TWM566318U - Liquid cooling heat exchange device and apparatus having the same - Google Patents

Abstract

The present invention discloses a liquid-cooled heat exchange device and a device having a liquid-cooled heat exchange device, which is a liquid-cooled heat exchange device and device which can be installed, for example, but not limited to, inside a computer to help the computer main body to dissipate heat; a plurality of piping units, a vapor or gas pressurizer, a heat sink, a throttling device, a heat sink, a control unit, a thermal conduction cycle tank, and a casing; whereby the creation is by The hardware design of the heat transfer medium filled in the pipeline unit is circulated through the steam or gas pressurizer, the heat sink and the throttling device, so that the heat transfer medium flows to the heat absorber and the heat is taken away by the heat absorption surface, and is heated by the heat. The guiding circulation box is mainly used to exchange the heat source of the heat absorber with the cooling liquid quickly and stably, and achieve the effective heat exchange cycle and accelerate the heat dissipation effect.

Description

Liquid cooling heat exchange device and equipment having liquid cooling heat exchange device

The present invention relates to a liquid-cooled heat exchange device and a device having the liquid-cooled heat exchange device, and in particular to a liquid-cooled heat exchange device and equipment that can be installed in a computer, for example, to help the computer host to dissipate heat.

According to traditional heat dissipation systems used on personal computers, such as heat dissipation systems installed on central processing units (CPUs) or other chips, fins with heat dissipation or heat conduction functions are usually installed on top ( (Also known as cooling fins), the thermal energy generated by the CPU or chip can be guided through the fins to complete the cooling process of the personal computer; however, with the advancement of technology, the contact area of the heat source continues to shrink, and calculations However, the increase in speed will further increase the temperature of the entire heat source. If only the cooling fins are used for heat dissipation, in addition to poor efficiency, it will also be difficult to dissipate heat due to the semi-closed computer case. The accumulation of dust will reduce the heat dissipation effect.

At present, the industry has developed two novel heat dissipation methods. The first heat dissipation method is shown in FIG. 1 and is a schematic diagram of a conventional liquid cooling system. A liquid cooling system (40) is directly connected to a computer host ( 50) The internal central processing unit (51) is connected. First, a piping system (41) inputs a lower-temperature liquid from the liquid cooling system (40) to a heat conducting portion that is in contact with the central processing unit (51). (42), the liquid will absorb the heat generated by the central processing unit (51) and cause the temperature of the liquid to rise; then, the liquid is led out to a heat dissipation end (43) through the pipeline system (41), and The liquid in the heat-dissipating end (43) is dissipated through a heat-dissipating fan (44) and the temperature of the liquid is reduced; then, the liquid is transported to the liquid-cooling system (40) through the pipeline system (41) again. And the heat-conducting part (42) to generate an internal circulation and achieve the heat dissipation effect on the central processing unit (51); however, the mechanism of cooling by the liquid cooling system (40), its flow cycle will be subject to the The limitation of the internal space of the computer host (50), so it is usually mobile The distance is short and the line is fixed. In addition to the limited installation position, the short cycle will make the liquid at the heat sink (43) unable to effectively remove heat, so under long-term use, it flows into the heat conduction The liquid in the part (42) will gradually heat up, and then it will not be able to effectively dissipate heat to the central processing unit (51).

In addition, the second cooling method is the schematic diagram of the traditional fan cooling system shown in Figure 2. A host unit (60) is connected to the central processing unit (51) and a graphics processing unit (62). A cooling fan (44) is provided on each of the GPUs. At the same time, a row of fans (64) is provided on the host unit (60). The fan cooling system can pass through the cooling fan (44) to the central processing unit (51) and The thermal energy generated by the graphics processor (62) is guided out, and hot air is discharged out of the host unit (60) through the exhaust fan (64) to achieve the effect of exhausting heat.

Those who use the cooling fan (44) for the heat dissipation mechanism, in order to produce good heat dissipation, the cooling fan (44) and the exhaust fan (64) often need to keep the running state during the startup process of the host unit (60), but run At the same time, the cooling fan (44) and the exhaust fan (64) will consume a large amount of power. At the same time, the operation of the cooling fan (44) and the exhaust fan (64) will also generate noise, and after a long period of use, the CPU (51) and the temperature of the graphics processor (62) will rise; in addition, the cooling fan (44) generates air flow to take away heat, and is installed in the central processing unit (51) and the graphics processor ( The cooling fan (44) on 62) cannot directly perform effective heat removal for peripheral computing chips, so the overall heat dissipation effect is limited; therefore, how to achieve the effect of thermal cycling through innovative hardware design The effect of heat dissipation is still a problem that developers and related researchers in related industries such as the manufacture and sale of heat exchange devices need to continue to overcome and solve.

