TWI623569B - 各向異性導電膜和使用其的顯示裝置 - Google Patents

各向異性導電膜和使用其的顯示裝置 Download PDF

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Publication number
TWI623569B
TWI623569B TW105131507A TW105131507A TWI623569B TW I623569 B TWI623569 B TW I623569B TW 105131507 A TW105131507 A TW 105131507A TW 105131507 A TW105131507 A TW 105131507A TW I623569 B TWI623569 B TW I623569B
Authority
TW
Taiwan
Prior art keywords
conductive film
anisotropic conductive
alkyl
group
aryl
Prior art date
Application number
TW105131507A
Other languages
English (en)
Chinese (zh)
Other versions
TW201716478A (zh
Inventor
朴永祐
高連助
金智軟
宋基態
申遇汀
崔賢民
許健寧
黃慈英
Original Assignee
三星Ｓｄｉ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020150137912A external-priority patent/KR101900542B1/ko
Priority claimed from KR1020160021494A external-priority patent/KR101908177B1/ko
Application filed by 三星Ｓｄｉ股份有限公司 filed Critical 三星Ｓｄｉ股份有限公司
Publication of TW201716478A publication Critical patent/TW201716478A/zh
Application granted granted Critical
Publication of TWI623569B publication Critical patent/TWI623569B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Non-Insulated Conductors (AREA)
TW105131507A 2015-09-30 2016-09-30 各向異性導電膜和使用其的顯示裝置 TWI623569B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
??10-2015-0137912 2015-09-30
KR1020150137912A KR101900542B1 (ko) 2015-09-30 2015-09-30 이방 도전성 필름용 조성물, 이방 도전성 필름 및 이를 이용한 디스플레이 장치
??10-2016-0021494 2016-02-23
KR1020160021494A KR101908177B1 (ko) 2016-02-23 2016-02-23 이방 도전성 필름 및 이를 이용한 전자 장치

Publications (2)

Publication Number Publication Date
TW201716478A TW201716478A (zh) 2017-05-16
TWI623569B true TWI623569B (zh) 2018-05-11

Family

ID=58427778

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105131507A TWI623569B (zh) 2015-09-30 2016-09-30 各向異性導電膜和使用其的顯示裝置

Country Status (3)

Country Link
CN (1) CN108140452B (fr)
TW (1) TWI623569B (fr)
WO (1) WO2017057920A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200927868A (en) * 2007-09-19 2009-07-01 Toray Industries Adhesive composition for electronic member and adhesive sheet for electronic member by using it
KR20110016538A (ko) * 2009-08-12 2011-02-18 주식회사 이그잭스 다면체 올리고머 실세스퀴녹산 화합물을 함유하는 이방 도전성 접착제
WO2015133395A1 (fr) * 2014-03-07 2015-09-11 日東電工株式会社 Film de résine

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101138798B1 (ko) * 2008-12-29 2012-04-24 제일모직주식회사 신뢰성이 향상된 이방 전도성 필름용 조성물 및 이를 이용한 이방전도성 필름
KR101671047B1 (ko) * 2009-07-01 2016-10-31 교리쯔 가가꾸 산교 가부시키가이샤 속경화성이 우수한 에너지선 경화형 에폭시 수지 조성물
JP5768454B2 (ja) * 2011-04-14 2015-08-26 デクセリアルズ株式会社 異方性導電フィルム
KR101344872B1 (ko) * 2011-10-17 2013-12-26 이근수 중합체 조성물, 이로부터 얻어진 필름 및 그 제조 방법
KR101597726B1 (ko) * 2013-04-29 2016-02-25 제일모직주식회사 이방성 도전 필름 및 이를 이용한 디스플레이 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200927868A (en) * 2007-09-19 2009-07-01 Toray Industries Adhesive composition for electronic member and adhesive sheet for electronic member by using it
KR20110016538A (ko) * 2009-08-12 2011-02-18 주식회사 이그잭스 다면체 올리고머 실세스퀴녹산 화합물을 함유하는 이방 도전성 접착제
WO2015133395A1 (fr) * 2014-03-07 2015-09-11 日東電工株式会社 Film de résine

Also Published As

Publication number Publication date
CN108140452B (zh) 2020-02-18
TW201716478A (zh) 2017-05-16
WO2017057920A1 (fr) 2017-04-06
CN108140452A (zh) 2018-06-08

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