TWI633376B - Light source apparatus and ultra-violet irradiation apparatus - Google Patents

Abstract

The present invention provides a light source device capable of suppressing a decline in ultraviolet irradiation performance over the years. The light source device 201 includes a light emitting element 205, a ceramic substrate 210, and a heat dissipation member 220. The light emitting element 205 emits light having a dominant wavelength in the ultraviolet region. The ceramic substrate 210 is provided with a light-emitting element 205 on one surface side, using ceramics as a base material, and a conductive pattern 211 made of a conductor is formed on a surface of the side on which the light-emitting element 205 is disposed, and at least an outer portion covering the conductive pattern 211 is formed. Coating 218. The heat radiating member 220 is disposed on the opposite side of the surface on which the light emitting element 205 is disposed in the ceramic substrate 210 and is made of a metal material.

Description

Light source device and ultraviolet irradiation device

Embodiments of the present invention relate to a light source device and an ultraviolet irradiation device.

For a light source device using a light emitting element such as a light emitting diode (LED) or a laser diode (LD) as a light source, in order to ensure an illuminated area or obtain a required light intensity ‧ Uniformity, using multiple light-emitting elements. The light emitting element adjusts the light output by adjusting the current, but due to individual differences in Vf (forward voltage), when electrically connected in parallel, there may be differences in light output due to the difference in current flowing through each light emitting element. As a result, the uniformity is adversely affected. Therefore, the light emitting elements are preferably electrically connected in series, but when a plurality of light emitting elements are electrically connected in series, the applied voltage becomes high. In this case, if the commonly used aluminum substrate is used as the mounting substrate, the insulation layer of the substrate must be thickened to ensure the withstand voltage. However, if the insulation layer of the substrate is thickened, the thermal conductivity will decrease. Therefore, the temperature of the light-emitting element is likely to rise, which also causes a decrease in efficiency. Therefore, in a light source device, a substrate using ceramics as a base material is used as a security device. A substrate on which a light emitting element is mounted.

When used for curing liquid crystal or the like, a light source device including a plurality of solid-state light-emitting elements is used. Currently, a light source device having a solid-state light-emitting element that emits ultraviolet rays is used in a photoreaction step such as curing, lamination, or bonding of a liquid crystal panel. The light source device is configured by connecting a plurality of solid-state light-emitting element rows in parallel to irradiate ultraviolet rays to a predetermined area, and the solid-state light-emitting element row is configured by connecting a plurality of solid-state light-emitting elements in series.

Furthermore, photo-alignment technology (for example, see Patent Literature 3 and Patent Literature 4) is currently attracting attention as a technology that replaces the rubbing process, which is an alignment treatment of an alignment film of a liquid crystal panel. The ultraviolet irradiation device used in the photo-alignment technology includes a rod-shaped lamp as a light source and a polarizing element. In such an ultraviolet irradiation device, the polarizing element passes the ultraviolet rays in a predetermined direction among the ultraviolet rays irradiated by the rod-shaped lamp, and irradiates the passing ultraviolet rays to a workpiece or the like, thereby performing an alignment treatment of the alignment film.

[Prior Art Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2012-89553

Patent Document 2: International Publication No. 2014/103598

Patent Document 3: Japanese Patent Laid-Open No. 2009-265290

Patent Document 4: Japanese Patent Laid-Open No. 2011-145381

The light source device not only irradiates visible light, but also irradiates ultraviolet rays to an object to be irradiated. Therefore, the light source device may be used in the case of performing photoreaction or ultraviolet curing. In the light source device used when irradiating ultraviolet rays in this manner, a light emitting element that emits ultraviolet rays is used as a light emitting element. Such light source devices are often used in a high-output state, and the amount of heat generated tends to increase. Therefore, the cooling performance must be improved.

As a method for improving the cooling performance of the light source device, for example, water cooling is performed by circulating the cooling water. In the case of water cooling, the substrate or the heat dissipation member is preferably made of a material having high thermal conductivity such as aluminum form. When aluminum is used as the base material of the substrate on which the light-emitting element is mounted, in order to prevent oxidation or corrosion of the wiring conductor layer, and to protect the insulating layer from thermal damage when electronic components are mounted on the aluminum substrate, the coating forms a resistance. Solder resist layer.

However, when a structure in which the light source device is cooled by water cooling is used, dew condensation may occur, and on the other hand, the solder resist has high water absorption, and therefore may absorb moisture generated by the dew condensation. At this time, it is considered that the insulation resistance of the solder resist may decrease and short circuit between the wiring conductors, or the wiring conductors may be corroded due to the absorbed moisture. Therefore, it is very difficult to irradiate ultraviolet rays efficiently for a long period of time by using a lamp using a light emitting element that emits ultraviolet rays.

The present invention has been made in view of the circumstances described above, and an object of the present invention is to provide a light source device that suppresses a decline in ultraviolet radiation performance over time.

In addition, in the conventional light source device, ultraviolet rays may be irradiated with uneven illumination due to a temperature deviation between the rows of solid-state light-emitting elements during lighting. therefore, In the light source device, it is required to suppress uneven irradiation of ultraviolet rays with respect to an object to be irradiated.

An object of the present invention is to provide a light source device that suppresses uneven irradiation of ultraviolet rays to an object to be irradiated.

Furthermore, in recent years, development of an ultraviolet irradiation device using an absorption-type polarizing element is being advanced, and the absorption-type polarizing element can obtain higher polarization characteristics than the reflection-type polarizing element. However, the absorption type polarizing element has weak heat resistance. For example, in an ultraviolet irradiation device using a discharge lamp such as a mercury lamp or a metal halide lamp as a light source, the absorption type The deterioration is remarkable, and it cannot withstand the practical use of an ultraviolet irradiation device.

An object of the present invention is to provide an ultraviolet irradiation device that suppresses deterioration of an absorption-type polarizing element.

A light source device according to an embodiment includes a light emitting element, a ceramic substrate, and a heat dissipation member. The light emitting element emits light having a dominant wavelength in the ultraviolet region. A ceramic substrate is provided with a light emitting element on one surface side, and ceramics is used as a base material. A conductive pattern made of a conductor and an overcoat covering at least the conductive pattern are formed on the surface of the side on which the light emitting element is disposed. . The heat radiating member is disposed on the opposite side of the surface on which the light emitting element is disposed in the ceramic substrate, and is made of a metal material.

The light emitting element is provided with a plurality of light emitting elements having different dominant wavelengths of the irradiated light.

For the ceramic substrate, alumina or aluminum nitride is used for the substrate.

The outer coating reflects ultraviolet rays.

The outer coating absorbs ultraviolet light.

The light source device according to the embodiment includes a light emitting section, a current adjustment unit, a heat radiation unit, and a control unit. The light-emitting section includes a solid-state light-emitting element row including a plurality of solid-state light-emitting elements which are connected in series and arranged on a predetermined line and emit ultraviolet rays. The light-emitting section arranges a plurality of solid-state light-emitting element rows in a direction intersecting a predetermined line. The current adjustment unit is provided with two or more, corresponding to one or more solid-state light-emitting element rows of the light-emitting section, and the current value of the solid-state light-emitting elements flowing through the corresponding solid-state light-emitting element row can be changed. The heat dissipating unit allows a fluid to flow in a direction crossing a predetermined line to dissipate heat emitted from the solid-state light-emitting elements of two or more solid-state light-emitting element rows adjacent to each other in the crossing direction of the light-emitting portion. The control unit controls the current adjustment unit. The control unit causes the current adjustment unit to change the current value of the solid-state light-emitting elements flowing through the solid-state light-emitting element rows so that the relative degrees of ultraviolet rays emitted by the solid-state light-emitting elements in the plurality of solid-state light-emitting elements rows become equal.

The light source device includes a temperature detection unit that is provided at a predetermined position of the light emitting section and can detect the temperature of the predetermined position. The control unit causes the current adjustment unit to change a current value of the solid-state light-emitting elements flowing through the solid-state light-emitting element row based on a detection result of the temperature detection unit.

The light source device is provided with a plurality of temperature detection units at intervals along the flow direction of the fluid.

The ultraviolet irradiation device according to the embodiment includes a light source including a light emitting element that emits ultraviolet rays, and an absorption-type polarizing element that suppresses ultraviolet rays emitted from the light source. Polarized light whose polarization axis is parallel to a predetermined reference direction is transmitted.

The ultraviolet irradiation device includes an optical member between the light source and the absorption-type polarizing element.

According to the present invention, it is possible to provide a light source device that suppresses a decline in ultraviolet irradiation performance over the years.

According to the present invention, it is possible to provide a light source device that suppresses uneven irradiation of ultraviolet rays to an object to be irradiated.

According to the present invention, it is possible to provide an ultraviolet irradiation device that suppresses deterioration of an absorption-type polarizing element.

