KR101333777B1 - Led lighting equipment - Google Patents

Led lighting equipment Download PDF

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KR101333777B1
KR101333777B1 KR1020120086356A KR20120086356A KR101333777B1 KR 101333777 B1 KR101333777 B1 KR 101333777B1 KR 1020120086356 A KR1020120086356 A KR 1020120086356A KR 20120086356 A KR20120086356 A KR 20120086356A KR 101333777 B1 KR101333777 B1 KR 101333777B1
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South Korea
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heat
led
heat dissipation
led module
led lighting
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KR1020120086356A
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Korean (ko)
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김화자
순 동 강
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주식회사 엘엠에이치코리아
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/104—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V27/00—Cable-stowing arrangements structurally associated with lighting devices, e.g. reels 
    • F21V27/02—Cable inlets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention relates to an LED illumination device, particularly, to an LED illumination device that has heat radiation blocks discharging the high temperature heat generated from an LED module, form a cooling convection flowing space between the heat radiation blocks to efficiently cool, and improves the lifetime and the quality of the products. The invention, in the LED illumination device, comprises an LED module comprising an LED bulb and a substrate and emitting light by supplying a power source; a protection cover comprising a lens part collecting emitted light energy and protecting the LED module, a wire arrangement line pipe integrating with a wing plate with a fixing hole and arranging a wire for supplying the power source; a heating unit with a cooling convection flowing space between the slice heat radiation that blocks a circuit protection installation space part for installing a circuit protector at one side and integrating with a protection circuit combination wing piece having a combination hole combining the protection cover on both sides in a body part having heat radiation pins and an insertion installation hole; and a heat pipe inserted into the insertion installation hole.

Description

엘이디 조명기기{LED lighting equipment}LED lighting equipment

본 발명은 엘이디 조명기기에 관한 것으로서 보다 상세하게는 엘이디모듈의 사용시 발생되는 고온의 열을 방출하는 방열블럭을 다수개 설치하되 방열블럭과 방열블럭 사이에 냉각대류유동공간을 형성시켜 효율적으로 냉각시켜 제품의 수명과 품질이 향상될 수 있도록 한 엘이디 조명기기에 관한 것이다.
The present invention relates to an LED lighting device, and more particularly, to install a plurality of heat dissipation blocks for dissipating high-temperature heat generated when the LED module is used to form a cooling convection flow space between the heat dissipation block and the heat dissipation block to efficiently cool The present invention relates to an LED lighting device that can improve product life and quality.

일반적으로 발광다이오드(Light Emitting Diode; LED)는 화합물 반도체에 전압을 가할 때 발광 현상이 일어나는 특성을 이용하여 개발되었으며, 종래의 광원에 비해 소형이고 수명이 길며 전기 에너지가 빛 에너지로 변환시키는 효율이 뛰어나다In general, a light emitting diode (LED) is developed by using a characteristic in which a light emitting phenomenon occurs when a voltage is applied to a compound semiconductor. The light emitting diode (LED) has a small size, a long lifetime, and an efficiency of converting electrical energy into light energy. outstanding

최근에 반도체 기술의 발전으로 고휘도의 백색 LED에 대한 상용화가 이루어짐에 따라, 이를 이용한 다양한 조명기기 등이 등장하고 있는 추세이다. 특히, 다수의 LED 소자를 직ㆍ병렬로 배열하는 형태의 고밀도로 집적시켜 단위 면적당 광도, 즉 휘도를 수천 cd/㎠ 이상으로 높여줌으로써, 충분히 먼 거리를 조명할 수 있는 조명용 LED 모듈에 대한 연구ㆍ개발이 활발하게 이루어지고 있다.Recently, due to the development of semiconductor technology and commercialization of high brightness white LEDs, various lighting devices using the same have been on the rise. Particularly, research on the lighting LED module that can illuminate a long distance by increasing the brightness per unit area, that is, the luminance, that is, the intensity per unit area by integrating a large number of LED elements in a series or in parallel. Development is active.

그러나, LED의 집적 밀도가 증가할수록 동일 면적에서 발생하는 열도 증가하게 되므로, LED 소자에서 발생하는 대량의 열로 인해 LED 소자에 손상이 발생할 수 있는 문제가 있다.However, as the integrated density of the LED increases, the heat generated in the same area also increases, so that a large amount of heat generated in the LED device may cause damage to the LED device.

이러한 문제를 해결하기 위하여 인쇄회로기판(printed circuit board; PCB)의 하부에 방열효과가 우수한 금속 재질의 방열판을 부착하여 방열성능을 높인 LED 조명기기가 제시되어 있다.In order to solve this problem, an LED lighting device having a high heat dissipation effect is provided by attaching a heat dissipation plate having excellent heat dissipation effect to a lower portion of a printed circuit board (PCB).

예를 들면, 하나의 PCB 기판에 다수 개의 LED 소자를 배치 조립하고, 하부에는 방열판을 부착하는 동시에 상부는 케이스로 마감한 형태의 LED 조명기기가 상용화되고 있다.For example, a plurality of LED devices are disposed and assembled on a single PCB substrate, a heat sink is attached to a lower portion, and an LED luminaire of a type in which a top is closed with a case is commercially available.

