steam or gas pressurizer is connected to the pipeline unit by the pipeline unit; a throttling device, the heat dissipation device is connected to the node The flow device is connected by the pipeline unit; a heat absorber, the throttling device and the heat absorber are connected by the pipeline unit, and the heat absorber and the vapor or gas pressurizer are connected by the pipeline unit, The heat absorber is provided with a heat absorption surface; a control unit is connected with the steam or gas pressurizer, the heat dissipation device, the throttling device and the heat absorber signal.

The heat exchange device as described above, wherein the heat exchange device further includes a casing, and the interior of the casing is provided with the vapor or gas pressurizer, the heat dissipation device, the throttling device, and the control unit, and The heat sink is disposed outside the casing.

The heat exchange device as described above, wherein the heat dissipation device is composed of a fin-type heat sink, a fan, or a water-cooled heat dissipation device.

The heat exchange device as described above, wherein the throttling device is a capillary tube, a temperature-sensing expansion valve, an electronic expansion valve or a first-class orifice restrictor.

The equipment having a heat exchange device includes at least: a device and the heat exchange device described above, wherein at least one working unit is provided inside the device; the heat absorber is in contact with the working unit.

In another embodiment, the equipment having a heat exchange device includes at least: a device and a heat exchange device; wherein the heat exchange device includes at least: a pipeline unit, the pipeline unit is capable of Filling a heat transfer medium; a vapor or gas pressurizer, which is connected to the pipeline unit; a heat dissipation device, the vapor or gas pressurizer and the heat dissipation device are connected to the pipeline unit Connection; a throttling device, the heat dissipation device and the throttling device are connected by the pipeline unit; a plurality of heat sinks, the throttling device and the heat absorber are connected by the pipeline unit, and the heat sink is connected with the steam Or the gas pressurizer is connected by the pipeline unit, and each of the heat absorbers is provided with a heat absorption surface; a control unit is connected with the steam or gas pressurizer, the heat dissipation device, the throttling device and the heat absorption device. Signal connection; wherein the device is provided with at least one working unit; the heat absorption surface is in contact with the working unit.

The apparatus having a heat exchange device as described above, wherein the plurality of heat sinks are connected by the pipeline unit.

As described above, the device having a heat exchange device, wherein the plurality of heat sinks are connected in series by the pipeline unit.

As described above, the device having a heat exchange device, wherein the plurality of heat sinks are connected in series by the pipeline unit.

The apparatus having a heat exchange device as described above, wherein the plurality of working units have a plurality of wafers, and the heat absorption surface is in contact with the wafers.

The apparatus having a heat exchange device as described above, wherein the plurality of heat absorption surfaces are in contact with the corresponding wafer.

The apparatus having a heat exchange device as described above, wherein each of the heat absorption surfaces is in contact with a corresponding one of the wafers.

The device having a heat exchange device as described above, wherein the chip is a central processing unit or a graphics processor.

The equipment having a heat exchange device as described above, wherein the equipment is further provided with at least one power supply unit, and the power supply unit is electrically connected to the working unit.

The equipment having a heat exchange device as described above, wherein the power supply unit is electrically connected to the heat exchange device.

As described above, the equipment having a heat exchange device, wherein the working unit is further provided with a temperature sensor between the heat absorbing surface and the working unit, and is in contact with the heat absorbing unit and the working unit.

The equipment having a heat exchange device as described above, wherein the working unit is also provided with a pulse width modulation speed regulating device, and the control unit is connected to the pulse width modulation speed regulating device by a signal.

In the heat exchange device provided by the present invention, the heat absorber of the heat exchange device can directly contact a heat source, which can directly reduce the temperature and dissipate heat, thereby improving the cooling effect. Moreover, after the heat transfer medium has been circulated, the temperature of the heat transfer medium can be kept at a low temperature in the heat sink, so it will not lose its cooling effect even if it is used for a long time. At the same time, for the equipment with a heat exchange device, the work unit can directly contact the heat sink, and a direct and effective heat dissipation effect can be achieved. The heat exchange device installed in the device will not increase the volume, and because The heat absorber can provide a direct and continuous heat dissipation effect, so that the operating temperature of the work unit can be within a better temperature, and thus the delay or damage caused by overheating can be avoided.

