TWI630857B - Substrate manufacturing method and laser processing device - Google Patents
Substrate manufacturing method and laser processing device Download PDFInfo
- Publication number
- TWI630857B TWI630857B TW105117381A TW105117381A TWI630857B TW I630857 B TWI630857 B TW I630857B TW 105117381 A TW105117381 A TW 105117381A TW 105117381 A TW105117381 A TW 105117381A TW I630857 B TWI630857 B TW I630857B
- Authority
- TW
- Taiwan
- Prior art keywords
- surface layer
- layer
- substrate
- hole
- film
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 62
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000012545 processing Methods 0.000 title claims description 17
- 239000002344 surface layer Substances 0.000 claims abstract description 129
- 239000010410 layer Substances 0.000 claims abstract description 122
- 239000004020 conductor Substances 0.000 claims abstract description 101
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 238000000576 coating method Methods 0.000 claims abstract description 30
- 239000011344 liquid material Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 38
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 25
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 18
- 239000011888 foil Substances 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 16
- 238000009826 distribution Methods 0.000 description 10
- 239000001569 carbon dioxide Substances 0.000 description 9
- 229910002092 carbon dioxide Inorganic materials 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 230000031700 light absorption Effects 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 4
- 235000011837 pasties Nutrition 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
- H01L21/02288—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating printing, e.g. ink-jet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/7687—Thin films associated with contacts of capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
- H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015112762A JP6501627B2 (ja) | 2015-06-03 | 2015-06-03 | レーザ加工装置 |
| JP2015-112762 | 2015-06-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201701741A TW201701741A (zh) | 2017-01-01 |
| TWI630857B true TWI630857B (zh) | 2018-07-21 |
Family
ID=57575233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105117381A TWI630857B (zh) | 2015-06-03 | 2016-06-02 | Substrate manufacturing method and laser processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6501627B2 (ja) |
| KR (1) | KR101840932B1 (ja) |
| CN (1) | CN106255319B (ja) |
| TW (1) | TWI630857B (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7154147B2 (ja) * | 2019-01-31 | 2022-10-17 | 京セラ株式会社 | 印刷配線板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070054216A1 (en) * | 2005-09-02 | 2007-03-08 | Konica Minolta Medical & Graphic, Inc. | Near-infrared ray absorbing material and production method of the same |
| TWI481325B (zh) * | 2012-03-09 | 2015-04-11 | Mitsui Mining & Smelting Co | 印刷配線板的製造方法及雷射加工用銅箔 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4078715B2 (ja) * | 1998-06-02 | 2008-04-23 | 三菱瓦斯化学株式会社 | 信頼性に優れたビア孔の形成方法 |
| MXPA01009619A (es) * | 1999-03-23 | 2003-06-24 | Circuit Foil Luxembourg Trading Sarl | Metodo para fabricar un tablero de circuito impreso de capa multiple y una hoja metalica de material mixto para utilizarse en el mismo. |
| JP2001144411A (ja) * | 1999-09-03 | 2001-05-25 | Mec Kk | プリント配線板の孔あけ法およびそれに用いる表面処理剤 |
| JP2003248207A (ja) * | 2002-02-22 | 2003-09-05 | Fujitsu Display Technologies Corp | 液晶表示パネルの製造方法および製造装置 |
| JP2006202840A (ja) * | 2005-01-18 | 2006-08-03 | Seiko Epson Corp | 配線基板の製造方法 |
| JP2011171724A (ja) * | 2010-01-19 | 2011-09-01 | Shibaura Mechatronics Corp | 基板の配線修正方法、基板の配線修正装置及び基板の配線形成装置 |
| JP2014143237A (ja) * | 2013-01-22 | 2014-08-07 | Toppan Printing Co Ltd | ビアホールの形成方法及び多層プリント配線板の製造方法 |
-
2015
- 2015-06-03 JP JP2015112762A patent/JP6501627B2/ja active Active
-
2016
- 2016-06-01 KR KR1020160067893A patent/KR101840932B1/ko active IP Right Grant
- 2016-06-02 CN CN201610390237.4A patent/CN106255319B/zh not_active Expired - Fee Related
- 2016-06-02 TW TW105117381A patent/TWI630857B/zh not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070054216A1 (en) * | 2005-09-02 | 2007-03-08 | Konica Minolta Medical & Graphic, Inc. | Near-infrared ray absorbing material and production method of the same |
| TWI481325B (zh) * | 2012-03-09 | 2015-04-11 | Mitsui Mining & Smelting Co | 印刷配線板的製造方法及雷射加工用銅箔 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106255319A (zh) | 2016-12-21 |
| KR101840932B1 (ko) | 2018-03-21 |
| TW201701741A (zh) | 2017-01-01 |
| KR20160142779A (ko) | 2016-12-13 |
| CN106255319B (zh) | 2019-03-08 |
| JP2016225554A (ja) | 2016-12-28 |
| JP6501627B2 (ja) | 2019-04-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |