TW201903322A - Irradiation unit and irradiation apparatus - Google Patents

Abstract

The present invention enhances peak illuminance and enables space saving. An irradiation unit (30) that applies light to a predetermined irradiation position (T) is provided with: a pair of mounting substrates (52) which has light emitting parts (60) including ultraviolet LEDs, respectively and which is disposed such that the light emitting parts (60) oppose each other; and a pair of first reflection surfaces (55) and a pair of second reflection surfaces (57) which are disposed at such opposing positions that the paired first reflection surfaces (55) oppose the light emitting parts (60) of the mounting substrates (52), respectively, and the paired second reflection surfaces (57) oppose the light emitting parts (60) of the mounting substrates (52), respectively, and which perform light distribution control of light of the light emitting parts (60) positioned at the opposing positions. The second reflection surfaces (57) are located closer to the predetermined irradiation position (T) than the first reflection surfaces (55) are, and are each spaced from the light emitting part (60) at its opposing position, with respect to the first reflection surfaces (55), so as to be disposed on the other light emitting part (60) side. Each second reflection surface (57) is disposed with a space (Q) provided between the second reflection surface (57) and a corresponding one of the first reflection surfaces (55). Light, which enters each second reflection surface (57) from the light emitting part (60) at its opposing position, enters the second reflection surface (57) through the space (Q).

Description

 Irradiation unit and illumination device  

The present invention relates to an illumination unit and an illumination device.

There is known an irradiation apparatus including a plurality of light source units each having a plurality of LEDs arranged in a row and reflecting members that reflect light of the LEDs, and radiating light, each of the light source units being tied to The alignment is performed in a direction orthogonal to the axial direction in which the linear light is extended, and the linear light is superposed on each other to be irradiated onto the object to be irradiated (see, for example, Patent Document 1).

Further, there is also known an irradiation apparatus including a plurality of LEDs arranged in a row, a reflection member that reflects light of the LEDs toward a predetermined focus, and a direct light component of the LEDs are condensed on the reflection A rod-shaped lens having a predetermined focus of the member is irradiated with the linear light collected by the predetermined focus to the object to be irradiated (for example, refer to Patent Document 2).

These irradiation devices are widely used in various devices such as printing devices or film manufacturing devices.

 [Previous Technical Literature]    [Patent Literature]  

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2014-172023

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2013-48079

In other words, depending on the device configuration in which the printing device, the film manufacturing device, and the like are incorporated, there is a case where the assembly space of the irradiation device is narrow. In the illuminating device of Patent Document 1, the width dimension in the direction orthogonal to the axial direction of the linear light is a size that is not commensurate with the grouping space, and it is difficult to store the irradiation device in the device to be incorporated. Group into space.

Further, in the irradiation apparatus of Patent Document 2, it is difficult to increase the number of arrays of LEDs, and it is difficult to increase the peak illuminance as compared with Patent Document 1. Further, in the configuration in which the arrangement density of the LEDs is increased and the peak illuminance is increased, it is necessary to increase the cooling performance of the LEDs, thereby increasing the size of the irradiation device.

An object of the present invention is to provide an irradiation unit and an irradiation apparatus capable of improving peak illuminance and achieving space saving.

This specification contains all the contents of Japanese Patent Application No. 2017-063474, filed on March 28, 2017.

The present invention provides an irradiation unit that irradiates light to a predetermined irradiation position, and is characterized in that it includes a pair of mounting substrates each having a light-emitting portion including a light-emitting element, and the light-emitting portions of the respective light-emitting portions are arranged to face each other And a pair of first reflecting surface and second reflecting surface, wherein the light is disposed at an opposite position of each of the light emitting portions of the mounting substrate, and performs light distribution control on the light of the light emitting portion at the opposite position; Each of the two reflecting surfaces is located on the side closer to the predetermined irradiation position than the first reflecting surface, and the light emitting portion from the opposite position is on the side of the light emitting portion on the other side and the first reflection The surface is spaced apart from each other, and is disposed in a space between the first reflecting surface and the first reflecting surface. The light incident from the light-emitting portion to the second reflecting surface at the opposite position passes through the space and enters the second portion. Reflective surface.

According to another aspect of the invention, in the irradiation unit, the pair of the second reflecting surfaces are spaced apart from each other by a distance between the pair of mounting substrates.

The present invention is characterized in that in the irradiation unit, the pair of mounting substrates are arranged in parallel with each other.

According to another aspect of the invention, in the illumination unit, all of the light having a predetermined radiation angle of the light-emitting portion is incident on any one of the first reflection surface and the second reflection surface.

In the above-described irradiation unit, a plurality of the light-emitting elements are arranged in a row in the light-emitting portion, and light is linearly irradiated toward the predetermined irradiation position.

In the above-described irradiation unit, the first reflecting surface and the second reflecting surface converge the light of the light-emitting portion at the opposite position on the elliptical reflecting surface of the predetermined irradiation position.

In the above-described irradiation unit, the first reflecting surface is an elliptical reflecting surface that condenses the light-emitting portion at a facing position to the predetermined irradiation position, and the second reflecting surface is flat or 1 The reflecting surface is a different curved surface.

The present invention is characterized in that the illumination unit includes a light-emitting module including: the mounting substrate; and a wiring pattern, wherein the plurality of light-emitting elements are arranged in a row on the mounting surface of the mounting substrate The flat plate is superposed on the mounting surface of the mounting substrate, and has an exit opening surrounded by a plurality of the light-emitting elements arranged on the mounting substrate; the plurality of light-emitting elements are arranged for each predetermined number Electrically connected in parallel, the wiring pattern includes a series connection wiring portion electrically connecting the light-emitting element groups of the light-emitting elements electrically connected in parallel to each other, and the series connection wiring portion is adjacent to the two adjacent ones The light-emitting element group extends and includes: a first bonding portion to which each of the light-emitting elements of the light-emitting element group is joined; and a second bonding portion that is bonded to the other of the light-emitting element groups by a wire Each of the light-emitting elements; the connection portion of the wires of the light-emitting elements is inverted for each of the light-emitting element groups, and Each of the series connection wiring portions is disposed at a position inverted for each of the two adjacent light emitting element groups.

According to another aspect of the invention, in the illumination unit, each of the light-emitting element groups includes a diode element that prevents an overvoltage from being applied to each of the light-emitting elements of the light-emitting element group, and a recess is formed in the series connection wiring portion. The above-described diode element is disposed in the recess.

According to the invention, in the above-described irradiation unit, the mounting substrate is provided with a positioning portion that is engaged with the flat plate and positioned.

The present invention is characterized in that the irradiation unit includes a cover member that blocks light transmittance of the emission opening.

According to the invention, in the irradiation unit, the emission opening of the flat plate is provided with a holding member that holds the cover member with an elastic force.

According to another aspect of the invention, in the irradiation unit, a reflection surface for causing light of the light-emitting element to be parallelized is provided on an inner circumferential surface of the emission opening of the flat plate.

According to the invention, in the above-described irradiation unit, the cover member is provided with a lens portion that controls transmitted light.

The present invention provides an irradiation apparatus comprising: the plurality of irradiation units according to any one of the above; and a cooling means for cooling each of the irradiation units; and each of the irradiation units is connected and arranged The cooling means performs air cooling by blowing cooling air to each of the irradiation units, or cooling the inside of each of the irradiation units.