〔this invention〕

10‧‧‧Heat exchange device

11‧‧‧Piping unit

12‧‧‧Steam or gas pressurizer

13‧‧‧Cooling device

131‧‧‧ fin heat sink

132‧‧‧fan

14‧‧‧ throttling device

15‧‧‧ heat sink

151‧‧‧heat absorption surface

16‧‧‧Control unit

20‧‧‧shell

30‧‧‧ Equipment

31‧‧‧shell

32‧‧‧ Power Supply Unit

33‧‧‧Working unit

331‧‧‧Motherboard

3311‧‧‧Central Processing Unit

3312‧‧‧Temperature sensor

3313‧‧‧Pulse width modulation speed control device

3321‧‧‧Graphics Processor

H‧‧‧ heat source

[Learning]

40‧‧‧Liquid cooling system

41‧‧‧Piping system

42‧‧‧Heat conduction department

43‧‧‧Cooling end

44‧‧‧cooling fan

50‧‧‧Computer host

51‧‧‧Central Processing Unit

60‧‧‧Host unit

62‧‧‧Graphics Processor

64‧‧‧ exhaust fan

Figure 1 is a schematic diagram of a conventional liquid cooling system.

Figure 2 is a schematic diagram of a conventional fan cooling system.

Fig. 3 is a perspective view of the heat exchange device of the present invention.

FIG. 4 is an exploded perspective view of the first embodiment of the device with a heat exchange device according to the present invention.

Fig. 5 is a schematic diagram of a second embodiment of a device having a heat exchange device according to the present invention.

FIG. 6 is a perspective external view of a second embodiment of a device with a heat exchange device according to the present invention.

In order to help examiners understand the technical features, contents and advantages of the present invention and the effects that can be achieved, the present invention will be described in detail in conjunction with the accompanying drawings in the form of embodiments, and the drawings used therein, The main purpose is only for the purpose of illustration and supplementary description. It may not be the actual proportion and precise configuration after the implementation of the invention. Therefore, the attached drawings should not be interpreted and limited to the scope of rights of the present invention in actual implementation. He Xianming.

Please refer to FIG. 3, which is a three-dimensional appearance view of the heat exchange device of the present invention. The so-called “heat exchange” refers to the ability to perform cold and heat exchange. The heat exchange device 10 includes: a pipeline unit 11, the The piping unit 11 can be filled with a heat-transfer medium (not shown). The heat-transfer medium is a substance that can switch between gas and liquid, such as refrigerant or water.

A vapor or gas pressurizer 12 is connected to the pipeline unit 11. The vapor or gas pressurizer 12 can compress the heat transfer medium in the pipeline unit 11 to a high temperature. High-pressure gaseous state; the vapor or gas pressurizer 12 can be a compressor.

A heat radiating device 13 is connected to the pipeline unit 11 and is connected to the steam or gas pressurizer 12, that is, the steam or gas pressurizer 12 and the heat radiating device 13 are connected to the pipeline unit 11. tube The cooling unit 13 is connected; the heat sink 13 includes a fin-type heat sink 131 and a fan 132. After the heat transfer medium flows into the fin-type heat sink 131, the cooling action can be performed through the fan 132, and the The heat transfer medium in the pipeline unit 11 is converted into a low-temperature and high-pressure liquid state; for example, the heat sink 13 may be the fin-type heat sink 131, the fan 132, or a water-cooled heat sink; the water-cooled heat sink The device is a tank filled with water, and the fin-type heat sink 131 or the pipeline unit 11 is immersed in the water-cooled heat dissipation device formed by the tank filled with water to achieve the effect of heat dissipation.

A throttling device 14, which is connected to the pipeline unit 11 and connected to the heat dissipation device 13, that is, the heat dissipation device 13 and the throttling device 14 are connected to the pipeline unit 11; The throttling device 14 is a capillary tube, a temperature-sensing expansion valve, an electronic expansion valve, or a first-rate orifice restrictor (oriface). The throttling device 14 is a heat transfer medium in the pipeline unit 11. It is transformed into a low-temperature and low-pressure gaseous state.

A heat absorber 15 is connected to the pipeline unit 11. The heat absorber 15 is disposed between the throttling device 14 and the vapor or gas pressurizer 12, that is, the throttling device 14 and The heat absorber 15 is connected by the pipeline unit 11, and the heat absorber 15 and the vapor or gas pressurizer 12 are connected by the pipeline unit 11. The heat absorber 15 is provided with a heat absorption surface 151, which absorbs heat. The surface 151 is capable of contacting a heat source H and exchanging cold and heat with the heat source H. Generally, the heat source H transfers heat to the heat absorption surface 151 so that the temperature of the heat source H can be reduced or maintained at a specific temperature; and The low-temperature and low-pressure gaseous heat medium flowing through the heat absorber 15 passes through the heat-absorbing surface 151 and takes away the heat transferred from the heat source H to the heat-absorbing surface 151, and is converted into a low-pressure and high-temperature gaseous heat transfer medium. Then, it flows to the vapor or gas pressurizer 12 through the pipeline unit 11 to complete a circulation loop.

