TWI636866B - 在撓性薄膜構造的顯示單元貼合光學功能膜的方法 - Google Patents
在撓性薄膜構造的顯示單元貼合光學功能膜的方法 Download PDFInfo
- Publication number
- TWI636866B TWI636866B TW104117644A TW104117644A TWI636866B TW I636866 B TWI636866 B TW I636866B TW 104117644 A TW104117644 A TW 104117644A TW 104117644 A TW104117644 A TW 104117644A TW I636866 B TWI636866 B TW I636866B
- Authority
- TW
- Taiwan
- Prior art keywords
- display unit
- film
- optical
- mother board
- unit
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 60
- 239000010408 film Substances 0.000 title description 142
- 238000010030 laminating Methods 0.000 title description 2
- 239000010409 thin film Substances 0.000 title description 2
- 230000003287 optical effect Effects 0.000 claims abstract description 144
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 239000012790 adhesive layer Substances 0.000 claims abstract description 45
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 230000001681 protective effect Effects 0.000 claims description 18
- 238000005520 cutting process Methods 0.000 claims description 17
- 239000012528 membrane Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 42
- 238000001179 sorption measurement Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 description 37
- 230000001070 adhesive effect Effects 0.000 description 37
- 239000002390 adhesive tape Substances 0.000 description 31
- 239000002131 composite material Substances 0.000 description 14
- 238000007689 inspection Methods 0.000 description 14
- 238000004804 winding Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000003825 pressing Methods 0.000 description 5
- 239000012788 optical film Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 229920006015 heat resistant resin Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/06—Electrode terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Polarising Elements (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-158103 | 2014-08-01 | ||
| JP2014158103A JP5911029B2 (ja) | 2014-08-01 | 2014-08-01 | 可撓性薄膜構造の表示セルに光学機能フィルムを貼り合わせる方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201609358A TW201609358A (zh) | 2016-03-16 |
| TWI636866B true TWI636866B (zh) | 2018-10-01 |
Family
ID=55217700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104117644A TWI636866B (zh) | 2014-08-01 | 2015-06-01 | 在撓性薄膜構造的顯示單元貼合光學功能膜的方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5911029B2 (ja) |
| KR (1) | KR102457666B1 (ja) |
| CN (1) | CN105321866B (ja) |
| TW (1) | TWI636866B (ja) |
| WO (1) | WO2016017806A1 (ja) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10804407B2 (en) | 2016-05-12 | 2020-10-13 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing apparatus and stack processing apparatus |
| TWI567008B (zh) * | 2016-06-15 | 2017-01-21 | All Ring Tech Co Ltd | Assembly of the components of the transfer device |
| TWI567011B (zh) * | 2016-06-15 | 2017-01-21 | All Ring Tech Co Ltd | Method and device for conveying the components of the bonding process |
| KR102544982B1 (ko) | 2016-09-02 | 2023-06-20 | 삼성디스플레이 주식회사 | 표시 장치의 제조장치 및 표시 장치의 제조방법 |
| JP6739390B2 (ja) * | 2017-03-30 | 2020-08-12 | 富士フイルム株式会社 | 有機ｅｌ画像表示装置の製造方法 |
| US11245153B2 (en) | 2017-05-18 | 2022-02-08 | Thyssenkrupp Ag | Battery housing |
| KR102609560B1 (ko) * | 2017-09-08 | 2023-12-04 | 삼성전자주식회사 | 반도체 제조 장치 |
| WO2019064367A1 (ja) * | 2017-09-27 | 2019-04-04 | シャープ株式会社 | 表示デバイスの製造方法、表示デバイスの製造装置 |
| JP6862330B2 (ja) | 2017-10-25 | 2021-04-21 | パナソニック液晶ディスプレイ株式会社 | 液晶表示装置 |
