TWI640586B - 硏磨用組成物、硏磨用組成物之製造方法及硏磨用組成物之調製用套組 - Google Patents
硏磨用組成物、硏磨用組成物之製造方法及硏磨用組成物之調製用套組 Download PDFInfo
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- TWI640586B TWI640586B TW103110296A TW103110296A TWI640586B TW I640586 B TWI640586 B TW I640586B TW 103110296 A TW103110296 A TW 103110296A TW 103110296 A TW103110296 A TW 103110296A TW I640586 B TWI640586 B TW I640586B
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- 239000007791 liquid phase Substances 0.000 description 1
- 150000002668 lysine derivatives Chemical class 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
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- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F216/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an alcohol radical
- C08F216/04—Acyclic compounds
- C08F216/06—Polyvinyl alcohol ; Vinyl alcohol
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/06—Other polishing compositions
- C09G1/14—Other polishing compositions based on non-waxy substances
- C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
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| JP2013-057226 | 2013-03-19 | ||
| JP2013-057228 | 2013-03-19 | ||
| JP2013057227 | 2013-03-19 | ||
| JP2013057225 | 2013-03-19 | ||
| JP2013-057225 | 2013-03-19 | ||
| JP2013-057227 | 2013-03-19 | ||
| JP2013057228 | 2013-03-19 | ||
| JP2013057226 | 2013-03-19 |
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| TW201500492A TW201500492A (zh) | 2015-01-01 |
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| TW103110296A TWI640586B (zh) | 2013-03-19 | 2014-03-19 | 硏磨用組成物、硏磨用組成物之製造方法及硏磨用組成物之調製用套組 |
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| JP (5) | JP5900913B2 (OSRAM) |
| KR (1) | KR102330030B1 (OSRAM) |
| CN (1) | CN105051145B (OSRAM) |
| SG (1) | SG11201507438YA (OSRAM) |
| TW (2) | TWI665275B (OSRAM) |
| WO (1) | WO2014148399A1 (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12466027B2 (en) | 2022-10-14 | 2025-11-11 | Industrial Technology Research Institute | Processing system of suspension abrasive jets |
| US12487613B2 (en) | 2023-07-05 | 2025-12-02 | Industrial Technology Research Institute | Machine for smashing thermosetting materials |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5900913B2 (ja) * | 2013-03-19 | 2016-04-06 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット |
| US10717899B2 (en) | 2013-03-19 | 2020-07-21 | Fujimi Incorporated | Polishing composition, method for producing polishing composition and polishing composition preparation kit |
| JP6367113B2 (ja) * | 2014-12-25 | 2018-08-01 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| JP6655354B2 (ja) * | 2014-12-26 | 2020-02-26 | 花王株式会社 | シリコンウェーハ用研磨液組成物、又はシリコンウェーハ用研磨液組成物キット |
| US10748778B2 (en) * | 2015-02-12 | 2020-08-18 | Fujimi Incorporated | Method for polishing silicon wafer and surface treatment composition |
| JP6960336B2 (ja) * | 2015-10-23 | 2021-11-05 | ニッタ・デュポン株式会社 | 研磨用組成物 |
| WO2017069253A1 (ja) * | 2015-10-23 | 2017-04-27 | ニッタ・ハース株式会社 | 研磨用組成物 |
| JP6801964B2 (ja) * | 2016-01-19 | 2020-12-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びシリコン基板の研磨方法 |
| JP6572830B2 (ja) * | 2016-06-13 | 2019-09-11 | 信越半導体株式会社 | シリコンウェーハの搬送・保管方法 |
| WO2018025656A1 (ja) * | 2016-08-02 | 2018-02-08 | 株式会社フジミインコーポレーテッド | シリコンウェーハ粗研磨用組成物の製造方法、シリコンウェーハ粗研磨用組成物セット、およびシリコンウェーハの研磨方法 |
| WO2018025655A1 (ja) * | 2016-08-02 | 2018-02-08 | 株式会社フジミインコーポレーテッド | シリコンウェーハ粗研磨用組成物の濃縮液 |
| JP7050684B2 (ja) * | 2016-08-31 | 2022-04-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨用組成物セット |
| RU2754808C2 (ru) | 2016-12-22 | 2021-09-07 | Иллюмина, Инк. | Модуль проточной ячейки и способ его получения |
| US20200010727A1 (en) * | 2017-02-20 | 2020-01-09 | Fujimi Incorporated | Intermediate polishing composition for silicon substrate and polishing composition set for silicon substrate |