The reason is that the creator has taken this into consideration and supplemented with his rich professional knowledge and years of practical experience to improve and create a liquid-cooled heat exchange device and equipment with a liquid-cooled heat exchange device. The purpose is to provide a It can be, but is not limited to, liquid-cooled heat exchange devices and equipment installed inside the computer to help the host computer dissipate heat. It is mainly designed by filling the heat transfer medium inside the piping unit with a hardware design. The circulation of the heat dissipation device and the throttling device effectively allows the heat transfer medium to flow to the heat absorber to take away the heat from the heat absorption surface, and the heat conduction circulation box uses the cooling liquid to quickly and stably exchange the heat source of the heat absorber, which effectively achieves effective heat exchange. Cycle and accelerate to achieve the main advantages of heat dissipation.

According to the purpose of this creation, a liquid-cooled heat exchange device is proposed, which includes at least a plurality of pipeline units, a vapor or gas pressurizer, a heat sink, a throttling device, a heat sink, a control unit, and a heat exchanger. A circulation box and a casing; a vapor or gas pressurizer is correspondingly connected to the pipeline unit; a heat dissipation device is correspondingly connected to the vapor or gas pressurer through the pipeline unit; a throttling device is connected by a pipeline The heat sink is connected to the throttling device and the steam or gas pressurizer respectively through the pipeline unit, where the heat sink is provided with a heat absorption surface; the control unit is pressurized to the steam or gas respectively. Heat sink, throttling device, and heat sink signal connection; the thermal conductivity circulation box system includes a box body, a cooling liquid, internal pipelines, and cooling pipelines respectively arranged inside the box body, where the internal pipelines and The cooling pipe is connected to the heat sink through a piping unit; the inside of the casing is provided with a steam or gas pressurizer, a heat sink, a throttling device, and a control unit. Heat and thermal conductivity of the circulation tank disposed outside the housing of the system.

In one embodiment of the present invention, the heat dissipation device includes a fin-type heat sink and a fan.

In one embodiment of the present invention, the heat dissipation device is a water-cooled heat dissipation device.

In one embodiment of the present invention, the throttling device is one of a capillary tube, a temperature-sensing expansion valve, an electronic expansion valve, or a orifice restrictor.

In one embodiment of the present invention, the internal piping system is distributed in a continuous U-shaped pipe.

In an embodiment of the present invention, the thermal conductivity circulation box may further be provided with a driving member to drive the operation of the thermal conductivity circulation box.

In an embodiment of the present invention, the liquid-cooled heat exchange device may further be provided with a temperature control unit electrically connected to the control unit.

In addition, according to the purpose of this creation, the author proposes another device with a liquid-cooled heat exchange device, which includes at least one liquid-cooled heat exchange device, and a device; the liquid-cooled heat exchange device includes a plurality of pipeline units The steam or gas pressurizer and heat sink are connected to the steam or gas pressurizer through the pipeline unit, the throttling device is connected to the heat sink through the pipeline unit, and the heat sink is borrowed respectively. The throttling device and the vapor or gas pressurizer are connected by the pipeline unit correspondingly, wherein the heat absorber is provided with a heat absorption surface, the control unit is respectively connected with the vapor or gas pressurizer, the heat dissipation device, the throttling device, and the signal of the heat absorber. The connection and a thermal conductivity circulation box system includes a box body, a cooling liquid, an internal pipe, and a cooling pipe respectively arranged inside the box body, wherein the internal pipe and the cooling pipe correspond to each other through a pipe unit. The heat sink is connected; the interior of the device includes at least one working unit, wherein the working unit is connected to the heat absorption surface.

In one embodiment of the present invention, the heat-absorbing surface is in contact with one of the wafers of the work cell.

In one embodiment of the present invention, the chip is a device such as a central processing unit or a graphics processing unit.

In one embodiment of the present invention, the central processing unit has a specification of 95W or more.

In one embodiment of the present invention, the graphics processor has a specification of 150W or more.

In one embodiment of the present invention, the liquid-cooled heat exchange device is designed to dissipate heat between 250W and 600W.