According to the present invention, in the above-described irradiation device, the cooling means includes a pipe body extending through each of the irradiation units and introducing an outside air, and the pipe body is provided for each of the irradiation units A blowing hole for blowing the above outside air is blown.

According to the present invention, in the above-described irradiation device, each of the irradiation units includes a base body on which the mounting substrate is mounted, and the base system includes an integrally molded product in which a cooling fin of the cooling air is blown.

According to a still further aspect of the invention, in the illumination device, the heat sink is disposed in parallel to a direction in which the cooling air is blown.

According to the present invention, peak illuminance can be improved, and space saving can be achieved.

1‧‧‧UV irradiation device (irradiation device)

2‧‧‧ frame

2A‧‧‧ top surface

2B, 2C‧‧‧ side

2D, 10D, 522B‧‧‧ bottom

4‧‧‧Power supply agency

6‧‧‧Inhalation fan

8‧‧‧Exhaust fan

10‧‧‧Shell body

12‧‧‧ top panel

14‧‧‧ bottom panel

15‧‧‧Fan mounting hole

16‧‧‧Installation opening

17‧‧‧Light through hole

18‧‧‧Installation box

20‧‧‧Power cable

22, 530‧‧‧ exit opening

24‧‧‧ Covering glass

30, 130, 230, 330‧‧‧ illumination unit

32‧‧‧Installation components

34B, 34C‧‧‧ side panels

36‧‧‧ pillar (pipe)

36A‧‧‧ opposite

38‧‧‧Import

39‧‧‧ ventilation space

40‧‧‧Blow out the hole

42, 242‧‧ ‧ heat sink

42A, 55A, 155A‧‧‧ lower end

42B‧‧‧ board

42C, 57A, 157A‧‧‧ upper end

44, 54‧‧‧1st reflector

50, 250, 350‧‧‧ base body

52, 620‧‧‧ Mounting substrate

55, 155‧‧‧1st reflecting surface

56‧‧‧Substrate mounting surface

57, 157‧‧‧2nd reflecting surface

58‧‧‧Installation surface

60‧‧‧Lighting Department

62‧‧‧Installation board

64‧‧‧Terminal

80,680, 780‧‧‧Lighting module

243‧‧ ‧ Heat sink unit

351‧‧‧ separable parts

370‧‧‧ Cooling tube

502‧‧‧Lighting Department

504A‧‧‧ both ends

504B, 522C‧‧‧ edge

506‧‧‧ screw holes

508‧‧‧Wiring connection

512‧‧‧Wiring

522‧‧‧LED chip (lighting element)

522A‧‧‧Upper surface

522A1‧‧‧ Wafer Lighting Department

523‧‧‧Zina diode (diode element)

524‧‧‧ tablet

526‧‧ ‧covering components

529‧‧‧Wiring pattern

530A‧‧‧

531‧‧‧1st connection wiring department

532‧‧‧2nd connection wiring department

533‧‧‧Series connection wiring department

534‧‧‧Fixed material space

535‧‧‧ wafer joint (first joint)

536‧‧‧Wire joint (2nd joint)

537‧‧‧Wire

537A‧‧‧Wire connection

538‧‧‧Extension

539‧‧‧ recess

540‧‧‧ Protrusion

542‧‧‧ hole department (positioning department)

544‧‧‧reflecting surface

550‧‧‧ Keeping components

555‧‧‧Lens Department

A‧‧‧ Length direction

B‧‧‧Blowing direction

E1‧‧‧ axis

E2‧‧‧ Straight line

G‧‧‧LED group

H‧‧‧Light

Ia, Ib‧‧‧ UV

K‧‧‧ unit optical axis

L‧‧‧ separation distance

Ln‧‧‧ line

P‧‧‧Light axis

Q‧‧‧ Space

R‧‧‧defined width

S‧‧‧ distance

T‧‧‧established illumination position

W‧‧‧Printing surface

F1‧‧‧1st focus

F2‧‧‧2nd focus

11‧‧‧1st range

22‧‧‧2nd range

Θ‧‧‧radiation angle

Δ‧‧‧ gap

Fig. 1 is a side view showing the configuration of an ultraviolet irradiation device according to an embodiment of the present invention.

Fig. 2 is an exploded perspective view of the ultraviolet irradiation device.

Fig. 3 is a view showing the internal structure of the ultraviolet irradiation device.

Fig. 4 is a perspective view showing the configuration of an irradiation unit.

Fig. 5 is a schematic view of the irradiation unit viewed from the fan mounting direction of the frame.

Fig. 6 is an explanatory diagram of light distribution control of the irradiation unit.

7 is a perspective view of a light-emitting module, (A) is a perspective view of the front side, and (B) is a perspective view of the back side.

Fig. 8 is a view showing the configuration of a light-emitting module, wherein (A) is a plan view, (B) is a front view, (C) is a bottom view, and (D) is a side view.

Figure 9 is a cross-sectional view taken along line IX-IX of Figure 8(A).

Figure 10 is an exploded perspective view of the light emitting module.

Fig. 11 is a view schematically showing a cross-sectional configuration of a light-emitting module.

Fig. 12 is a view schematically showing an electrical configuration of a light-emitting module.

Fig. 13 is a view showing a wiring pattern of a light-emitting module.

Figure 14 is an enlarged view of the X portion of Figure 13.

Fig. 15 is a view showing the configuration of an irradiation unit according to a first modification of the present invention.

Fig. 16 is a view showing the configuration of an irradiation unit according to a second modification of the present invention.

Fig. 17 is a view showing the configuration of an irradiation unit according to a third modification of the present invention.

Fig. 18 is a view showing the configuration of a light-emitting module according to a fourth modification of the present invention.

Fig. 19 is a cross-sectional view showing the configuration of a light-emitting module according to a fifth modification of the present invention.

Fig. 20 is a view showing the configuration of a mounting surface of a mounting board according to a sixth modification of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Fig. 1 is a side view showing the configuration of an ultraviolet irradiation device 1 of the present embodiment.

The ultraviolet irradiation device 1 is incorporated as an inter-deck UV drying device into an assembly space provided in a lithographic printing apparatus using ultraviolet curable ink, and is applied to a printing surface of the printed matter by ultraviolet irradiation. The UV-curable ink of W (Fig. 5) is hardened.

As shown in FIG. 1, the ultraviolet irradiation device 1 of the present embodiment includes a housing 2, a power supply mechanism 4, an intake fan 6, and an exhaust fan 8.

The casing 2 is a rectangular parallelepiped casing extending in the width direction of the printed matter (direction perpendicular to the conveying direction), and is disposed in the lithographic printing apparatus such that the bottom surface 2D and the printed matter face each other. The power supply mechanism 4 is a mechanism that supplies external power to the casing 2 and is provided on the top surface 2A of the casing 2. The intake fan 6 and the exhaust fan 8 are air blowing means for circulating cooling air to the casing 2, and the intake fan 6 is provided on the side surface 2B on one side of the casing 2, and the exhaust side is provided on the other side 2C. Fan 8. By the operation of the intake fan 6 and the exhaust fan 8, the cooling air is blown in the longitudinal direction A of the casing 2, and the inside of the casing 2 is air-cooled.

2 is an exploded perspective view of the ultraviolet irradiation device 1.

The casing 2 includes a casing body 10, a top panel 12, and a bottom panel 14.

