TWI625996B - 配線基板的製造方法 - Google Patents

配線基板的製造方法 Download PDF

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Publication number
TWI625996B
TWI625996B TW103117893A TW103117893A TWI625996B TW I625996 B TWI625996 B TW I625996B TW 103117893 A TW103117893 A TW 103117893A TW 103117893 A TW103117893 A TW 103117893A TW I625996 B TWI625996 B TW I625996B
Authority
TW
Taiwan
Prior art keywords
solder resist
resist layer
manufacturing
thickness
exposed
Prior art date
Application number
TW103117893A
Other languages
English (en)
Chinese (zh)
Other versions
TW201509256A (zh
Inventor
豊田裕二
Yuji Toyoda
後閑寬彥
Norihiko Gokan
川合宣行
Noriyuki Kawai
中川邦弘
Kunihiro Nakagawa
Original Assignee
三菱製紙股份有限公司
Mitsubishi Paper Mills Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱製紙股份有限公司, Mitsubishi Paper Mills Limited filed Critical 三菱製紙股份有限公司
Publication of TW201509256A publication Critical patent/TW201509256A/zh
Application granted granted Critical
Publication of TWI625996B publication Critical patent/TWI625996B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW103117893A 2013-05-22 2014-05-22 配線基板的製造方法 TWI625996B (zh)

Applications Claiming Priority (20)

Application Number Priority Date Filing Date Title
JP2013-107932 2013-05-22
JP2013107932 2013-05-22
JP2013125178 2013-06-14
JP2013-125178 2013-06-14
JP2013-131839 2013-06-24
JP2013131839 2013-06-24
JP2013139706 2013-07-03
JP2013-139706 2013-07-03
JP2013-142482 2013-07-08
JP2013142482 2013-07-08
JP2013147430 2013-07-16
JP2013-147430 2013-07-16
JP2013-150825 2013-07-19
JP2013150825 2013-07-19
JP2013150824 2013-07-19
JP2013-150824 2013-07-19
JP2014-086392 2014-04-18
JP2014086392 2014-04-18
JP2014-090220 2014-04-24
JP2014090220 2014-04-24

Publications (2)

Publication Number Publication Date
TW201509256A TW201509256A (zh) 2015-03-01
TWI625996B true TWI625996B (zh) 2018-06-01

Family

ID=51933504

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103117893A TWI625996B (zh) 2013-05-22 2014-05-22 配線基板的製造方法

Country Status (5)

Country Link
JP (3) JP6224520B2 (cg-RX-API-DMAC10.html)
KR (1) KR102076479B1 (cg-RX-API-DMAC10.html)
CN (4) CN105210460B (cg-RX-API-DMAC10.html)
TW (1) TWI625996B (cg-RX-API-DMAC10.html)
WO (1) WO2014188945A1 (cg-RX-API-DMAC10.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6075643B2 (ja) * 2013-11-28 2017-02-08 京セラ株式会社 配線基板の製造方法
KR200491846Y1 (ko) 2014-12-10 2020-06-17 미쓰비시 세이시 가부시키가이샤 레지스트층의 박막화 장치
TWI675256B (zh) * 2015-03-13 2019-10-21 日商三菱製紙股份有限公司 阻焊劑圖型之形成方法
JP6656027B2 (ja) * 2015-03-13 2020-03-04 三菱製紙株式会社 ソルダーレジストパターンの形成方法
KR102814782B1 (ko) * 2020-03-12 2025-05-30 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
KR102898765B1 (ko) * 2020-04-23 2025-12-12 엘지이노텍 주식회사 회로 기판
KR102988621B1 (ko) * 2020-06-12 2026-07-09 엘지이노텍 주식회사 회로기판
KR102909754B1 (ko) 2020-06-12 2026-01-09 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
US11551939B2 (en) * 2020-09-02 2023-01-10 Qualcomm Incorporated Substrate comprising interconnects embedded in a solder resist layer
WO2022231015A1 (ko) * 2021-04-26 2022-11-03 엘지이노텍 주식회사 회로기판
CN113517202A (zh) * 2021-05-27 2021-10-19 日月光半导体(上海)有限公司 集成电路装置及其制造方法
CN113950193B (zh) * 2021-09-24 2024-09-10 上海富乐华半导体科技有限公司 Dbc覆铜陶瓷基板上圆形半腐蚀沉孔的设计方法
KR102949898B1 (ko) 2022-06-27 2026-04-09 삼성전자주식회사 반도체 패키지