Furthermore, according to the purpose of this creation, the author proposes another device with a liquid-cooled heat exchange device, which includes at least a liquid-cooled heat exchange device, and a device; the liquid-cooled heat exchange device includes a plurality of pipes The unit, the vapor or gas pressurizer, and the heat sink are connected to the vapor or gas pressurizer through the piping unit, and the throttling device is connected to the heat sink through the piping unit, and a plurality of heat sinks The throttling device and the steam or gas pressurizer are connected by pipeline units respectively. Each of the heat sinks is provided with a heat absorption surface, and the control unit is respectively connected with the steam or gas pressurizer, heat dissipation device, and throttling device. As well as the signal connection of the heat sink, a thermal conductivity circulation box system includes a box body, a cooling liquid, an internal pipe, and a cooling pipe respectively arranged inside the box body, wherein the internal pipe and the cooling pipe are connected by a pipe. The circuit unit is connected to the heat sink correspondingly; the internal system of the device includes a plurality of working units, and the working unit is correspondingly connected to the heat absorption surface.

In one embodiment of the present invention, the heat sink is connected by a pipeline unit.

In one embodiment of the present invention, the heat sinks are connected in series by pipeline units.

In one embodiment of the present invention, the heat sinks are connected in series by pipeline units.

In one embodiment of the present invention, the work unit has a plurality of wafers, and the heat absorption surface is in contact with the wafers.

In one embodiment of the present invention, the heat-absorbing surface is in contact with the wafer.

In one embodiment of the present invention, each heat-absorbing surface is in contact with each wafer.

In one embodiment of the present invention, the chip is a device such as a central processing unit or a graphics processing unit.

In an embodiment of the present invention, the device may further be provided with at least one power supply unit, and the power supply unit is electrically connected to the work unit.

In one embodiment of the present invention, the power supply unit is electrically connected to the liquid-cooled heat exchange device.

In an embodiment of the present invention, a temperature sensor may be further connected between the work unit and the heat absorption surface, and the temperature sensor is in contact with the heat absorption device.

In an embodiment of the present invention, the work unit may further be provided with a pulse width modulation and speed regulating device connected to the control unit signal.

Therefore, the liquid-cooled heat exchange device and the equipment with the liquid-cooled heat exchange device of this creation are mainly designed by filling the heat transfer medium inside the piping unit with the hardware design. The circulation of the flow device effectively allows the heat transfer medium to flow to the heat sink and remove the heat from the heat absorption surface, and the heat conduction circulation box uses the cooling liquid to quickly and stably exchange the heat source of the heat sink, and indeed achieves an effective heat exchange cycle and accelerates the reach. The main advantages such as the effect of heat dissipation; In addition, the liquid-cooled heat exchange device and the equipment with the liquid-cooled heat exchange device of this creation mainly improve the cooling effect by directly cooling and dissipating heat through the heat absorber in direct contact with the heat source, and The temperature of the refrigerating medium can be kept at a low temperature after being circulated. Even if it is used for a long time, it will not lose its cooling effect, and avoid the disadvantages of delayed or damaged cooling caused by overheating.

In order to help the examiners understand the technical characteristics, content and advantages of this creation and the effects that it can achieve, we hereby combine this creation with the drawings and explain it in the form of examples in detail below. The drawings used in it are The main purpose is only for the purpose of illustration and supplementary instructions. It may not be the actual proportion and precise configuration after the implementation of the creation. Therefore, the proportion and configuration relationship of the attached drawings should not be interpreted and limited to the scope of rights of the actual implementation of the creation. He Xianming.

First, please refer to Figure 3, which is a schematic diagram of the overall installation of a liquid-cooled heat exchange device according to a preferred embodiment of the present invention. The so-called "heat exchange" can only be used to teach cold and heat; The cold heat exchange device (10) includes at least:

A plurality of pipeline units (11); in a preferred embodiment of the present invention, the interior of the pipeline units (11) is filled with a heat-transfer medium (not shown in the figure), wherein the The heat transfer medium system can be switched between gaseous and liquid state, and the heat transfer medium system can be, for example, but not limited to, one of a refrigerant or water;

A vapor or gas pressurizer (12) is correspondingly connected to the piping units (11); in a preferred embodiment of this creation, the vapor or gas pressurizer (12) can The heat transfer medium inside the piping unit (11) is compressed into a gaseous state of high pressure and high temperature, wherein the vapor or gas pressurizer (12) can be, for example, but not limited to, a compressor;