The casing body 10 is a rectangular parallelepiped casing having a top surface side, and fan mounting holes 15 are formed in the side faces 2C and 2B on both sides, and the intake fan 6 and the exhaust fan 8 are attached to the respective fan mounting holes 15.

The top panel 12 is a member that closes the top surface side of the casing body 10, and the top panel 12 is formed with a mounting opening 16 in which the power supply mechanism 4 is mounted. The power supply mechanism 4 includes a mounting box 18 that is attached to the mounting opening 16 and a power supply cable 20 that is connected to the mounting box 18 to transmit external power.

The bottom panel 14 is a member that is attached to the bottom surface 10D of the casing body 10. An exit opening 22 is formed in the bottom panel 14 at a position corresponding to the optical through hole 17 opened to the bottom surface 10D of the casing body 10. The light through hole 17 and the exit opening 22 are formed in a rectangular shape elongated in the longitudinal direction A of the casing 2, and the linear ultraviolet rays extending in the longitudinal direction A (FIG. 1) pass through the optical through hole 17 and the exit opening 22 And out. Between the casing body 10 and the bottom panel 14, a cover glass 24 for closing the through-hole 17 and the quartz opening of the exit opening 22 is provided.

Fig. 3 is a view showing the internal structure of the ultraviolet irradiation device 1.

As shown in FIGS. 2 and 3 , a plurality of (three in the illustrated example) irradiation units 30 and attachment members 32 to which the irradiation units 30 are attached are housed in the housing 2 .

The mounting member 32 is a member that holds each of the irradiation units 30 in the connected state in the longitudinal direction A of the casing 2. Specifically, the attachment member 32 includes a pair of side plates 34B and 34C which are disposed opposite to the side faces 2B and 2C of the frame body 2, a pair of stays 36 and 36, and the like between the side plates 34B and 34C. And extending the mounting plate 62; the irradiation unit 30 is fixed to the mounting plate 62.

The mounting member 32 of the present embodiment includes the above-described pillars 36 and 36 as cooling means for introducing cooling air to each of the irradiation units 30 and performing air cooling.

Specifically, the pillars 36 and 36 are disposed on the side of the bottom surface of the irradiation unit 30, and the hollow tubular body extending over each of the irradiation units 30 is provided with a side panel 34B to which the pillars 36 and 36 are connected. The outside air introduced into the intake fan 36 is introduced into the introduction port 38 inside the pillars 36 and 36. Further, in the pillars 36 and 36, a plurality of blowing holes 40 are formed in the opposing surface 36A of the irradiation unit 30, and the cooling air introduced from the inlet port 38 is directed from the blowing hole 40 toward the opposing surface 36A. The irradiation unit 30 is blown, and each of the irradiation units 30 is air-cooled by cooling air.

On the other hand, each of the irradiation units 30 is provided with a plurality of fins 42 in a rectangular plate shape disposed at the position of each of the blowing holes 40, and the cooling fins blown from the respective blowing holes 40 are blown to the respective fins 42. wind. Thereby, each of the irradiation units 30 is efficiently cooled by the cooling wind independent of each other.

Further, in the present embodiment, the plate surface 42B of each of the fins 42 is provided in parallel with the cooling air blowing direction B (the direction from the bottom surface 2D of the casing 2 toward the top surface 2A), and the blowing is suppressed. The cooling air blown by the holes 40 is mixed with each other until passing through the fins 42. Thereby, the thermal independence of the cooling wind for each of the irradiation units 30 is improved.

As shown in FIG. 3, the inside of the casing 2 is such that the side of the intake fan 6 is partitioned by the side plates 34B, and substantially all of the outside gas taken in by the intake fan 6 is introduced into the columns 36, 36. On the other hand, the end portions of the side of the exhaust fan 8 of the pillars 36 and 36 are closed by the side plate 34C, and the cooling air system introduced from the introduction port 38 is all blown out from the blowing hole 40 for air cooling of the irradiation unit 30. .

Further, the balance between the number of revolutions (intake capacity and exhaust capacity) of the intake fan 6 and the exhaust fan 8 is adjusted so that the air volume from each of the blow holes 40 of the stays 36 and 36 is substantially uniform.

Thereby, each of the irradiation units 30 uses the cooling air independent of each other, and the air is cooled by substantially equal air volume.

As shown in FIG. 3, inside the casing 2, on the side of the top surface 2A, a ventilation space 39 extending in the longitudinal direction A at a substantially central portion and reaching the exhaust fan 8 is provided. The cooling air blown out from the respective blowing holes 40 in the blowing direction B passes through the respective fins 42 and reaches the ventilating space 39, flows through the ventilating space 39, and is quickly discharged to the outside from the exhaust fan 8.

Next, the configuration of the irradiation unit 30 will be described in detail.

Fig. 4 is a perspective view showing the configuration of the irradiation unit 30, and Fig. 5 is a view showing the irradiation unit 30 viewed from the fan mounting direction of the casing 2.

As shown in FIGS. 4 and 5, the irradiation unit 30 includes a pair of base bodies 50, a pair of light-emitting modules 80 having a light-emitting portion 60 and a mounting substrate 52, and a first reflector 54 formed with The first reflecting surface 55 is opposed to the light emitting portion 60; the members are arranged in line symmetry on the unit optical axis K which is the optical axis of the irradiation unit 30. Further, the irradiation unit 30 is provided on each of the pair of base bodies 50, and is provided with a second reflection surface 57 that is opposite to the light-emitting portion 60. Further, the ultraviolet light of each of the light-emitting portions 60 is controlled by the light distribution of the first reflecting surface 55 and the second reflecting surface 57 at the opposite positions, and is directed to the predetermined irradiation position T above the unit optical axis K so as to be perpendicular to the unit. The optical axis K extends in a line shape and is irradiated.

In the ultraviolet irradiation apparatus 1 of the present embodiment, each of the plurality of irradiation units 30 is attached to the mounting member 32 and connected, and the irradiation light of each of the irradiation units 30 is linearly connected to the printing surface W. The linear ultraviolet rays of the required length (in the present embodiment, the length across which the printing surface W is traversed) are irradiated onto the printing surface W.

When each part of the irradiation unit 30 is described in detail, each of the pair of base bodies 50 is provided with a substrate mounting surface 56 as a mounting portion of the mounting substrate 52 of the light-emitting module 80 as shown in FIG. 5, as shown in FIG. The second reflecting surface 57 as the reflecting portion and the plurality of fins 42 as the heat radiating portion are shown.

The board mounting surface 56 is a flat portion parallel to the optical axis K and has a substantially rectangular shape extending in the longitudinal direction A of the housing 2, and the mounting board 52 is attached substantially in parallel with the board mounting surface 56.

The mounting substrate 52 is a rectangular substrate extending long, and as shown in FIG. 4, a light emitting portion 60 is provided on the mounting surface 58 thereof. The light-emitting portion 60 is an LED wafer 522 (Fig. 10) having a plurality of ultraviolet LEDs arranged in a row along the direction in which the mounting substrate 52 extends, and ultraviolet rays are linearly emitted by the light emission of the LED chips 522. As shown in FIG. 5, the optical axis P of the light-emitting portion, which is the optical axis of the light-emitting portion 60, is substantially perpendicular to the mounting surface 58. The pair of mounting substrates 52 are such that the light-emitting portions 60 are opposed to each other via the unit optical axis K, and further, the mounting surfaces 58 are arranged in parallel with each other, and the optical axes P of the respective light-emitting portions of the mounting substrate 52 are perpendicular to the unit optical axis K. And they are located on the same axis E1.

The second reflecting surface 57 is a reflecting surface that extends in the extending direction of the light emitting portion 60 (the longitudinal direction A of the housing 2), and is disposed closer to the predetermined irradiation position T than the light emitting portion 60 and the first reflecting surface 55 of the mounting substrate 52. At the position, the light distribution of the ultraviolet light emitted from the light-emitting portion 60 at the opposite position is controlled.

The heat sink 42 is provided on the back surface of the substrate mounting surface 56 throughout the longitudinal direction A, and dissipates heat from the mounting substrate 52 to the substrate mounting surface 56. Further, each of the fins 42 has a substantially rectangular shape in which the lower end portion 42A extends to the back surface of the second reflecting surface 57, and also dissipates heat applied to the second reflecting surface 57 by ultraviolet irradiation.

In the present embodiment, the base body 50 is formed of a highly thermally conductive material such as aluminum, and has one of the substrate mounting surface 56, the second reflecting surface 57, and the plurality of fins 42. Thereby, the thermal resistance between the substrate mounting surface 56 and the second reflecting surface 57 and the heat sink 42 can be suppressed as compared with the case where the heat sink 42 is formed by using a different member, for example, so that high heat dissipation performance can be obtained.

In the irradiation unit 30 of the present embodiment, the upper end portion 42C of each of the fins 42 protrudes from the substrate mounting surface 56 toward the side of the top surface 2A of the frame 2. The ventilation space 39 inside the casing 2 is formed between the upper end portions 42C of the fins 42 of each of the pair of base bodies 50.

As shown in FIG. 4, the first reflector 54 is provided between the pair of mounting substrates 52, extends in the longitudinal direction A of the casing 2, and is convexly attached to the side of the predetermined irradiation position T. Board 62.

The mounting plate 62 is disposed in the ventilation space 39 between the pair of base bodies 50, and is a rectangular plate extending in the longitudinal direction A of the frame 2, as shown in FIG. 2 above, supported by the mounting member 32. Side plates 34B, 34C. Further, the mounting plate 62 is provided on a surface opposite to the surface on which the first reflector 54 is mounted, and a terminal block 64 is provided for each of the irradiation units 30, and the power supply cable 20 is electrically connected to each terminal block 64. Furthermore, the mounting plate 62 can also be held by the pair of base bodies 50 instead of being held by the mounting member 32.

Further, as described above, in the first reflector 54, the pair of first reflecting surfaces 55 are provided back to back. Each of the first reflecting surfaces 55 is a reflecting surface that extends in the extending direction (the longitudinal direction A) of the light-emitting portion 60, and performs light distribution control on the ultraviolet light emitted from the light-emitting portion 60 at the opposite position.

FIG. 6 is an explanatory diagram of light distribution control of the irradiation unit 30.

As shown in the figure, the light-emitting portion 60 of the light-emitting module 80 has a predetermined radiation angle θ centered on the optical axis P of the light-emitting portion, and in the irradiation unit 30, substantially all of the ultraviolet rays are within the range of the radiation angle θ. The first reflecting surface 55 and the second reflecting surface 57 located at the opposite positions of the light-emitting portion 60 are light-distributed.

Specifically, the ultraviolet rays of the first range α1 of the radiation angle θ are incident on the first reflecting surface 55 to perform light distribution control, and the ultraviolet rays remaining in the second range α2 are incident on the second reflecting surface 57 to perform light distribution control.

In order to realize the light distribution control, the lower end portion 55A of the first reflecting surface 55 and the upper end portion 57A of the second reflecting surface 57 are located above the straight line E2 dividing the first range α1 and the second range α2, and all the ultraviolet rays of the radiation angle θ are incident. It is one of the first reflecting surface 55 and the second reflecting surface 57.

Further, in the present embodiment, the first reflecting surface 55 and the second reflecting surface 57 located at the opposite positions of the mounting substrate 52 on one side are not physically continuous, and are located at the first reflection as shown in FIG. The second reflecting surface 57 of the surface 55 closer to the predetermined irradiation position T is disposed closer to the side of the light-emitting portion 60 of the mounting substrate 52 on the other side than the first reflecting surface 55. The space Q is separated between the first reflecting surface 55 and the second reflecting surface 57 by the distance S.

Further, in this configuration, the ultraviolet rays of the second range α2 radiated from the respective mounting substrates 52 are not shielded from the second reflecting surface 57 on the same side as the mounting substrate 52, but pass through the space Q. The light distribution control is performed by entering the second reflecting surface 57 located at the opposite position of the mounting substrate 52.

In the present embodiment, each of the pair of second reflecting surfaces 57 is spaced apart from the first reflecting surface 55 by the space Q, so that the first reflecting surface 55 and the second reflecting are arranged. The width of the irradiation unit 30 is narrower than the configuration in which the surface 57 is set to be one continuous reflection surface.

As will be described in detail, when the first reflecting surface 55 and the second reflecting surface 57 are continuous reflecting surfaces, the first reflecting surface 55 of each of the first reflecting bodies 54 is formed to the side of the predetermined irradiation position T. Further, the amount of the second reflecting surface 57 is extended, and the width of the first reflecting body 54 is increased. On the other hand, in the case of the irradiation unit 30 of the present embodiment, the width of the first reflector 54 is reduced by the amount of the second reflecting surface 57, so that the width of the irradiation unit 30 is narrowed.

Further, in the present embodiment, as shown in Fig. 5, each of the pair of second reflecting surfaces 57 is spaced apart by a distance L between the pair of mounting substrates 52, and is spaced apart by substantially the same distance from the distance L. Since the arrangement is performed, even if the second reflecting surface 57 is separated from the first reflecting surface 55, the increase in the width of the irradiation unit 30 can be suppressed.

Further, since the pair of mounting substrates 52 are arranged in parallel with each other, the width of the irradiation unit 30 is made narrower than when the both are disposed obliquely.

In the irradiation unit 30 of the present embodiment, the first reflecting surface 55 and the second reflecting surface 57 are condensing reflection surfaces that condense the ultraviolet rays of the light-emitting portions 60 located at the opposite positions thereof at the predetermined irradiation position T.

Specifically, the first reflection surface 55 and the second reflection surface 57 are formed as an elliptical reflection surface in which the first focus f1 is set in the light-emitting portion 60 and the second focus f2 is set at the predetermined irradiation position T. As a result, as shown in FIG. 6, the ultraviolet rays Ia and Ib which are incident on each of the first reflecting surface 55 and the second reflecting surface 57 are concentrated on the second focus f2, that is, the predetermined irradiation position T.

Further, since the ultraviolet rays of the light-emitting portions 60 of the respective pairs of the mounting substrates 52 are superimposed on the predetermined irradiation position T, the amount of light at the predetermined irradiation position T can be multiplied as compared with the case where the light-emitting portion 60 is one. .

Next, the above-described light emitting module 80 will be described in detail.

The light-emitting module 80 is smaller and higher in output than the conventional light-emitting module shown in, for example, Japanese Laid-Open Patent Publication No. Hei. No. 2006-261375, and the like. Uniformity.