1, 1-1, 1-2, 2, 3, 4, 5, 6, 6-1, 6-2 ‧‧‧ light source device

10‧‧‧ carrier

10a‧‧‧mounting surface

20‧‧‧Lighting Department

21‧‧‧Mounting substrate (substrate)

21a‧‧‧ surface of mounting substrate (outer peripheral surface)

21b‧‧‧ Back side of mounting substrate

22‧‧‧Solid-state light-emitting element array

23‧‧‧Solid-state light-emitting element

24‧‧‧DC Power

30‧‧‧Current adjustment unit

40‧‧‧cooling unit

41‧‧‧ heat sink

41a‧‧‧Board mounting section

41b‧‧‧ Fin

42‧‧‧cooling fan

43‧‧‧fan

44‧‧‧Exhaust

50‧‧‧Frame

50a, 50b‧‧‧ opening

60‧‧‧Temperature detection unit

70‧‧‧control unit

100‧‧‧ ultraviolet irradiation device

101‧‧‧Mirror

201‧‧‧light source device

205‧‧‧Light-emitting element

210‧‧‧ceramic substrate

211‧‧‧ conductive pattern

212‧‧‧Solder

215‧‧‧Power Supply Department

218‧‧‧Outer coating

220‧‧‧Heat dissipation component

221‧‧‧flow

223‧‧‧Inlet

224‧‧‧ Outlet

230‧‧‧Packaging

232‧‧‧Reflector

301, 301-1, 301-2‧‧‧ ultraviolet irradiation device

310‧‧‧light source

311‧‧‧matrix

312‧‧‧light-emitting element

314‧‧‧1st light emitting element

314a‧‧‧1st light emitting chip

314b, 316b‧‧‧Reflector

314c, 316c‧‧‧ lens (optical member)

316‧‧‧Second light emitting element

316a‧‧‧Second light emitting chip

320‧‧‧ Absorptive Polarizing Element

330‧‧‧Optical component (lens)

340‧‧‧Wire grid polarizing element

K‧‧‧ Arrow

W‧‧‧Irradiated object (workpiece, object)

U‧‧‧ Ultraviolet (light)

UA‧‧‧ Ultraviolet (light)

PA‧‧‧ polarization axis

FIG. 1 is a sectional view of a light source device according to the first embodiment.

FIG. 2 is a modification of the light source device according to Embodiment 1, and is a cross-sectional view when a package is used.

3 is a diagram showing a schematic configuration of an ultraviolet irradiation device including a light source device according to a second embodiment.

4 is a cross-sectional view taken along a line II-II in FIG. 3.

5 is a block diagram showing a schematic configuration of a light emitting unit of a light source device according to Embodiment 2 from below.

FIG. 6 is a diagram showing a light source device according to a first modification of the second embodiment shown from below; Block diagram of a rough structure.

FIG. 7 is a block diagram showing a schematic configuration of a light source device according to a second modification of the second embodiment.

8 is a block diagram showing a schematic configuration showing a schematic configuration of a light source device according to Embodiment 3 from below.

FIG. 9 is a block diagram showing a schematic configuration showing a schematic configuration of a light source device according to Embodiment 4 from below.

FIG. 10 is a block diagram showing a schematic configuration showing a schematic configuration of a light source device according to Embodiment 5 from below.

11 (a) and 11 (b) are diagrams showing a configuration of a light source device according to a sixth embodiment.

FIG. 12 is a side view of the ultraviolet irradiation device including the light source device according to the seventh embodiment as viewed in the Y-axis direction.

FIG. 13 is a perspective view showing a schematic configuration of a light source device according to Embodiment 7. FIG.

14 is a side view of a light source device according to a seventh embodiment.

15 is a perspective view showing a schematic configuration of a light source device according to a first modification of the seventh embodiment.

16 is a perspective view showing a schematic configuration of a light source device according to a second modification of the seventh embodiment.

FIG. 17 is a perspective view showing a schematic configuration of an ultraviolet irradiation apparatus according to Embodiment 8. FIG.

FIG. 18 is a view of the ultraviolet irradiation device according to Embodiment 8 as viewed from the Y-axis direction.

FIG. 19 is a diagram of the light source 310 of the ultraviolet irradiation apparatus according to Embodiment 8 as viewed from the Z-axis direction.

FIG. 20 is a view of the ultraviolet irradiation device according to the ninth embodiment as viewed from the Y-axis direction.

FIG. 21 is a view of a modification of the ultraviolet irradiation device according to the ninth embodiment as viewed from the Y-axis direction.

The light source device 201 of the first embodiment described below includes a light emitting element 205, a ceramic substrate 210, and a heat dissipation member 220. The light emitting element 205 emits light having a dominant wavelength in the ultraviolet region. The ceramic substrate 210 is provided with a light-emitting element 205 on one surface side, and ceramics is used as a base material, and a conductive pattern 211 made of a conductor is formed on a surface of the side on which the light-emitting element 205 is disposed, and a conductive pattern Outer coating 218. The heat radiating member 220 is disposed on the opposite side of the surface on which the light emitting element 205 is disposed in the ceramic substrate 210 and is made of a metal material.

In the light source device 201 of the first embodiment described below, the light-emitting element 205 is provided with a plurality of light-emitting elements 205 having different dominant wavelengths of the emitted light.

In the light source device 201 of the first embodiment described below, the ceramic substrate 210 uses alumina or aluminum nitride as a base material.

In the light source device 201 of the first embodiment described below, the overcoat layer 218 reflects ultraviolet rays.

In the light source device 201 of the first embodiment described below, the outer coating The layer 218 absorbs ultraviolet rays.

[Embodiment 1]

Next, a light source device according to the first embodiment will be described based on the drawings. FIG. 1 is a sectional view of a light source device according to the first embodiment. The light source device 201 shown in FIG. 1 includes a plurality of light emitting elements 205. The light emitting elements 205 are light sources in the light source device 201. The plurality of light emitting elements 205 are arranged on one side of a ceramic substrate 210. The ceramic substrate 210 is a ceramic substrate. It is formed into a plate shape as a base material. As the base material of the ceramic substrate 210, for example, when reflection characteristics are required, it is preferable to use white and high reflectance alumina. Furthermore, in order to ensure higher heat radiation performance, it is preferable to use aluminum nitride with high thermal conductivity. That is, the ceramic substrate 210 contains an inorganic material.

The light emitting element 205 can emit light having a dominant wavelength in the ultraviolet region, for example, irradiate light having a dominant wavelength of 240 nm or more and 405 nm or less. In addition, the plurality of light-emitting elements 205 are provided with a plurality of light-emitting elements 205 whose main wavelengths of the irradiated light are different in the ultraviolet wavelength band. Therefore, the light-emitting element 205 can irradiate a wide range of ultraviolet rays in the ultraviolet band through the plurality of light-emitting elements 205. wavelength. In addition, for the plurality of light-emitting elements 205, the dominant wavelengths of all the light-emitting elements 205 may not be different, as long as the plurality of light-emitting elements 205 are viewed as a whole, the main wavelengths of light including the light-emitting elements 205 are different from each other. The light emitting element 205 is sufficient.

A conductive pattern 211 and an overcoat layer 218 are formed on the side of the ceramic substrate 210 on which the light emitting element 205 is disposed. The conductive pattern 211 includes a conductor, and for example, a material having high conductivity such as copper or silver is used as a main component. The conductive pattern 211 including a conductor is formed on the ceramic substrate 210 with an arbitrary circuit pattern. This Embodiment 1 In the light source device 201, the electrical connection states of the plurality of light-emitting elements 205 are formed in series. Each light-emitting element 205 is connected to the conductive pattern 211 by a solder 212, and thus the light-emitting element 205 is electrically connected to the conductive pattern 211. That is, in the light source device 201 of the first embodiment, in order to prevent adverse effects on uniformity caused by connecting a plurality of light-emitting elements 205 in parallel, a plurality of light-emitting elements 205 are connected in series.

The overcoat layer 218 is made of an inorganic substance for preventing insulation and corrosion, and is formed by covering at least the conductive pattern 211. That is, the overcoat layer 218 is formed on the surface of the ceramic substrate 210 on the side where the light emitting element 205 is disposed, and is formed on a portion other than the mounting portion, the power feeding portion 215, and the like, and covers the ceramic substrate 210. Therefore, the overcoat layer 218 is formed on a portion of the conductive pattern 211 where the conductive pattern 211 is formed, and on the opposite side of the surface on which the ceramic substrate 210 is located in the conductive pattern 211, and other than the portion where the light emitting element 205 and solder 212 are located part. The overcoat layer 218 contains glass as a main component and contains particles that reflect or absorb ultraviolet rays. The overcoat layer 218 may include a member that reflects ultraviolet rays or a member that absorbs ultraviolet rays. In short, the outer coating layer 218 may have any structure as long as it can suppress ultraviolet rays from reaching the conductor pattern 211.

The ceramic substrate 210 is provided with a power supply section 215 that is electrically connected to an external power source (not shown). A pair of power supply sections 215 is provided on the ceramic substrate 210, and the pair of power supply sections 215 is arranged on the side of the ceramic substrate 210 on which the light emitting element 205 and the conductive pattern 211 are provided. For example, the pair of power supply sections 215 is disposed on the side of the ceramic substrate 210 near the ends facing each other on the side where the light emitting element 205 and the conductive pattern 211 are disposed, and is electrically connected to the conductive pattern 211. In addition, power The part 215 may be provided in other parts, and the arrangement position is not limited as long as it is in a form electrically connected to the conductive pattern 211 and capable of receiving power supplied from a power source.

A heat dissipating member 220 made of a metal material is disposed on the ceramic substrate 210 on the side opposite to the surface on which the light emitting element 205 is disposed. The heat radiating member 220 is a so-called water-cooled heat radiating member 220 using cooling water as a cooling medium. The heat radiating member 220 is made of, for example, aluminum, which is a material having a high thermal conductivity, and is formed in a rectangular tube shape with closed ends. The heat dissipation member 220 formed in a rectangular tube shape is disposed in a state where one surface of the outer peripheral surface of the rectangular tube is in contact with the surface on the opposite side of the surface on the ceramic substrate 210 where the light emitting element 205 is disposed.

In addition, the heat dissipation member 220 is provided with an inflow port 223 through which cooling water flows in and an outflow port 224 through which the cooling water in the heat radiation member 220 flows out. For example, the inflow port 223 is provided at one end in the longitudinal direction of the heat dissipation member 220, and the outflow port 224 is provided at the other end in the longitudinal direction of the heat dissipation member 220. The inside of the heat radiating member 220 becomes a flow path 221 of cooling water. The cooling water flows into the heat radiating member 220 from the inflow port 223, and the cooling water flowing into the heat radiating member 220 can flow out of the flow outlet 224 through the flow path 221 in the heat radiating member 220. . The inflow port 223 and the outflow port 224 are connected to a cooling path. The cooling path includes a pump (not shown) that sucks and sends cooling water, and a heat exchanger (such as a radiator) that cools the cooling water. (The illustration is omitted). As a result, the cooling water flowing in the flow path 221 in the heat radiating member 220 is cooled and looped in the heat exchanger.

The light source device 1 according to the first embodiment is configured as described above, and its operation will be described below. When the light source device 201 is turned on, electricity from the outside The source supplies power to the pair of power supply sections 215. The power supplied to the power supply section 215 is supplied to the light emitting element 205 via the conductive pattern 211 and the solder 212. The light-emitting element 205 is lit by the power supplied in this manner, and irradiates light having a dominant wavelength in the ultraviolet region (hereinafter referred to as ultraviolet rays). The ultraviolet light radiated from the light emitting element 205 is irradiated while being diffused from the surface of the light source device 201 on the side where the light emitting element 205 is disposed, and is irradiated to the object to be irradiated.

The light emitting element 205 is lit by the power supplied in this manner. However, in the light source device 201 of the first embodiment, the plurality of light emitting elements 205 are connected in series. Therefore, when the light-emitting element 205 is turned on, it is lit by applying a high voltage. However, the substrate on which the light-emitting element 205 is provided is a ceramic substrate 210 made of ceramic. Therefore, the light-emitting element 205 can be continuously lit without being generated. Damage to insulation. That is, when the substrate provided with the light-emitting element 205 is formed of a material having a low withstand voltage such as aluminum, depending on the thickness of the substrate, if a high voltage is applied to the light-emitting element 205, insulation breakdown may occur. The voltage is high. Therefore, even if a high voltage is applied to the light-emitting element 205, insulation damage does not occur, and the light-emitting element 205 can be turned on to continuously irradiate ultraviolet rays.

In addition, the light-emitting element 205 irradiated with ultraviolet rays generates heat when it is lighted. Therefore, in the light source device 201 according to the first embodiment, the light-emitting element 205 is lighted while suppressing an increase in temperature by the heat dissipation member 220. Specifically, when the light-emitting element 205 is turned on, heat generated by the light-emitting element 205 is transmitted to the ceramic substrate 210 via the solder 212 and the conductive pattern 211, and further transmitted from the ceramic substrate 210 to the heat dissipation member 220. The heat transmitted to the heat radiating member 220 is transmitted to the heat radiating member. 220 cooling water.

On the other hand, when the light emitting element 205 is turned on, the heat dissipation member 220 causes the cooling water to flow from the inflow port 223 into the heat dissipation member 220 by driving of a pump provided in the cooling path, and the cooling water in the heat dissipation member 220 flows from the flow. The outlet 224 flows out. Therefore, the cooling water whose temperature rises due to the heat transfer generated by the light emitting element 205 flows out from the outflow port 224.

The cooling water flowing out of the outflow port 224 is cooled by performing heat exchange in a heat exchanger provided in the cooling path. Accordingly, the heat generated by the light emitting element 205 is released to the outside of the light source device 1. The cooling water cooled in the heat exchanger flows into the heat radiating member 220 from the inflow port 223 again, and flows through the flow path 221 in the heat radiating member 220 while receiving the heat from the light emitting element 205 and the temperature rises. 224 out. The heat radiating member 220 radiates the heat to the outside of the light source device 201 while circulating the cooling water in this manner, thereby suppressing a temperature rise of the light source device 201 due to the heat generated by the light emitting element 205. That is, the heat radiating member 220 cools the light source device 201. The cooling medium passing through the flow path 221 in the heat radiating member 220 is not limited to cooling water, and may be a liquid or a gas such as compressed air or nitrogen.

Here, when cooling is performed by the heat radiating member 220 as described above, depending on the environment in which the light source device 201 is used or the cooling state in the heat radiating member 220, dew condensation may occur. When dew condensation occurs, moisture may adhere to the surface of the light source device 201, but the ceramic substrate 210 includes an inorganic material, and the conductive pattern 211 is covered with an overcoat layer 218. Therefore, even when moisture adheres to the light source device due to dew condensation In the case of the 201 surface, it is also difficult for the ceramic substrate 210 and the conductive pattern 211 to be corroded by the moisture.

In addition, since the heat radiating member 220 is formed using aluminum, which is a material with high thermal conductivity, although heat dissipation is high, rust may be generated. Although rust may be generated in such a manner in the heat radiating member 220, the heat radiating member 220 is disposed in a state where a ceramic substrate 210 made of ceramic is interposed between the heat radiating member 220 and the light emitting element 205 and the conductive pattern 211. Therefore, even when rust is generated in the heat radiating member 220, the rust is blocked by the ceramic substrate 210, and thus it is difficult to cause problems such as insulation damage due to rust or corrosion of electrical paths in the light source device 201.

In addition, when irradiating ultraviolet rays to an irradiated object for photoreaction or ultraviolet curing, the irradiated objects may be irradiated with ultraviolet rays from a short distance. Therefore, in the light source device 201 of the first embodiment, when a photoreaction or ultraviolet curing is performed on an object to be irradiated, the object may be irradiated with ultraviolet rays from a short distance. In the case of UV curing, substances called impurities are generated by chemical reactions. If this impurity adheres to the metal material constituting the heat radiation member 220, rust is likely to be generated from the adhered portion, but the ceramic substrate 210 is located between the heat radiation member 220 and the object when the object is irradiated with ultraviolet rays. Therefore, even when impurities are generated due to the chemical reaction of the object to be irradiated, the impurities can be prevented from reaching the heat radiating member 220, and even under conditions where impurities are likely to be generated due to the chemical reaction of the object to be irradiated, it is difficult to cause the impurities. Rust generation of the heat dissipation member 220 due to the generation of the impurities.

The light source device 201 of the first embodiment described above uses the ceramic substrate 210 as a substrate and dissipates the heat generated when the light-emitting element 205 is lit. The thermal member 220 is disposed on the side of the ceramic substrate 210 opposite to the surface on which the light emitting element 205 is disposed. Further, the conductive pattern 211 is covered by an overcoat layer 218. These measures not only ensure the cooling performance, but also suppress the corrosion caused by the moisture of the condensation even when condensation occurs during cooling. As a result, it is possible to suppress the deterioration of the ultraviolet irradiation performance over the years.

Further, the conductive pattern 211 is covered with the overcoat layer 218, thereby preventing the conductive pattern 211 from being exposed to ultraviolet rays emitted from the light-emitting element 205 and reflected from the object to be irradiated to reach the conductive pattern 211, thereby suppressing the effect of ultraviolet irradiation performance. Annual deterioration.

Further, as the substrate, a ceramic substrate 210 using ceramics as a base material is used. The ceramic has high insulation properties, and it is not necessary to form a heat conductive layer containing a resin or the like as a main component in the base material. In this case, it is possible to maintain high thermal conductivity and ensure high withstand voltage. Furthermore, ceramics are more UV-resistant than resins, so that deterioration can be suppressed even in a structure where substrates are irradiated with ultraviolet rays. As a result of these measures, it is possible to suppress the decline in ultraviolet irradiation performance over the years.

Furthermore, as the light-emitting element 205, a plurality of light-emitting elements 205 having different dominant wavelengths of the light to be irradiated are arranged, whereby the reaction can be performed more reliably when a chemical reaction such as photoreaction or ultraviolet curing is performed on the object to be irradiated. That is, depending on the material of the object to be irradiated by the chemical reaction caused by ultraviolet radiation, the wavelength of light that is likely to cause chemical reaction may be different. However, by arranging a plurality of light-emitting elements 205 having different main wavelengths of light, Whatever the material is, a chemical reaction can be easily performed. As a result, a chemical reaction can be suppressed by irradiating the object with ultraviolet rays. Uneven.