그러나, LED 소자로부터 하부의 방열체까지의 열전달은 그 중간에 위치한 열전도도가 낮은 플렉시블 PCB와 접착제에 의하여 방해를 받고, 또 하나의 방열체가 전체 LED 소자의 방열을 담당하기 때문에 열이 중심쪽으로 집중되는 등 LED 소자를 고밀도로 집적하여 발생하는 대량의 열을 모두 방열시키는 데에는 한계가 있으며, 결국 발광시 수반되는 열로 인해 LED 소자에 손상이 발생할 위험성이 높은 문제점이 있다.However, heat transfer from the LED element to the lower radiator is interrupted by a flexible PCB and adhesive with low thermal conductivity located in the middle, and heat is concentrated toward the center because another radiator is responsible for radiating the entire LED element. There is a limit to heat dissipation of a large amount of heat generated by integrating a high-density LED device, such as, there is a high risk of damage to the LED device due to the heat accompanying the light emission.

이렇게 다수의 LED 소자가 하나의 기판상에 집적되어 있고, 또 DC에서 구동되는 방식이기 때문에 손상된 하나 또는 몇 개의 LED 소자 때문에 전체 조명기기를 교체해야 하는 문제점이 있다.Since a plurality of LED elements are integrated on one substrate and driven in DC, there is a problem in that the entire lighting device needs to be replaced due to one or several damaged LED elements.

또한, 기존 LED 조명기기의 경우 다수의 LED 소자가 하나의 기판에 의존한 회로구성 형태를 갖기 때문에 형상을 구현하는데 제약이 있는 등 다양한 형상으로 제작하는데 한계가 있고, 형상 변경시 금형을 새로 제작해야 하는 등 경제적인 측면에서도 불리한 점이 있다.In addition, in the case of the existing LED lighting equipment, there are limitations in the production of various shapes such as there are limitations in implementing the shape since many LED devices have a circuit configuration form depending on a single board, and when the shape is changed, a new mold must be manufactured. There are also disadvantages in terms of economics.

이러한 문제점을 감안하여 대한민국 특허등록 제978208호의 조립형 LED 조명기기가 제안된바 있다. 상기한 종래 조립형 LED 조명기기는 여러 개의 LED 완제품을 가로 배열 및 세로 배열 중 선택되는 선형 배열 형태, 삼각형 배열, 사각형 배열, 오각형 배열 및 육각형 배열, 원형 배열 형태 또는 타원형 배열 형태 중 선택된 어느 하나의 배열 형태의 LED 장착부를 갖는 고정 형틀에 조립하여 사용한다.In view of these problems, an assembly type LED lighting device of Korean Patent Registration No. 978208 has been proposed. The conventional assembled LED lighting device is any one selected from a linear arrangement, a triangular arrangement, a square arrangement, a pentagonal arrangement and a hexagonal arrangement, a circular arrangement, or an oval arrangement in which a plurality of LED finished products are selected from a horizontal arrangement and a vertical arrangement. It is used by assembling in the fixed mold having the LED mounting part of the arrangement type.

이때 상기 LED 완제품은 첨부도면 도 1 및 도 2에 도시된 바와 같이 고정 형틀(11)에 삽입 설치되는 상기 LED 완제품(12)은 전원을 공급받기 위한 전선(13)을 갖는 LED 램프(14)와, 열 방출을 위하여 상기 LED 램프(14)의 저면부에 결합되며 금속 재질로 이루어진 방열부재(15)과, 빛 확산을 위하여 상기 LED 램프(14)의 상부에 결합되는 투명 커버(16)를 포함하되, 상기 방열부재(15)는 각각 금속 재질로서 LED 램프(14)의 저면부에 차례로 결합되는 베이스 방열판(15a)과 방열 블록(15b)으로 이루어지고, 상기 방열 블록(15b)의 바깥 둘레면에는 다수의 방열핀(17)이 형성되어 이루어진 구조이다.At this time, the LED finished product is the LED finished product 12 is inserted into the fixed mold 11, as shown in the accompanying drawings, Figure 1 and 2 and the LED lamp 14 having a wire 13 for receiving power and , A heat dissipation member 15 coupled to the bottom of the LED lamp 14 for heat dissipation, and a transparent cover 16 coupled to the top of the LED lamp 14 for light diffusion. However, each of the heat dissipation member 15 is formed of a base heat sink 15a and a heat dissipation block 15b, which are respectively coupled to the bottom of the LED lamp 14 as a metal material, and the outer circumferential surface of the heat dissipation block 15b. There is a structure in which a plurality of heat radiation fins 17 are formed.

상기한 선등록 대한민국 특허등록 제978208호의 조립형 LED 조명기기 또한 단일 방열블럭이 단일체로 형성되어 있어 냉각의 효율이 떨어져 제품의 수명과 품질이 저하되며, LED모듈과 방열블럭 사이에 별도의 방열판을 사용함으로 구조가 복잡하고 LED모듈에서 발생된 고온의 열을 방열판으로 이동시킨 후 다시 방열블럭으로 이동시킴으로서 냉각효율이 저하되는 문제점이 있다. 또한 LED모듈에 연결된 전원선들의 정리 공간이 존재하지 않아 잔은 숏트로 LED모듈이 파손되는 문제점이 있다.
The above-described registered LED lighting device of Korea Patent Registration No. 978208 also has a single heat dissipation block formed as a single unit, which reduces cooling efficiency and degrades the life and quality of the product. As a result, the structure is complicated and the cooling efficiency is lowered by moving the high temperature heat generated from the LED module to the heat sink and then to the heat radiation block again. In addition, there is a problem that the LED module is broken due to a short since no space for cleaning the power lines connected to the LED module exists.