A heat dissipation device (13) is correspondingly connected to the vapor or gas pressurizer (12) through the pipeline unit (11); in addition, the heat dissipation device (13) includes a fin-type heat dissipation bar (131) ), And a fan (132); further, the heat dissipation device (13) is a water-cooled heat dissipation device; in a preferred embodiment of the present invention, the heat dissipation device (13) and the vapor or gas pressurizer (12) is connected to each other through the pipeline unit (11), and the heat dissipating device (13) is composed of the fin-type heat sink (131) and the fan (132), and the pipeline unit ( 11) After the heat transfer medium in 11) flows into the fin-type heat sink (131), the fan (132) can be used to cool down, and then the heat transfer medium can be converted into a low-temperature and high-pressure liquid state;

The throttling device (14) is correspondingly connected to the heat dissipation device (13) through the pipeline unit (11); in addition, the throttling device (14) is a capillary tube, a temperature-sensing expansion valve, and an electronic expansion device. One of the devices such as a valve or an orifice restrictor (orifice); in a preferred embodiment of the present invention, the throttling device (14) and the heat dissipation device (13) are connected by the pipeline unit (11) Corresponding connection, and the throttling device (14) can reduce the pressure of the heat transfer medium in the pipeline unit (11) into a low-temperature and low-pressure liquid state to achieve the purpose of evaporative freezing;

A heat absorber (15) is connected to the throttling device (14) and the vapor or gas pressurizer (12) respectively through the pipeline units (11), wherein the heat absorber (15) is provided A heat absorption surface (151); in a preferred embodiment of the present invention, the heat absorber (15) is respectively connected to the throttling device (14) and the steam or A gas pressurizer (12), wherein the heat absorber (15) is provided with the heat absorption surface (151), and the heat absorption surface (151) is in contact with a heat source (H) and performs cold and heat exchange with the heat source (H) Wherein, the heat source (H) is heat energy generated from the operation of a chip (for example, a central processing unit). Generally, the heat source (H) is capable of transferring heat to the heat absorption surface (151) to enable the heat source (151). (H) The temperature is reduced or maintained at a certain temperature, and the low-temperature and low-pressure liquid heat medium passing through the heat sink (15) passes through the heat absorption surface (151) and is transferred from the heat source (H) to the heat absorption surface. The heat of (151) is taken away and converted into a high-temperature and low-pressure gaseous heat transfer medium, and finally flows through the pipeline unit (11) to the vapor or gas pressurizer (12) to complete a cycle Road;

A control unit (16) is connected to the steam or gas pressurizer (12), the heat sink (13), the throttling device (14), and the heat sink (15) respectively. In a preferred embodiment, the control unit (16) is connected to the steam or gas pressurizer (12), the heat sink (13), the throttling device (14) and the heat sink (15). To control the operation of the vapor or gas pressurizer (12), the heat sink (13), the throttling device (14) and the heat sink (15) and provide the required power;

A thermal conductivity circulation box (17) includes a box body (171), a cooling liquid (not shown in the figure), an internal pipe (172), and a cooling pipe respectively disposed inside the box body (171). (173), wherein the two ends of the internal pipeline (172) respectively correspond to the pipeline unit (11); in addition, the internal pipeline (172) has a continuous U-shaped pipe shape distribution, or other heat exchange type In addition, the thermal conductivity circulation box (17) can be further provided with a driving member (174) to drive the cooling liquid operation of the thermal conductivity circulation box (17); in a preferred embodiment of the present invention The thermal conductivity circulation box (17) is composed of the box body (171), the internal pipeline (172) in the form of a continuous U-tube, and the cooling pipeline (173), wherein the cooling pipe The internal part of the circuit (173) is filled with a cooling liquid, and the internal pipeline (172) which has a continuous U-shaped tube shape distribution can effectively improve the heat exchange efficiency of the cooling liquid of the thermal conduction circulation box (17), and The two ends of the cooling pipe (173) are respectively connected to the heat sink (15) to circulate heat, and the driving member (174) drives the cooling liquid to the cooling pipe (173) and the heat conduction circulation box. (17) in Circulating flow (173); and