Further, the ceramic substrate 210 includes an inorganic material. However, when alumina is used as the base material of the ceramic substrate 210, the ultraviolet rays irradiated from the light emitting element 205 can be reflected with a high reflectance, and thus the ultraviolet irradiation performance can be improved. Furthermore, when aluminum nitride is used as the base material of the ceramic substrate 210, the heat of the light-emitting element 205 can be more reliably transmitted to the heat dissipation member 220 due to the high thermal conductivity of the aluminum nitride, thereby improving heat dissipation. performance. Furthermore, when any one of alumina and aluminum nitride is used as the base material of the ceramic substrate 210, when rust is generated in the heat dissipation member 220, it is possible to prevent the rust from extending into the ceramic substrate 210. One surface of the light emitting element 205 and the conductive pattern 211. As a result, problems such as corrosion of the electrical path of the light source device 201 due to rust generated in the heat dissipation member 220 can be more reliably suppressed. As a result of these measures, it is possible to suppress the decline in ultraviolet irradiation performance over the years.

In addition, as the light-emitting element 205, a light-emitting element that irradiates light having a main wavelength of 240 nm to 405 nm is used. Therefore, when the object to be irradiated is irradiated with ultraviolet rays to perform a chemical reaction, the reaction can be performed more reliably. As a result, when the light source device 201 is used as a lamp for subjecting an irradiated object to a photoreaction or ultraviolet curing, it is possible to suppress unevenness in the chemical reaction.

In addition, the overcoat layer 218 reflects most of the ultraviolet rays, and thereby can further suppress the ultraviolet rays from reaching the conductive pattern 211. As a result, it is possible to suppress the deterioration of the ultraviolet irradiation performance over the years.

Moreover, the outer coating layer 218 absorbs most of the ultraviolet rays, thereby enabling further advancement. The ultraviolet rays are prevented from reaching the conductive pattern 211 in steps. As a result, it is possible to suppress the deterioration of the ultraviolet irradiation performance over the years.

[Modification]

In the light source device 201, the light emitting element 205 is directly connected to the conductive pattern 211 through the solder 212, but the light emitting element 205 may not be directly connected to the conductive pattern 211. FIG. 2 is a modification of the light source device according to Embodiment 1, and is a cross-sectional view when a package is used. For example, as shown in FIG. 2, the light-emitting element 205 may be provided as a package 230 that is integrated with the reflector 232, and the package 230 is connected to the conductive pattern 211 through the solder 212, thereby being disposed on the ceramic substrate 210. For the packaging material of the package 230 in which the light-emitting element 205 serves as a light source, ceramics are used in order to prevent deterioration due to ultraviolet rays. That is, the reflector 232 uses ceramics as a base material.

When the light-emitting element 205 and the reflector 232 are integrated into the ceramic substrate 210 by using the package 230 thus integrated, the ultraviolet light when the light-emitting element 205 is lit can be reflected by the reflector 232 and irradiated. Thereby, it is possible to suppress the excessive diffusion of the ultraviolet rays irradiated from the light emitting element 205, and it is possible to efficiently irradiate the desired direction. As a result, the ultraviolet irradiation performance can be improved, and high irradiation performance can be maintained for a long period of time. Furthermore, since the package 230 uses ceramics as the packaging material, the thermal expansion is equivalent to the thermal expansion of the ceramic substrate 210. As a result, breakage of the mounting portion can be reduced, and durability can be improved. The arrangement pattern of the light emitting elements 205 is not limited to that shown in FIG. 2. That is, in FIG. 2, one light-emitting element 205 is arranged in one package 230. For example, a plurality of light-emitting elements 205 having different dominant wavelengths of light to be irradiated may be arranged in one package 230.

The light source devices 1, 1-1, 1-2, 2, 3, 4, 5, 6, 6-1, and 6-2 described in Embodiments 2 to 7 described below include a light emitting unit 20 and a current adjustment unit 30. 。 Cooling unit 40 and control unit 70. The light emitting section 20 includes a solid-state light-emitting element row 22 having a plurality of solid-state light-emitting elements 23 connected in series and arranged on a predetermined line and emitting ultraviolet rays. The light-emitting section 20 includes a plurality of solid-state light-emitting element rows 22 arranged in a direction crossing a predetermined line. The current adjustment unit 30 is provided with two or more, corresponding to one or more solid-state light-emitting element rows 22 of the light-emitting section 20 and capable of changing the current value of the solid-state light-emitting elements 23 flowing through the corresponding solid-state light-emitting element rows 22. The heat radiating unit 40 allows a fluid to flow in a direction crossing a predetermined line to dissipate heat emitted from the solid state light emitting elements 23 of the two or more solid state light emitting element rows 22 adjacent to each other in the crossing direction of the light emitting section 20. The control unit 70 controls the current adjustment unit 30. The control unit 70 causes the current adjustment unit 30 to change the current value of the solid-state light-emitting elements 23 flowing through the solid-state light-emitting element rows 22 so that the relative degrees of ultraviolet rays emitted from the solid-state light-emitting elements 23 of the plurality of solid-state light-emitting elements rows 22 become equal.

Further, the light source devices 1, 1-1, 1-2, 2, 3, 4, 5, 6, 6-1, and 6-2 described in Embodiments 2 to 7 described below include a temperature detection unit 60. The temperature detection unit 60 is disposed at a predetermined position of the light emitting unit 20 and can detect the temperature of the predetermined position. Based on the detection result of the temperature detection unit 60, the control unit 70 causes the current adjustment unit 30 to change the current flowing through the corresponding solid-state light emitting element row 22 Current value of the solid-state light-emitting element 23.

In addition, the light source devices according to Embodiments 2 to 7 and the like described below In 1, 1-1, 1-2, 2, 3, 4, 5, 6, 6-1, and 6-2, a plurality of temperature detection units 60 are provided at intervals along the flow direction of the fluid.

[Embodiment 2]

Next, a light source device 1 according to a second embodiment of the present invention will be described based on the drawings. 3 is a diagram showing a schematic configuration of an ultraviolet irradiation device including a light source device according to Embodiment 2. FIG. 4 is a cross-sectional view taken along the line II-II in FIG. 3. FIG. 5 is a view showing the light source device according to Embodiment 2 from below. A block diagram of the general structure of the light emitting section.

The light source device 1 according to the second embodiment (hereinafter simply referred to as a light source device) constitutes an ultraviolet irradiation device 100 shown in FIG. 3. The ultraviolet irradiation device 100 is, for example, a device used for a photo-reaction step such as curing, lamination, or lamination of a liquid crystal panel, and irradiates ultraviolet light of a predetermined wavelength to an object to be irradiated W (shown in FIG. 3).

As shown in FIG. 3, the ultraviolet irradiation device 100 includes a light source device 1, a stage 10 on which an object to be irradiated W is placed on the mounting surface 10 a, and the like. Hereinafter, directions orthogonal to each other parallel to the mounting surface 10a are referred to as X-axis direction and Y-axis direction, and directions orthogonal to the mounting surface 10a are referred to as Z-axis direction. The light source device 1 includes a light emitting unit 20, a plurality of current adjustment units 30 (shown in FIG. 5), a heat radiation unit 40, a housing 50, a temperature detection unit 60, and a control unit 70.

As shown in FIGS. 3 and 5, the light emitting section 20 includes a mounting substrate 21 (corresponding to a substrate) and a plurality of solid-state light emitting element rows 22. The mounting substrate 21 is arranged parallel to the X-axis direction and the Y-axis direction, that is, the mounting surface 10a. The mounting substrate 21 has a plurality of solid-state light-emitting elements 23 constituting a solid-state light-emitting element row 22 mounted on a surface 21 a facing the mounting surface 10 a along the Z-axis direction. The mounting substrate 21 moves the solid-state light-emitting element 23 along X The two directions, the axial direction and the Y-axis direction, are arranged on the surface 21 a and arranged on the surface. The mounting substrate 21 connects the solid-state light-emitting elements 23 in a predetermined pattern.

The plurality of solid-state light-emitting element rows 22 include a plurality of solid-state light-emitting elements 23 mounted on the surface 21 a of the mounting substrate 21. The solid-state light-emitting elements 23 constituting each solid-state light-emitting element row 22 are arranged on a mounting substrate 21 on a straight line parallel to the X-axis direction as a predetermined line, and an anode and a cathode are connected in series. The solid-state light-emitting element 23 emits ultraviolet rays. The solid-state light-emitting elements 23 constituting the solid-state light-emitting element row 22 are supplied with electric power from a DC power source 24 (shown in FIG. 5). The light-emitting section 20 includes a plurality of solid-state light-emitting element rows 22 arranged in a Y-axis direction orthogonal (intersecting) to the X-axis direction as a predetermined line. The plurality of solid-state light-emitting element rows 22 are connected in parallel to each other, and are connected in parallel to the DC power source 24. Therefore, the electric power supplied from the DC power source 24 is caused to flow as a current through the plurality of solid-state light-emitting element rows 22 along the arrow K shown in FIGS. 3 to 5 parallel to the X-axis direction. In this way, the light-emitting section 20 includes n (natural numbers) solid-state light-emitting element rows 22. That is, the light emitting section 20 includes the first solid-state light-emitting element row 22, the second solid-state light-emitting element row 22, ..., the n-1th solid-state light-emitting element row 22, and the n-th solid-state light-emitting element row 22 as the solid-state light-emitting element row.