대한민국 특허등록 제978208호Korea Patent Registration No. 978208 대한민국 특허등록 제925527호Republic of Korea Patent Registration No. 925527

본 발명은 상기한 종래 문제점을 감안하여 안출한 것으로서 본 발명의 목적은 The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is

첫째, 엘이디모듈의 사용시 발생되는 고온의 열을 방출하는 방열블럭을 다수개 설치하되 방열블럭과 방열블럭 사이에 냉각대류유동공간을 형성시켜 효율적으로 냉각시켜 제품의 수명과 품질이 향상될 수 있으며,First, install a plurality of heat dissipation blocks for dissipating high temperature heat generated when the LED module is used, but by forming a cooling convection flow space between the heat dissipation block and the heat dissipation block can be efficiently cooled to improve the life and quality of the product,

둘째, 다수의 방열블럭은 히트파이프에 의해 고정되어 방열블럭에 의해 열교환이 이루어지지만 방열블럭의 내측부 열이 히트파이프로 전달되어 열교환이 이루어져 냉각됨으로 방열블럭의 외측부와 내측부가 동시에 열교환이 이루어지도록 함과,Secondly, a plurality of heat dissipation blocks are fixed by heat pipes to perform heat exchange by the heat dissipation blocks, but heat is transferred to the heat pipes of the heat dissipation blocks so that the heat exchange takes place and the heat dissipation blocks are simultaneously cooled. and,

셋째, 엘이디모듈과 방열블럭 사이에 설치되는 방열판을 생략하여 구조를 간단히 구성하고, 엘이디모듈에서 발생된 고온의 열이 직접 방열블럭에 전달되도록 하여 냉각 효율이 증대되도록 함과, Third, the structure is simply omitted by omitting the heat sink installed between the LED module and the heat dissipation block, and the high temperature heat generated from the LED module is directly transmitted to the heat dissipation block to increase the cooling efficiency,

넷째, 엘이디모듈에 전원을 공급하는 전선을 정리하는 배선정리라인관이 구비된 보호커버와, 방열블럭에 전선을 클램핑하는 전선홀딩부를 형성시켜 전선의 정열이 용이하게 이루어지도록 한 엘이디 조명기기를 제공하는데 있다.
Fourth, to provide an LED lighting device to facilitate the alignment of the wires by forming a protective cover with a wiring arrangement line tube for arranging the electric wires for supplying power to the LED module, and a wire holding part for clamping the wires in the heat dissipation block. It is.

상기와 같은 문제점을 감안하여 안출된 본 발명의 목적은 엘이디 조명기기에 있어서, led전구와 기판으로 이루어져 전원의 공급에 의해 발광하는 엘이디모듈과; 상기 엘이디모듈을 보호하면서 발광된 빛에너지를 집광하는 렌즈부와 고정공이 형성된 날개판이 일체로 형성되며 전원을 공급하는 전선을 정리하는 배선정리라인관이 구비된 보호커버와; 다수개의 방열핀이 일정한 간격으로 구비된 몸체부에는 끼움설치공이 구비되며 양측단에는 보호커버와 결합되는 결합공이 구비된 보호회로결합날개편을 일체로 형성하고 일측으로 엘이디모듈의 기판을 보호하는 회로보호기를 설치하는 회로보호기설치공간부를 구비한 슬라이스방열블럭이 2개 이상 설치되어 이루어지며 슬라이스방열블럭과 슬라이스방열블럭 사이에는 냉각대류유동공간이 더 형성되어 이루어진 발열수단과; 상기 끼움설치공에 삽입 설치되는 히트파이프를 포함하여 구성된 것을 특징으로 하는 엘이디 조명기기에 의하여 달성된다.An object of the present invention devised in view of the above problems is an LED lighting device, comprising an LED module and a LED light emitting by the supply of power consisting of a substrate; A protective cover provided with a lens line for condensing the emitted light energy while protecting the LED module, and a wing plate having a fixed hole formed therein, and a wiring arrangement line tube for arranging electric wires for supplying power; The body portion provided with a plurality of heat radiation fins at regular intervals is provided with a fitting installation hole, and a circuit protector for integrally forming a protective circuit coupling wing piece having a coupling hole coupled to a protective cover at both ends and protecting the board of the LED module to one side. Two or more slice heat dissipation blocks having a circuit protector installation space for installing the heat dissipation means, wherein a cooling convection flow space is further formed between the slice heat dissipation block and the slice heat dissipation block; It is achieved by the LED lighting device, characterized in that it comprises a heat pipe inserted into the fitting hole.

상기 몸체부에는 열교환통공이 더 형성된 것을 특징으로 하는 엘이디 조명기기에 의하여 달성된다.The body portion is achieved by an LED lighting device, characterized in that the heat exchange hole is further formed.

상기 냉각대류유동공간 보다 슬라이스방열블럭을 관통한 히트파이프의 길이가 길게 돌출되게 설치된 것을 특징으로 하는 엘이디 조명기기에 의하여 달성된다.
It is achieved by an LED lighting device, characterized in that the length of the heat pipe passing through the slice heat-dissipating block is protruded longer than the cooling convection flow space.

