TWI642340B - 配線板之製造方法 - Google Patents

配線板之製造方法 Download PDF

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Publication number
TWI642340B
TWI642340B TW103144797A TW103144797A TWI642340B TW I642340 B TWI642340 B TW I642340B TW 103144797 A TW103144797 A TW 103144797A TW 103144797 A TW103144797 A TW 103144797A TW I642340 B TWI642340 B TW I642340B
Authority
TW
Taiwan
Prior art keywords
layer
main surface
molecular bonding
wiring
wiring board
Prior art date
Application number
TW103144797A
Other languages
English (en)
Chinese (zh)
Other versions
TW201542058A (zh
Inventor
中村茂雄
Shigeo Nakamura
巽志朗
Shiro Tatsumi
竹內光二
Koji Takeuchi
Original Assignee
日商味之素股份有限公司
Ajinomoto Co., Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司, Ajinomoto Co., Inc. filed Critical 日商味之素股份有限公司
Publication of TW201542058A publication Critical patent/TW201542058A/zh
Application granted granted Critical
Publication of TWI642340B publication Critical patent/TWI642340B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW103144797A 2013-12-27 2014-12-22 配線板之製造方法 TWI642340B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013272771 2013-12-27
JP2013-272771 2013-12-27
JP2014027636 2014-02-17
JP2014-027636 2014-02-17

Publications (2)

Publication Number Publication Date
TW201542058A TW201542058A (zh) 2015-11-01
TWI642340B true TWI642340B (zh) 2018-11-21

Family

ID=53478465

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103144797A TWI642340B (zh) 2013-12-27 2014-12-22 配線板之製造方法

Country Status (4)

Country Link
JP (1) JP6657954B2 (ja)
KR (1) KR102259485B1 (ja)
TW (1) TWI642340B (ja)
WO (1) WO2015098601A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7085328B2 (ja) 2017-09-29 2022-06-16 日東電工株式会社 配線回路基板、その製造方法および撮像装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234573A (ja) * 2002-02-07 2003-08-22 Fujitsu Ltd 多層配線基板の製造方法およびこれにより製造される多層配線基板
JP2013004619A (ja) * 2011-06-14 2013-01-07 Daitech Inc フレキシブル配線板及びその製造方法
WO2013143732A1 (en) * 2012-03-29 2013-10-03 Atotech Deutschland Gmbh Method for manufacture of fine line circuitry

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012043631A (ja) 2010-08-19 2012-03-01 Chugoku Electric Power Co Inc:The ネジ落下防止補助具
JP5753471B2 (ja) * 2011-10-12 2015-07-22 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234573A (ja) * 2002-02-07 2003-08-22 Fujitsu Ltd 多層配線基板の製造方法およびこれにより製造される多層配線基板
JP2013004619A (ja) * 2011-06-14 2013-01-07 Daitech Inc フレキシブル配線板及びその製造方法
WO2013143732A1 (en) * 2012-03-29 2013-10-03 Atotech Deutschland Gmbh Method for manufacture of fine line circuitry

Also Published As

Publication number Publication date
WO2015098601A1 (ja) 2015-07-02
KR20160102395A (ko) 2016-08-30
JP6657954B2 (ja) 2020-03-04
TW201542058A (zh) 2015-11-01
KR102259485B1 (ko) 2021-06-03
JPWO2015098601A1 (ja) 2017-03-23

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