A casing (20) is provided with the vapor or gas pressurizer (12), the heat radiating device (13), the throttling device (14), and the control unit (16), and the heat absorption The heat exchanger (15) and the heat conduction circulation box (17) are arranged outside the casing (20). In a preferred embodiment of the present invention, the liquid-cooled heat exchange device (10) can be accommodated in The casing (20) is convenient to carry and install. When heat exchange is required, it is only necessary to contact the heat absorption surface (151) of the heat absorber (15) with the heat source (H). The heat absorption surface (151) is The low-temperature and low-pressure liquid heat transfer medium filled in the internal pipeline (172) can be used for heat exchange to absorb the heat generated by the heat source (H) and convert the heat-transfer medium into a high-temperature and low-pressure gas state. ; Then, the heat transfer medium flows from the internal pipeline (172) through the pipeline unit (11) to the vapor or gas pressurizer (12) to pressurize to a high temperature and high pressure gas state, and After the pipeline unit (11) is introduced into the fin heat sink (131) of the heat sink (13) and the heat is cooled by the fan (132), the heat transfer medium in the pipeline unit (11) will be converted Low Liquid state at high temperature and high pressure; finally, the heat transfer medium is converted into a low temperature and low pressure liquid state through the capillary of the throttling device (14), so that the heat transfer medium introduced into the internal pipeline (172) becomes a low temperature and low pressure state to complete The circulation circuit; this circulation circuit can ensure that the heat transfer medium temperature of the heat absorption surface (151) in contact with the cooling pipe (173) can effectively dissipate the heat source (H) so that the heat absorption surface (151) reaches heat Exchange, so as to ensure that the operation of the central processing unit is still within a proper operating temperature under long-term operation.

In addition, please refer to FIG. 4 and FIG. 5, which are schematic diagrams of the exploded whole device and a schematic diagram of the erection of the whole device, which is a preferred embodiment of the device having a liquid-cooled heat exchange device. (10) is the same as the previous embodiment, so it will not be repeated; the liquid-cooled heat exchange device (10) is directly installed in a device (30), which is a computer host, a container or a building In a preferred embodiment of the invention, the device (30) is a computer host, and the device (30) has a casing (31). In the embodiment, the casing (31) is a computer casing, and a power supply unit (32) and a working unit (33) are provided inside the casing (31) or the device (30). The working unit (33) The main board (331) is provided with a central processing unit (3311), wherein the central processing unit (3311) is a heat source, and the liquid cooling heat exchange device (10) is opposite to the main board (331). The work unit (33) is provided with the heat sink (15), wherein the heat absorption surface (151) of the heat sink (15) is in contact with the central processing unit (3311); at the same time, the power supply The unit (32) can directly supply the power required by the liquid-cooled heat exchange device (10), so that the liquid-cooled heat exchange device (10) does not require additional power; generally speaking, the heat sink (15) The area of action is small, so the power consumption of the steam or gas pressurizer (12) is relatively small, so the liquid-cooled heat exchanger (10) can directly use the power provided by the power supply unit (32) without Will affect the performance and stability of the work unit (33); at the same time, a temperature sensor (3312) is further connected to the motherboard (331) of the work unit (33), and the temperature sensor (3312) It is clamped between the heat sink (15) and the central processing unit (3311) and is in contact with the heat absorption surface (151). The main board (331) is provided with a pulse width modulation speed regulating device (3313) The control unit (16) is connected to the pulse width modulation speed regulating device (3313) to control the operation of the liquid-cooled heat exchange device (10). When the working unit (33) is just started, its temperature is Below a threshold, the control unit (16) does not activate the steam or gas pressurizer (12) and the fan (132); after a period of time, the worker The temperature of the central processing unit (3311) on the unit (33) will rise, so the temperature sensor (3312) will sense that the temperature of the central processing unit (3311) has increased. When the temperature sensor (3312) senses the central processing unit, When the temperature of the processor (3311) is equal to or exceeds the threshold value, the pulse width modulation speed regulating device (3313) notifies the control unit (16) with a signal, and the control unit (16) will drive the steam or gas The pressurizer (12) and the fan (132) are operated to perform the cyclic cooling of the heat medium between the circulation circuit, and then after the temperature drop is completed, for example, the temperature sensor (3312) senses the central processing unit (3311) When the temperature is lower than the threshold value, the pulse width modulation speed regulating device (3313) notifies the control unit (16) with another signal, and the control unit (16) can slow down or stop the liquid cooling heat exchange device (10) Operation; therefore, the liquid-cooled heat exchange device (10) can be operated again when needed, which can reduce energy loss and avoid excessive heat dissipation of the heat sink (15), resulting in the central processing unit (3311) and the work unit (33) Frost or low temperature.