| JP6387209B1 (ja) * | 2017-10-26 | 2018-09-05 | 堺ディスプレイプロダクト株式会社 | フレキシブルｏｌｅｄデバイスの製造方法および製造装置 |
| JP6650965B2 (ja) * | 2018-06-13 | 2020-02-19 | 堺ディスプレイプロダクト株式会社 | フレキシブルｏｌｅｄデバイスの製造方法および製造装置 |
| TWI822379B (zh) * | 2022-10-06 | 2023-11-11 | 萬潤科技股份有限公司 | 貼合方法及設備 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06312837A (ja) * | 1993-04-30 | 1994-11-08 | Ii M Techno:Kk | 搬送装置 |
| JP2014021498A (ja) * | 2012-07-13 | 2014-02-03 | Samsung Display Co Ltd | 表示パネルの製造方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS524200B2 (ja) | 1973-08-16 | 1977-02-02 | ||
| JP4528923B2 (ja) | 2005-12-05 | 2010-08-25 | 学校法人金沢工業大学 | Ｅｌ素子 |
| JP4975500B2 (ja) * | 2007-03-28 | 2012-07-11 | 富士フイルム株式会社 | 感光性積層体製造装置及び製造方法 |
| WO2009104371A1 (ja) | 2008-02-20 | 2009-08-27 | シャープ株式会社 | フレキシブル半導体基板の製造方法 |
| JP2010013250A (ja) | 2008-07-04 | 2010-01-21 | Asyst Technologies Japan Inc | 搬送システム及びコンピュータプログラム |
| JP5418505B2 (ja) * | 2009-02-03 | 2014-02-19 | コニカミノルタ株式会社 | 有機エレクトロニクス素子及びその製造方法 |
| JP4669087B1 (ja) * | 2009-05-15 | 2011-04-13 | 日東電工株式会社 | 光学表示装置の製造システム及び製造方法 |
| JP5448264B2 (ja) | 2009-11-19 | 2014-03-19 | 三菱化学株式会社 | ポリカーボネート樹脂フィルム並びに透明フィルム |
| JP4972198B2 (ja) * | 2010-08-27 | 2012-07-11 | 日東電工株式会社 | 光学機能フィルム連続ロール、およびそれを用いた液晶表示素子の製造方法、ならびに光学機能フィルム貼り合せ装置 |
| JP4972197B2 (ja) * | 2010-08-27 | 2012-07-11 | 日東電工株式会社 | 光学機能フィルム連続ロール、およびそれを用いた液晶表示素子の製造方法、ならびに光学機能フィルム貼り合せ装置 |
| KR101267529B1 (ko) * | 2010-10-30 | 2013-05-24 | 엘지디스플레이 주식회사 | 플렉서블한 유기전계 발광소자 제조 방법 |
| JP5737625B2 (ja) | 2011-08-04 | 2015-06-17 | 大日本印刷株式会社 | ガラスフィルム積層体、ガラスフィルム積層体ロール、カラーフィルタ用画素付ガラスフィルム積層体およびガラスフィルム積層体の製造方法 |
| JP6016064B2 (ja) | 2011-09-02 | 2016-10-26 | 日本電気硝子株式会社 | 高屈折率ガラス |
| JP5896669B2 (ja) | 2011-09-27 | 2016-03-30 | テルモ株式会社 | シリンジ用プランジャー、シリンジおよびプレフィルドシリンジ |
| JP2013070787A (ja) | 2011-09-27 | 2013-04-22 | Equos Research Co Ltd | 歩行支援装置 |
| KR101174834B1 (ko) | 2012-04-05 | 2012-08-17 | 주식회사 다보씨앤엠 | 공정필름을 이용한 필름형 디스플레이 기판의 제조방법 및 이에 사용되는 필름형 디스플레이 기판 제조용 공정필름 |
| JP5946362B2 (ja) * | 2012-08-10 | 2016-07-06 | 日東電工株式会社 | 光学表示パネルの製造方法および光学表示パネルの製造システム |
| JP6037551B2 (ja) * | 2012-09-13 | 2016-12-07 | 住友化学株式会社 | 光学部材貼合体の製造装置 |
| JP5744819B2 (ja) * | 2012-11-09 | 2015-07-08 | 日東電工株式会社 | 光学表示パネルの連続製造方法および光学表示パネルの連続製造システム |
| JP6066055B2 (ja) * | 2012-12-06 | 2017-01-25 | Ａｉメカテック株式会社 | 有機ｅｌ封止装置 |
| WO2015012239A1 (ja) * | 2013-07-24 | 2015-01-29 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子の製造方法、及び、製造装置 |
| JP6213254B2 (ja) * | 2014-01-20 | 2017-10-18 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子の製造方法 |
-
2014
- 2014-08-01 JP JP2014158103A patent/JP5911029B2/ja active Active
-
2015
- 2015-06-01 TW TW104117644A patent/TWI636866B/zh active
- 2015-07-01 KR KR1020150094160A patent/KR102457666B1/ko active IP Right Grant
- 2015-07-08 CN CN201510397532.8A patent/CN105321866B/zh active Active
- 2015-07-31 WO PCT/JP2015/071834 patent/WO2016017806A1/ja active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06312837A (ja) * | 1993-04-30 | 1994-11-08 | Ii M Techno:Kk | 搬送装置 |
| JP2014021498A (ja) * | 2012-07-13 | 2014-02-03 | Samsung Display Co Ltd | 表示パネルの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5911029B2 (ja) | 2016-04-27 |
| JP2016035508A (ja) | 2016-03-17 |
| CN105321866B (zh) | 2018-06-26 |
| CN105321866A (zh) | 2016-02-10 |
| TW201609358A (zh) | 2016-03-16 |
| KR102457666B1 (ko) | 2022-10-24 |
| WO2016017806A1 (ja) | 2016-02-04 |
| KR20160016591A (ko) | 2016-02-15 |
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