7 is a perspective view of the light-emitting module 80, FIG. 7(A) is a perspective view from the front, and FIG. 7(B) is a perspective view from the back. 8 is a view showing the configuration of the light-emitting module 80. FIG. 8(A) is a plan view, FIG. 8(B) is a front view, FIG. 8(C) is a bottom view, and FIG. 8(D) is a side view. Figure 9 is a cross-sectional view taken along line IX-IX of Figure 8(A).

As shown in FIGS. 7 and 8, the light-emitting module 80 has a substantially rectangular plate shape, and a light-emitting portion 502 is provided on the front surface thereof. The light emitting portion 502 emits linearly elongated linear light throughout the longitudinal direction of the light emitting module 80 (the direction connecting the both ends 504A).

A plurality of screw holes 506 are formed in the edge portions 504B and 504B on the long sides of the light-emitting module 80, and the screws are inserted into the screw holes 506 to fix the light-emitting module 80 to the substrate mounting surface 56 of the irradiation unit 30. .

Further, a pair of wiring connecting portions 508 and 508 are provided on the front surface of the light emitting module 80. The wiring connecting portions 508 and 508 are connected to the terminals of the electric wiring, and are respectively connected to the positive electrode and the negative electrode wirings 512 and 512 (FIG. 10) that transmit power.

In the light-emitting module 80 of the present embodiment, the pair of wiring connecting portions 508 and 508 are disposed only on the side of the edge portion 504B on either side of the edge portions 504B and 504B of the light-emitting module 80 (FIG. 7). (A) is the lower side of the drawing). Therefore, when the two light-emitting modules 80 are arranged side by side, the arrangement can be performed by the side of the non-wire connecting portions 508 and 508 (the upper side of the drawing in FIG. 7(A)). The portions 504B are arranged to face each other such that the wirings 512 and 512 do not occlude the light emitted from the light emitting portions 502 of the two light-emitting modules 80.

FIG. 10 is an exploded perspective view of the light emitting module 80.

As shown in the figure, the light-emitting module 80 includes the mounting substrate 52, a plurality of LED chips 522, a Zener diode 523, a flat plate 524, and a cover member 526. In addition, in FIGS. 1 to 9, illustration of other members other than the mounting substrate 52 is omitted.

The mounting substrate 52 is a substrate on which a wiring pattern 529 (see FIG. 13 and is omitted in FIG. 10) is formed on a surface of a substantially rectangular substrate. For the material of the substrate, an insulating material such as a resin or an insulating ceramic or a metal material whose back surface is subjected to an insulating treatment is used. A material having a particularly high thermal conductivity (a metal such as an aluminum alloy or copper or a ceramic such as alumina or aluminum nitride) is used for the mounting substrate 52. By providing the mounting substrate 52 with high thermal conductivity, the heat of the LED wafer 522 can be well dissipated, thereby achieving high output.

FIG. 11 is a view schematically showing a cross-sectional configuration of the light-emitting module 80. In the figure, the flat plate 524 and the cover member 526 are omitted.

The LED chip 522 is a wafer having a substantially square plate shape in plan view, and as shown in FIG. 11, an electrode is formed on each of the upper surface 522A and the bottom surface 522B. Further, a wafer light-emitting portion 522A1 that emits ultraviolet light H is provided on the upper surface 522A. The electrode wafer of the bottom surface 522B is bonded to the wiring pattern 529, and the electrode of the upper surface 522A is bonded to the wiring pattern 529 by the wire 537. Thereby, the electrodes of the upper surface 522A and the bottom surface 522B of the LED wafer 522 are electrically connected to the wiring pattern 529.

As shown in FIG. 8(A), the LED chips 522 are arranged in a row on the mounting surface 58 of the mounting substrate 52 with a fixed gap δ (FIG. 8(A)). The size of the gap δ is set such that the uniformity of the length direction of the linear light source is good, and the value of the required irradiation intensity can be obtained. In the present embodiment, the size of the LED chip 522 is 1.5 mm × 1.5 mm, and the gap δ at this time is set to be 0.1 mm to 2.0 mm. Furthermore, the arrangement interval of the LED chips 522 may be defined in advance according to the distance between the optical axes of the adjacent LED chips 522 instead of the gap δ.

The Zener diode 523 is a diode element that prevents an overvoltage from being applied to the LED chip 522. In the light-emitting module 80, a Zener diode 523 is provided for each of the LED chips 522.

The flat plate 524 is a member that is placed on the mounting surface 58 of the mounting substrate 52 and covers the entire mounting surface 58 to protect the wiring pattern 529, the LED wafer 522, and the wires 537. The flat plate 524 is formed of, for example, a resin material or a metal material (for example, an aluminum alloy or the like) having excellent thermal conductivity.

As shown in FIG. 10, an opening 530 is formed in the flat plate 524, and the exit opening 530 is formed to expose all of the LED chips 522 arranged on the mounting substrate 52.

The cover member 526 is a plate-like member that closes the light-transmitting opening 530. As shown in FIG. 9, a step portion 530A is formed on the inner circumference of the exit opening 530 at a depth of 0.2 to 20 mm from the front surface over the entire circumference, and a cover member 526 is placed on the step portion 530A. At both end portions of the exit opening 530 in the longitudinal direction, a fixing material space 534 which is connected to the step portion 530A is provided, and an adhesive is injected into the fixing material space 534, and the cover member 526 is fixed by the adhesive.

Further, an elastic material such as a spring material or a rubber material may be embedded in the fixing material space 534 without using an adhesive, and the cover member 526 may be fixed by an elastic force so as not to fall off. By using an elastic material for fixing the cover member 526, the elastic material and the cover member 526 can be easily detached from the flat plate 524, and the cover member 526 can be easily replaced.

As shown in FIG. 9, the inner peripheral surface of the exit opening 530 is provided on the lower side of the step portion 530A and is provided with a reflecting surface 544. The light distribution of the light H emitted from the LED chip 522 is controlled by the reflecting surface 544, and the directivity can be improved. The reflecting surface 544 forms a curved reflecting surface that reflects the light H of the LED wafer 522 substantially parallel to the optical axis of the LED wafer 522, whereby substantially parallel light is emitted from the exit opening 530. By causing the light H to be parallelized by the reflecting surface 544, the amount of light blocked by the exit opening 530 can be suppressed, and the light use efficiency can be improved.

The reflecting surface 544 is formed by a light reflecting film produced by vapor deposition of a reflective material such as aluminum, mirror polishing of an inner peripheral surface, or adhesion of a reflecting plate such as an aluminum plate.

FIG. 12 is a view schematically showing an electrical configuration of the light-emitting module 80.

As shown in the figure, the light-emitting module 80 is provided with N (where N≧2) LED chips 522 electrically connected in parallel to form N (including N≧2) LED groups G, and each LED group G is electrically Sexually connected in series. Further, the M×N LED chips 522 are arranged in a line shape on the mounting surface 58 of the mounting substrate 52 with a fixed gap δ (that is, at equal intervals) as described above.

Further, one Zener diode 523 is electrically and anti-parallel-connected to each of the LED chips 522 of the LED group G for each LED group G, thereby protecting the LED chips 522 from overvoltage damage.

In the light-emitting module 80 of the present embodiment, M=4 and N=12, and a total of 48 LED chips 522 are linearly arranged.

Furthermore, the values of M and N can be determined based on the current value and voltage value that can be applied to the mounting substrate 52. For example, in the case of using a widely used printed substrate, the LED wafer 522 can be disposed within the range of M x N = 4 to 600 (where M ≧ 2, N ≧ 2). Furthermore, of course, the number of LED chips 522 to be mounted is limited depending on the capabilities of the power supply device that supplies power to the light-emitting module 80.