In addition, the device (30) has two working units (33) inside. The working units (33) are respectively the main board (331) and a display card (332). The main board (331) is provided with The central processing unit (3311) and the graphics card (332) are provided with a graphics processor (3321), and the liquid-cooled heat exchange device (10) is provided with the cooling pipe relative to the working units (33). Two heat sinks (15) connected in series in circuit (173), wherein the heat sinks (15) are respectively connected with the central processing unit (3311) and the graphics processor (1311) through their respective heat absorption surfaces (151). 3321) contact.

In addition, the central processing unit (3311) has a specification of 95W, and the graphics processor (3321) has a specification of 150W. The liquid-cooled heat exchange device (10) is for heat between 250W ~ 600W. Cooling.

Furthermore, please refer to FIG. 6, which is a block diagram of a liquid-cooled heat exchange device according to a preferred embodiment of a device having a liquid-cooled heat exchange device. The liquid-cooled heat exchange device (10) is roughly It is the same as the previous embodiment, so it will not be repeated; the equipment (30) has a plurality of working units (33) inside, and the liquid-cooled heat exchange device (10) of this embodiment has a plurality of heat sinks (15), The plurality of heat absorbers (15) are connected by the pipeline unit (11) to complete the circulation circuit, and preferably, the plurality of heat absorbers (15) are connected in series by the cooling pipeline (173) to complete the circulation circuit. The best is that a plurality of the heat sinks (15) are connected in series with the cooling pipe (173) to complete the circulation loop; the heat sink (15) and the heat absorption surface (151) are connected to the central processing unit ( 3311) contact, preferably the heat absorption surface (151) is in contact with the corresponding central processing unit (3311), most preferably each heat absorption surface (151) is in contact with each corresponding central processing unit (3311) contact.

According to the above implementation description, compared with the existing technology and products, this creation has the following advantages:

1. The liquid-cooled heat exchange device and the equipment with the liquid-cooled heat exchange device in this creation are mainly designed by filling the heat transfer medium inside the piping unit with the hardware design, through the steam or gas pressurizer, heat dissipation device, throttling The circulation of the device effectively allows the heat transfer medium to flow to the heat sink and take away the heat from the heat absorption surface, and the heat conduction circulation box quickly and stably exchanges the heat source of the heat absorption gas, which effectively achieves an effective heat exchange cycle and accelerates the heat dissipation effect The main advantage.

2. The liquid-cooled heat exchange device and the equipment with liquid-cooled heat exchange device in this creation mainly improve the cooling effect through the direct cooling and heat dissipation effect of the heat absorber in direct contact with the heat source, and the temperature of the cooling medium after circulation Can maintain low temperature state, even if it is used for a long time, it will not lose its cooling effect, and avoid the disadvantages of delayed or damaged cooling caused by overheating.

In summary, the liquid-cooled heat-exchange device and the device with the liquid-cooled heat-exchange device of this creation can indeed achieve the expected use effect through the embodiments disclosed above, and this creation has not been disclosed before the application. , Cheng has fully complied with the provisions and requirements of the Patent Law. I filed an application for a creation patent in accordance with the law, and I urge you to examine it and grant the patent.

However, the illustrations and descriptions disclosed above are only preferred embodiments of this creation, and are not intended to limit the scope of protection of this creation. Anyone who is familiar with the art, based on the characteristics of this creation, does other things. Equivalent changes or modifications should be regarded as not departing from the design scope of this creation.

