TWI641650B - Organic electroluminescent display element sealant - Google Patents

Organic electroluminescent display element sealant Download PDF

Info

Publication number
TWI641650B
TWI641650B TW103126555A TW103126555A TWI641650B TW I641650 B TWI641650 B TW I641650B TW 103126555 A TW103126555 A TW 103126555A TW 103126555 A TW103126555 A TW 103126555A TW I641650 B TWI641650 B TW I641650B
Authority
TW
Taiwan
Prior art keywords
group
weight
polymerizable functional
curable resin
post
Prior art date
Application number
TW103126555A
Other languages
English (en)
Chinese (zh)
Other versions
TW201510056A (zh
Inventor
渡邉康雄
七里德重
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW201510056A publication Critical patent/TW201510056A/zh
Application granted granted Critical
Publication of TWI641650B publication Critical patent/TWI641650B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/22—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the initiator used in polymerisation
    • C08G2650/24—Polymeric initiators

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW103126555A 2013-08-26 2014-08-04 Organic electroluminescent display element sealant TWI641650B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2013-174579 2013-08-26
JP2013174579 2013-08-26

Publications (2)

Publication Number Publication Date
TW201510056A TW201510056A (zh) 2015-03-16
TWI641650B true TWI641650B (zh) 2018-11-21

Family

ID=52586263

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103126555A TWI641650B (zh) 2013-08-26 2014-08-04 Organic electroluminescent display element sealant

Country Status (5)

Country Link
JP (1) JP5799177B2 (ko)
KR (1) KR102226987B1 (ko)
CN (1) CN105026456B (ko)
TW (1) TWI641650B (ko)
WO (1) WO2015029689A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6560985B2 (ja) * 2014-01-23 2019-08-14 デンカ株式会社 樹脂組成物
KR102392860B1 (ko) * 2016-10-19 2022-04-29 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
KR20200115573A (ko) * 2018-01-26 2020-10-07 아지노모토 가부시키가이샤 밀봉용 경화성 수지 조성물
CN112955488A (zh) * 2018-11-28 2021-06-11 积水化学工业株式会社 固化性树脂组合物、固化物及有机el显示元件
WO2020129794A1 (ja) * 2018-12-18 2020-06-25 積水化学工業株式会社 硬化性樹脂組成物、硬化物、及び、有機ｅｌ表示素子
KR20210132001A (ko) * 2019-02-21 2021-11-03 덴카 주식회사 조성물

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200946555A (en) * 2008-03-21 2009-11-16 Sekisui Chemical Co Ltd Curable composition, anisotropic conductive material and connection structure
TW201202336A (en) * 2010-06-25 2012-01-16 Sumitomo Bakelite Co Resin composition, transparent composite substrate and display device substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07238148A (ja) * 1994-02-25 1995-09-12 Hitachi Chem Co Ltd 感光性ポリアミドエポキシ樹脂組成物
JP2001357973A (ja) 2000-06-15 2001-12-26 Sony Corp 表示装置
JP4328645B2 (ja) * 2004-02-26 2009-09-09 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板
JP2006135128A (ja) * 2004-11-08 2006-05-25 Seiko Epson Corp 導電性材料用組成物、導電性材料、導電層、電子デバイスおよび電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200946555A (en) * 2008-03-21 2009-11-16 Sekisui Chemical Co Ltd Curable composition, anisotropic conductive material and connection structure
TW201202336A (en) * 2010-06-25 2012-01-16 Sumitomo Bakelite Co Resin composition, transparent composite substrate and display device substrate

Also Published As

Publication number Publication date
TW201510056A (zh) 2015-03-16
KR20160047425A (ko) 2016-05-02
KR102226987B1 (ko) 2021-03-11
WO2015029689A1 (ja) 2015-03-05
JPWO2015029689A1 (ja) 2017-03-02
CN105026456B (zh) 2017-10-17
CN105026456A (zh) 2015-11-04
JP5799177B2 (ja) 2015-10-21

Similar Documents

Publication Publication Date Title
TWI695059B (zh) 電子裝置用密封劑及電子裝置之製造方法
TWI641650B (zh) Organic electroluminescent display element sealant
CN106459374B (zh) 有机电致发光显示元件用密封剂
JP7377295B2 (ja) 有機エレクトロルミネッセンス表示素子用封止剤
TWI636090B (zh) Sealant for organic electroluminescent display elements
TWI614301B (zh) 有機ｅｌ顯示元件用封止劑
JP2014225380A (ja) 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法
JP6247125B2 (ja) 有機光デバイスの製造方法
JP2017228414A (ja) 有機エレクトロルミネッセンス表示素子用封止剤
JP2020024938A (ja) 硬化性組成物及び有機エレクトロルミネッセンス表示素子用封止剤
JP2019147963A (ja) 有機エレクトロルミネッセンス表示素子用封止剤
JP6527390B2 (ja) 有機エレクトロルミネッセンス表示素子用封止剤
JP2015044917A (ja) 光後硬化性樹脂組成物
TW201905154A (zh) 有機ｅｌ顯示元件用密封劑

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees