KR20160057673A

KR20160057673A - Liquid Cooling Apparatus for Heat Dissipation of high Power Light Emitting Diode

Info

Publication number: KR20160057673A
Application number: KR1020140158561A
Authority: KR
Inventors: 지재근
Original assignee: 지재근
Priority date: 2014-11-14
Filing date: 2014-11-14
Publication date: 2016-05-24

Abstract

At least one or more LEDs for generating light upon power application are mounted on an upper portion of a substrate, a circulation base is coupled to a lower portion of the substrate, the substrate and the circulation base are hermetically coupled by a sealing member, And a fixing member for fixedly coupling the circulation base.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a liquid cooling apparatus for heat dissipation of a high-

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a liquid cooling apparatus for dissipating heat of a high-power LED, and more particularly, to a liquid cooling apparatus for dissipating heat generated by an LED module light source using a coolant.

Light emitting diodes (LEDs), which consume less electricity, have been used for display devices such as various instrument panels since they do not have much light. In recent years, high power LEDs have been developed and used as lighting lamps. Such an LED lamp for illumination has a remarkably small power consumption and a long life span as compared with a conventional lamp such as a halogen lamp or a mercury lamp.

However, LED is basically semiconductor, so it is very vulnerable to heat. In particular, high power LEDs have caused many problems due to high heat generation. When the LED lamp is turned on, when the LED lamp is turned on, the LED is heated, and when the LED is heated, the lifetime of the LED is shortened. Due to the high heat generation characteristic, it is difficult to properly maintain the operating temperature and shorten the life time as well as the color distortion. Therefore, a heat dissipating device that effectively dissipates the heat generated during the operation of the LED is required.

Accordingly, in the case of a conventional high-power LED illumination lamp, an air-cooling type in which heat is dispersed to the surroundings by air as a cooling means, an LED illumination lamp having various types of cooling fins has been developed in order to effectively dissipate heat.

In the case of the LED illumination lamp, in order to sufficiently radiate heat, the cooling fin must be very large or have a large number of heat dissipation pins, which leads to a problem of a bulky and difficult to manufacture, and thus a manufacturing cost.

Korean Patent No. 0688979

In order to solve the problem of the air cooling type cooling means, liquid such as water or oil is directly contacted with the substrate by using the cooling means as a cooling means, and the heat generated in the LED is discharged to the outside It is a liquid cooling device for heat dissipation of high power LED.

At least one or more LEDs for generating light upon power application are mounted on an upper portion of a substrate, a circulation base is coupled to a lower portion of the substrate, the substrate and the circulation base are hermetically coupled by a sealing member, The circulation base is fixedly coupled by a fixing member.

The substrate is made of a metal PCB, and the circulation base has a cooling water circulation path formed therein, and one surface thereof is opened to communicate with the cooling water circulation path.

A heat dissipating member may further be provided on the lower surface of the substrate, and a supporting member for fixing the sealing member to the circulation base may be further provided.

In the liquid cooling device for dissipating heat of the high power LED according to the embodiment of the present invention, the coolant circulates directly in contact with the metal PCB, and further includes a heat dissipating member on the lower surface of the metal PCB, By reducing the resistance, it is possible to effectively dissipate the heat generated by the LED to the outside, thereby preventing the LED from being overheated.

1 is an exemplary view of a liquid cooling apparatus for heat dissipation of a high-power LED according to an embodiment of the present invention.
FIG. 2 is an exemplary view in which a supporting member and a heat dissipating member are coupled to a liquid cooling device for heat dissipation of a high-power LED according to an embodiment of the present invention.
3 is a view showing another embodiment of a liquid cooling apparatus for heat dissipation of a high-power LED according to an embodiment of the present invention.
4 is an exemplary view of a heat dissipating member of a liquid cooling device for heat dissipation of a high-power LED according to an embodiment of the present invention.

It will be understood by those skilled in the art that various modifications, substitutions and alterations can be made hereto without departing from the spirit and scope of the invention as defined by the appended claims. will be. Therefore, the embodiments disclosed in the present invention and the accompanying drawings are intended to illustrate and not to limit the technical idea of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings . The scope of protection of the present invention should be construed according to the following claims, and all technical ideas which are within the scope of the same should be interpreted as being included in the scope of the present invention.

FIG. 1 is a view illustrating a liquid cooling apparatus for dissipating heat of a high-power LED according to an exemplary embodiment of the present invention. FIG. 2 is a cross-sectional view of a liquid cooling apparatus for dissipating heat of a high- FIG. 3 is another embodiment of a liquid cooling device for heat dissipation of a high-power LED according to an embodiment of the present invention.

1 and 2, a liquid cooling apparatus 100 for heat dissipation of a high-power LED according to an embodiment of the present invention includes an LED 10, a substrate 20, a circulation base 30, a sealing member (not shown) 40 and a fixing member 60.

A heat dissipating member 32 may be further provided along the cooling water circulation path 32 of the circulation base 30 coupled to the lower portion of the substrate 20 and a sealing member 40 The member 50 may further be provided.

The LEDs 10 are manufactured in the form of a package and can be mounted on the substrate, and include a light emitting source for generating light upon power application, and a heat source for generating heat.