이와 같은 본 발명은 엘이디모듈의 사용시 발생되는 고온의 열을 방출하는 방열블럭을 다수개 설치하되 방열블럭과 방열블럭 사이에 냉각대류유동공간을 형성시켜 효율적으로 냉각시켜 제품의 수명과 품질이 향상될 수 있으며, 또한 다수의 방열블럭은 히트파이프에 의해 고정되어 방열블럭에 의해 열교환이 이루어지지만 방열블럭의 내측부 열이 히트파이프로 전달되어 열교환이 이루어져 냉각됨으로 방열블럭의 외측부와 내측부가 동시에 열교환이 이루어지도록 함과, 상기 엘이디모듈과 방열블럭 사이에 설치되는 방열판을 생략하여 구조를 간단히 구성하고, 엘이디모듈에서 발생된 고온의 열이 직접 방열블럭에 전달되도록 하여 냉각 효율 증대 및 엘이디모듈에 전원을 공급하는 전선을 정리하는 배선정리라인관이 구비된 보호커버와, 방열블럭에 전선을 클램핑하는 전선홀딩부를 형성시켜 전선의 정열이 용이한 등의 효과가 있는 매우 유용한 발명이다.
The present invention is to install a plurality of heat dissipation blocks for dissipating high temperature heat generated when using the LED module to form a cooling convection flow space between the heat dissipation block and the heat dissipation block to efficiently cool the product life and quality will be improved In addition, a plurality of heat dissipation blocks are fixed by a heat pipe, and the heat exchange is performed by the heat dissipation block, but heat is transferred to the heat pipes of the heat dissipation block and the heat exchange is performed to cool the heat dissipation block. The structure is simplified by omitting the heat sink installed between the LED module and the heat dissipation block, and the high temperature heat generated from the LED module is directly transmitted to the heat dissipation block to increase cooling efficiency and supply power to the LED module. Protective cover with wiring line line for arranging wires It is a very useful invention that has the effect of easily aligning the wires by forming a wire holding portion for clamping the wires.

도 1a은 종래 엘이디 조명기기의 구조를 보여주는 분해 사시도.
도 1b는 종래 엘이디 조명기기의 구조를 보여주는 단면예시도.
도 2는 본 발명의 기술이 적용된 엘이디 조명기기의 구조를 보여주는 결합사시도.
도 3은 도 2는 본 발명의 기술이 적용된 엘이디 조명기기의 구조를 보여주는 단면예시도.
도 4는 본 발명의 기술적 요지인 슬라이스방열블럭의 구조를 보여주는 사시도.
도 5 내지 도 6은 본 발명의 다른 실시예를 보여주는 단면예시도.
도 7은 본 발명의 사용상태를 보여주는 예시도.
도 8은 본 발명의 또 다른 구조의 조명기기를 보여주는 정면도Figure 1a is an exploded perspective view showing the structure of a conventional LED lighting device.
Figure 1b is a cross-sectional view showing the structure of a conventional LED lighting device.
Figure 2 is a perspective view showing the structure of the LED lighting apparatus to which the technique of the present invention is applied.
Figure 3 is a cross-sectional view showing the structure of the LED lighting apparatus to which the technique of the present invention is applied.
Figure 4 is a perspective view showing the structure of the slice heat-dissipating block which is the technical subject of the present invention.
5 to 6 is a cross-sectional view showing another embodiment of the present invention.
7 is an exemplary view showing a use state of the present invention.
8 is a front view showing a lighting device of another structure of the present invention.

이하 본 발명의 바람직한 실시예를 첨부된 도면에 의거하여 상세히 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

첨부도면 도 2는 본 발명의 기술이 적용된 엘이디 조명기기의 구조를 보여주는 결합사시도이고 도 3은 도 2는 본 발명의 기술이 적용된 엘이디 조명기기의 구조를 보여주는 단면예시도로서 이에 따르면 본 발명의 엘이디 조명기기는 led전구(110)와 기판(120)으로 이루어져 전원의 공급에 의해 발광하는 엘이디모듈(100)을 보호하면서 발광된 빛에너지를 집광하는 렌즈부(210)와 고정공(230a)이 형성된 날개판(230)이 일체로 형성되며 전원을 공급하는 전선을 정리하는 배선정리라인홈(220)이 구비된 보호커버(200)가 빛이 발광되는 상부에 설치된다.2 is a perspective view showing a structure of the LED lighting apparatus to which the technology of the present invention is applied and FIG. 3 is a cross-sectional view showing the structure of the LED lighting apparatus to which the technology of the present invention is applied. The lighting device is composed of a led bulb 110 and the substrate 120 is formed with a lens unit 210 and a fixing hole 230a for condensing the emitted light energy while protecting the LED module 100 to emit light by the supply of power The wing plate 230 is integrally formed, and the protective cover 200 having the wire arrangement line groove 220 for arranging the electric wires for supplying power is installed at the upper part where light is emitted.

한편 엘이디모듈(100)을 기준으로 보호커버(200)가 설치된 타측면에는 엘이디모듈(100)에서 발생된 고온의 열을 방출하여 열교환시키는 방열수단(300)이 설치된다.On the other hand, the heat dissipation means 300 for dissipating heat by dissipating high temperature heat generated from the LED module 100 is installed on the other side of the LED module 100 on which the protective cover 200 is installed.