Fig. 13 is a view showing a configuration of a mounting surface 58 of the mounting substrate 52, and Fig. 14 is an enlarged view of a portion X of Fig. 13. Furthermore, in FIG. 14, in order to indicate the electrical connection of the LED wafer 522, circuit marks are drawn on the LED chip 522.

As shown in FIG. 13, the wiring pattern 529 includes a first connection wiring portion 531 and a second connection wiring portion 532, which are continuous with each of the pair of wiring connection portions 508 and 508, and a wiring portion 533 connected in series. The LED groups G of the LED chips 522 are connected in series. As described above, the pair of wiring connecting portions 508 and 508 are connected to the wirings 512 and 512 of the positive electrode and the negative electrode, and the first connecting wiring portion 531 and the second connecting wiring portion 532 are maintained at the potentials of the positive electrode and the negative electrode, respectively.

On the other hand, a plurality of LED groups G are linearly arranged along the longitudinal direction of the mounting substrate 52, and one of the LED groups G at both ends is connected to the first connection wiring portion 531, and the other is connected to the first 2 The wiring portion 532 is connected. Further, each of the LED groups G is electrically connected to each other by a series connection wiring portion 533.

As shown in FIGS. 13 and 14, each of the first connection wiring portion 531 and the series connection wiring portion 533 has a wafer bonding portion 535, and each of the LED chips 522 of one LED group G is bonded to the wafer bonding portion 535. .

Further, the second connection wiring portion 532 has a wire bonding portion 536, and the upper surface 522A of each of the LED chips 522 of one LED group G is bonded to the wire bonding portion 536 by a wire 537.

The series connection wiring portion 533 has an extending portion 538 extending over the adjacent two LED groups G, and each of the both ends of the extending portion 538 includes the wafer bonding portion 535 and the wire bonding portion 536.

Furthermore, in the present embodiment, each of the LED chips 522 is connected to the wire bonding portion 536 by two wires 537. However, the number of wires 537 connecting the LED chip 522 and the wire bonding portion 536 is arbitrary.

Here, on the upper surface 522A of the LED wafer 522, as shown in FIG. 14, the respective wire connection portions 537A of the plurality of wires 537 are collectively disposed in the vicinity of the edge portion 522C. Further, the LED chip 522 is disposed such that the wire connecting portion 537A and the wire bonding portion 536 are opposed to each other (that is, the distance between the wire connecting portion 537A and the wire bonding portion 536 is the shortest).

In the light-emitting module 80, not all of the LED chips 522 are disposed in a state in which the wire connection portions 537A are oriented in the same direction. For each of the LED groups G, the wire connection portions 537A of the LED chips 522 are mutually Arranged in the state of reversal. Further, in association with the arrangement of the LED chips 522, each of the series connection wiring portions 533 is disposed at an inverted position for each of the adjacent two LED groups G, and the respective LED groups G are electrically connected in series.

According to the wiring pattern configuration, the adjacent LED groups G are electrically connected by the series connection wiring portion 533 extending along the same, and the pattern of the series connection wiring portions 533 does not pass through the gap between the LED groups G. . Therefore, the gap between the LED groups G can also be set to be equal to the gap δ between the LED chips 522, so that the illuminance caused by the inconsistency between the gaps between the LED groups G and the LED chips 522 does not occur. Both can make the uniformity good.

Further, as shown in FIG. 14, a concave portion 539 is formed in the extending portion 538 of the wiring portion 533 connected in series. A wafer bonding portion 535 in which the wiring portion 533 is connected in series is formed in the recess portion 539, and the Zener diode 523 is mounted on the recess portion 539.

According to this configuration, the Zener diode 523 is disposed at a position that enters the recess 539 of the extension portion 538 of the series connection wiring portion 533. Therefore, when the Zener diode 523 is disposed between the LED groups G, the phase is applied. In comparison, the gap δ of all the LED chips 522 is made uniform, and the Zener diode 523 does not cause illuminance unevenness. Further, since the Zener diode 523 is disposed in the vicinity of the wire bonding portion 536, the wire 537 is not lengthened.

As shown in FIG. 10 above, in the flat plate 524 of the light-emitting module 80, a plurality of (at least two or more) protrusions 540 are provided on the surface (bottom surface) covering the mounting substrate 52, and also on the mounting surface 58 of the mounting substrate 52. A hole portion 542 that receives the protrusion 540 is provided. By the engagement of the protrusions 540 with the hole portion 542, the flat plate 524 is positioned relative to the mounting substrate 52, so that the inner peripheral surface of the exit opening 530 of the flat plate 524 does not occur due to the positional displacement of the flat plate 524 or the like. The wire 537 or the LED chip 522 is in contact with each other to cause damage.

Further, as described above, the cover member 526 is provided in the exit opening 530 of the flat plate 524. Therefore, the LED chip 522 or the lead wire 537 exposed from the exit opening 530 is protected by the cover member 526, and the damage thereof is surely prevented.

According to this embodiment, the following effects are exhibited.

In the irradiation unit 30 of the present embodiment, each of the second reflecting surfaces 57 is located closer to the predetermined irradiation position T than the first reflecting surface 55, and the light-emitting portion 60 from the opposite position is directed to the other side. The side of the light-emitting portion 60 is spaced apart from the first reflection surface 55, and a space Q is disposed between the first reflection surface 55 and the first reflection surface 55. Further, the ultraviolet rays Ib incident on the second reflecting surface 57 of the opposite position from the respective light-emitting portions 60 are incident on the second reflecting surface 57 through the space Q.

By this, the width of the irradiation unit 30 (mounting substrate) is set to be different from the configuration in which the first reflecting surface 55 and the second reflecting surface 57 which are continuous with each other are arranged at the opposite positions of the respective light-emitting portions 60. The distance between the partitioning directions 52 is narrowed, and the size of the ultraviolet irradiation device 1 can be reduced.

Further, since the ultraviolet rays of each of the pair of light-emitting portions 60 are irradiated to the predetermined irradiation position T, the peak illuminance at the predetermined irradiation position T can be improved as compared with the configuration in which the light-emitting portion 60 is provided.

In the irradiation unit 30 of the present embodiment, the pair of second reflecting surfaces 57 are spaced apart from each other by a distance L between the pair of mounting substrates 52. Thereby, in the configuration in which the second reflecting surface 57 and the first reflecting surface 55 are separated from each other, the increase in the width of the irradiation unit 30 can be suppressed.

In the irradiation unit 30 of the present embodiment, the mounting substrates 52 of the pair of light-emitting modules 80 are arranged in parallel with each other. Therefore, the width of the irradiation unit 30 can be suppressed as compared with the configuration in which the mounting substrates 52 are arranged in non-parallel with each other.

In the irradiation unit 30 of the present embodiment, the light of the range of the radiation angle θ of the light-emitting unit 60 is incident on any of the first reflection surface 55 and the second reflection surface 57, and the light distribution control is performed. Therefore, even the first reflection is performed. The surface 55 and the second reflecting surface 57 are spaced apart, and the light use efficiency is not lowered.