(Traditional liquid cooling system)
(40) ‧‧‧Liquid cooling system
(41) ‧‧‧Piping system
(42) ‧‧‧Heat conduction department
(43) ‧‧‧Cooling end
(44) ‧‧‧Cooling Fan
(50) ‧‧‧Computer host
(51) ‧‧‧Central Processing Unit
(Traditional fan cooling system)
(60) ‧‧‧Host Unit
(62) ‧‧‧Graphics Processor
(64) ‧‧‧Exhaust Fan
(The liquid-cooled heat exchange device and the equipment with the liquid-cooled heat exchange device)
(10) ‧‧‧Liquid cooling heat exchange device
(11) ‧‧‧Piping unit
(12) ‧‧‧Steam or gas pressurizer
(13) ‧‧‧Cooling device
(131) ‧‧‧finned heat sink
(132) ‧‧‧fan
(14) ‧‧‧Throttling device
(15) ‧‧‧Heat absorber
(151) ‧‧‧Heat absorption surface
(16) ‧‧‧Control unit
(17) ‧‧‧Heat Conduction Circulation Box
(171) ‧‧‧Box
(172) ‧‧‧Internal pipeline
(173) ‧‧‧cooling pipeline
(174) ‧‧‧Driver
(20) ‧‧‧Shell
(30) ‧‧‧Equipment
(31) ‧‧‧Shell
(32) ‧‧‧Power supply unit
(33) ‧‧‧Working unit
(331) ‧‧‧Motherboard
(3311) ‧‧‧Central Processing Unit
(3312) ‧‧‧Temperature sensor
(3313) ‧‧‧Pulse width modulation speed
(332) ‧‧‧Graphics
(3321) ‧‧‧Graphics Processor
(H) ‧‧‧Heat

Figure 1: Schematic of a traditional liquid cooling system. Figure 2: Schematic diagram of a traditional fan cooling system. Fig. 3: Schematic diagram of the overall device installation of a preferred embodiment of the liquid-cooled heat exchange device of the present invention. FIG. 4 is an overall exploded view of a preferred embodiment of a device having a liquid-cooled heat exchange device. Figure 5: Schematic diagram of the overall installation of a preferred embodiment of a liquid-cooled heat exchange device. Fig. 6: A block diagram of a liquid-cooled heat exchange device according to a preferred embodiment of the device having a liquid-cooled heat exchange device of the present invention.

Claims (23)