상기 방열수단(300)의 구조는 첨부도면 도 4에 도시된 바와 같이 다수개의 방열핀(330)이 일정한 간격으로 구비된 몸체부(320)에는 끼움설치공(320a)이 구비되며, 보호커버(200)와 결합되는 결합공(340a)이 구비된 보호회로결합날개편(340)을 일체로 형성하고 일측으로 회로보호기(500)를 설치하는 회로보호기설치공간부(350)를 구비한 슬라이스방열블럭(310)이 첨부도면 도 2 및 도 3에 도시된 바와 같이 2개 이상 설치되어 이루어지며, 상기 슬라이스방열블럭(310)과 슬라이스방열블럭(310) 사이에는 냉각대류유동공간(360)이 더 형성되어 이루어진 구조이다.The structure of the heat dissipation means 300 has a fitting installation hole 320a is provided in the body portion 320 provided with a plurality of heat dissipation fins 330 at regular intervals, as shown in FIG. 4, and a protective cover 200. Slice heat radiation block having a circuit protector mounting space unit 350 which integrally forms a protective circuit coupling blade piece 340 having a coupling hole 340a coupled thereto and installs a circuit protector 500 on one side ( 2 and 3 are provided as two or more as shown in the accompanying drawings, a cooling convection flow space 360 is further formed between the slice heat radiation block 310 and the slice heat radiation block 310 It is a structure.

한편 상기 끼움설치공(320a)에는 히트파이프(600)가 삽입 설치되며, 상기 몸체부(320)에는 열교환통공(320b)이 더 형성되며, 첨부도면 도 5에 도시된 바와 같이 상기 냉각대류유동공간(360) 보다 슬라이스방열블럭(310)을 관통한 히트파이프(600)의 끝단 길이가 길게 돌출되게 설치하여 사용할 수 있으며, 첨부도면 도 6에 도시된 바와 같이 상기 냉각대류유동공간(360) 보다 슬라이스방열블럭(310)을 관통하여 돌출된 히트파이프(600) 끝단에 슬라이스방열블럭(310)을 더 설치하여 사용할 수 있다.Meanwhile, a heat pipe 600 is inserted and installed in the fitting hole 320a, and a heat exchange hole 320b is further formed in the body 320, and the cooling convection flow space is shown in FIG. An end length of the heat pipe 600 penetrating through the slice heat-dissipating block 310 may be installed to protrude longer than that of 360, and as shown in FIG. 6, the slice is smaller than the cooling convection flow space 360. The slice heat dissipation block 310 may be further installed at the end of the heat pipe 600 protruding from the heat dissipation block 310.

이와 같은 본 발명의 사용은 첨부도면 도 7에 도시된 바와 같이 엘이디모듈(100)에 전원을 공급하면 상기 엘이디모듈(100)을 보호하면서 발광된 빛에너지를 집광하는 렌즈부(210)를 통해 빛은 발광되며, 이때 상기 엘이디모듈(100)에서는 고온의 열이 발생된다.The use of the present invention as shown in Figure 7 attached to the power supply to the LED module 100, the light through the lens unit 210 for condensing the emitted light energy while protecting the LED module 100 Is emitted, and at this time, the high temperature heat is generated in the LED module 100.

한편 날개판(230)에 형성된 고정공(230a)을 관통하는 체결수단에 의해 슬라이스방열블럭(310)과 연결되어 있는 방열수단(300)을 통해 열교환이 이루어진다. 이때 상기 슬라이스방열블럭(310)의 끼움설치공(320a)에 삽입 설치되는 히트파이프(600)에 고온의 열이 동시에 전달되어 열교환이 이루어져 고온의 열을 저온이 되도록 냉각시킨다.Meanwhile, heat exchange is performed through the heat dissipation means 300 connected to the slice heat dissipation block 310 by the fastening means penetrating the fixing hole 230a formed in the wing plate 230. At this time, high temperature heat is simultaneously transferred to the heat pipe 600 inserted into the fitting hole 320a of the slice heat dissipation block 310 to heat exchange to cool the high temperature heat to a low temperature.

본 발명의 기술적 요지인 방열수단의 방열방법은 엘이디모듈(100)과 직접 첩촉하고 있는 슬라이스방열블럭(310)에 고온의 열이 전달되며, 상기 슬라이스방열블럭(310)에 전달된 열 중 일부가 몸체부(320)에 일체로 형성되어 있는 방열핀(330)과 몸체부(320)에 구비된 열교환통공(320b)을 통해 대기중으로 방열되고 방열되지 아니한 열은 히트파이프(600)로 전달되며, 상기 히트파이프(600)로 전달된 열 중 일부가 대기중으로 방열되고 방열되지 아니한 열은 다시 슬라이스방열블럭(310)에 전달되되, 이때 상기 슬라이스방열블럭(310)과 슬라이스방열블럭(310) 사이에는 냉각대류유동공간(360)이 형성되어 있어 상기한 냉각대류유동공간(360)을 통해 대기중으로 열을 방열시킨다.In the heat dissipation method of the heat dissipation means which is the technical gist of the present invention, high temperature heat is transmitted to the slice heat dissipation block 310 directly contacting the LED module 100, and a part of heat transferred to the slice heat dissipation block 310 is transferred. The heat dissipated into the atmosphere through the heat dissipation fin 330 integrally formed in the body portion 320 and the heat exchange through hole 320b provided in the body portion 320 and the heat not radiated are transferred to the heat pipe 600. Some of the heat transferred to the heat pipe 600 is radiated to the atmosphere and heat that is not radiated is transferred to the slice heat dissipation block 310 again, wherein the slice heat dissipation block 310 and the slice heat dissipation block 310 are cooled. Convection flow space 360 is formed to dissipate heat into the atmosphere through the cooling convection flow space 360.

