TWI648767B - 基板處理方法及基板處理裝置 - Google Patents

基板處理方法及基板處理裝置 Download PDF

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Publication number
TWI648767B
TWI648767B TW106127782A TW106127782A TWI648767B TW I648767 B TWI648767 B TW I648767B TW 106127782 A TW106127782 A TW 106127782A TW 106127782 A TW106127782 A TW 106127782A TW I648767 B TWI648767 B TW I648767B
Authority
TW
Taiwan
Prior art keywords
substrate
liquid
organic solvent
filler
revolutions
Prior art date
Application number
TW106127782A
Other languages
English (en)
Chinese (zh)
Other versions
TW201820406A (zh
Inventor
金松泰範
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW201820406A publication Critical patent/TW201820406A/zh
Application granted granted Critical
Publication of TWI648767B publication Critical patent/TWI648767B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW106127782A 2016-09-27 2017-08-16 基板處理方法及基板處理裝置 TWI648767B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016-188638 2016-09-27
JP2016188638 2016-09-27
JP2017-153163 2017-08-08
JP2017153163A JP6983571B2 (ja) 2016-09-27 2017-08-08 基板処理方法および基板処理装置

Publications (2)

Publication Number Publication Date
TW201820406A TW201820406A (zh) 2018-06-01
TWI648767B true TWI648767B (zh) 2019-01-21

Family

ID=61837178

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106127782A TWI648767B (zh) 2016-09-27 2017-08-16 基板處理方法及基板處理裝置

Country Status (3)

Country Link
JP (1) JP6983571B2 (ko)
KR (1) KR102015702B1 (ko)
TW (1) TWI648767B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7013309B2 (ja) * 2018-04-10 2022-01-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7308105B2 (ja) * 2019-09-02 2023-07-13 東京エレクトロン株式会社 現像処理方法及び現像処理装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011124313A (ja) * 2009-12-09 2011-06-23 Tokyo Electron Ltd 基板処理システム、基板処理装置、基板処理方法及び基板処理プログラムを記録した記録媒体
JP2013258272A (ja) * 2012-06-12 2013-12-26 Toshiba Corp 基板の乾燥方法、電子装置の製造方法及び基板の乾燥装置
TW201517116A (zh) * 2013-07-19 2015-05-01 Tokyo Electron Ltd 基板處理裝置、基板處理方法及基板處理用記憶媒體
TW201523725A (zh) * 2013-09-30 2015-06-16 Shibaura Mechatronics Corp 基板處理裝置及基板處理方法
TW201613016A (en) * 2014-08-15 2016-04-01 Screen Holdings Co Ltd Substrate treatment apparatus, and substrate treatment method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3300624B2 (ja) * 1997-01-24 2002-07-08 東京エレクトロン株式会社 基板端面の洗浄方法
JP5188216B2 (ja) * 2007-07-30 2013-04-24 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5681560B2 (ja) * 2011-05-17 2015-03-11 東京エレクトロン株式会社 基板乾燥方法及び基板処理装置
JP5622675B2 (ja) * 2011-07-05 2014-11-12 株式会社東芝 基板処理方法及び基板処理装置
JP6117711B2 (ja) * 2014-02-06 2017-04-19 信越化学工業株式会社 半導体基板の洗浄乾燥方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011124313A (ja) * 2009-12-09 2011-06-23 Tokyo Electron Ltd 基板処理システム、基板処理装置、基板処理方法及び基板処理プログラムを記録した記録媒体
JP2013258272A (ja) * 2012-06-12 2013-12-26 Toshiba Corp 基板の乾燥方法、電子装置の製造方法及び基板の乾燥装置
TW201517116A (zh) * 2013-07-19 2015-05-01 Tokyo Electron Ltd 基板處理裝置、基板處理方法及基板處理用記憶媒體
TW201523725A (zh) * 2013-09-30 2015-06-16 Shibaura Mechatronics Corp 基板處理裝置及基板處理方法
TW201613016A (en) * 2014-08-15 2016-04-01 Screen Holdings Co Ltd Substrate treatment apparatus, and substrate treatment method

Also Published As

Publication number Publication date
JP2018056553A (ja) 2018-04-05
JP6983571B2 (ja) 2021-12-17
TW201820406A (zh) 2018-06-01
KR20180034229A (ko) 2018-04-04
KR102015702B1 (ko) 2019-08-28

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