The solid-state light-emitting elements 23 constituting the solid-state light-emitting element array 22 emit ultraviolet rays that vibrate in all directions uniformly, and include LEDs (Light Emitting Diodes), LDs (Laser Diodes), and the like. The solid-state light-emitting element 23 emits ultraviolet rays having a peak wavelength of 240 nm or more and 450 nm or less. In addition, the peak wavelength referred to in this specification refers to the wavelength of the ultraviolet rays having the strongest contrast among the ultraviolet rays emitted from the solid-state light-emitting element 23. In addition, the relative degree in the present invention means An index of the degree of contrast of the light portion 20, that is, the ultraviolet rays emitted from the solid-state light-emitting element 23. As the relative illuminance, for example, the illuminance measured by a so-called illuminance meter such as a UV integrated light meter UIT-250 and a photoreceptor UVD-S365 using a USHIO electrical mechanism can be used as the relative illuminance. The illuminance meter is not limited to the above, and for example, UV-MO3A and UV-SN35 manufactured by ORC can be used. For the contrast, for example, at a position where the object to be irradiated W is placed, a light receiving element that receives ultraviolet rays and outputs an electric signal may be used to relatively detect the intensity change of the ultraviolet rays.

The current adjustment unit 30 is provided in two or more, and is provided corresponding to one or more solid-state light-emitting element rows 22 of the light-emitting section 20. In the second embodiment, the current adjustment units 30 correspond to the solid-state light-emitting element rows 22 one-to-one. The current adjustment unit 30 includes, for example, a variable resistor whose resistance value can be changed, and is connected in series with a plurality of solid-state light-emitting elements 23 constituting the corresponding solid-state light-emitting element row 22. By changing the resistance value, the current adjustment unit 30 can change the current value flowing through the solid-state light-emitting elements 23 of the corresponding solid-state light-emitting element row 22. The current adjustment unit 30 may be mounted on or mounted outside the mounting substrate 21.

The heat radiating unit 40 flows a gas as a fluid along the back surface 21b of the mounting substrate 21 in a Y-axis direction orthogonal (intersecting) with respect to the X-axis direction as a predetermined line, so that The heat emitted from the solid-state light-emitting elements 23 of two or more adjacent solid-state light-emitting element rows 22 in the Y-axis direction of the direction is released to the outside of the light source device 1. In the second embodiment, the heat dissipation unit 40 causes the gas to flow in the Y-axis direction so that all the solid-state light-emitting elements 23 of the solid-state light-emitting element rows 22 emit light. Heat is released outside the light source device 1. As shown in FIGS. 3 and 4, the heat dissipation unit 40 includes a heat sink 41, a heat dissipation fan 42, and the like. The heat sink 41 is mounted on the back surface 21 b on the back side of the surface 21 a of the mounting substrate 21 of the light emitting section 20. The heat sink 41 includes a material (metal or the like) having a low thermal resistance such as an aluminum alloy. In the second embodiment, the heat sink 41 is integrally provided with a flat substrate mounting portion 41a mounted on the back surface 21b of the mounting substrate 21, and a plurality of fins 41b facing away from the stage from the substrate mounting portion 41a. The direction of 10 stands out. The fins 41b protrude from the substrate mounting portion 41a in the Z-axis direction and are formed in a flat plate shape extending linearly in the Y-axis direction. A plurality of fins 41b are provided at regular intervals in the X-axis direction.

The heat radiating fan 42 is attached to one end portion of the heat sink 41 in the Y-axis direction, and rotates to introduce a gas outside the light source device 1 as a fluid between the fins 41b of the heat sink 41, and to flow between the fins 41b After that, it is discharged out of the light source device 1. The heat-dissipating fan 42 releases heat from the solid-state light-emitting elements 23 of the solid-state light-emitting element row 22 to the outside of the light source device 1 through the mounting substrate 21, the heat sink 41, and the like by flowing gas between the fins 41b.

Further, in the present invention, the heat radiating unit 40 may include a box-shaped heat pipe, a pump, and the like. The box-shaped heat pipe is mounted on the back surface 21b of the mounting substrate 21 and sealed inside, and the liquid as a fluid flows inside. The pump moves the liquid in the heat pipe.

The frame 50 covers the back surface 21 b of the mounting substrate 21 and the heat sink 41 of the heat radiation unit 40. In the second embodiment, the frame 50 is formed in a box shape with both ends in the Y-axis direction open. The housing 50 is rotated by the heat radiating fan 42 of the heat radiating unit 40, so that A gas as a fluid is introduced through one of the openings 50 a on a side remote from the heat radiating fan 42, and the gas heated by the heat absorber 41 is discharged to the outside from the other opening 50 b near the heat radiating fan 42.

The temperature detection unit 60 is provided at a predetermined position of the light emitting section 20 and can detect the temperature of the predetermined position. In the second embodiment, the plurality of temperature detection units 60 are provided in the light emitting unit 20 at intervals in the Y-axis direction, which is the flow direction of the gas as the fluid in the heat radiating unit 40. In the second embodiment, the temperature detection unit 60 is provided at the center of the X-axis direction of the end of one of the openings 50 a of the frame 50 near the surface 21 a of the mounting substrate 21 and the frame close to the surface 21 a of the mounting substrate 21. The center of the X-axis direction of the end of the other opening portion 50 b of the body 50 is two in total. The temperature detection unit 60 outputs a detection result to the control unit 70.

The control unit 70 controls the ultraviolet irradiation operation of the ultraviolet irradiation device 100. The control unit 70 is constituted, for example, by a microprocessor (not shown) as a main body, which includes an arithmetic processing device including a central processing unit (CPU) or a read-only memory ( Read Only Memory (ROM), Random Access Memory (RAM), etc., and are connected to a display unit that displays the status of processing operations, and an operation unit used by the operator to register processing content information, etc. .

The control unit 70 controls the current adjustment unit 30 provided corresponding to each of the solid-state light-emitting element rows 22 of the light-emitting section 20 of the light source device 1 to change a current value flowing through the solid-state light-emitting elements 23 in each of the solid-state light-emitting element rows 22. . The control unit 70 controls the flow of the solid-state light-emitting elements 23 passing through the solid-state light-emitting element rows 22 When the current value is changed, based on the detection result of the temperature detection unit 60, each current adjustment unit 30 is caused to change the current value flowing through the solid-state light-emitting elements 23 in the corresponding solid-state light-emitting element row 22 so that a plurality of solid-state light-emitting element rows 22 The relative degrees of ultraviolet rays emitted from the solid-state light-emitting element 23 are equal.

Next, a processing operation of the object W to be irradiated by the ultraviolet irradiation apparatus 100 will be described. First, the operator registers the processing content information in the control unit 70 and starts a processing operation when there is an instruction to start the processing operation. When the processing operation is started, the control unit 70 causes the heat radiation fan 42 of the heat radiation unit 40 of the light source device 1 to operate.

In addition, when a predetermined period of time has elapsed after the heat radiation fan 42 of the heat radiation unit 40 is operated, the ultraviolet irradiation device 100 places the object W on the mounting surface 10 a of the stage 10 from the solid-state light-emitting element rows 22 of the light-emitting section 20. Each solid-state light-emitting element 23 emits ultraviolet rays to irradiate the object W on the mounting surface 10 a with ultraviolet rays. The control unit 70 controls the current adjustment unit 30 to apply power to each of the solid-state light-emitting element rows 22. The object W to be irradiated with ultraviolet rays for a fixed time is detached from the mounting surface 10 a of the stage 10, and the object W to be irradiated with ultraviolet rays is placed on the mounting surface 10 a of the stage 10. Ultraviolet rays were irradiated in the same manner as in the aforementioned step.

The ultraviolet irradiation device 100 of the present invention may be provided with a filter or an optical element between the light source device 1 and the stage 10 as necessary.

In the light source device 1 of the second embodiment configured as described above, the control unit 70 causes the current adjustment units 30 to change the current value of the solid-state light-emitting elements 23 flowing through the corresponding solid-state light-emitting element rows 22 so that the The relative degrees of ultraviolet rays emitted from the solid-state light-emitting element 23 become equal. Therefore, the light source device 1 can It is sufficient to suppress variations in the illuminance of ultraviolet rays irradiated onto the object to be irradiated. Therefore, the light source device 1 can suppress uneven irradiation of ultraviolet rays with respect to the object W to be irradiated.

Further, the light source device 1 includes a temperature detection unit 60 that detects the temperature on the surface 21 a of the mounting substrate 21 that is the predetermined position of the light emitting section 20, and the control unit 70 controls based on the detection result of the temperature detection unit 60. Each current adjustment unit 30. Therefore, the light source device 1 can suppress variations in the illuminance of ultraviolet rays irradiated onto the object to be irradiated W. Therefore, the light source device 1 can make the relative degrees of ultraviolet rays emitted from the solid-state light-emitting elements 23 of the plurality of solid-state light-emitting element rows 22 as equal as possible, and can suppress variations in the illuminance of ultraviolet rays irradiated to the object to be irradiated. Therefore, the light source device 1 can suppress uneven irradiation of ultraviolet rays with respect to the object W to be irradiated.

Furthermore, in the light source device 1, by providing a plurality of temperature detection units 60 at intervals along the flow direction of the fluid, each of the current adjustment units 30 can change the solid-state light-emitting element flowing through the corresponding solid-state light-emitting element row 22 23 current value. Therefore, the light source device 1 can make the relative degrees of ultraviolet rays emitted from the solid-state light-emitting elements 23 of the plurality of solid-state light-emitting element rows 22 as equal as possible, and can suppress variations in the illuminance of ultraviolet rays irradiated to the object to be irradiated. Therefore, the light source device 1 can suppress uneven irradiation of ultraviolet rays with respect to the object W to be irradiated.