첨부도면 도 7에 도시된 바와 같이 본 발명에 있어서 방열수단(300)은 다수의 슬라이스방열블럭(310)과 냉각대류유동공간(360)으로 구성되되, 상기 냉각대류유동공간(360)은 슬라이스방열블럭(310)의 총합-1개의 숫자 즉, n-1개로 형성된다.7, the heat dissipation means 300 is composed of a plurality of slice heat dissipation block 310 and the cooling convection flow space 360, the cooling convection flow space 360 is slice heat dissipation The total number of blocks 310 is formed by one number, that is, n-1.

따라서 본 발명에서는 엘이디모듈(100)에 의해 발생된 고온의 열이 방열수단(300)과 히트파이프(600)를 통해 열교환이 이루어진다. Therefore, in the present invention, the heat of the high temperature generated by the LED module 100 is heat exchanged through the heat radiating means 300 and the heat pipe 600.

한편 첨부도면 도 5에 도시된 바와 같이 상기 냉각대류유동공간(360) 보다 슬라이스방열블럭(310)을 관통한 히트파이프(600)의 길이가 길게 돌출되게 설치하여 사용할 수 있으며, 첨부도면 도 6에 도시된 바와 같이 상기 냉각대류유동공간(360) 보다 슬라이스방열블럭(310)을 관통하여 돌출된 히트파이프(600) 끝단에 슬라이스방열블럭(310)을 더 설치하여 사용할 수 있다.Meanwhile, as shown in FIG. 5, the length of the heat pipe 600 penetrating through the slice heat-dissipating block 310 may be longer than that of the cooling convection flow space 360. As shown, the slice heat dissipation block 310 may be further installed and used at the end of the heat pipe 600 protruding through the slice heat dissipation block 310 rather than the cooling convection flow space 360.

이때 상기 본 발명의 구조에 있어서 첨부도면 도 7에 도시된 바와 같이 슬라이스방열블럭(310)과 슬라이스방열블럭(310) 사이에 일정한 간격의 냉각대류유동공간(360)을 형성한 구조를 갖는 엘이디 조명기기와 도 1b에 도시된 종래 엘이디 조명기기의 "A"와 "B" 지점의 온도를 비교해 보면 표1과 같이 본 발명의 엘이디 조명기기 구조가 냉각 효율이 향상됨을 알 수 있다.At this time, in the structure of the present invention, the LED illumination having a structure in which a cooling convection flow space 360 of a predetermined interval is formed between the slice heat radiation block 310 and the slice heat radiation block 310 as shown in FIG. Comparing the temperature between the device and the temperature of the "A" and "B" point of the conventional LED lighting device shown in Figure 1b it can be seen that the LED lighting device structure of the present invention as shown in Table 1, the cooling efficiency is improved.

또한 도 1b에 도시된 종래 엘이디 조명기기의 "A"와 "B" 지점의 온도와 도 5 및 도 6에 도시된 본 발명의 실시예의 "C", "D", "E", "F", "G", "H", "I" 지점의 온도를 비교해 보면 표1과 같이 본 발명의 엘이디 조명기기 구조가 냉각 효율이 향상됨을 알 수 있다.In addition, the temperature of the "A" and "B" point of the conventional LED lighting device shown in Figure 1b and "C", "D", "E", "F" of the embodiment of the present invention shown in Figures 5 and 6 Comparing the temperature of the points "G", "H", and "I", it can be seen that the LED lighting device structure of the present invention improves the cooling efficiency as shown in Table 1.

지점Point 종래 Conventional 본 발명(Ⅰ)Invention (I) 본 발명(Ⅱ)Invention (II) 본 발명(Ⅲ)Invention (III) A 지점온도Point A temperature 80℃~180℃80 ℃ ~ 180 ℃ B 지점온도B point temperature 70℃~170℃70 ℃ ~ 170 ℃ C 지점온도C point temperature 65℃~165℃65 ℃ ~ 165 ℃ D 지점온도D point temperature 55℃~155℃55 ℃ ~ 155 ℃ E 지점온도E point temperature 65℃~165℃65 ℃ ~ 165 ℃ F 지점온도F point temperature 55℃~155℃55 ℃ ~ 155 ℃ G 지점온도G point temperature 65℃~165℃65 ℃ ~ 165 ℃ H 지점온도H point temperature 55℃~155℃55 ℃ ~ 155 ℃ I 지점온도I point temperature 55℃~155℃55 ℃ ~ 155 ℃