A control unit 16 is connected to the steam or gas pressurizer 12, the heat dissipating device 13, the throttling device 14, and the heat absorber 15 and can provide power and control the steam or gas pressurizer 12, the The operation of the heat radiating device 13, the throttling device 14 and the heat sink 15.

A casing 20 is provided with the vapor or gas pressurizer 12, the heat dissipating device 13, the throttling device 14, and the control unit 16, and the heat absorber 15 is provided in the casing. 20 outside.

In order to further understand the structural features of the present invention, the use of means and techniques, and the expected effects, the use of this development camp is described. I believe that we can have a deeper and more specific understanding of the present invention, as described below; As shown in FIG. 3, the casing 20 can house the heat exchange device 10 as a whole for easy carrying and installation. When heat exchange is performed, only the heat absorption surface 151 and the heat source H of the heat sink 15 are required. In this embodiment, the heat source H is a chip such as a central processing unit, and the heat absorption surface 151 can perform heat exchange with the low-temperature and low-pressure gaseous heat transfer medium filled in the pipeline unit 11 to exchange the heat The heat generated by the heat source H is absorbed, and the heat transfer medium is converted into a high-temperature and low-pressure gaseous state; then, the heat transfer medium is transported to the vapor or gas pressurizer 12 via the pipe unit 11 and pressurized via the vapor or gas. After the device 12 is pressurized to form a high-temperature and high-pressure gaseous heat transfer medium, the fin-type heat sink 131 introduced into the heat sink 13 via the pipe unit 11 is again transported and cooled by the exhaust heat of the fan 132. The heat transfer medium in 11 will be converted into a low-temperature and high-pressure liquid heat transfer medium. Then, the heat transfer medium in the throttling device 14 will be converted into a low-temperature and low-pressure gaseous heat transfer medium after conversion by the capillary of the throttling device 14. The heat transfer medium is in a low temperature and low pressure state to complete the circulation loop. This circulation circuit can ensure that the temperature of the heat transfer medium of the heat absorption surface 151 can effectively dissipate the heat source H; therefore, it can ensure that the operation of the CPU is still within a proper operating temperature under long-term operation. .

Please also refer to FIG. 4 at the same time, which is an exploded perspective view of the first embodiment of the equipment with a heat exchange device according to the present invention. The heat exchange device is the same as the previous embodiment, and will not be described again. The heat exchange device 10 is directly installed in a device 30. The device may be a computer host, a container, or a building. In this embodiment, the device 30 is an example of the computer host. The device 30 has a casing 31. In this embodiment, the casing 31 is a computer case. The inside of the casing 31 or the device 30 has a power supply unit 32 and a working unit 33. The unit 33 is a main board 331. The main board 331 is provided with a central processing unit 3311 (the heat source in this embodiment). The heat exchange device 10 is provided with the heat sink 15 with respect to the working unit 33. The heat absorption surface 151 is in contact with the CPU 3311. At the same time, the power supply unit 32 can directly supply power to the heat exchange device 10, so that the heat exchange device 10 does not need to use an additional power source. Generally speaking, the area of the heat sink 15 is relatively small, so the vapor or gas is relatively The power consumption of the pressurizer 12 is not large, so the heat exchange device 10 directly using the power of the power supply unit 32 will not affect the efficiency and stability of the work unit 33. At the same time, a temperature sensor 3312 is further connected to the motherboard 331 of the work unit 33 between the heat sink 15 and the central processing unit 3311. The temperature sensor 3312 is clamped between the heat sink 15 and The central processing unit 3311 is in contact with the heat absorption surface 151. The motherboard 331 is provided with a pulse width modulation (PWM) speed regulation device 3313. The control unit 16 is connected to the pulse width modulation speed control device 3313 to control the operation state of the heat exchanger device 10. When the work unit 33 is initially started, its temperature is lower than a threshold value, so the control unit 16 does not start the steam or gas pressurizer 12 and the fan 132; after a period of time, the work unit 33 The temperature of the central processing unit 3311 will increase, so the temperature sensor 3312 will sense that the temperature of the central processing unit 3311 has increased; when the temperature sensor 3312 senses that the temperature of the central processing unit 3311 is equal to or exceeds the threshold value , The pulse width modulation speed regulating device 3313 notifies the control unit 16 with a signal, and the control unit 16 will drive the vapor or gas The compressor 12 and the fan 132 are operated to cool down the heat medium through the circulation loop. Then, when the temperature drop is completed, for example, when the temperature sensor 3312 senses that the temperature of the central processing unit 3311 is less than the threshold value, the pulse width modulation speed regulating device 3313 notifies the control unit 16 with another signal. The control unit 16 can slow down or stop the operation of the heat exchange device 10. Therefore, the heat exchange device 10 can be operated again when needed, so it can reduce the loss of energy and avoid excessive heat dissipation of the heat absorber 15, which causes the central processor 3311 and the working unit 33 to frost or the temperature is too low. .