Further, in the light source device 1, by emitting ultraviolet rays having a peak wavelength of 240 nm or more and 450 nm or less, the solid-state light-emitting element 22 can suppress uneven irradiation of ultraviolet rays to the object to be irradiated.

[Modification 1]

Next, a first modification of the second embodiment of the present invention will be described based on the drawings. 的 光光 装置 1-1. FIG. 6 is a block diagram showing a schematic configuration of a light source device according to a first modification of the second embodiment. In FIG. 6, the same portions as those in the aforementioned second embodiment are denoted by the same reference numerals, and descriptions thereof are omitted.

As shown in FIG. 6, the light source device 1-1 according to the first modification of the second embodiment does not include a temperature detection unit 60. Furthermore, the control unit 70 of the light source device 1-1 controls the current adjustment unit 30 based on a value stored in advance.

The light source device 1-1 according to the first modification of the second embodiment can suppress variations in the illuminance of ultraviolet rays irradiated on the object W as in the second embodiment, and can suppress uneven irradiation of ultraviolet rays on the object W.

[Modification 2]

Next, a light source device 1-2 according to a second modification of the second embodiment of the present invention will be described based on the drawings. FIG. 7 is a block diagram showing a schematic configuration of a light source device according to a second modification of the second embodiment. In FIG. 7, the same portions as those in the aforementioned second embodiment are denoted by the same reference numerals and descriptions thereof are omitted.

As shown in FIG. 7, the light source device 1-2 according to the second modification of the second embodiment includes a temperature detection unit 60 corresponding to each solid-state light-emitting element row 22. That is, in the light source device 1-2 according to the second modification, the solid-state light-emitting element rows 22 and the temperature detection unit 60 correspond one-to-one, and the corresponding solid-state light-emitting element rows 22 and the temperature detection unit 60 are disposed at close positions.

The light source device 1-2 according to the second modification of the second embodiment can suppress variations in the illuminance of ultraviolet rays irradiated on the object W as in the second embodiment, and can suppress uneven irradiation of ultraviolet rays on the object W.

[Embodiment 3]

Next, a light source device 2 according to a third embodiment of the present invention will be described based on the drawings. 8 is a block diagram showing a schematic configuration showing a schematic configuration of a light source device according to Embodiment 3 from below. In FIG. 8, the same portions as those in Embodiment 2 and the like described above are denoted by the same reference numerals and descriptions thereof will be omitted.

As shown in FIG. 8, the light source device 2 according to the third embodiment includes solid-state light-emitting elements 23 arranged in each solid-state light-emitting element row 22. The solid-state light-emitting elements 23 are connected in series on a plurality of straight lines parallel to the X-axis direction. Although the temperature detection unit 60 is omitted in FIG. 8, in the third embodiment, the temperature detection unit 60 may be arranged in the same manner as the second modification of the second embodiment and the second embodiment.

The light source device 2 according to the third embodiment can suppress variations in the illuminance of the ultraviolet rays irradiated on the object W as in the second embodiment, and can suppress uneven irradiation of the ultraviolet rays on the object to be irradiated.

[Embodiment 4]

Next, a light source device 3 according to a fourth embodiment of the present invention will be described based on the drawings. FIG. 9 is a block diagram showing a schematic configuration showing a schematic configuration of a light source device according to Embodiment 4 from below. In FIG. 9, the same portions as those of the aforementioned Embodiment 2, Embodiment 3, and the like are denoted by the same reference numerals and descriptions thereof will be omitted.

As shown in FIG. 9, a light source device 3 according to Embodiment 4 is provided with solid-state light-emitting elements 23 in each solid-state light-emitting element row 22. The solid-state light-emitting elements 23 are connected in series on a plurality of straight lines parallel to the X-axis direction. In the fourth embodiment, as in the second embodiment, the solid-state light-emitting elements 23 may be replaced with the solid-state light-emitting elements 23. Arranged on a straight line parallel to the X-axis direction. Although the temperature detection unit 60 is omitted in FIG. 9, in the fourth embodiment, the temperature detection unit 60 may be arranged in the same manner as the second modification of the second embodiment and the second embodiment.

Furthermore, as shown in FIG. 9, the heat radiation unit 40 of the light source device 3 according to the fourth embodiment is provided with fans 43 for sucking gas into the housing 50 at both ends in the Y-axis direction, and is provided with a center from the Y-axis direction. The gas is discharged to a discharge port 44 outside the casing 50.

The light source device 3 according to the fourth embodiment can suppress variations in the illuminance of ultraviolet rays irradiated on the object to be irradiated, and can suppress uneven irradiation of ultraviolet rays on the object to be irradiated, as in the second embodiment and the like.

[Embodiment 5]

Next, a light source device 4 according to a fifth embodiment of the present invention will be described based on the drawings. FIG. 10 is a block diagram showing a schematic configuration showing a schematic configuration of a light source device according to Embodiment 5 from below. In FIG. 10, the same parts as those in the aforementioned second embodiment and the like are denoted by the same reference numerals and descriptions thereof will be omitted.

The light source device 4 of Embodiment 5 forms each solid-state light-emitting element row 22 in a straight line parallel to the X-axis direction, and as shown in FIG. 10, the direction of the current flowing through each solid-state light-emitting element row 22 adjacent to each other is reversed. . Although the temperature detection unit 60 is omitted in FIG. 10, in the fifth embodiment, the temperature detection unit 60 may be arranged in the same manner as in the second modification of the second embodiment and the second embodiment. Furthermore, although the current adjustment unit 30 is omitted in FIG. 10, in the present invention, the current adjustment unit 30 is provided corresponding to each solid-state light-emitting element row 22. Moreover, the control unit 70 is omitted in FIG. 10.

The light source device 4 according to the fifth embodiment can be similar to the second embodiment and the like, It is possible to suppress variations in the illuminance of ultraviolet rays irradiated on the object to be irradiated W, and to suppress uneven irradiation of ultraviolet rays to the object to be irradiated W.

[Embodiment 6]

Next, a light source device 5 according to a sixth embodiment of the present invention will be described based on the drawings. 11 (a) is a side view of a light source device according to Embodiment 6, and FIG. 11 (b) is a plan view showing a schematic configuration of the light source device according to Embodiment 6 from below. In FIG. 11, the same portions as those in the aforementioned second embodiment and the like are denoted by the same reference numerals and descriptions thereof will be omitted.

As shown in FIG. 11 (a), a light source device 5 according to Embodiment 6 is provided with a pair of mounting substrates 21 so that the back surfaces 21b face each other at intervals, and a surface 21a of each mounting substrate 21 is provided parallel to the X-axis direction. Of a plurality of solid-state light-emitting element rows 22. The housing 50 connects the two ends of the mounting substrate 21 in the X-axis direction, and the heat dissipation unit 40 allows gas to flow between the mounting substrates 21 in the Y-axis direction. Although the temperature detection unit 60 is omitted in FIGS. 11 (a) and 11 (b), in the sixth embodiment, the temperature detection unit 60 may be arranged in the same manner as the second modification of the second embodiment and the second embodiment. Furthermore, although the current adjustment unit 30 is omitted in FIGS. 11 (a) and 11 (b), in the present invention, the current adjustment unit 30 is provided corresponding to each solid-state light-emitting element row 22. Moreover, the control unit 70 is omitted in FIG. 11.

The light source device 5 according to the sixth embodiment can suppress variations in the illuminance of ultraviolet rays irradiated on the object to be irradiated in the same manner as in the second embodiment and the like, and can suppress uneven irradiation of ultraviolet rays on the object to be irradiated.

[Embodiment 7]

Next, a light source device 6 according to a seventh embodiment of the present invention will be described based on the drawings. FIG. 12 is a side view of the ultraviolet irradiation device including the light source device according to the seventh embodiment as viewed in the Y-axis direction. FIG. 13 is a perspective view showing a schematic configuration of the light source device according to the seventh embodiment. side view. 15 is a perspective view showing a schematic configuration of a light source device according to a first modification of the seventh embodiment, and FIG. 16 is a perspective view showing a schematic configuration of a light source device according to the second modification of the seventh embodiment. In FIG. 12 to FIG. 16, the same portions as those in the aforementioned second embodiment and the like are denoted by the same reference numerals, and descriptions thereof will be omitted.

As shown in FIGS. 13 and 14, in the light source device 6 according to the seventh embodiment, a plurality of solid-state light-emitting element rows 22 are provided on the outer peripheral surface 21 a of the mounting substrate 21 having a circular cross-section. The solid-state light-emitting element row 22 includes a plurality of solid-state light-emitting elements 23 which are arranged on a surface (outer peripheral surface) 21 a of the mounting substrate 21 on a circumference as a predetermined line and are connected in series. The plurality of solid-state light-emitting element rows 22 are arranged in a plurality along the Y-axis direction orthogonal (intersecting) to a predetermined line. The heat radiating unit 40 causes a gas as a fluid to flow along the Y-axis direction inside the mounting substrate 21 to dissipate heat generated by the solid-state light-emitting element 23. In addition, temperature detection units 60 are provided at both ends in the Y-axis direction of the surface (outer peripheral surface) 21 a of the mounting substrate 21. Furthermore, the ultraviolet irradiation device 100 including the light source device 6 according to the seventh embodiment includes a mirror 101 that irradiates ultraviolet rays emitted from the solid-state light-emitting element 23 of the light source device 6 toward the mounting surface 10 a of the stage 10. Object W reflection.