The irradiation unit 30 of the present embodiment is connected to the light-emitting unit 60, and a plurality of ultraviolet LEDs are arranged in a row, and the light is linearly irradiated toward the predetermined irradiation position T. Thereby, the irradiation unit 30 which is preferably used for irradiating the printing surface W having the width with the linear ultraviolet rays extending in the width direction and performing photohardening treatment on the ink can be obtained.

In the irradiation unit 30 of the present embodiment, the first reflecting surface 55 and the second reflecting surface 57 are elliptically reflecting surfaces in which the ultraviolet ray of the light-emitting portion 60 at the opposite position is condensed at the predetermined irradiation position T, so that the irradiation position T can be set at the predetermined irradiation position T. A higher peak illuminance is obtained.

In the ultraviolet irradiation apparatus 1 of the present embodiment, the cooling air is blown to each of the irradiation units 30 to perform air cooling, so that the output of the ultraviolet LEDs included in the light-emitting units 60 of the respective irradiation units 30 can be increased.

The ultraviolet irradiation device 1 of the present embodiment includes a hollow tubular pillar 36 through which the outside of the irradiation unit 30 extends and introduces outside air, and the pillar 36 is provided with a blowing hole for blowing the outside air to each of the irradiation units 30. 40.

Thereby, each of the irradiation units 30 can be individually cooled by the cooling air.

In the ultraviolet irradiation device 1 of the present embodiment, each of the irradiation units 30 is provided with a base body 50 on which the light-emitting module 80 is mounted, and the base body 50 is provided with an integrally molded product in which the cooling fins 42 are blown. Thereby, compared with the structure in which the heat sink 42 and the base body 50 are provided separately, the thermal resistance between the light-emitting module 80 and the heat sink 42 can be suppressed, and heat dissipation can be improved.

In the ultraviolet irradiation device 1 of the present embodiment, each of the fins 42 is provided in parallel with the blowing direction B of the cooling air, so that the mixing of the cooling air blown from the respective blowing holes 40 can be suppressed, and the irradiation unit can be improved for each irradiation unit. The thermal independence of the cooling wind of 30.

In the light-emitting module 80 of the present embodiment, the wire connection portion 537A of the LED chip 522 is inverted for each LED group G, and each of the series connection wiring portions 533 is disposed for each adjacent two. The position where the LED group G is reversed.

Thereby, the adjacent LED groups G are electrically connected to each other by the series connection wiring portion 533 extending along the same, so that the pattern of the series connection wiring portions 533 does not pass through the gap between the LED groups G. Therefore, the gap between the LED groups G can be made equal to the gap δ between the LED chips 522, so that the illuminance caused by the inconsistency of the gap δ between the gaps between the LED groups G and the LED chips 522 does not occur. Uneven, in addition, more LED chips 522 can be arranged at a high density. Thereby, a small size, high output, and good uniformity of the light-emitting module 80 can be obtained.

Further, the LED chip 522 and the lead 537 are protected by the flat plate 524, and damage such as it can be prevented.

Further, in the present embodiment, a concave portion 539 is formed between the wafer bonding portion 535 and the wire bonding portion 536 of the series connection wiring portion 533, and a Zener diode 523 is disposed in the concave portion 539.

Thereby, the Zener diode 523 is disposed at a position that enters the series connection wiring portion 533. Therefore, all the LED chips 522 are made as compared with the case where the Zener diode 523 is disposed between the LED groups G. The gap δ is uniform, and the Zener diode 523 does not cause illuminance unevenness. Further, since the Zener diode 523 is disposed in the vicinity of the wire bonding portion 536, the wire 537 is not lengthened.

Further, in the present embodiment, the mounting substrate 52 is provided with a hole portion 542 as a positioning portion that is engaged with the projection 540 of the flat plate 524 and positioned.

By the engagement of the projections 540 and the hole portions 542, the flat plate 524 is positioned relative to the mounting substrate 52, so that the inner circumferential surface of the exit opening 530 of the flat plate 524 does not occur due to the positional displacement of the flat plate 524 or the like. The wire 537 or the LED chip 522 is in contact with each other to cause damage or the like.

Further, in the present embodiment, the mounting substrate 52 is provided with the hole portion 542, and the flat plate 524 is provided with the protrusion 540. Alternatively, the mounting substrate 52 may be provided with a protrusion and the hole portion to be engaged with the protrusion. Set on the tablet 524.

Further, in the present embodiment, since the cover member 526 is provided in the exit opening 530 of the flat plate 524, the LED chip 522 and the lead wire 537 can be reliably protected from damage.

Further, in the present embodiment, the inner peripheral surface of the exit opening 530 of the flat plate 524 is provided with a reflecting surface 544 for causing the light H of the LED chip 522 to be parallelized, so that the amount of light blocked by the inner peripheral surface can be suppressed. Improve light utilization efficiency.

Further, the above-described embodiments are merely illustrative of one aspect of the invention, and may be arbitrarily modified and applied without departing from the spirit and scope of the invention.

 (Modification 1)  

In the above-described embodiment, the first reflecting surface 55 and the second reflecting surface 57 of the irradiation unit 30 are exemplified in the case where the light of the light-emitting portion 60 at the opposite position is condensed on the elliptical reflecting surface of the predetermined irradiation position T. However, the present invention is not limited thereto, and the second reflecting surface 57 may be a flat surface or a curved surface different from the first reflecting surface 55. Further, the condensing position of the first reflecting surface 55 may be different from the predetermined irradiation position T.

Fig. 15 is a view showing the configuration of the irradiation unit 130 of the present modification. In the drawings, members that are described in the embodiments are denoted by the same reference numerals, and their description is omitted.

The irradiation unit 130 linearly emits ultraviolet rays having a predetermined width R centered on the unit optical axis K.

Specifically, the first reflecting surface 155 is formed as an elliptical reflecting surface having the second focus f2 inside the irradiation unit 130 with the light-emitting portion 60 as the first focus f1, and the ultraviolet light Ia of the light-emitting portion 60 is directed to a predetermined irradiation position. T is diffused and emitted in the width direction (the direction in which the pair of mounting substrates 52 are spaced apart). The second reflecting surface 157 is a planar reflecting surface, and the second reflecting surface 157 also diffuses and emits the ultraviolet ray Ib of the light-emitting portion 60 toward the predetermined irradiation position T in the width direction.

By the light distribution control by the reflection of the first reflecting surface 155 and the second reflecting surface 157, the predetermined irradiation position T is linearly irradiated with ultraviolet rays that are diffused into the width R in the width direction.

In the present modification, the lower end portion 155A of the first reflecting surface 155 and the upper end portion 157A of the second reflecting surface 157 are also located above the straight line E2 that divides the radiation range of the light-emitting portion 60, and all the ultraviolet rays of the radiation angle θ are incident on Any one of the first reflecting surface 155 and the second reflecting surface 157.

Further, in the present modification, the second reflecting surface 157 may be a curved surface such as a paraboloid.

 (Modification 2)  

Fig. 16 is a view showing the configuration of the irradiation unit 230 of the present modification.

As shown in FIG. 16, the heat sink 242 of the irradiation unit 230 may extend in the longitudinal direction A, and each of the fins 242 may be exposed to the cooling air flowing along the longitudinal direction A of the casing 2.

In the irradiation unit 230 of the present modification, the fin unit 243 in which the fins 242 are integrally formed is formed separately from the base body 250.

 (Modification 3)  

Fig. 17 is a view showing the configuration of the irradiation unit 330 of the present modification.