A method of mounting the LED 10 on the substrate 20 may be a SMT (surface mounting method) or a COB method in which an LED chip is directly coupled to the substrate 20.

The substrate 20 on which the LEDs 10 are mounted is composed of a metal PCB having excellent heat conduction and heat dissipation and is coupled to the circulation base 30. The cooling water is circulated along the cooling water circulation path 31 of the circulation base 30 and is in surface contact with the surface of the substrate 20 and is circulated, so that a metal material such as aluminum having good thermal conductivity can be used as the material.

The circulation base 30 has a cooling water circulation path 31 formed therein and one surface thereof is opened to communicate with the cooling water circulation path 31 and the substrate 20 is coupled in the opened direction. The circulation base 30 is a metal heat sink. However, in the case of high power LED illumination, since the heat sink is insufficient in heat radiation, the circulation base 30 of the present invention is formed with the cooling water circulation path 31 so that the cooling water can be circulated therein.

The cooling water circulation path 31 is disposed in parallel with the mounting surface of the heat generating LED 10 so as to increase the heat exchange efficiency with the LED 10. As the cooling water, oil, water, or the like can be used, and a sealing member 40 for waterproofing is hermetically coupled to both ends of the substrate 20 in the flow direction of the cooling water circulation path 31.

The lower portion of the substrate 20 may further include a heat dissipating member 32 to reduce heat resistance due to circulation of the cooling water.

The heat dissipating member 32 is made of a metal material such as aluminum having a good thermal conductivity and is capable of efficiently discharging heat generated from the LED 10 through the extended contact surface with the substrate 20.

Further, a supporting member 50 may be further provided on the substrate 20 to fix the sealing member 40 thereto. When the fixing member 60 is coupled to the sealing member 40, the sealing member 40 may be damaged. In order to prevent the sealing member 40 from being damaged, a support member 50 may be further provided on the substrate.

The sealing member 40 and the substrate 20 and the circulation base 30 are coupled by the fixing member 60. When the supporting member 50 is further provided, the supporting member 50 and the circulation base 30 are fixed Is joined by the member (60) to fix and support the substrate.

3 shows another embodiment of the present invention in which two rows of grooves (not shown) having a sealing member 40 coupled to the upper surface of the circulation base 30 are formed on both sides along the cooling water circulation path 31 And the substrate 20 on which the LED 10 is mounted is coupled to the upper portion of the sealing member 40. Further, the radiation member 32 may be further provided on the lower surface of the substrate.

The substrate 20, the sealing member 40, and the circulation base 30 are fixed by the fixing member 60. That is, the fixing member 60 is engaged with the substrate 20 and coupled with the circulation base 30 through the two sealing members 40.

4 shows a heat dissipating member 32 of the present invention in which a coupling plate 33 is coupled to the lower surface of the substrate 20 and at least one radiating fin 34 formed perpendicularly to the lower surface of the coupling plate 33 It is a combination.

4 (a) to 4 (c) are views showing a state in which the radiating fins 33 are formed perpendicularly to the coupling plate. The radiating fins 33 can be formed along the direction in which the cooling water flows and are arranged in a zigzag Lt; / RTI >

The center pin 35 may be vertically disposed on the central portion of the coupling plate 33 and may include a plurality of radiating fins protruding from both sides of the center pin 35.

The operation of the liquid cooling device for heat dissipation of the high-power LED according to the embodiment of the present invention will be described below.

The cooling water circulation path 31 is formed in parallel with the mounting arrangement of the LED 10 so that the cooling water is circulated as close to the LED 10 as possible to reduce the thermal resistance. Accordingly, when the cooling water is supplied from the pump (not shown) to the cooling water circulation path 31, the cooling water circulates along the cooling water circulation path 31. At this time, the heat is absorbed and circulated by the LED 10.

That is, the cooling water circulates along the cooling water circulation path 31 while being in surface contact with the substrate 20 and the heat dissipating member 32, so that the heat generated by the LED 10 can be quickly discharged to the outside.

Accordingly, it is possible to prevent the LED 10 from being overheated while maintaining the temperature at a constant temperature, thereby preventing damage to components and lifetime due to heat generation.

100: liquid cooling device
10: LED
20: substrate
30: circulation base
31: Cooling water circulation path
32:
33:
34: Radiating pin
35: center pin
40: sealing member
50: support member
60: Fixing member

Claims

At least one or more LEDs for generating light upon power application are mounted on an upper portion of a substrate, a circulation base is coupled to a lower portion of the substrate, the substrate and the circulation base are hermetically coupled by a sealing member, Wherein the circulation base is fixedly coupled by a fixing member.

The method according to claim 1,
Wherein the substrate is made of a metal PCB.

3. The method of claim 1,
Wherein the circulation base has a cooling water circulation path formed therein, and one surface of the high-power LED is opened to communicate with the cooling water circulation path.

The method according to claim 1,
Further comprising a supporting member for fixing the sealing member to the circulation base.

3. The method according to claim 1 or 2,
And a heat dissipating member provided on a lower surface of the substrate.

6. The method of claim 5,
Wherein the heat dissipating member is coupled to a lower surface of the substrate, and a plurality of heat dissipating fins (34) are vertically coupled to the coupling plate.