상기 표1에서 알 수 있듯 본 발명은 엘이디모듈의 사용시 발생되는 고온의 열을 방출하는 방열블럭을 다수개 설치하되 방열블럭과 방열블럭 사이에 냉각대류유동공간을 형성시켜 효율적으로 냉각시켜 제품의 수명과 품질이 향상될 수 있으며, 또한 다수의 방열블럭은 히트파이프에 의해 고정되어 방열블럭에 의해 열교환이 이루어지지만 방열블럭의 내측부 열이 히트파이프로 전달되어 열교환이 이루어져 냉각됨으로 방열블럭의 외측부와 내측부가 동시에 열교환이 이루어지도록 함과, 상기 엘이디모듈과 방열블럭 사이에 설치되는 방열판을 생략하여 구조를 간단히 구성하고, 엘이디모듈에서 발생된 고온의 열이 직접 방열블럭에 전달되도록 하여 냉각 효율 증대 및 엘이디모듈에 전원을 공급하는 전선을 정리하는 배선정리라인관이 구비된 보호커버와, 방열블럭에 전선을 클램핑하는 전선홀딩부를 형성시켜 전선의 정열이 용이한 등의 효과가 있는 매우 유용한 발명이다.
첨부도면 도 8은 본 발명의 또 다른 구조의 조명기기를 보여주는 정면도로서 이에 따르면 led전구(110)와 기판(120)으로 이루어져 전원의 공급에 의해 발광하는 엘이디모듈(100)을 보호하면서 발광된 빛에너지를 집광하는 렌즈부(210)와 고정공(230a)이 형성된 날개판(230)이 일체로 형성되며 전원을 공급하는 전선을 정리하는 배선정리라인관(220)이 구비된 보호커버(200)와 다수개의 방열핀(330)이 일정한 간격으로 구비된 몸체부(320)에는 끼움설치공(320a)이 구비되며 양측단에는 보호커버(200)와 결합되는 결합공(340a)이 구비된 보호회로결합날개편(300)을 일체로 형성한 슬라이스방열블럭(310)에는 냉각대류유동홈(310-1)이 더 형성되어 이루어진 발열수단(300)과 상기 끼움설치공(320a)에 삽입 설치되는 히트파이프(600)를 포함하여 구성된 구조이다.
As can be seen in Table 1, the present invention is to install a plurality of heat dissipation blocks for dissipating high-temperature heat generated when using the LED module, but forms a cooling convection flow space between the heat dissipation block and the heat dissipation block to efficiently cool the life of the product In addition, the heat dissipation blocks may be fixed by a heat pipe, and the heat exchange is performed by the heat dissipation block, but the heat of the inner part of the heat dissipation block is transferred to the heat pipe and the heat exchange is performed to cool the heat. The heat exchange is carried out at the same time, the structure is omitted simply by omitting the heat sink installed between the LED module and the heat dissipation block, and the high temperature heat generated from the LED module is directly transmitted to the heat dissipation block to increase the cooling efficiency and LED Protector equipped with a wiring arrangement line tube for arranging the electric wires supplying power to the module And, to form the electric wire holding clamping the wires to the heat dissipation block is a very useful invention that is effective, such as ease of alignment of the wires.
8 is a front view showing a lighting device of another structure of the present invention, which consists of a led bulb 110 and a substrate 120, the light emitted while protecting the LED module 100 to emit light by the supply of power The protective cover 200 is provided with a lens arrangement 210 for condensing energy and a wing plate 230 having a fixed hole 230a are integrally formed and a wiring arrangement line tube 220 for arranging electric wires for supplying power. And a plurality of heat dissipation fins 330 are provided at a predetermined interval between the body part 320 and the fitting installation hole 320a, and both sides of the protective circuit coupling provided with a coupling hole 340a coupled with the protective cover 200. The heat radiation means 300 and the heat pipe inserted into the fitting hole 320a are formed in the slice heat-dissipating block 310 in which the blade pieces 300 are integrally formed with a cooling convection flow groove 310-1. The structure is configured to include 600.

100 : 엘이디모듈 110 : led전구
120 : 기판 200 : 보호커버
210 : 렌즈부 220 : 배선정리라인홈
230 : 날개판 230a : 고정공
300 : 방열수단 310 : 슬라이스방열블럭
320 : 몸체부 320a : 끼움설치공
320b : 열교환통공 330 : 방열핀
340 : 보호회로결합날개편 350 : 회로보호기설치공간부
360 : 냉각대류유동공간 600 : 히트파이프100: LED module 110: led bulb
120: substrate 200: protective cover
210: lens unit 220: wiring arrangement line groove
230: wing plate 230a: fixing hole
300: heat dissipation means 310: slice heat dissipation block
320: body portion 320a: fitting installation hole
320b: heat exchange through hole 330: heat dissipation fin
340: wing combination protection circuit 350: circuit protector installation space
360: cooling convection flow space 600: heat pipe

Claims (6)