| JP7074525B2 (ja) * | 2017-03-30 | 2022-05-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| CN108499963A (zh) * | 2017-05-18 | 2018-09-07 | 苏州权素船舶电子有限公司 | 一种电子材料研磨清洗方法 |
| CN111315835B (zh) * | 2017-11-06 | 2022-08-26 | 福吉米株式会社 | 研磨用组合物及其制造方法 |
| KR102647949B1 (ko) | 2017-11-16 | 2024-03-14 | 닛키 쇼쿠바이카세이 가부시키가이샤 | 실리카 입자의 분산액 및 그 제조 방법 |
| JP6929239B2 (ja) * | 2018-03-30 | 2021-09-01 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| JP7221479B2 (ja) * | 2018-08-31 | 2023-02-14 | 日化精工株式会社 | ダイシング加工用製剤及び加工処理液 |
| WO2020196369A1 (ja) * | 2019-03-26 | 2020-10-01 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP7384592B2 (ja) * | 2019-08-22 | 2023-11-21 | 株式会社三共 | 遊技機 |
| US11492512B2 (en) * | 2019-09-26 | 2022-11-08 | Fujimi Incorporated | Polishing composition and polishing method |
| JP6884898B1 (ja) * | 2020-01-22 | 2021-06-09 | 日本酢ビ・ポバール株式会社 | 研磨用組成物 |
| US20230106868A1 (en) * | 2020-03-13 | 2023-04-06 | Fujimi Incorporated | Polishing composition and polishing method |
| JP7720137B2 (ja) * | 2020-09-30 | 2025-08-07 | 株式会社フジミインコーポレーテッド | ポリビニルアルコール組成物を含む半導体用濡れ剤の製造方法 |
| EP4503097A1 (en) * | 2022-03-31 | 2025-02-05 | Fujimi Incorporated | Polishing composition |
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| SG11201405091TA (en) * | 2012-02-21 | 2014-09-26 | Hitachi Chemical Co Ltd | Polishing agent, polishing agent set, and substrate polishing method |
| JP5822356B2 (ja) | 2012-04-17 | 2015-11-24 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
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| SG11201506001VA (en) | 2013-02-13 | 2015-09-29 | Fujimi Inc | Polishing composition, method for producing polishing composition and method for producing polished article |
| JP5900913B2 (ja) | 2013-03-19 | 2016-04-06 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット |
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2014
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- 2014-03-14 EP EP14767647.2A patent/EP2977423B1/en active Active
- 2014-03-14 WO PCT/JP2014/057008 patent/WO2014148399A1/ja not_active Ceased
- 2014-03-19 TW TW107130386A patent/TWI665275B/zh active
- 2014-03-19 TW TW103110296A patent/TWI640586B/zh active
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2016
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2019
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2022
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| TW200944583A (en) * | 2008-02-18 | 2009-11-01 | Jsr Corp | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US12466027B2 (en) | 2022-10-14 | 2025-11-11 | Industrial Technology Research Institute | Processing system of suspension abrasive jets |
| US12487613B2 (en) | 2023-07-05 | 2025-12-02 | Industrial Technology Research Institute | Machine for smashing thermosetting materials |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6514653B2 (ja) | 2019-05-15 |
| US10351732B2 (en) | 2019-07-16 |
| EP2977423A1 (en) | 2016-01-27 |
| TW201500492A (zh) | 2015-01-01 |
| JP2022118024A (ja) | 2022-08-12 |
| KR20150133694A (ko) | 2015-11-30 |
| KR102330030B1 (ko) | 2021-11-24 |
| TW201900795A (zh) | 2019-01-01 |
| JPWO2014148399A1 (ja) | 2017-02-16 |
| EP2977423A4 (en) | 2017-03-22 |
| JP6513591B2 (ja) | 2019-05-15 |
| JP2019151849A (ja) | 2019-09-12 |
| EP2977423B1 (en) | 2022-09-28 |
| JP5900913B2 (ja) | 2016-04-06 |
| JP2016135882A (ja) | 2016-07-28 |
| US20160272846A1 (en) | 2016-09-22 |
| EP3967736A1 (en) | 2022-03-16 |
| CN105051145A (zh) | 2015-11-11 |
| JP2016166343A (ja) | 2016-09-15 |
| TWI665275B (zh) | 2019-07-11 |
| WO2014148399A1 (ja) | 2014-09-25 |
| JP7246235B2 (ja) | 2023-03-27 |
| CN105051145B (zh) | 2018-06-26 |
| EP3967736B1 (en) | 2023-10-11 |
| SG11201507438YA (en) | 2015-10-29 |
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