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200906245A (en) * 2007-07-26 2009-02-01 Samsung Electro Mech Printed circuit board and manufacturing method thereof
TW201026188A (en) * 2008-12-18 2010-07-01 Unimicron Technology Corp Surface plating process for circuit substrate
JP2011077191A (ja) * 2009-09-29 2011-04-14 Mitsubishi Paper Mills Ltd ソルダーレジストの形成方法
CN103109588A (zh) * 2010-09-28 2013-05-15 三菱制纸株式会社 阻焊图案的形成方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS346263B1 (cg-RX-API-DMAC10.html) 1957-01-18 1959-07-18
EP0377872A2 (de) * 1989-01-09 1990-07-18 Siemens Aktiengesellschaft Verfahren zum Aufbringen einer Lötstoppabdeckung auf Leiterplatten
JPH05226505A (ja) 1992-02-18 1993-09-03 Ibiden Co Ltd プリント配線板
JPH0659449A (ja) * 1992-08-06 1994-03-04 Tamura Kaken Kk 感光性樹脂組成物
JPH0661647A (ja) * 1992-08-07 1994-03-04 Fujitsu Ltd 薄膜回路基板の製造方法
JP3395222B2 (ja) * 1992-12-10 2003-04-07 松下電器産業株式会社 プリント配線板の製造方法
KR20040088592A (ko) * 1996-01-11 2004-10-16 이비덴 가부시키가이샤 프린트 배선판 및 그의 제조방법
JP3856414B2 (ja) * 1997-12-25 2006-12-13 日本ビクター株式会社 プリント配線基板の製造方法及びプリント配線基板
JP2001135919A (ja) * 1999-11-08 2001-05-18 Sumitomo Metal Electronics Devices Inc プラスチックパッケージの製造方法
JP3767676B2 (ja) * 2000-09-12 2006-04-19 信越化学工業株式会社 オルガノシロキサン系高分子化合物及び光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜
KR100389314B1 (ko) * 2001-07-18 2003-06-25 엘지전자 주식회사 도금인입선 없는 인쇄회로기판의 제조방법
TWI312166B (en) * 2001-09-28 2009-07-11 Toppan Printing Co Ltd Multi-layer circuit board, integrated circuit package, and manufacturing method for multi-layer circuit board
JP3883948B2 (ja) 2002-10-16 2007-02-21 大日本印刷株式会社 多層配線基板およびフリップチップ方式の半導体パッケージ
CN1751547B (zh) * 2003-02-13 2011-11-16 株式会社藤仓 多层基板及其制造方法
CN1926930B (zh) * 2004-03-03 2011-06-15 新光电气工业株式会社 电路板制造方法与电路板
CN100459077C (zh) * 2006-03-15 2009-02-04 日月光半导体制造股份有限公司 基板的制造方法
JP4660826B2 (ja) * 2006-08-18 2011-03-30 山栄化学株式会社 レジストパターンの形成方法
CN100555619C (zh) * 2007-04-11 2009-10-28 全懋精密科技股份有限公司 基板表面处理结构及其制作方法
CN101364586B (zh) * 2007-08-10 2010-06-23 全懋精密科技股份有限公司 封装基板结构
CN101170069A (zh) * 2007-11-21 2008-04-30 健鼎（无锡）电子有限公司 高对准度的防焊层开口方法
CN101668390B (zh) * 2009-09-22 2011-06-08 深圳崇达多层线路板有限公司 一种印刷线路板阻焊层的生产工艺
CN102088822B (zh) * 2009-12-08 2014-12-17 三星半导体(中国)研究开发有限公司 具有焊点自保护功能的pcb基板及其焊盘制作工艺
JP5830925B2 (ja) 2011-05-10 2015-12-09 日立化成株式会社 プリント配線板の製造方法
JP2013041958A (ja) * 2011-08-15 2013-02-28 Hitachi Cable Ltd プリント配線基板およびプリント配線基板の製造方法
JP3182371U (ja) * 2012-02-10 2013-03-21 三菱製紙株式会社 レジスト層の薄膜化処理装置
JP2014078551A (ja) * 2012-10-09 2014-05-01 Ngk Spark Plug Co Ltd 配線基板、配線基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200906245A (en) * 2007-07-26 2009-02-01 Samsung Electro Mech Printed circuit board and manufacturing method thereof
TW201026188A (en) * 2008-12-18 2010-07-01 Unimicron Technology Corp Surface plating process for circuit substrate
JP2011077191A (ja) * 2009-09-29 2011-04-14 Mitsubishi Paper Mills Ltd ソルダーレジストの形成方法
CN103109588A (zh) * 2010-09-28 2013-05-15 三菱制纸株式会社 阻焊图案的形成方法

Also Published As

Publication number Publication date
JP2017183744A (ja) 2017-10-05
JP6416323B2 (ja) 2018-10-31
CN107969077B (zh) 2020-02-18
KR102076479B1 (ko) 2020-02-12
JP2015216332A (ja) 2015-12-03
JP6224520B2 (ja) 2017-11-01
CN105210460A (zh) 2015-12-30
WO2014188945A1 (ja) 2014-11-27
JP6514807B2 (ja) 2019-05-15
CN107979919B (zh) 2020-07-10
TW201509256A (zh) 2015-03-01
KR20160013007A (ko) 2016-02-03
CN107969076A (zh) 2018-04-27
CN107969077A (zh) 2018-04-27
JP2018139318A (ja) 2018-09-06
CN107969076B (zh) 2020-04-28
CN105210460B (zh) 2019-01-11
CN107979919A (zh) 2018-05-01

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