TWI649159B - 研磨墊的修整方法及裝置 - Google Patents

研磨墊的修整方法及裝置 Download PDF

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Publication number
TWI649159B
TWI649159B TW104104535A TW104104535A TWI649159B TW I649159 B TWI649159 B TW I649159B TW 104104535 A TW104104535 A TW 104104535A TW 104104535 A TW104104535 A TW 104104535A TW I649159 B TWI649159 B TW I649159B
Authority
TW
Taiwan
Prior art keywords
polishing pad
polishing
surface roughness
temperature
pad
Prior art date
Application number
TW104104535A
Other languages
English (en)
Chinese (zh)
Other versions
TW201532735A (zh
Inventor
丸山徹
高橋信行
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW201532735A publication Critical patent/TW201532735A/zh
Application granted granted Critical
Publication of TWI649159B publication Critical patent/TWI649159B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/095—Cooling or lubricating during dressing operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW104104535A 2014-02-20 2015-02-11 研磨墊的修整方法及裝置 TWI649159B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014030998A JP6340205B2 (ja) 2014-02-20 2014-02-20 研磨パッドのコンディショニング方法及び装置
JP2014-030998 2014-02-20

Publications (2)

Publication Number Publication Date
TW201532735A TW201532735A (zh) 2015-09-01
TWI649159B true TWI649159B (zh) 2019-02-01

Family

ID=53797295

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104104535A TWI649159B (zh) 2014-02-20 2015-02-11 研磨墊的修整方法及裝置

Country Status (5)

Country Link
US (1) US9731401B2 (enExample)
JP (1) JP6340205B2 (enExample)
KR (1) KR102179092B1 (enExample)
CN (1) CN104858785B (enExample)
TW (1) TWI649159B (enExample)

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TWI872241B (zh) * 2020-05-08 2025-02-11 日商荏原製作所股份有限公司 墊溫度調整裝置、墊溫度調整方法、及研磨裝置

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JP6161999B2 (ja) * 2013-08-27 2017-07-12 株式会社荏原製作所 研磨方法および研磨装置
JP2017121672A (ja) * 2016-01-05 2017-07-13 不二越機械工業株式会社 ワーク研磨方法および研磨パッドのドレッシング方法
US9865477B2 (en) * 2016-02-24 2018-01-09 Taiwan Semiconductor Manufacturing Co., Ltd. Backside polisher with dry frontside design and method using the same
TWI582385B (zh) * 2016-05-06 2017-05-11 中華大學 一種研磨墊檢測系統及其方法
JP6715153B2 (ja) * 2016-09-30 2020-07-01 株式会社荏原製作所 基板研磨装置
JP7023455B2 (ja) * 2017-01-23 2022-02-22 不二越機械工業株式会社 ワーク研磨方法およびワーク研磨装置
JP6923342B2 (ja) * 2017-04-11 2021-08-18 株式会社荏原製作所 研磨装置、及び、研磨方法
US10350724B2 (en) 2017-07-31 2019-07-16 Taiwan Semiconductor Manufacturing Company, Ltd. Temperature control in chemical mechanical polish
CN107553330B (zh) * 2017-10-20 2019-07-12 德淮半导体有限公司 修整盘系统、化学机械研磨装置及修整盘脱落侦测方法
CN109702650A (zh) * 2017-10-26 2019-05-03 长鑫存储技术有限公司 研磨垫修整方法、化学机械研磨方法及装置
CN109866108A (zh) * 2017-12-01 2019-06-11 咏巨科技有限公司 抛光垫修整装置及其制造方法以及抛光垫修整方法
JP6975078B2 (ja) 2018-03-15 2021-12-01 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
KR102644395B1 (ko) * 2018-05-02 2024-03-08 주식회사 케이씨텍 패드 어셈블리 및 이를 포함하는 컨디셔너 장치
CN110549239A (zh) * 2018-05-31 2019-12-10 长鑫存储技术有限公司 化学机械研磨装置及研磨垫表面修整方法
US11738423B2 (en) * 2018-07-31 2023-08-29 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
JP7066599B2 (ja) * 2018-11-28 2022-05-13 株式会社荏原製作所 温度調整装置及び研磨装置
JP7315332B2 (ja) * 2019-01-31 2023-07-26 株式会社荏原製作所 ダミーディスクおよびダミーディスクを用いた表面高さ測定方法
TWI856837B (zh) * 2019-03-21 2024-09-21 美商應用材料股份有限公司 監視化學機械拋光中的拋光墊紋理
JP7240931B2 (ja) * 2019-03-29 2023-03-16 株式会社荏原製作所 熱交換器の洗浄装置、および研磨装置
US11633833B2 (en) * 2019-05-29 2023-04-25 Applied Materials, Inc. Use of steam for pre-heating of CMP components
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
JP7406980B2 (ja) * 2019-12-24 2023-12-28 株式会社荏原製作所 研磨ユニット、基板処理装置、および研磨方法
CN112405333B (zh) * 2020-12-04 2022-08-16 华海清科(北京)科技有限公司 一种化学机械抛光装置和抛光方法
KR102721631B1 (ko) * 2021-09-17 2024-10-23 에스케이엔펄스 주식회사 연마패드의 리프레쉬 방법, 이를 이용한 반도체 소자의 제조방법 및 반도체 소자의 제조 장치
CN115415912A (zh) * 2022-08-03 2022-12-02 天津中环领先材料技术有限公司 一种硅片抛光装置及采用该装置的抛光方法

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Publication number Priority date Publication date Assignee Title
TWI872241B (zh) * 2020-05-08 2025-02-11 日商荏原製作所股份有限公司 墊溫度調整裝置、墊溫度調整方法、及研磨裝置

Also Published As

Publication number Publication date
US9731401B2 (en) 2017-08-15
JP2015155128A (ja) 2015-08-27
CN104858785B (zh) 2019-01-11
US20150231760A1 (en) 2015-08-20
KR20150098574A (ko) 2015-08-28
TW201532735A (zh) 2015-09-01
CN104858785A (zh) 2015-08-26
JP6340205B2 (ja) 2018-06-06
KR102179092B1 (ko) 2020-11-16

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