As shown in FIG. 17, the irradiation unit 330 is provided with a plurality of cooling pipes 370 through which a refrigerant such as cooling water flows, as a cooling means instead of the fins, and may be cooled by the refrigerant. In the irradiation unit 330, the base body 350 is provided with a separable portion 351 on the back surface of the mounting substrate 52, and the cooling tube 370 is sandwiched between the portion 351 and the base body 350 and housed inside the base body 350. . Thereby, since the refrigerant of the cooling pipe 370 flows in the vicinity of the mounting substrate 52, the heat of the light-emitting portion 60 of the mounting substrate 52 is efficiently collected by the refrigerant.

 (Modification 4)  

In the above embodiment, the cover member 526 is fixed to the light-emitting module 80 of the flat plate 524 by an adhesive, but the invention is not limited thereto.

That is, as in the light-emitting module 680 shown in FIG. 18, a leaf spring that is pressed against the holding member 526 by a spring force as a holding member 550 may be attached to the exit opening 530, and the cover may be fixed by the holding member 550. Member 526. According to this configuration, since the cover member 526 is held only by the elastic force of the holding member 550, the cover member 526 can be easily removed. Further, an elastic member such as rubber that holds the cover member 526 by an elastic force may be used for the holding member 550 instead of the leaf spring.

 (Modification 5)  

In the above embodiment, for example, the light-emitting module 780 shown in FIG. 19 may be used, and the cover member 526 may be configured to include a lens portion 555 that controls light distribution of transmitted light. For the lens portion 555, for example, a lenticular lens that is long in the direction in which the LED chips 522 are arranged is preferably used. In this case, by holding the cover member 526 by the holding member 550, the cover member 526 can be easily replaced to obtain a desired light distribution.

 (Modification 6)  

In the above-described embodiment, a configuration in which one row of LED chips 522 is attached to the mounting substrate 52 is exemplified, but the present invention is not limited thereto. Alternatively, as in the mounting substrate 620 shown in FIG. 20, the plurality of lines Ln of the LED chips 522 arranged in one row may be mounted side by side. In this case, the first connection wiring portion 531, the second connection wiring portion 532, and the series connection wiring portion 533 are provided for each line Ln. Further, the plate 524 is provided with one emission opening 530 of a size that exposes the LED chips 522 of all the lines Ln, or an individual emission opening 530 is provided for each LED chip 522.

In the above-described embodiments and modifications, the light-emitting portion 60 is not limited to the LED chip 522 of the ultraviolet LED, and may be composed of any light-emitting element.

Further, the ultraviolet irradiation device 1 is used in addition to the printing device, and may be incorporated into any device such as a film manufacturing device.

Claims (18)

 An irradiation unit that is configured to irradiate light to a predetermined irradiation position, and is characterized in that: a pair of mounting substrates each having a light-emitting portion including a light-emitting element, wherein the light-emitting portions of each of the light-emitting portions are opposed to each other And a pair of first reflecting surface and second reflecting surface disposed at an opposite position of each of the light emitting portions of the mounting substrate, and performing light distribution control on the light of the light emitting portion at the opposite position; Each of the second reflecting surfaces is located closer to the predetermined irradiation position than the first reflecting surface, and furthermore, the light emitting portion from the opposite position is on the side of the light emitting portion on the other side and the first a reflecting surface is spaced apart from each other and disposed in a space between the first reflecting surface, and the light from the second reflecting surface incident on the opposite position from each of the light emitting portions passes through the space and enters The second reflecting surface.    The irradiation unit of claim 1, wherein the pair of the second reflecting surfaces are spaced apart from each other by a distance between the pair of mounting substrates.    The irradiation unit of claim 1 or 2, wherein the pair of mounting substrates are arranged in parallel with each other.    The irradiation unit according to any one of claims 1 to 3, wherein all of the light beams of the predetermined radiation angle of the light-emitting portion are incident on any one of the first reflection surface and the second reflection surface.    The irradiation unit according to any one of claims 1 to 4, wherein the plurality of light-emitting elements are arranged in a row in the light-emitting portion, and the light is linearly irradiated toward the predetermined irradiation position.    The illuminating unit according to any one of claims 1 to 5, wherein the first reflecting surface and the second reflecting surface condense light of the light-emitting portion at a facing position on an elliptical reflecting surface of the predetermined irradiation position .    The irradiation unit according to any one of claims 1 to 5, wherein the first reflecting surface converges the elliptical reflecting surface of the predetermined irradiation position by the light-emitting portion at the opposite position, and the second reflecting surface is The plane or the curved surface different from the first reflecting surface described above.    The illuminating unit according to any one of claims 1 to 7, further comprising: a light-emitting module, wherein the light-emitting module includes: the mounting substrate; and a wiring pattern which is arranged in a plurality of rows arranged on the mounting surface of the mounting substrate The light-emitting element is wired; and the flat plate is overlapped with the mounting surface of the mounting substrate, and an emission opening surrounded by the plurality of light-emitting elements arranged on the mounting substrate is formed; and the plurality of light-emitting elements are predetermined The number of the wiring patterns is electrically connected in parallel, and the wiring pattern includes a series connection wiring portion electrically connecting the light-emitting element groups of the light-emitting elements that are mutually electrically connected in parallel, and the series connection wiring portion is along the phase And extending the two light-emitting element groups adjacent to each other, and further comprising: a first bonding portion to which each of the light-emitting elements of the light-emitting element group is joined; and a second bonding portion that is joined to the other side by a wire Each of the light-emitting elements of the light-emitting element group; the connection portion of the light-emitting element of the light-emitting element is inverted for each of the light-emitting element groups, and Each wiring portion are connected in the line at a position disposed for each adjacent two of the light emitting element group of reversed.    The illumination unit of claim 8, wherein each of the light-emitting element groups is provided with a diode element for preventing an overvoltage applied to each of the light-emitting elements of the light-emitting element group, and a recess is formed in the series connection wiring portion. The above-described diode element is disposed in the recess.    The illuminating unit of claim 8 or 9, wherein the mounting substrate is provided with a positioning portion that is engaged with the flat plate and positioned.    The irradiation unit according to any one of claims 8 to 10, comprising a cover member having a light transmissive property for blocking the exit opening.    The irradiation unit of claim 11, wherein the exit opening of the flat plate is provided with a holding member that holds the cover member with an elastic force.    The irradiation unit according to any one of claims 8 to 12, wherein a reflection surface for causing the light of the light-emitting element to be parallelized is provided on an inner circumferential surface of the emission opening of the flat plate.    The irradiation unit of claim 11, wherein the cover member is provided with a lens portion that controls transmitted light.    An illuminating device comprising: a plurality of irradiation units of any one of claims 1 to 14; and a cooling means for cooling each of the illuminating units; each of the illuminating units is connected In the arrangement, the cooling means blows cooling air to each of the irradiation units to perform air cooling, or cools the inside of each of the irradiation units by introducing a refrigerant.    The apparatus according to claim 15, wherein the cooling means includes a tube body extending through the irradiation unit and introducing an outside air, and the tube body is provided with a blowing for each of the irradiation units The above-mentioned outside air blowing hole.    The irradiation apparatus of claim 16, wherein each of the irradiation units includes a base body on which the mounting substrate is mounted, and the base system includes an integrally molded product that blows the cooling fins.    The illuminating device of claim 17, wherein the fins are disposed in parallel to a blowing direction of the cooling air.