엘이디 조명기기에 있어서,
led전구와 기판으로 이루어져 전원의 공급에 의해 발광하는 엘이디모듈과;
상기 엘이디모듈을 보호하면서 발광된 빛에너지를 집광하는 렌즈부와 고정공이 형성된 날개판이 일체로 형성되며 전원을 공급하는 전선을 정리하는 배선정리라인관이 구비된 보호커버와;
다수개의 방열핀이 일정한 간격으로 구비된 몸체부에는 끼움설치공이 구비되며 양측단에는 보호커버와 결합되는 결합공이 구비된 보호회로결합날개편을 일체로 형성하고 일측으로 회로보호기를 설치하는 회로보호기설치공간부를 구비한 슬라이스방열블럭이 2개 이상 설치되어 이루어지며 슬라이스방열블럭과 슬라이스방열블럭 사이에는 냉각대류유동공간이 더 형성되어 이루어진 발열수단과;
상기 끼움설치공에 삽입 설치되는 히트파이프를 포함하여 구성된 것을 특징으로 하는 엘이디 조명기기.
In the LED lighting device,
an LED module composed of a led bulb and a substrate to emit light by supplying power;
A protective cover provided with a lens line for condensing the emitted light energy while protecting the LED module, and a wing plate having a fixed hole formed therein, and a wiring arrangement line tube for arranging electric wires for supplying power;
The body portion provided with a plurality of heat radiation fins at regular intervals is provided with a fitting installation hole and a circuit protector installation space for integrally forming a protective circuit coupling wing piece having a coupling hole coupled to a protective cover at both ends and installing a circuit protector to one side. Two or more slice heat dissipation blocks provided with a heat dissipation means formed between the slice heat dissipation block and the slice heat dissipation block further with a cooling convection flow space;
LED lighting apparatus comprising a heat pipe inserted into the fitting installation hole.
제 1 항에 있어서,
상기 몸체부에는 열교환통공이 더 형성된 것을 특징으로 하는 엘이디 조명기기.The method of claim 1,
LED lighting device, characterized in that the heat exchange hole is further formed in the body portion. 제 1 항에 있어서,
상기 냉각대류유동공간 보다 슬라이스방열블럭을 관통한 히트파이프의 길이가 길게 돌출되게 설치된 것을 특징으로 하는 엘이디 조명기기.
The method of claim 1,
LED lighting device, characterized in that the length of the heat pipe passing through the slice heat-dissipating block protrudes longer than the cooling convection flow space.
삭제delete 엘이디 조명기기에 있어서,
led전구와 기판으로 이루어져 전원의 공급에 의해 발광하는 엘이디모듈과;
상기 엘이디모듈을 보호하면서 발광된 빛에너지를 집광하는 렌즈부와 고정공이 형성된 날개판이 일체로 형성되며 전원을 공급하는 전선을 정리하는 배선정리라인관이 구비된 보호커버와;
다수개의 방열핀이 일정한 간격으로 구비된 몸체부에는 끼움설치공이 구비되며 양측단에는 보호커버와 결합되는 결합공이 구비된 보호회로결합날개편을 일체로 형성한 슬라이스방열블럭과 슬라이스방열블럭 사이에는 냉각대류유동공간이 더 형성되어 이루어진 발열수단과;
상기 끼움설치공에 삽입 설치되는 히트파이프를 포함하여 구성된 것을 특징으로 하는 엘이디 조명기기.
In the LED lighting device,
an LED module composed of a led bulb and a substrate to emit light by supplying power;
A protective cover provided with a lens line for condensing the emitted light energy while protecting the LED module, and a wing plate having a fixed hole formed therein, and a wiring arrangement line tube for arranging electric wires for supplying power;
The body portion provided with a plurality of heat radiation fins at regular intervals is provided with a fitting installation hole and cooling convection between the slice heat dissipation block and the slice heat dissipation block integrally formed with a protective circuit coupling blade piece having a coupling hole coupled with a protective cover at both ends. A heat generating means formed by a flow space further;
LED lighting apparatus comprising a heat pipe inserted into the fitting installation hole.
엘이디 조명기기에 있어서,
led전구와 기판으로 이루어져 전원의 공급에 의해 발광하는 엘이디모듈과;
상기 엘이디모듈을 보호하면서 발광된 빛에너지를 집광하는 렌즈부와 고정공이 형성된 날개판이 일체로 형성되며 전원을 공급하는 전선을 정리하는 배선정리라인관이 구비된 보호커버와;
다수개의 방열핀이 일정한 간격으로 구비된 몸체부에는 끼움설치공이 구비되며 양측단에는 보호커버와 결합되는 결합공이 구비된 보호회로결합날개편을 일체로 형성한 슬라이스방열블럭에는 냉각대류유동홈이 더 형성되어 이루어진 발열수단과;
상기 끼움설치공에 삽입 설치되는 히트파이프를 포함하여 구성된 것을 특징으로 하는 엘이디 조명기기.
In the LED lighting device,
an LED module composed of a led bulb and a substrate to emit light by supplying power;
A protective cover provided with a lens line for condensing the emitted light energy while protecting the LED module, and a wing plate having a fixed hole formed therein, and a wiring arrangement line tube for arranging electric wires for supplying power;
The body portion provided with a plurality of heat radiation fins at regular intervals is provided with a fitting installation hole, and a cooling convection flow groove is further formed in the slice heat dissipation block integrally formed with a protective circuit coupling blade piece having a coupling hole coupled to a protective cover at both ends. Heating means made up;
LED lighting apparatus comprising a heat pipe inserted into the fitting installation hole.
KR1020120086356A 2012-08-07 2012-08-07 Led lighting equipment KR101333777B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102411344B1 (en) * 2022-04-05 2022-06-22 주식회사 누리온 Flood light apparatus with radianting heat performace

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Publication number Priority date Publication date Assignee Title
US20080007954A1 (en) * 2006-07-05 2008-01-10 Jia-Hao Li Heat-Dissipating Structure For LED Lamp
KR20100036463A (en) * 2008-09-30 2010-04-08 서진산 Led lighting device
KR20100054507A (en) * 2008-11-14 2010-05-25 삼성엘이디 주식회사 Led lamp with heat dissipation device
KR20100106729A (en) * 2009-03-24 2010-10-04 주식회사 엠티티 Cooling apparutus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080007954A1 (en) * 2006-07-05 2008-01-10 Jia-Hao Li Heat-Dissipating Structure For LED Lamp
KR20100036463A (en) * 2008-09-30 2010-04-08 서진산 Led lighting device
KR20100054507A (en) * 2008-11-14 2010-05-25 삼성엘이디 주식회사 Led lamp with heat dissipation device
KR20100106729A (en) * 2009-03-24 2010-10-04 주식회사 엠티티 Cooling apparutus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102411344B1 (en) * 2022-04-05 2022-06-22 주식회사 누리온 Flood light apparatus with radianting heat performace

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