KR102179092B1 - 연마 패드의 컨디셔닝 방법 및 장치 - Google Patents

연마 패드의 컨디셔닝 방법 및 장치 Download PDF

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Publication number
KR102179092B1
KR102179092B1 KR1020150021693A KR20150021693A KR102179092B1 KR 102179092 B1 KR102179092 B1 KR 102179092B1 KR 1020150021693 A KR1020150021693 A KR 1020150021693A KR 20150021693 A KR20150021693 A KR 20150021693A KR 102179092 B1 KR102179092 B1 KR 102179092B1
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South Korea
Prior art keywords
polishing pad
surface roughness
polishing
roughness
temperature
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Korean (ko)
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KR20150098574A (ko
Inventor
도루 마루야마
노부유키 다카하시
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가부시키가이샤 에바라 세이사꾸쇼
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/095—Cooling or lubricating during dressing operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020150021693A 2014-02-20 2015-02-12 연마 패드의 컨디셔닝 방법 및 장치 Active KR102179092B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-030998 2014-02-20
JP2014030998A JP6340205B2 (ja) 2014-02-20 2014-02-20 研磨パッドのコンディショニング方法及び装置

Publications (2)

Publication Number Publication Date
KR20150098574A KR20150098574A (ko) 2015-08-28
KR102179092B1 true KR102179092B1 (ko) 2020-11-16

Family

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Application Number Title Priority Date Filing Date
KR1020150021693A Active KR102179092B1 (ko) 2014-02-20 2015-02-12 연마 패드의 컨디셔닝 방법 및 장치

Country Status (5)

Country Link
US (1) US9731401B2 (enExample)
JP (1) JP6340205B2 (enExample)
KR (1) KR102179092B1 (enExample)
CN (1) CN104858785B (enExample)
TW (1) TWI649159B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN112405333A (zh) * 2020-12-04 2021-02-26 华海清科(北京)科技有限公司 一种化学机械抛光装置和抛光方法

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JP6161999B2 (ja) * 2013-08-27 2017-07-12 株式会社荏原製作所 研磨方法および研磨装置
JP2017121672A (ja) * 2016-01-05 2017-07-13 不二越機械工業株式会社 ワーク研磨方法および研磨パッドのドレッシング方法
US9865477B2 (en) * 2016-02-24 2018-01-09 Taiwan Semiconductor Manufacturing Co., Ltd. Backside polisher with dry frontside design and method using the same
TWI582385B (zh) * 2016-05-06 2017-05-11 中華大學 一種研磨墊檢測系統及其方法
JP6715153B2 (ja) * 2016-09-30 2020-07-01 株式会社荏原製作所 基板研磨装置
JP7023455B2 (ja) * 2017-01-23 2022-02-22 不二越機械工業株式会社 ワーク研磨方法およびワーク研磨装置
JP6923342B2 (ja) * 2017-04-11 2021-08-18 株式会社荏原製作所 研磨装置、及び、研磨方法
US10350724B2 (en) * 2017-07-31 2019-07-16 Taiwan Semiconductor Manufacturing Company, Ltd. Temperature control in chemical mechanical polish
CN107553330B (zh) * 2017-10-20 2019-07-12 德淮半导体有限公司 修整盘系统、化学机械研磨装置及修整盘脱落侦测方法
CN109702650A (zh) * 2017-10-26 2019-05-03 长鑫存储技术有限公司 研磨垫修整方法、化学机械研磨方法及装置
CN109866108A (zh) * 2017-12-01 2019-06-11 咏巨科技有限公司 抛光垫修整装置及其制造方法以及抛光垫修整方法
JP6975078B2 (ja) 2018-03-15 2021-12-01 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
KR102644395B1 (ko) * 2018-05-02 2024-03-08 주식회사 케이씨텍 패드 어셈블리 및 이를 포함하는 컨디셔너 장치
CN110549239A (zh) * 2018-05-31 2019-12-10 长鑫存储技术有限公司 化学机械研磨装置及研磨垫表面修整方法
US11738423B2 (en) * 2018-07-31 2023-08-29 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
JP7066599B2 (ja) * 2018-11-28 2022-05-13 株式会社荏原製作所 温度調整装置及び研磨装置
JP7315332B2 (ja) * 2019-01-31 2023-07-26 株式会社荏原製作所 ダミーディスクおよびダミーディスクを用いた表面高さ測定方法
TWI820308B (zh) * 2019-03-21 2023-11-01 美商應用材料股份有限公司 監視化學機械拋光中的拋光墊紋理
JP7240931B2 (ja) * 2019-03-29 2023-03-16 株式会社荏原製作所 熱交換器の洗浄装置、および研磨装置
US11633833B2 (en) * 2019-05-29 2023-04-25 Applied Materials, Inc. Use of steam for pre-heating of CMP components
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
JP7406980B2 (ja) * 2019-12-24 2023-12-28 株式会社荏原製作所 研磨ユニット、基板処理装置、および研磨方法
JP7421413B2 (ja) * 2020-05-08 2024-01-24 株式会社荏原製作所 パッド温度調整装置、パッド温度調整方法、および研磨装置
KR102721631B1 (ko) * 2021-09-17 2024-10-23 에스케이엔펄스 주식회사 연마패드의 리프레쉬 방법, 이를 이용한 반도체 소자의 제조방법 및 반도체 소자의 제조 장치
CN115415912A (zh) * 2022-08-03 2022-12-02 天津中环领先材料技术有限公司 一种硅片抛光装置及采用该装置的抛光方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112405333A (zh) * 2020-12-04 2021-02-26 华海清科(北京)科技有限公司 一种化学机械抛光装置和抛光方法

Also Published As

Publication number Publication date
TWI649159B (zh) 2019-02-01
CN104858785A (zh) 2015-08-26
JP6340205B2 (ja) 2018-06-06
CN104858785B (zh) 2019-01-11
TW201532735A (zh) 2015-09-01
JP2015155128A (ja) 2015-08-27
US20150231760A1 (en) 2015-08-20
US9731401B2 (en) 2017-08-15
KR20150098574A (ko) 2015-08-28

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