Further, as shown in FIG. 15, the light source device 6-1 according to the first modification of the seventh embodiment is provided with a temperature detection unit 60 corresponding to each solid-state light-emitting element row 22, and is implemented. As shown in FIG. 16, the light source device 6-2 according to the second modification of the seventh aspect is not provided with a temperature detection unit 60.

The light source devices 6, 6-1, and 6-2 of the seventh embodiment, the first modification and the second modification of the seventh embodiment can suppress variations in illuminance of ultraviolet rays irradiated to the object W in the same manner as in the second embodiment and the like. Non-uniform irradiation of ultraviolet rays to the object W is suppressed.

The light source devices 1, 1-1, 1-2, 2, 3, 4, 5, 6, 6-1, and 6-2 of the foregoing Embodiments 2 to 7 and the like have been shown to be used for curing the liquid crystal panel. An example of the ultraviolet irradiation device 100 in a photoreaction step such as overlapping or bonding. However, the light source device 1, 1-1, 1-2, 2, 3, 4, 5, 6, 6-1, and 6-2 of the present invention may also constitute a semiconductor manufacturing device or a photochemical reaction of a chemical substance. Diverse devices.

Furthermore, in the aforementioned second to sixth embodiments, a plurality of solid-state light-emitting elements 23 connected in series are arranged on a straight line parallel to the X-axis direction to form a solid-state light-emitting element row 22, but the present invention is not limited to this. this. For example, a plurality of solid-state light-emitting elements 23 connected in series may be arranged on a circle as a predetermined line to form a solid-state light-emitting element row 22. At this time, it is desirable that the plurality of solid-state light-emitting element rows 22 are arranged on a concentric circle.

The ultraviolet irradiation apparatuses 301, 301-1, and 301-2 described below in Embodiments 8 to 9 include a light source 310 having a light-emitting element 312 that emits ultraviolet U, and an absorption-type polarizing element 320 that emits light from the light source 310. The polarized light UA whose polarization axis PA is parallel to a predetermined reference direction in the ultraviolet U is transmitted.

Furthermore, in the ultraviolet irradiation devices 301, 301-1, and 301-2 of the eighth to ninth embodiments described below, there are optical members (lens 314c, lens) between the light source 310, the base 311, and the absorption-type polarizing element 320. 316c, lens 330, wire grid polarizing element 340).

[Embodiment 8]

Next, the ultraviolet irradiation device 301 according to the eighth embodiment of the present invention will be described based on the drawings. FIG. 17 is a perspective view showing a schematic configuration of the ultraviolet irradiation device according to the eighth embodiment. FIG. 18 is a view of the ultraviolet irradiation device according to the eighth embodiment viewed from the Y-axis direction. FIG. 19 is a view showing the ultraviolet irradiation device according to the eighth embodiment from the Z-axis direction. Of light source 310.

The ultraviolet irradiation device 301 according to the eighth embodiment shown in FIG. 17 irradiates a polarization axis PA parallel to a predetermined reference direction on the surface of the object to be irradiated W, that is, the workpiece as an alignment processing object (indicated by arrows in FIG. (Referred to as vibration direction). The ultraviolet irradiation device 301 according to the eighth embodiment is used, for example, for manufacturing an alignment film of a liquid crystal panel, an alignment film of a viewing angle compensation film, or a polarizing film. The ultraviolet irradiation device 301 mainly irradiates ultraviolet light UA having a wavelength of 365 (nm), which is a desired wavelength, to the surface of the workpiece W, which is the object to be irradiated. The "ultraviolet rays" referred to in the eighth embodiment refer to light in a wavelength range from 240 (nm) to 450 (nm), for example.

The polarization axis PA of the ultraviolet light UA that is irradiated to the surface of the workpiece W, which is the object to be irradiated, is appropriately set according to the structure, use, or required specification of the workpiece, which is the object to be irradiated W. Hereinafter, the width direction of the workpiece W, that is, the workpiece, is referred to as the X-axis. The direction is called the Y-axis direction, and the direction orthogonal to the X-axis direction and the workpiece W, that is, the long side direction of the workpiece, is called the Z-axis direction. In the direction parallel to the Z axis, the direction facing the tip of the arrow indicating the Z axis direction is referred to as upward, and the direction opposite to the direction facing the tip of the arrow indicating the Z axis direction is referred to as the downward direction.

As shown in FIG. 17, the ultraviolet irradiation device 301 includes a light source 310 having a light-emitting element 312 that emits ultraviolet U that vibrates in all directions and has a wavelength of about 365 (nm), and an absorption-type polarizing element 320.

The light source 310 uses a light emitting element 312. The ultraviolet rays U emitted from the light source 310 include ultraviolet rays having a wavelength of about 365 (nm), and are so-called unpolarized lights having various polarization axis components. In the eighth embodiment, one light source 310 is provided, and the light source 310 is disposed above the workpiece, that is, the absorption-type polarizing element 320 and the object W to be irradiated.

The absorption-type polarizing element 320 irradiates ultraviolet rays U emitted from the light source 310. The absorption-type polarizing element 320 transmits polarized light (ultraviolet light UA) whose polarization axis PA is parallel to the reference direction among the ultraviolet rays U toward the object to be irradiated W, that is, the workpiece. That is, the absorption-type polarizing element 320 derives, from the ultraviolet rays U having the polarization axis PA, ultraviolet rays UA whose polarization axis PA vibrates only in the reference direction. In addition, ultraviolet rays UA whose polarization axis PA vibrates only in the reference direction are generally referred to as linearly polarized light. The polarization axis PA of the ultraviolet UA refers to a vibration direction of an electric field and a magnetic field of the ultraviolet UA.

In the eighth embodiment, the absorption-type polarizing element 320 is provided below the light source 310 and above the surface of the workpiece W that is the object to be irradiated. The absorption-type polarizing element 320 is an element in which metallic nano particles included in a glass plate are aligned in a fixed direction. The polarizing element absorbs ultraviolet rays whose polarization axis in the ultraviolet rays U emitted from the light source 310 intersects the reference direction, and transmits ultraviolet rays UA whose polarization axis PA is parallel to the reference direction. As the absorption-type polarizing element 320, for example, Colorpol (registered trademark) UV375BC5 manufactured by CODIXX can be used.

Next, the light source 310 will be described in detail using FIGS. 18 and 19.

In the ultraviolet irradiation device 301 of Embodiment 8, the light source 310 is configured by providing a plurality of light-emitting elements 312 on a base 311. The base 311 holds a plurality of light emitting elements 312. In addition, the base 311 transmits heat emitted from the plurality of light emitting elements 312 to the outside of the ultraviolet irradiation device 301, thereby suppressing a temperature rise of the plurality of light emitting elements 312. In addition, the base 311 may include a metal such as aluminum or a material having good heat dissipation properties such as a ceramic substrate. In addition, the base body 311 may include a heat-radiating medium flow path through which a heat-radiating medium (not shown) flows, and the heat-radiating medium is used to transmit heat emitted from the plurality of light-emitting elements 312 as soon as possible. In addition, the heat radiation medium may include a heat radiation medium supply port for supplying the heat radiation medium and a heat radiation medium discharge port for releasing the heat radiation medium. In addition, the heat dissipation medium may be looped by a loop mechanism (not shown).

The light emitting element 312 is provided on the base 311 and emits ultraviolet rays U. The light emitting element 312 emits at least ultraviolet U and includes a semiconductor such as an LED (Light Emitting Diode) or an LD (Laser Diode). The light emitting element 312 includes a first light emitting element 314 that emits ultraviolet rays having a first peak wavelength, and a second light emitting element 316 that emits ultraviolet rays having a second peak wavelength different from the first peak wavelength. The first light-emitting element 314 surrounds the light-emitting wafer 314a that emits ultraviolet light having a first peak wavelength. It is formed and includes a reflector 314b having an opening portion. The periphery of the light-emitting wafer 314a and the opening portion of the reflector 314b in which the light-emitting wafer 314a is arranged are sealed by a glass cover (not shown). The second light-emitting element 316 is formed around a light-emitting wafer 316a that emits ultraviolet rays of a second peak wavelength, and includes a reflector 316b having an opening portion. The periphery of the light-emitting wafer 316a and the opening portion of the reflector 316b in which the light-emitting wafer 316a is arranged are sealed by a glass cover (not shown). The light emitting element 312 mixes ultraviolet rays of a first peak wavelength emitted from the first light emitting element 314 and ultraviolet rays of a second peak wavelength emitted from the second light emitting element 316 to emit ultraviolet rays U.

Next, an operation of the ultraviolet irradiation device 1 according to the eighth embodiment will be described. The ultraviolet irradiation device 301 according to the eighth embodiment has a structure in which the workpiece W to be irradiated, that is, the workpiece is positioned below the absorption-type polarizing element 320, and emits ultraviolet rays U from the light source 310. Then, the ultraviolet light U emitted from the light source 310 is directly emitted toward the absorption-type polarizing element 320. Further, in the ultraviolet irradiation device 301, the absorption-type polarizing element 320 transmits ultraviolet rays UA having a polarization axis PA parallel to the reference direction in the ultraviolet rays U toward the light irradiation area on the surface of the object W to be irradiated, so that the object W, which is the The surface is subjected to an orientation treatment.