Please refer to FIG. 5 and FIG. 6 at the same time. This is a second embodiment of the device having the heat exchange device according to the present invention. The heat exchange device 10 is substantially the same as the previous embodiment, so it is no longer To repeat. Among them, the inside of the device 30 has a plurality of the working units 33, the heat exchange device 10 of this embodiment has a plurality of the heat absorbers 15, and the plurality of the heat absorbers 15 are connected by the pipeline unit 11 to complete The circulation circuit, preferably, a plurality of the heat sinks 15 are connected in series by the pipeline unit 11 to complete the circulation circuit, and the most optimally, the plurality of heat sinks 15 are connected in series by the pipeline unit 11 in order to complete The circulation loop; the heat absorption surface 151 of the heat sink 15 is in contact with the central processing unit 3311 (in this embodiment, the heat source), preferably the heat absorption surface 151 is in contact with the corresponding central processing unit 3311 ( In this embodiment, it is the heat source), and each of the heat absorption surfaces 151 is in contact with the corresponding central processing unit 3311 (the heat source in this embodiment).

In the embodiments of FIG. 5 and FIG. 6, the inside of the device 30 has two working units 33, and the two working units 33 are respectively the main board 331 and a display card 332. The main board 331 The central processing unit 3311 is provided on the display card 332, and a graphics processor 3321 is provided on the display card 332. The heat exchange device 10 is provided with two pipeline units 11 connected in series to the two work units 33. The heat sink 15; wherein the two heat sinks 15 are in contact with the central processing unit 3311 and the graphics processor 3321 through the respective heat absorption surfaces 151 respectively.

Of course, the device 30 may also be provided with a plurality of the power supply units 32 to switch to supply power to the plurality of work units 33 or the heat exchange device 10 in response to a demand for power deployment.

In summary, when this invention is known to have industrial applicability and advancement, and this invention has not been seen in any publications, it is also novel. When it complies with the provisions of the Patent Law, it has filed a patent application in accordance with the law. Patent for prayer.

The above is only one of the feasible embodiments of the present invention. When it cannot be used to limit the scope of the present invention; that is, all equal changes and modifications made in accordance with the scope of the patent application for the present invention should still be covered by this patent. Within range.

Claims (2)

A heat exchange device at least comprises: a pipeline unit (11); a vapor or gas pressurizer (12), the vapor or gas pressurizer (12) is connected to the pipeline unit (11); The heat dissipation device (13), the steam or gas pressurizer (12) and the heat dissipation device (13) are connected by the pipeline unit (11); wherein the heat dissipation device (13) is a fin-type heat dissipation bar (131) a water-cooled heat dissipation device; a throttling device (14), the heat dissipation device (13) and the throttling device (14) are connected by the pipeline unit (11); a heat sink (15), The throttling device (14) and the heat sink (15) are connected by the pipeline unit (11), and the heat sink (15) and the vapor or gas pressurizer (12) are connected by the pipeline unit ( 11) connection, the heat absorber (15) is provided with a heat absorption surface (151); a control unit (16) is connected with the steam or gas pressurizer (12), the heat dissipation device (13), the throttling The device (14) is connected to the heat sink (15) by a signal; a casing (20) is installed inside the casing (20) with the vapor or gas pressurizer (12) and the heat sink (13) , The throttling device (14) and the control unit (16), and the heat sink (15) is provided To the outside of the casing (20). The heat exchange device according to item 1 of the scope of patent application, wherein the throttling device (14) is a capillary tube, a temperature-sensing expansion valve, an electronic expansion valve or a first-class orifice restrictor.