A liquid-cooled heat exchange device at least includes: a plurality of pipeline units (11); a vapor or gas pressurizer (12), correspondingly connected to the pipeline units (11); a heat dissipation device (13) ), Which is connected to the vapor or gas pressurizer (12) by the pipeline unit (11); the throttle device (14), which is corresponding to the heat dissipation device by the pipeline unit (11) (13) connection; a heat absorber (15), which respectively connects the throttling device (14) and the vapor or gas pressurizer (12) through the pipeline units (11) respectively, wherein the heat absorber (15) is provided with a heat absorption surface (151); a control unit (16) is respectively connected with the steam or gas pressurizer (12), the heat dissipation device (13), the throttling device (14), and the Signal connection of the heat absorber (15); a thermal conductivity circulation box (17), which includes a box body (171), a cooling liquid disposed inside the box body (171), an internal pipeline (172), and cooling A pipeline (173), wherein the internal pipeline (172) and the cooling pipeline (173) are correspondingly connected to the heat sink (15) through the pipeline unit (11); and a casing (20) , The interior is equipped with the steam Or gas pressurizer (12), the heat radiating device (13), the throttling device (14), and the control unit (16), and the heat absorber (15) and the heat conduction circulation box (17) are provided Outside the casing (20). The liquid-cooled heat exchange device according to item 1 of the scope of the patent application, wherein the heat dissipation device (13) comprises a fin-type heat dissipation bar (131), and a fan (132). The liquid-cooled heat exchange device according to item 1 of the scope of the patent application, wherein the throttling device (14) is one of a capillary tube, a temperature-sensitive expansion valve, an electronic expansion valve, or a orifice restrictor plate. The liquid-cooled heat exchange device according to item 1 of the scope of the patent application, wherein the internal pipeline (172) is distributed in a continuous U-shaped tube. According to the liquid-cooled heat exchange device described in item 1 of the scope of the patent application, the heat conduction circulation box (17) is further provided with a driving member (174) to drive the operation of the heat conduction circulation box (17). A device having a liquid-cooled heat-exchange device includes at least: a liquid-cooled heat-exchange device (10), comprising: a plurality of pipeline units (11); a vapor or gas pressurizer (12); a The heat radiation device (13) is correspondingly connected to the vapor or gas pressurizer (12) through the pipeline unit (11); The throttling device (14) is correspondingly connected through the pipeline unit (11) Connected to the heat sink (13); (1) a heat absorber (15), which respectively connects the throttling device (14) and the vapor or gas pressurizer (12) through the pipeline units (11), The heat absorber (15) is provided with a heat absorption surface (151); a control unit (16) is respectively connected with the steam or gas pressurizer (12), the heat dissipation device (13), and the throttling device (14) ), And the signal connection of the heat sink (15); a thermal conductivity circulation box (17), which includes a box (171), a cooling liquid and an internal pipe (172) respectively disposed inside the box (171) ), And a cooling pipe (173), wherein the internal pipe (172) and the cooling pipe (173) are connected to the heat sink (15) through the pipe unit (11) correspondingly. ; And a device (30), inside which system comprises at least one working unit (33), wherein (33) system and the endothermic surface (151) of the working unit is connected. The device having a liquid-cooled heat exchange device as described in item 6 of the scope of the patent application, wherein the heat absorption surface (151) is in contact with a wafer of the work unit (33). The device having a liquid-cooled heat exchange device according to item 7 of the scope of the patent application, wherein the chip is one of a central processing unit (3311) or a graphics processor (3321). For example, the equipment with liquid-cooled heat exchange device described in item 8 of the scope of the patent application, wherein the central processing unit (3311) has a specification of 95W or more. For example, the device with a liquid-cooled heat exchange device described in item 8 of the scope of the patent application, wherein the graphics processor (3321) has a specification of 150W or more. The device with a liquid-cooled heat exchange device as described in item 8 of the scope of the patent application, wherein the liquid-cooled heat exchange device (10) is for heat dissipation between 250W and 600W. A device having a liquid-cooled heat-exchange device includes at least: a liquid-cooled heat-exchange device (10), comprising: a plurality of pipeline units (11); a vapor or gas pressurizer (12); a The heat radiation device (13) is correspondingly connected to the vapor or gas pressurizer (12) through the pipeline unit (11); The throttling device (14) is correspondingly connected through the pipeline unit (11) Connected to the heat sink (13); A plurality of heat sinks (15) are connected to the throttling device (14) and the steam or gas pressurizer (12) through the pipeline units (11) respectively. Each of the heat sinks (15) is provided with a heat absorption surface (151); a control unit (16) is connected with the steam or gas pressurizer (12), the heat sink (13), and the throttling respectively. The device (14), and the signal connection of these heat sinks (15); A thermal conductivity circulation box (17), which includes a box (171), a cooling liquid disposed inside the box (171), Pipe (172) and cooling pipe (173), wherein the internal pipe (172) and the cooling pipe (173) correspond to each other through the pipe unit (11) Connected to the heat sinks (15); and a device (30), the interior of which includes a plurality of work units (33), wherein the work units (33) are correspondingly connected to the heat absorption surfaces (151). For example, the device with liquid-cooled heat exchange device described in item 12 of the scope of the patent application, wherein the heat sinks (15) are connected by the pipeline units (11). For example, the equipment with a liquid-cooled heat exchange device described in item 12 of the scope of the patent application, wherein the heat sinks (15) are connected in series by the pipeline units (11). For example, the device with a liquid-cooled heat exchange device described in item 14 of the scope of the patent application, wherein the heat sinks (15) are connected in series by the pipeline units (11). For example, the device with a liquid-cooled heat exchange device described in item 12 of the scope of the patent application, wherein the working units (33) have a plurality of wafers, and the heat-absorbing surface (151) is in contact with the wafers. The device with a liquid-cooled heat exchange device as described in item 16 of the scope of patent application, wherein the heat-absorbing surfaces (151) are in contact with the wafer correspondingly. According to the device with a liquid-cooled heat exchange device described in item 16 of the scope of the patent application, each of the heat absorption surfaces (151) is in contact with each of the wafers. The device having a liquid-cooled heat exchange device according to item 16 of the scope of the patent application, wherein the chip is one of a central processing unit (3311) or a graphics processor (3321). For example, the equipment with a liquid-cooled heat exchange device described in item 12 of the scope of the patent application, wherein the equipment (30) is further provided with at least one power supply unit (32), and the power supply unit (32) is electrically connected to the work Unit (33). According to the device with a liquid-cooled heat exchange device described in item 20 of the scope of the patent application, wherein the power supply unit (32) is electrically connected to the liquid-cooled heat exchange device (10). According to the device with liquid-cooled heat exchange device described in item 12 of the scope of the patent application, a temperature sensor (3312) is further connected between the working unit (33) and the heat absorption surface (151), and the temperature The inductor (3312) is in contact with the heat sink (15). According to the device with a liquid-cooled heat exchange device described in item 12 of the scope of the patent application, the working unit (33) is further provided with a pulse width modulation speed regulating device (3313) connected to the signal of the control unit (16).