In the ultraviolet irradiation device 301 according to the eighth embodiment described above, when a wire grid type polarizing element is used, a surface having a wire grid formed and a surface without a wire grid formed are so-called backsheets. The polarizer has a back surface and the extinction ratio changes. However, in the absorptive polarizing element 320, the metal nano-particles formed inside the absorptive polarizing element 320 absorb light oscillating in a direction other than the reference direction, so there is no so-called back surface like a wire grid polarizing element, so it is easy to handle .

In the ultraviolet irradiation device 301, the light source 310 emits only ultraviolet rays of the first peak wavelength and ultraviolet rays of the second peak wavelength, and does not emit light other than ultraviolet rays of the first peak wavelength and ultraviolet rays of the second peak wavelength. That is, irradiation of light other than the ultraviolet U to the absorption-type polarizing element 320 is restricted. Therefore, the ultraviolet irradiation device 1 can reduce the light absorbed by the absorption-type polarizing element 320, and specifically, can reduce the amount of light absorbed by the metal nano-particles formed inside the absorption-type polarization element 320. As long as the amount of light absorbed by the metal nano-particles can be reduced, the temperature of the absorption-type polarizing element 320 can be suppressed from increasing, and the possibility of the absorption-type polarizing element 320 reaching a high temperature can be reduced. problem. Therefore, even if the ultraviolet irradiation device 301 uses the absorption-type polarizing element 320, problems such as cracking of the absorption-type polarizing element 320 can be suppressed.

Further, in the ultraviolet irradiation device 301, the absorption-type polarizing element 320 is irradiated with ultraviolet U, and light of a wavelength other than the ultraviolet U is restricted. Therefore, it is possible to suppress the absorption of the light other than the ultraviolet-U into the absorption-type polarizing element 320. A phenomenon in which the extinction ratio of the absorption-type polarizing element 320 decreases. The extinction ratio ER is a numerical value indicating the quality of polarized light, and is expressed by using P-polarized light intensity Ip and S-polarized light intensity Is and ER = Ip / Is.

The ultraviolet irradiation device 301 can suppress a phenomenon in which light other than ultraviolet rays of the first peak wavelength and ultraviolet rays of the second peak wavelength is irradiated to the absorption-type polarizing element 320. That is, the ultraviolet irradiation device 301 suppresses the phenomenon that long-wavelength ultraviolet rays, visible rays, and infrared rays are irradiated to the absorption-type polarizing element 320. Therefore, it is possible to suppress the long-wavelength ultraviolet rays, visible rays, and infrared rays from being irradiated to the absorption-type polarization element 320. therefore, The ultraviolet irradiation device 1 can suppress deterioration of the absorption-type polarizing element of the absorption-type polarizing element 320.

Further, in the ultraviolet irradiation device 301, as the light source 310, a light-emitting element 312 is used. The light-emitting element 312 includes a first light-emitting element 314 and a second light-emitting element 316 that emit ultraviolet rays of a first peak wavelength. Therefore, the absorption-type polarizing element can be suppressed. The decrease in the lifespan and extinction ratio of 320, and the sufficient amount of ultraviolet light U can be irradiated to the irradiated object W, that is, the workpiece, so that the time required to irradiate light to the object can be suppressed.

Further, the ultraviolet irradiation device 301 uses a first light-emitting element that emits ultraviolet rays having a first peak wavelength and a second light-emitting element that emits ultraviolet rays having a second peak wavelength. Therefore, compared with a light-emitting element that emits only ultraviolet rays having a single peak wavelength, In some cases, the energy given to the irradiated object is further increased.

In addition, the main wavelength of the light emitted from the light-emitting element 312 is 240 nm to 450 nm, so that the ultraviolet irradiation on the object to be irradiated can be performed more reliably, and the unevenness of the photochemical reaction of the object to be irradiated can be suppressed.

The light-emitting element 312 is not limited to the above-mentioned structure. For example, the first light-emitting wafer 314 a constituting the first light-emitting element 314 and the second light-emitting wafer 316 a constituting the second light-emitting element 316 may be housed in the same reflector 314 a to constitute the light-emitting element 314.

The absorption-type polarizing element 320 is not limited to the above structure. For example, a plurality of absorption-type polarizing elements 320 may be superposed to form an integrated absorption-type polarizing element 320.

(Embodiment 9)

20 is a side view showing a schematic configuration of a modified example of the ultraviolet irradiation device according to Embodiment 9. FIG.

In the ninth embodiment, an ultraviolet irradiation device 301-1 having a lens 314c, a lens 316c, and a lens 330 as optical members between the light source 310 and the absorption-type polarizing element 320 is shown.

The lens 314c is provided in contact with the reflector 314b of the first light emitting element 314, and adjusts the direction of light emitted from the first light emitting element 314. The lens 316c is provided in contact with the reflector 316b of the second light-emitting element 316, and adjusts the direction of light emitted from the second light-emitting element 316. The lens 314c and the lens 316c include, for example, a material such as quartz glass that transmits ultraviolet rays emitted from the first light-emitting wafer 314a and the second light-emitting wafer 316a.

The lens 330 functions as a so-called collimate lens that adjusts light emitted from the first light-emitting element 314 and the second light-emitting element 316. The lens 330 is provided near the absorption-type polarizing element 320 and adjusts the direction of light emitted from the light source 310. The lens 330 is made of a material such as quartz glass that transmits ultraviolet rays U emitted from the light source 310 in the same manner as the lenses 314c and 316c.

With this configuration, it is possible to suppress deterioration of the absorption-type polarizing element in the same manner as in the eighth embodiment.

Furthermore, since an optical member is provided between the light source 310 and the absorptive polarizing element 320, the direction of the ultraviolet rays U can be adjusted until it reaches the absorptive polarizing element 320. Therefore, it is possible to suppress the Deterioration of the polarization axis and extinction ratio of the irradiated object.

FIG. 21 is a side view showing a schematic configuration of another modification of the ultraviolet irradiation apparatus according to Embodiment 9. FIG.

In this modification, an ultraviolet irradiation device 301-2 in which a wire grid polarizing element 340 is provided between the light source 310 and the absorption-type polarizing element 320 is shown. With this configuration, it is possible to suppress deterioration of the extinction ratio in the same manner as in the ninth embodiment.

Furthermore, by using the wire-grid polarizing element 340, the amount of ultraviolet U that is unpolarized light can be reduced. Therefore, the amount of undesired ultraviolet U that is irradiated to the absorption-type polarizing element 320 can be reduced. As a result, the absorption-type polarizing element can be further suppressed Degradation.

Although some embodiments and modifications of the present invention have been described, these embodiments and modifications are merely examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope or gist of the invention, and are also included in the invention described in the scope of patent application and its equivalent scope.

Claims (9)

A light source device comprising: a light-emitting element emitting light having a dominant wavelength in an ultraviolet region; a ceramic substrate, the light-emitting element is arranged on one side, ceramic is used as a base material, and the light-emitting element is arranged A conductive pattern composed of a conductor and an overcoat layer that covers at least the conductive pattern and suppresses the light from reaching the conductive pattern are formed on one side of the surface; a heat dissipation member disposed in the ceramic substrate; The side opposite to the one-side surface of the light-emitting element is made of a metal material; two or more current adjusting units can change the value of the current flowing through the light-emitting element; a control unit controls the current An adjusting unit; and the control unit causing the current adjusting unit to change a current value flowing through the light emitting element so that the relative degrees of ultraviolet rays emitted by the light emitting element become equal. The light source device according to item 1 of the scope of patent application, wherein the light emitting element is provided with a plurality of light emitting elements having different dominant wavelengths of the irradiated light. The light source device according to claim 1 or claim 2, wherein the ceramic substrate uses alumina or aluminum nitride for a substrate. The light source device according to claim 1 or claim 2, wherein the outer coating layer reflects ultraviolet rays. The light source device according to claim 1 or claim 2, wherein the outer coating layer absorbs ultraviolet rays. The light source device according to item 1 of the scope of patent application, includes a light-emitting section in which a plurality of solid-state light-emitting element rows are arranged in a direction crossing a predetermined line, and the plurality of solid-state light-emitting element rows has a plurality of The light-emitting element, wherein a plurality of the light-emitting elements are connected in series and are disposed on the predetermined line and emit ultraviolet rays; and a heat dissipation unit that causes a fluid to flow in a direction crossing the predetermined line to Heat emitted from the light-emitting elements of the two or more adjacent solid-state light-emitting element rows in the cross direction is dissipated. The light source device according to item 6 of the scope of patent application, wherein a plurality of temperature detection units are provided at intervals along the flow direction of the fluid. An ultraviolet irradiation device, comprising: the light source device according to item 1 of the scope of patent application; and an absorption-type polarizing element that polarizes the polarization axis of ultraviolet rays emitted from the light source device in parallel with a predetermined reference direction transmission. The ultraviolet irradiation device according to item 8 of the scope of patent application, wherein an optical member is provided between the light source device and the absorption-type polarizing element.