TWI626337B - Hard gold plating solution - Google Patents

Hard gold plating solution Download PDF

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Publication number
TWI626337B
TWI626337B TW105143297A TW105143297A TWI626337B TW I626337 B TWI626337 B TW I626337B TW 105143297 A TW105143297 A TW 105143297A TW 105143297 A TW105143297 A TW 105143297A TW I626337 B TWI626337 B TW I626337B
Authority
TW
Taiwan
Prior art keywords
gold
gold plating
plating solution
solution
hard
Prior art date
Application number
TW105143297A
Other languages
English (en)
Chinese (zh)
Other versions
TW201736644A (zh
Inventor
Yoshinori Murakami
Hajime Terashima
Hideto Watanabe
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201736644A publication Critical patent/TW201736644A/zh
Application granted granted Critical
Publication of TWI626337B publication Critical patent/TWI626337B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW105143297A 2016-04-07 2016-12-27 Hard gold plating solution TWI626337B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016077335A JP2017186627A (ja) 2016-04-07 2016-04-07 硬質金めっき溶液

Publications (2)

Publication Number Publication Date
TW201736644A TW201736644A (zh) 2017-10-16
TWI626337B true TWI626337B (zh) 2018-06-11

Family

ID=60000966

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105143297A TWI626337B (zh) 2016-04-07 2016-12-27 Hard gold plating solution

Country Status (3)

Country Link
JP (1) JP2017186627A (ja)
TW (1) TWI626337B (ja)
WO (1) WO2017175428A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102131962A (zh) * 2008-08-25 2011-07-20 日本电镀工程股份有限公司 硬质金系镀液

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4396471A (en) * 1981-12-14 1983-08-02 American Chemical & Refining Company, Inc. Gold plating bath and method using maleic anhydride polymer chelate
US4795534A (en) * 1986-09-25 1989-01-03 Vanguard Research Associates, Inc. Electrolyte solution and process for gold electroplating
CN101550571A (zh) * 2008-03-31 2009-10-07 恩伊凯慕凯特股份有限公司 用于部分电镀的含有金的电镀液
JP5025815B1 (ja) * 2011-08-10 2012-09-12 小島化学薬品株式会社 硬質金めっき液

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102131962A (zh) * 2008-08-25 2011-07-20 日本电镀工程股份有限公司 硬质金系镀液

Also Published As

Publication number Publication date
TW201736644A (zh) 2017-10-16
JP2017186627A (ja) 2017-10-12
WO2017175428A1 (ja) 2017-10-12

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